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IPC-5262 Cover Image

IPC-5262 - Standard Only

Design, Critical Process and Acceptance Requirements for Polymeric Applications

Document #:
IPC-5262
Revision
Original Version
Product Type
Standard Only
Released:  10/17/2022
Language
English
Current Revision
The IPC-5262 prescribes the minimum design, critical process and acceptance requirements for the application of polymeric materials to electrical/electronic components, modules, printed wiring assemblies and other elements thereof. The intent of IPC-5262 is to establish a baseline of requirements, procedures, practices and process attributes based on lessons learned and best practices that have...

IPC-5701 - Standard Only

Users Guide for Cleanliness of Unpopulated Printed Boards

Document #:
IPC-5701
Revision
Original Version
Product Type
Standard Only
Released:  07/01/2003
Language
English
Current Revision
Tackling PCB cleanliness is a tough job; residues on printed circuit boards are directly related to the reliability of the produced hardware and can result in serious failures if not known or monitored. But how do you measure "cleanliness"? How clean is "clean"? The IPC-5701 provides guidance into how these issues should be approached and specified in purchasing documents, addressing levels of...

IPC-5702 - Standard Only

Guidelines for OEMs in Determining Acceptable Levels of Cleanliness of Unpopulated Printed Boards

Document #:
IPC-5702
Revision
Original Version
Product Type
Standard Only
Released:  06/01/2007
Language
English
Current Revision
Every electronics manufacturer, whether an original equipment manufacturer (OEM) or electronics manufacturing services (EMS) company, must determine if the unpopulated printed boards entering the assembly process have an adequate level of cleanliness. The question of “how clean is clean enough?” is one that has no definitive answer, as there is no "golden number" for board cleanliness. The issue...

IPC-6012 - Revision E - Standard Only

Qualification and Performance Specification for Rigid Printed Boards

Document #:
IPC-6012
Revision
E
Product Type
Standard Only
Released:  02/20/2020
Language
English
IPC-6012E specification covers qualification and performance of rigid printed boards, including single-sided, double-sided, with or without plated-through holes, multilayer with or without blind/buried vias and metal core boards. It addresses final finish and surface plating coating requirements, conductors, holes/vias, frequency of acceptance testing and quality conformance as well as electrical...

IPC-9241 - Standard Only

Guidelines for Microsection Preparation

Document #:
IPC-9241
Revision
Original Version
Product Type
Standard Only
Released:  01/13/2017
Language
English
Current Revision
This standard is intended as a guideline in the proper preparation of a metallographic sample (microsection) of a printed board. The finished microsection is used for evaluating the quality of the laminate system and plated structures (e.g. PTHs and vias). Microsection sample preparation is regarded by many as a highly developed skill. The guidelines in this standard discuss the many variables and...

IPC-2225 - Standard Only

Sectional Design Standard for Organic Multichip Modules (MCM-L) and MCