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IPC-7711/21 - Revision B - Standard Only

Rework, modifikation og reparation af elektronikprodukter

Document #:
IPC-7711/21
Revision
B
Product Type
Standard Only
Released:  12/19/2012
Language
Danish
Current Revision
Stor opdatering af blyfri support og forbedrede inspektionsvejledninger for reparationer og modifikationer! Denne vejledning omfatter alt, der er nødvendigt for reparation og rework af elektronikprodukter og printkort! IPC-7711B/7721B „Rework, modifikation og reparation af elektronikprodukter“ har komplette procedurer, som er blevet opdaterede for at sikre, at de er anvendelige til både blyfri og...

IPC-7711/21 - Revision B - Standard Only

Přepracování, modifikace a opravy elektronických sestav

Document #:
IPC-7711/21
Revision
B
Product Type
Standard Only
Released:  01/27/2008
Language
Czech
Current Revision
Download an update to published IPC-7711B/7721B Part 3 Procedure 6.1.(English only) Základni aktualizace pro bezolovnatou technologii a zlepšené návody pro kontrolu oprav a modifikací Tento návod obsahuje vše, čeho je zapotřebí pro opravy a přepracování elektronických sestav a desek plošných spojů! IPC 7711/7721 Přepracování,modifikace a opravy elektronických sestav prošla kompletní aktualizaci...
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IPC-7711/21 - Revision B - Standard Only

Rilavorazione, Modifica e Riparazione di Assemblati Elettronici

Document #:
IPC-7711/21
Revision
B
Product Type
Standard Only
Released:  11/30/2007
Language
Italian
Current Revision
IPC-7711B/7721B rilavorazione, modifica e riparazione di assemblaggi elettronici un completo aggiornamento procedura per procedura al fine di garantirne l'applicabilità su entrambe le modalità di brasatura con Pb e senza Pb. Questo volume singolo include tutte le modifiche precedentemente pubblicate e diverse nuove procedure inerenti i BGA (compresi reballing) e la riparazione dei circuiti...

IPC-7711/21 - Revision C - Standard Only

Az elektronikai szerelvények újramunkálása, módosítása és javítása

Document #:
IPC-7711/21
Revision
C
Product Type
Standard Only
Released:  01/10/2019
Language
Hungarian
Current Revision
LEIRÁS Angol nyelvű leírás Ezen útmutató eljárásokat tartalmaz az elektronikai szerelvények újramunkálására, javítására ás módosítására. Ezen revízióban a korábbi szabványváltozat eljárásai, az általános információs és közös eljárási részek is frissítésre kerültek. Új eljárásként a szabvány kiegészült a beépített előfűtővel rendelkező fókuszált infravörös BGA forrasztási eljárással és az összes...
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IPC-6903 - Revision A - Standard Only

印刷电子设计与生产的术语及定义

Document #:
IPC-6903
Revision
A
Product Type
Standard Only
Released:  12/18/2018
Language
Chinese
Current Revision
IPC-6903A标准提供了62个印刷电子行业设计和制造相关的术语及定义。IPC-6903A标准为全球印刷电子行业提供一个共同的语言和知识
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IPC-7351 - Revision B - Standard Only

表面贴装设计及连接盘图形标准通用要求

Document #:
IPC-7351
Revision
B
Product Type
Standard Only
Released:  02/24/2020
Language
Chinese
Current Revision
本文件中的信息旨在提供表面贴装连接盘图形的适当尺寸、形状和公差，以确保为形成适当的焊料填充提供充足的区域，从而满足IPC J-STD-001 标准的要求，同时能够对这些焊点进行检验、测试及返工。设计工程师可以使用这些信息去建立标准的连接盘图形，此连接盘图形不仅可用于手工设计， 还可用于计算机辅助设计系统。无论电子元器件是被贴装到印制板的单面还是双面，是采用波峰焊、再流焊，还是其他的焊接方式，连接盘图形和元器件尺寸都应该优化，以确保形成适当的焊点和检验准则。2010年6月出版，2020年1月翻译。
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IPC-1720 - Revision A - Standard Only

组装资格认证纲要

Document #:
IPC-1720
Revision
A
Product Type
Standard Only
Released:  10/05/2012
Language
Chinese
Current Revision
简要介绍 （英文） IPC-1720A由IPC OEM委员会开发，分为电子组件制造商的能力和有详细、实质性信息的供应商的OEM客户。本程序简化了审核过程且降低了审核频率，从而减少了文书工作且提高了效率。公司和分公司的描述，分公司能力简介 ，设备概况（现场审核前），技术概况要求，质量概况，以及制造概况。A版本由一个单一的，易使用的电子文档微软（ Word TM模板）组成，提供了具有合并和整理数据的电子功能。共56页。2004年7月发布。

IPC-J-STD-001 - Revision F - Addendum - Space and Military

Space Applications Electronic Hardware Addendum to J-STD-001F

Document #:
IPC-J-STD-001
Revision
F
Product Type
Addendum
Released:  02/12/2015
Language
English
This Addendum supplements or replaces specifically identified requirements of IPC J-STD-001, Revision F, for soldered electrical and electronic assemblies that must survive the vibration and thermal cyclic environments of getting to and operating in space.
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IPC-J-STD-001 - Revision E - Addendum - Space and Military

Space Applications Electronic Hardware Addendum to IPC J-STD-001E Requirements for Soldered Electrical and Electronic Assemblies

Document #:
IPC-J-STD-001
Revision
E
Product Type
Addendum
Released:  12/01/2010
Language
English
When specifically required by procurement documentation, this Addendum supplements or replaces specifically identified requirements of IPC J-STD-001, Revision E of April 2010 by providing additional requirements to ensure the reliability of soldered electrical and electronic assemblies that must survive the vibration and thermal cyclic environments getting to and operating in space. The required...

IPC/WHMA-A-620 - Revision D - Addendum - Space and Military

Space and Military Applications Electronic Hardware Addendum to IPC/WHMA-A-620D

Document #:
IPC/WHMA-A-620
Revision
D
Product Type
Addendum
Released:  10/07/2020
Language
English
IPC/WHMA-A-620D-S space addendum provides additional requirements to IPC/WHMA-A-620D standard to ensure the reliability of cable and wire harness assemblies that must survive the vibration and thermal excursions encountered getting to and operating in the military and space environments. IPC/WHMA-A-620D-S cannot be used as a standalone document. It must be used with the base standard IPC/WHMA-A...

IPC-J-STD-001 and IPC-A-610 - Revision G - Addendum - Automotive

Automotive Addendum to IPC J-STD-001G Requirements for Soldered Electrical and Electronic Assemblies and IPC-A-610G Acceptability of Electronic Assemblies

Document #:
IPC-J-STD-001 and IPC-A-610
Revision
G
Product Type
Addendum
Released:  03/18/2020
Language
English
The IPC J-STD-001GA/IPC-A-610GA automotive addendum to J-STD-001G and IPC-A-610G provides criteria to ensure the reliability of mission-critical soldered automotive electrical and electronic assemblies in the field under harsh environments and considers the conditions of automated high-volume production. The IPC J-STD-001GA/IPC-A-610GA addendum is not a standalone document. The addendum requires...

IPC-A-610 - Revision G - Addendum - Telecom

Telecom Addendum to IPC-A-610 Revision G Acceptability of Electronic Assemblies

Document #:
IPC-A-610
Revision
G
Product Type
Addendum
Released:  10/01/2019
Language
English
The IPC-A-610GC Telecom Addendum to IPC-A-610G Acceptability of Electronic Assemblies provides specific requirements for telecommunications products when it is specifically required by procurement documentation. Information in this document either supplements or replaces specifically identified requirements of IPC-A-610 Revision G by providing additional requirements to ensure that electrical and...
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IPC-J-STD-001 - Revision F - Amendment 1

Cerințe pentru Ansamblurile Electrice și Electronice Lipite

Document #:
IPC-J-STD-001
Revision
F
Product Type
Amendment
Released:  11/28/2016
Language
Romanian
Current Revision
Acesta este un amendament la standardul IPC J-STD-001F, un standard industrial recunoscut și adoptat, acoperind cerințe de materiale și procese. Modificările includ, fără a se limita la acestea, o revizuire a cerințelor minime de umplere cu aliaj a găurilor metalizate, PTH, o schimbare a criteriilor pentru goluri la circuitele BGA cu bile fără turtire, reprezentări grafice noi pentru montarea...

IPC-J-STD-001 - Revision G - Addendum - Space and Military

Space and Military Applications Electronic Hardware Addendum to IPC J-STD-001G Requirements for Soldered Electrical and Electronic Assemblies

Document #:
IPC-J-STD-001
Revision
G
Product Type
Addendum
Released:  04/16/2018
Language
English
The IPC-J-STD-001GS space addendum supplements or replaces specifically identified requirements of IPC J-STD-001G for soldered electrical and electronic assemblies that must survive the vibration and thermal cyclic environments of getting to and operating in space and military applications.

IPC-A-610 - Revision F - Addendum - Telecom

Telecom Addendum to IPC-A-610 Revision F Acceptability of Electronic Assemblies

Document #:
IPC-A-610
Revision
F
Product Type
Addendum
Released:  02/02/2017
Language
English
This Telecom Addendum to IPC-A-610F Acceptability of Electronic Assemblies provides specific requirements for telecommunications products when it is specifically required by procurement documentation. Information in this document either supplements or replaces specifically identified requirements of IPC-A-610 Revision F by providing additional requirements to ensure that electrical and electronic...
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IPC-A-610 - Revision D - Addendum - Telecom

IPC-A-610DC-Telecom Addendum

Document #:
IPC-A-610
Revision
D
Product Type
Addendum
Released:  08/01/2009
Language
English
Telecom Addendum to IPC-A-610D Acceptability of Electronic Assemblies Telecom Addendum Published August 2009. When specifically required by procurement documentation, this Addendum supplements or replaces specifically identified requirements of IPC-A-610, Revision D of February 2005 by providing additional requirements to ensure compliance to GR-78-CORE.

IPC/WHMA-A-620 - Revision C - Addendum - Space and Military

Space Applications Electronic Hardware Addendum to IPC/WHMA-A-620C

Document #:
IPC/WHMA-A-620
Revision
C
Product Type
Addendum
Released:  03/30/2018
Language
English
IPC/WHMA-A-620C-S provides additional requirements to IPC/WHMA-A-620C to ensure the reliability of cable and wire harness assemblies that must survive the vibration and thermal cyclic environments getting to and operating in space. The IPC/WHMA-A-620C-S space addendum cannot be used as a stand alone document, it must be used with the base standard IPC/WHMA-A-620C.
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IPC/WHMA-A-620 - Revision B - Addendum - Space and Military

Space Applications Electronic Hardware Addendum to IPC/WHMA-A-620B

Document #:
IPC/WHMA-A-620
Revision
B
Product Type
Addendum
Released:  06/01/2013
Language
English
When specifically required by procurement documentation, this Addendum supplements or replaces specifically identified requirements of IPC/WHMA-A-620, Revision B, providing additional requirements to ensure the reliability of cable and wire harness assemblies that must survive the vibration and thermal cyclic environments getting to and operating in space. The required IPC training & certification...
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IPC-A-620 - Revision A - Addendum with Amendment 1 - Space and Military

Space Applications Electronic Hardware Addendum to IPC/WHMA-A-620A

Document #:
IPC/WHMA-A-620
Revision
A
Product Type
Addendum
Released:  07/16/2012
Language
English
IPC/WHMA-A-620AS with Amendment 1 Space Applications Electronic Hardware Addendum to IPC/WHMA-A-620A Requirements and Acceptance for Cable and Wire Harness Assemblies. When specifically required by procurement documentation, this Addendum supplements or replaces specifically identified requirements of IPC/WHMA-A-620, Revision A of July 2006 by providing additional requirements to ensure the...
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IPC-J-STD-001 - Revision H - Addendum - Space and Military

Ergänzung Elektronik-Hardware für Raumfahrt- und Militäranwendungen zu IPC J-STD-001H Anforderungen an gelötete elektrische und elektronische Baugruppen

Document #:
IPC-J-STD-001
Revision
H
Product Type
Addendum
Released:  06/22/2022
Language
German
Current Revision
Die Richtlinie IPC J-STD-001HS-DE Ergänzung für Raumfahrt-Anwendungen ergänzt oder ersetzt spezifisch identifizierte Anforderungen von IPC J-STD-001H-DE für gelötete elektrische und elektronische Baugruppen, die Schwingungen und die Umgebungsbedingungen thermischer Zyklen von Raumfahrt und militärischen Anwendungen überstehen müssen.
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IPC-J-STD-001 - Revision J - Addendum - Space and Military

J-STD-001Jはんだ付される電気および電子組立品に関する要求事項：宇宙・軍事用途向け追加規格

Document #:
IPC-J-STD-001
Revision
J
Product Type
Addendum
Released:  01/22/2026
Language
Japanese
Current Revision
“IPC J-STD-001JS 宇宙・軍事用途向け追加規格”は、IPC J-STD-001Jの要求事項のうち特定の要件を補完する/置き換えるものであり、宇宙および軍事用途において、輸送時や運用時の振動/熱サイクル環境に耐えることが求められる電気・電子組立品を対象としている。
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IPC-J-STD-048 - Standard Only

Notification Standard for Product Discontinuance

Document #:
IPC-J-STD-048
Revision
Original Version
Product Type
Standard Only
Released:  05/02/2015
Language
English
This standard is applicable to suppliers of, and affected customers for, electronic products and their constituent components. The goal of this notification standard is to better enable customers to manage and mitigate the disruption caused by the discontinuation of a product and to ensure continuity of supply. This standard establishes the requirements for timely customer notification of planned...
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IPC-J-STD-001 and IPC-A-610 - Revision J - Addendum - Automotive

IPC J-STD-001J はんだ付される電気および電子組立品、およびIPC-A-610J 電子組立品の許容基準：車載用途向け追加規格

Document #:
IPC-J-STD-001 and IPC-A-610
Revision
J
Product Type
Addendum
Released:  01/05/2026
Language
Japanese
Current Revision
IPC J-STD-001JA/IPC-A-610JAは、J-STD-001JおよびIPC-A-610Jの車載用途向け追加規格である。本書は、自動化された大量生産という条件を考慮しながら、過酷な環境下にある車載用電気・電子組立品について、そのはんだ付け信頼性を保証するための基準を提供するものである。 IPC J-STD-001JA/IPC-A-610JA(Addendum：追加規格)は独立した文書として使用するのではなく、J-STD-001JおよびIPC-A-610Jと併用する必要がある。
IPC-2591_1-5 Cover Image

IPC-2591 - Version 1.5 - Standard Only

Connected Factory Exchange (CFX)

Document #:
IPC-2591
Revision
1.5
Product Type
Standard Only
Released:  08/04/2022
Language
English
IPC-2591, CFX standard establishes the requirements for the omnidirectional exchange of information between manufacturing processes and associated host systems for assembly manufacturing. IPC-2591, CFX standard applies to communication between all executable processes in the manufacture of printed board assemblies, automated, semiautomated and manual, and is applicable to related mechanical...

IPC-9707 - Standard Only

Spherical Bend Test Method for Characterization of Board Level Interconnects

Document #:
IPC/JEDEC-9707
Revision
Original Version
Product Type
Standard Only
Released:  09/13/2011
Language
English
This standard on spherical transient bend testing is intended to characterize the maximum allowable strain that a surface mount component's board level interconnects can withstand in flexural loading. Whereas four-point monotonic bend test methods only address simple planar bending, spherical bend tests establish strain limits of board level interconnects under worst-case flexure conditions that...
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IPC-SMEMA 3.1 - Standard Only

SMEMA3.1 - Fiducial Mark Standard

Document #:
IPC-SMEMA 3.1
Revision
Original Version
Product Type
Standard Only
Released:  02/12/2007
Language
English
This SMEMA standard is for fiducial marks. It was developed to facilitate the accurate placement of components on printed circuit boards.
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IPC-J-STD-001 and IPC-A-610 - Revision H - Addendum - Automotive

Automotive-Ergänzung zu IPC J-STD-001H-DE Anforderungen an gelötete elektrische und elektronische Baugruppen und IPC-A-610H-DE, Abnahmekriterien für elektronische Baugruppen

Document #:
IPC-J-STD-001 and IPC-A-610
Revision
H
Product Type
Addendum
Released:  08/24/2023
Language
German
Current Revision
001H-DE und IPC-A-610H-DE enthält Kriterien zur Sicherstellung der Zuverlässigkeit gelöteter elektrischer und elektronischer Automotive-Baugruppen im Feld unter rauen Umgebungsbedingungen und berücksichtigt die Bedingungen einer automatisierten Großserienproduktion. Die Ergänzung IPC J-STD-001HA-DE/IPC-A-610HA-DE ist kein eigenständiges Dokument. Diese Ergänzung fordert, dass sie in Verbindung mit...
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IPC-2591 - Version 1.6 - Standard Only

Connected Factory Exchange (CFX)

Document #:
IPC-2591
Revision
1.6
Product Type
Standard Only
Released:  03/20/2023
Language
English
IPC-2591, Version 1.6 establishes the requirements for the omnidirectional exchange of information between manufacturing processes and associated host systems for assembly manufacturing. IPC-2591, Version 1.6 applies to communication between all executable processes in the manufacture of printed board assemblies, automated, semiautomated and manual, and is applicable to related mechanical assembly...
IPC-HERMES-9852 V. 1.5 Cover Image

IPC-HERMES-9852 - Version 1.5 - Standard Only

The Global Standard for Machine-to-Machine Communication in SMT Assembly

Document #:
IPC/HERMES-9852
Revision
1.5
Product Type
Standard Only
Released:  01/13/2023
Language
English
The IPC-HERMES-9852 is an open industry standard, developed by the Hermes Standard Initiative and approved by IPC. The IPC-HERMES-9852 provides a state-of-the-art communication protocol for machine-to-machine communication for surface-mount technology. Specifically, IPC-HERMES-9852, version 1.5 provides additional alignment with IPC-2591 (IPC-CFX). Used with IPC-2591, Connected Factory Exchange...
IPC-Hermes-9852 V 1.4 Cover Image

IPC-HERMES-9852 - Version 1.4 - Standard Only

The Global Standard for Machine-to-Machine Communication in SMT Assembly

Document #:
IPC/HERMES-9852
Revision
1.4
Product Type
Standard Only
Released:  04/13/2022
Language
English
The IPC-Hermes-9552 v. 1.4 is an open industry standard, developed by The Hermes Initiative and approved by IPC. The IPC-Hermes-9542 provide a state-of-the-art communication protocol for machine-to-machine communication for surface-mount technology (SMT). Specifically, IPC-HERMES-9852, version 1.4 provides additional alignment with IPC-2591 (IPC-CFX). Used with IPC-2591, Connected Factory Exchange...
IPC-J-STD-001HS French Cover Image

IPC-J-STD-001 - Revision H - Addendum - Space and Military

Addendum pour les produits électroniques des applications spatiales et militaires à la norme J-STD-001H, Exigences des Assemblages Électriques et Électroniques Brasés

Document #:
IPC-J-STD-001
Revision
H
Product Type
Addendum
Released:  07/26/2022
Language
French
Current Revision
Le présent Addendum IPC-J-STD-001HS relatif aux applications spatiales et militaires présente des exigences qui complètent ou remplacent des exigences spécifiques de la norme J-STD-001H, pour les assemblages électriques et électroniques brasés qui doivent résister aux vibrations et aux importantes variations thermiques subies dans des applications spatiales et militaires.
IPC/DAC-2552 Cover Image

IPC-DAC-2552 - Standard Only

General Electronic Components Model Based Definition (MBD) Standard

Document #:
IPC/DAC-2552
Revision
Original Version
Product Type
Standard Only
Released:  08/02/2022
Language
English
The IPC/DAC-2552 standard was developed jointly with the Digital Association of China (DAC), with the purpose to use Model Based Definition (MBD) to realize efficient and high-quality digital design of board-level assembly, support electronic assembly virtual manufacturing, and enabling the digitalization from requirement to product realization for printed board assemblies. The IPC/DAC-2552...
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IPC-HDBK-9798 - Handbook

Handbook for Press-fit Standard for Automotive Requirements and other High-Reliability Applications

Document #:
IPC-HDBK-9798
Revision
Original Version
Product Type
Handbook
Released:  06/21/2022
Language
English
Current Revision
IPC-HDBK-9798 provides guidelines and supporting information for manufacturing electronic assemblies using compliant press-fit technology. The intent is to explain the ‘‘how-to’’ and ‘‘why’’ information, and fundamentals for these processes. This handbook is supporting the IPC-9797 standard.
IPC-2591 Version 1.4 Cover Image

IPC-2591 - Version 1.4 - Standard Only

Connected Factory Exchange (CFX)

Document #:
IPC-2591
Revision
1.4
Product Type
Standard Only
Released:  01/10/2022
Language
English
IPC-2591 CFX standard establishes the requirements for the omnidirectional exchange of information between manufacturing processes and associated host systems for assembly manufacturing. IPC-2591 CFX standard applies to communication between all executable processes in the manufacture of printed board assemblies, automated, semi automated and manual, and is applicable to related mechanical...
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IPC-2591 - Version 1.3 - Standard Only

Connected Factory Exchange (CFX)

Document #:
IPC-2591
Revision
1.3
Product Type
Standard Only
Released:  03/08/2021
Language
English
The IPC-2591v1.3 standard establishes the requirements for the omni-directional exchange of information between manufacturing processes and associated host systems for assembly manufacturing. This standard applies to communication between all executable processes in the manufacture of printed board assemblies, automated, semi-automated and manual, and is applicable to related mechanical assembly...

IPC-2591 - Version 1.2 - Standard Only

Connected Factory Exchange (CFX)

Document #:
IPC-2591
Revision
1.2
Product Type
Standard Only
Released:  10/08/2020
Language
English
IPC-2591 version 1.2 (CFX) standard establishes the requirements for the omni-directional exchange of information between manufacturing processes and associated host systems for assembly manufacturing. IPC-2591 version 1.2 (CFX) standard applies to communication between all executable processes in the manufacture of printed board assemblies, automated, semi-automated and manual, and is applicable...

IPC-9797 - Standard Only

Press-fit Standard for Automotive Requirements and other High-Reliability Applications

Document #:
IPC-9797
Revision
Original Version
Product Type
Standard Only
Released:  06/01/2020
Language
English
IPC-9797 is the only industry-consensus standard for Requirements and Acceptance of Press-fit Pins. IPC-9797 prescribes practices for the characterization, qualification and acceptance requirements of compliant press-fit technology for printed boards that cover the manufacturability and reliability needs for high reliability applications intended for use in harsh environments such as automotive...

IPC-9191 - Standard Only

General Guidelines for Implementation of Statistical Process Control (SPC)

Document #:
IPC-9191
Revision
Original Version
Product Type
Standard Only
Released:  11/01/1999
Language
English
IPC-9191 reflects the principals of statistical process control (SPC) represented by ISO/DIS 11462-1, Guidelines for Implementation of Statistical Process Control (SPC) -- Part 1: Elements of SPC. This document outlines the SPC philosophy, implementation strategies, tools, and techniques used for relating process control and capability to final product requirements. Supersedes IPC-PC-90.
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IPC-9703 - Standard Only

IPC/JEDEC Mechanical Shock Test Guidelines for Solder Joint Reliability

Document #:
IPC/JEDEC-9703
Revision
Original Version
Product Type
Standard Only
Released:  03/18/2009
Language
English
Establishes mechanical drop and shock and test guidelines for assessing solder joint reliability of printed board assemblies from system to component level. This document addresses methods to define mechanical shock use-conditions, methods to define system level, system printed board level and component test board level testing that correlate to such use conditions and guidance on the use of...

IPC-9194 - Standard Only

Implementation of Statistical Process Control (SPC) Applied to Printed Board Assembly Manufacture Guideline

Document #:
IPC-9194
Revision
Original Version
Product Type
Standard Only
Released:  09/01/2004
Language
English
This guideline standard is intended to aid in interpretation of the requirements in IPC-9191, "General Guidelines for Implementation of Statistical process Control," specifically for printed board assembly (PBA) manufacture. This document and IPC-9191 should be used together; the standards are cross-referenced to each other in the Appendices of this guideline. This standard promotes process...

IPC-7530 - Standard Only

Guidelines for Temperature Profiling for Mass Soldering (Reflow & Wave) Processes

Document #:
IPC-7530
Revision
Original Version
Product Type
Standard Only
Released:  05/01/2001
Language
English
During mass soldering, it is important that all solder joints reach the minimum soldering (reflow) temperature to assure metallurgical bonding of the solder alloy and the base metals to be soldered. Metallurgical bonding requires that both surfaces to be soldered, as well as the solder, reach this minimum soldering temperature for a sufficient time to allow the wetting of the solder surfaces. This...

IPC-7094 - Standard Only

Design and Assembly Process Implementation for Flip Chip and Die Size Components

Document #:
IPC-7094
Revision
Original Version
Product Type
Standard Only
Released:  03/18/2009
Language
English
Implementing flip chip technology in a direct chip attach (DCA) assembly presents some unique challenges for design, assembly, inspection and repair personnel. IPC-7094 delivers useful and practical information to anyone who is currently using or contemplating developing products that employ the very complex and high density methods needed for the flip chip technology. The concepts have become...

IPC-SM-785-English

IPC-SM-785: Guidelines for Accelerated Reliability Testing of Surface Mount Attachments

Document #:
IPC-SM-785
Revision
Original Version
Product Type
Standard Only
Released:  11/01/1992
Language
English
Guidelines for accelerated reliability testing of surface mount solder attachments when evaluating and extrapolating the results of these tests towards actual use environments of electronic assemblies. 50 pages. Released November 1992. Included in the IPC-C-103 and the IPC-C-1000 Collections

J-STD-012 - Standard Only

Implementation of Flip Chip & Chip Scale Technology

Document #:
IPC-J-STD-012
Revision
Original Version
Product Type
Standard Only
Released:  01/01/1996
Language
English
This informative document describes the implementation of flip chip and related chip scale semiconductor packaging technologies. The areas discussed include design considerations, assembly processes, technology choices, application and reliability data. Chip packaging variations include flip chip, HDI, micro BGA, micro SMT and SLICC. Also provides general information on implementing flip chip and...

IPC-A-640 - Standard Only

Acceptance Requirements for Optical Fiber, Optical Cable, and Hybrid Wiring Harness Assemblies

Document #:
IPC-A-640
Revision
Original Version
Product Type
Standard Only
Released:  08/04/2017
Language
English
The IPC-A-640, Acceptance Requirements for Optical Fiber, Optical Cable and Hybrid Wiring Harness Assemblies standard provides acceptance requirements and technical insight for cable and wire harness assemblies incorporating optical fiber, optical cable and hybrid wiring technology. The IPC-A-640 standard includes full-color illustrations and an Excel spreadsheet Verification and Compliance...

IPC-D-640 - Standard Only

Design and Critical Process Requirements for Optical Fiber, Optical Cable and Hybrid Wiring

Document #:
IPC-D-640
Revision
Original Version
Product Type
Standard Only
Released:  09/13/2016
Language
English
This full-color document provides design and critical process requirements and technical insight for cable and wire harness assemblies incorporating optical fiber, optical cable and hybrid wiring technology. This standard also includes an Excel spreadsheet Verification and Compliance checklist.
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IPC/JEDEC-J-STD-035 - Standard Only

Acoustic Microscopy for Non-Hermetic Encapsulated Electronic Components

Document #:
IPC/JEDEC-J-STD-035
Revision
Original Version
Product Type
Standard Only
Released:  04/01/1999
Language
English
This test method defines the procedures for performing acoustic microscopy on non-hermetic encapsulated electronic components. It provides users with an acoustic microscopy process flow for detecting defects non-destructively in plastic packages while achieving reproducibility. Developed by IPC and JEDEC. 16 pages. Released April 1999. Equivalent to IEC Publicly Available Specification (PAS) 62191
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J-STD-013 - Standard Only

Implementation of Ball Grid Array & Other High Density Technology

Document #:
IPC-J-STD-013
Revision
Original Version
Product Type
Standard Only
Released:  07/01/1996
Language
English
This document establishes the requirements and interactions necessary for printed board assembly processes for interconnecting high performance/high pin count IC packages. Includes information on design principles, material selection, board fabrication, assembly technology, testing strategy and reliability expectations based on end-use environments. Developed by IPC, EIA, MCNC and Sematech. 96...
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IPC-J-STD-001 - Revision F - Redline Standard

J-STD-001 Revision E to Revision F Redline Comparison Document

Document #:
IPC-J-STD-001
Revision
F
Product Type
Redline Standard
Released:  10/21/2014
Language
English
J-STD-001 Revision E to Revision F Redline Comparison Document. This document is free to Task Group members participating in development of the standard and to Certification Centers with current training licenses for the associated Training and Certification program. CITs who are not members of the Task Group are encouraged to contact his or her MIT for a copy of the redline document.
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IPC/WHMA-A-620 - Revision E - Redline Standard

Requirements and Acceptance for Cable and Wire Harness Assemblies

Document #:
IPC/WHMA-A-620
Revision
E
Product Type
Redline Standard
Released:  03/06/2023
Language
English
IPC/WHMA-A-620E-RL is a redline document showing the difference from IPC/WHMA-A-620D to IPC/WHMA-A-620E. IPC/WHMA-A-620E-RL provides a side-by-side comparison of the two documents and includes the figures and tables. The document shows deleted/changed text in the IPC/WHMA-A-620D pages and new/revised text in the IPC/WHMA-A-620E pages. Due to the complexity of this document, it is only available in...
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IPC-J-STD-001 - Revision G - Redline Standard

Requirements for Soldered Electrical and Electronic Assemblies

Document #:
IPC-J-STD-001
Revision
G
Product Type
Redline Standard
Released:  10/31/2017
Language
English
This is a redline document showing the changes from IPC J-STD-001F with Amendment 1 to IPC J-STD-001G. This document provides a side-by-side comparison of the two documents and includes the figures and tables. The document shows the deleted/changed text in the IPC J-STD-001F with Amendment 1 pages and the new/revised text in purple highlights in the IPC J-STD-001G pages. Yellow pop-up boxes are...

IPC-HERMES-9852 - Standard Only

The Global Standard for Machine-to-Machine Communication in SMT Assembly

Document #:
IPC/HERMES-9852
Revision
Original Version
Product Type
Standard Only
Released:  06/01/2019
Language
English
IPC-HERMES-9852 an open industry standard, developed by The Hermes Standard Initiative and approved by IPC, provides a state-of-the-art communication protocol for machine-to-machine communication between equipment units in electronics assembly lines for surface-mount technology (SMT). Thus IPC-HERMES-9852 represents a next generation standard to the technology documented in IPC-SMEMA-9851...
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IPC-A-610 - Revision G - Redline Standard

Acceptability of Electronic Assemblies-Redline

Document #:
IPC-A-610
Revision
G
Product Type
Redline Standard
Released:  10/31/2017
Language
English
This is a redline document showing the changes from IPC-A-610F with Amendment 1 to IPC-A-610G. This document provides a side-by-side comparison of the two documents and includes the figures and tables. The document shows the deleted/changed text in the IPC-A-610F with Amendment 1 pages and the new/revised text in purple highlights in the IPC-A-610G pages. Yellow pop-up boxes are also present in...
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IPC-A-610 - Revision F - Redline Standard

IPC-A-610 Revision E to Revision F Redline Comparison Document

Document #:
IPC-A-610
Revision
F
Product Type
Redline Standard
Released:  10/21/2014
Language
English
IPC-A-610 Revision E to Revision F Redline Comparison Document. This document is free to Task Group members participating in development of the standard and to Certification Centers with current training licenses for the associated Training and Certification program. CITs who are not members of the Task Group are encouraged to contact his or her MIT for a copy of the redline document.

IPC-9202 - Standard Only

Material and Process Characterization/Qualification Test Protocol for Assessing Electrochemical Performance

Document #:
IPC-9202
Revision
Original Version
Product Type
Standard Only
Released:  10/20/2011
Language
English
This document provides tests that record changes in surface insulation resistance (SIR) on a representative sample of a printed circuit assembly. It quantifies any deleterious effects that might arise from solder flux or other process residues left on external surfaces after soldering, which can cause unwanted electrochemical reactions that grossly affect reliability. It uses test vehicles that...

IPC-9709 - Standard Only

Test Guidelines for Acoustic Emission Measurement during Mechanical Testing

Document #:
IPC-9709
Revision
Original Version
Product Type
Standard Only
Released:  09/13/2011
Language
English
Surface mount pad cratering typically initiates prior to detection by existing electrical monitoring test methods. There are limited instrumentation techniques that are currently available that can identify non-electrical damage and its location to a high degree of accuracy. This guideline document establishes an acoustic emission (AE) method to evaluate the performance and reliability of surface...

IPC-9203 - Standard Only

Users Guide to IPC-9202 and the IPC-B-52 Standard Test Vehicle

Document #:
IPC-9203
Revision
Original Version
Product Type
Standard Only
Released:  04/27/2012
Language
English
While there are a variety of industry test vehicles for the examination of materials compatibility, most available test boards leave something to be desired as there is often a dramatic difference in materials between such test boards and produced assemblies. A test vehicle was needed which could be used for both ion chromatography and SIR testing that would be more representative of mainstream...

IPC-7801 - Standard Only

Reflow Oven Process Control Standard

Document #:
IPC-7801
Revision
Original Version
Product Type
Standard Only
Released:  04/14/2015
Language
English
IPC-7801 provides process control for solder reflow ovens by baseline and periodic verifications of oven profiles using a standard methodology to demonstrate acceptable oven performance repeatability. Equipment calibration and maintenance guidelines are provided. This standard is intended to verify the operating parameters of the reflow oven. This standard is not intended for the assembly product...

IPC-7526 - Standard Only

Stencil and Misprinted Board Cleaning Handbook

Document #:
IPC-7526
Revision
Original Version
Product Type
Standard Only
Released:  02/13/2007
Language
English
Cleaning of stencils and misprinted PCBs has taken an increasingly important role in surface mount technology. Fine and ultra-fine pitch lands, together with other advanced packages, place new demands on stencil cleaning. Paste volume is a critical issue for fine, ultra-fine, chip-scale, BGA and flip-chip components. Insufficient solder due to clogging of stencil apertures is a primary cause of...

IPC-7093 - Standard Only

Design and Assembly Process Implementation for Bottom Termination Components

Document #:
IPC-7093
Revision
Original Version
Product Type
Standard Only
Released:  03/28/2011
Language
English
This standard describes the design and assembly challenges for implementing Bottom Termination surface mount Components (BTCs) whose external connections consist of metallized terminals that are an integral part of the component body. The BTCs in this document include all types and forms of bottom-only termination components intended for surface mounting. This includes such industry descriptive...

IPC-7091 - Standard Only

Design and Assembly Process Implementation of 3D Components

Document #:
IPC-7091
Revision
Original Version
Product Type
Standard Only
Released:  09/25/2017
Language
English
The IPC-7091 intends to provide useful and practical information to those who are designing, developing or using 3D-packaged semiconductor components or those who are considering 3D package implementation. The 3D semiconductor package may include multiple die elements—some homogeneous and some heterogeneous. The package may also include several discrete passive SMT devices, some of which are...
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IPC-7351 - Standard Only

Generic Requirements for Surface Mount Design and Land Pattern Standard

Document #:
IPC-7351
Revision
Original Version
Product Type
Standard Only
Released:  02/01/2005
Language
English
The successor to the IPC-SM-782A is here! The document covers land pattern design for all types of passive and active components, including resistors, capacitors, MELFs, SSOPs, TSSOPs, QFPs, BGAs, QFNs and SONs. The standard provides many brand new features, including an intelligent land pattern naming convention, zero component rotations for CAD systems, and a set of three separate land pattern...
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IPC-7092 - Standard Only

Design and Assembly Process Implementation for Embedded Components

Document #:
IPC-7092
Revision
Original Version
Product Type
Standard Only
Released:  02/18/2015
Language
English
This document describes the design and assembly challenges for implementing passive and active components, in either formed or placed methodology, into a printed board. It provides useful and practical information to decision makers of formed or placed, passive or active components and helps establish inspection techniques, testing processes, and reliability validations. Users will also learn...

IPC-2591 - Standard Only

Connected Factory Exchange (CFX)

Document #:
IPC-2591
Revision
Original Version
Product Type
Standard Only
Released:  04/11/2019
Language
English
IPC-2591 standard establishes the requirements for the omni-directional exchange of information between manufacturing processes and associated host systems for assembly manufacturing. The IPC-2591 standard applies to communication between all executable processes in the manufacture of printed board assemblies, automated, semi-automated and manual, and is applicable to related mechanical assembly...

IPC-2591 - Version 1.1 - Standard Only

Connected Factory Exchange (CFX)

Document #:
IPC-2591
Revision
1.1
Product Type
Standard Only
Released:  01/20/2020
Language
English
IPC-2591 version 1.1 provides updates to several CFX messages since the original IPC-2591 version release. IPC-2591 standard establishes the requirements for the omni-directional exchange of information between manufacturing processes and associated host systems for assembly manufacturing. IPC-2591 standard applies to communication between all executable processes in the manufacture of printed...

IPC-1072 - Standard Only

Intellectual Property Protection in Electronic Assembly Manufacturing

Document #:
IPC-1072
Revision
Original Version
Product Type
Standard Only
Released:  02/10/2016
Language
English
The purpose of this standard is to provide requirements and best practices for EMS companies to ensure protection of intellectual property for their customers. By using this standard, EMS companies can provide their customers assurance that the intellectual property built into their circuit boards is protected. The document is also a companion to IPC-1071 for printed circuit board manufacturers...

IPC-2231 - Standard Only

DFX Guidelines

Document #:
IPC-2231
Revision
Original Version
Product Type
Standard Only
Released:  05/14/2019
Language
English
The IPC-2231 standard provides guidelines for establishing a best practice methodology for use in developing a formal DFX (Design for Manufacturing, Fabrication, Assembly, Testability, Cost, Reliability, Environment, Reuse) process for layout of printed board assemblies that utilize surface mount and through hole devices.

IPC-1791 - Standard Only

Trusted Electronic Designer, Fabricator and Assembler Requirements

Document #:
IPC-1791
Revision
Original Version
Product Type
Standard Only
Released:  09/05/2018
Language
English
IPC-1791 provides minimum requirements, policies and procedures for printed board design, fabricating and assembly organizations and/or companies to become trusted sources for markets requiring high levels of confidence in the integrity of delivered products. Demonstration of the ability to meet and maintain the requirements of IPC-1791 as trusted design, fabricator or assembly organization...

IPC-1782 - Standard Only

Standard for Manufacturing and Supply Chain Traceability of Electronic Products

Document #:
IPC-1782
Revision
Original Version
Product Type
Standard Only
Released:  11/01/2016
Language
English
The lack of a uniform component traceability standard has caused an unnecessary consumption of resources (e.g., time, people, money, etc.) to track events or parts to their sources and to remedy any quality, reliability, etc., issues. Lack of a standard has also made it difficult to uniformly create and appropriately enforce the necessary contracts. This standard establishes minimum requirements...

IPC-1401 - Standard Only

Supply Chain Social Responsibility Management System Guidance

Document #:
IPC-1401
Revision
Original Version
Product Type
Standard Only
Released:  03/01/2017
Language
English
This standard helps companies achieve intended outcomes of a supply chain social responsibility management system, creating value for the company, its customers, its suppliers and other stakeholders. Users of this standard can expect the following outcomes: Enhancement of working conditions, environmental performance and ethics level of the supply chain Fulfillment of compliance obligations and...

IPC-T-50M-French

IPC-T-50M-FR: Termes et Définitions pour les Circuits Électroniques Imprimés et Assemblés

Document #:
IPC-T-50
Revision
M
Product Type
Standard Only
Released:  06/30/2015
Language
French
Ce document essentiel pour l’industrie fournit des descriptions et des illustrations de la terminologie de l’industrie d’assemblage électronique afin d’aider les utilisateurs et leur clients à casser les barrières linguistiques. La révision M contient plus de 220 termes nouveaux ou révisés, incluant la nouvelle terminologie pour les procédés de tropicalisation, d’enrobage et d’encapsulation, la...
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IPC/WHMA-A-620 - Revision E - Addendum - Space and Military

航天及军事应用电子部件补充标准

Document #:
IPC/WHMA-A-620
Revision
E
Product Type
Addendum
Released:  01/27/2025
Language
Chinese
Current Revision
IPC/WHMA-A-620ES航天和军事应用电子部件补充标准为IPC/WHMA-A-620E标准提供了额外要求，以确保线缆及线束组件的可靠性，必须能够耐受在军事或太空环境中运行或遇到的振动与超温。IPC/WHMA-A-620ES不能作为一个独立的文件使用。它必须与母标准IPC/WHMA-A-620E搭配使用。IPC/WHMA-A-620ES-CN于2025年2月发布。
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IPC-A-610 - Revision G - Addendum - Telecom

IPC-A-610G 电信补充标准

Document #:
IPC-A-610
Revision
G
Product Type
Addendum
Released:  01/15/2021
Language
Chinese
Current Revision
当采购文件特别要求对电子产品IPC-A-610G可接受性的IPC-A-610GC电信附录时，对电信产品提出了特定要求。本文档中的信息通过提供其他要求来确保电气和电子组件满足要求符合GE-78-CORE的客户的要求，从而补充或替代了IPC-A-610修订版G专门确定的要求

IPC-T-50 - Revision M - Standard Only

电子电路互连与封装术语及定义

Document #:
IPC-T-50
Revision
M
Product Type
Standard Only
Released:  09/19/2016
Language
Chinese
本文件是电子互连行业不可或缺的术语标准。该文件图文并茂，可帮助用户及其客户克服语言上的沟通障碍。M版本包含超过220多条新术语或修订术语，包括敷形涂覆、灌封和封装工艺、模板设计、统计工艺控制和挠性印制板技术。也包括通用行业缩写词。
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IPC/WHMA-A-620 - Revision C - Redline Standard

Requirements and Acceptance for Cable and Wire Harness Assemblies

Document #:
IPC/WHMA-A-620
Revision
C
Product Type
Redline Standard
Released:  03/31/2017
Language
English
This is a redline document showing the changes from IPC/WHMA-A-620B to IPC/WHMA-A-620C. This document provides a side-by-side comparison of the two documents and includes the figures and tables. The document shows the deleted/changed text in the IPC/WHMA-A-620B pages and the new/revised text in purple highlights in the IPC/WHMA-A-620C pages. Yellow pop-up boxes are also present in the IPC/WHMA-A...
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IPC-7711/21 - Revision C - Redline Standard

Rework, Modification and Repair of Electronic Assemblies - Redline

Document #:
IPC-7711/21
Revision
C
Product Type
Redline Standard
Released:  05/30/2017
Language
English
This is a redline document showing the changes from IPC-7711/21B to IPC-7711/21C. This 790+ page document provides a side-by-side comparison of the two documents and includes the figures. The document shows the deleted/changed text in the IPC-7711/21B pages and the new/revised text in purple highlights in the IPC-7711/21C pages. Yellow pop-up boxes are also present in the IPC-7711/21C pages to...
610H German Deutch Cover Image

IPC-A-610 - Revision H - Standard Only

Abnahmekriterien für elektronische Baugruppen

Document #:
IPC-A-610
Revision
H
Product Type
Standard Only
Released:  08/10/2021
Language
German
IPC-A-610H ist die in der Elektronik-Branche weltweit am meisten verwendete Abnahme-Richtlinie für Elektronikbaugruppen. Die IPC-A-610H-Richtlinie beinhaltet eine allgemeine Aktualisierung des Dokuments, führt mehrere neue oberflächenmontierbare Bauteiltypen ein und entfernt die Kategorie „Anzustreben“ bei den Bewertungen. Teilnehmer aus 29 Ländern haben ihre Beiträge und ihr Fachwissen...
IPC-A-610H French Cover Image

IPC-A-610 - Revision H - Standard Only

Acceptabilité des Assemblages Électroniques

Document #:
IPC-A-610
Revision
H
Product Type
Standard Only
Released:  08/11/2021
Language
French
L’IPC-A-610H est le référentiel d’acceptabilité des assemblages électroniques la plus couramment utilisée dans l’industrie électronique. Le référentiel IPC-A-610H comprend une mise à jour générale du document, présente plusieurs nouveaux types de composants montés en surface et supprime les conditions d’objectif. Les participants de 29 pays ont apporté leur contribution et leur expertise pour...
IPC-A-610H Hebrew Cover Image

IPC-A-610 - Revision H - Standard Only

במקרה של חילוקי דעות בין התרגום במסמך זה לבין הגירסה האנגלית, תינתן עדיפות לגירסה האנגלית.

Document #:
IPC-A-610
Revision
H
Product Type
Standard Only
Released:  08/04/2022
Language
Hebrew
תיאור IPC-A-610Hהוא תקן הקבלה להרכבת אלקטרוניקה הנפוץ ביותר בתעשיית האלקטרוניקה. תקן IPC-A-610H כולל עדכון כללי למסמך, מציג מספר סוגי רכיבי הרכבה חדשים על פני השטח ומסיר תנאי יעד. משתתפים מ-29 מדינות סיפקו את הקלט והמומחיות שלהם כדי להביא מסמך זה לתעשיית האלקטרוניקה. זו חובה עבור מבקרים, מפעילים ואחרים שלהם עניין בקריטריוני הקבלה עבור הרכבות אלקטרוניות. IPC-A-610 פותח בסינרגיה עם J-STD-001 ו- IPC...
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IPC-J-STD-001 - Revision H - Standard Only

Exigences Relatives aux Assemblages Électroniques et Électriques Brasés

Document #:
IPC-J-STD-001
Revision
H
Product Type
Standard Only
Released:  01/10/2022
Language
French
Le référentiel IPC-J-STD-001H est reconnu internationalement pour ses critères relatifs aux procédés et matériaux de brasage. Mise à jour grâce aux contributions et expertises de participants de 27 pays, le référentiel IPC-J-STD-001H fournit à l’industrie les critères les plus récents, ainsi que des recommandations sur l’utilisation des rayons X pour inspecter l’état des brasures de trous...
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IPC/WHMA-A-620 - Revision C - Addendum - Rail Transit

线缆及线束组件的要求与验收轨道交通补充标准Rail Transit Addendum to IPC/WHMA-A-620C

Document #:
IPC/WHMA-A-620
Revision
C
Product Type
Addendum
Released:  06/22/2022
Language
Chinese
Current Revision
IPC/WHMA-A-620C-R 轨道交通补充标准提供了对 IPC/WHMA-A-620C 标准的补充要求，描述了用于轨道交通行业的线缆、线束及其组件的相关要求，如生产压接、机械固定和焊接互连的材料、方法、测试和验收标准等，以保证其在高速铁路环境下电缆线束及其组件的高度可靠性和环境适应性。
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Coming Soon

IPC-9242: Guidelines for Microsection Evaluation

IPC-9691C: User Guide for the IPC-TM-650, Method 2.6.25 Conductive Anodic Filament (CAF) Resistance and Other Internal Electrochemical Migration Testing

IPC-A-630A: Acceptability Standard for Manufacture, Inspection, and Testing of Electronic Enclosures

IPC-4556A: Specification for Electroless Nickel/Electroless Palladium/ Immersion Gold (ENEPIG) Plating for Printed Boards

IPC-7527A: Requirements for Solder Paste Application

IPC-4204C: Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Boards

IPC-J-STD-002F: Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires

IPC-4101F: Specifications for Base Materials for Rigid and Multilayer Printed Boards

IPC-1755B: Responsible Sourcing of Minerals Data Exchange Standard

IPC-2223F: Sectional Design Standard for Flexible/Rigid-Flexible Printed Boards

IPC-HDBK-9798A: Handbook and Guide to Supplement IPC-9797

IPC-WP-011: Guidance for Strain Gage Limits for Assemblies

J-STD-046A: Customer Notification Standard for Product/Process Changes by Electronic Product Suppliers

J-STD-048A: Notification Standard for Product Discontinuance

IPC-T-50P: Terms and Definitions for Interconnecting and Packaging Electronic Circuits

IPC-1401B: Corporate Social Responsibility Management System Standard

IPC -1751B: Generic Requirements for Declaration Process Management

IPC-6013F: Qualification and Performance Specification for Flexible/Rigid-Flexible Printed Boards

IPC-4413 - Am1: Specification for Finished Fabric Woven from Low Dk Glass for Printed Boards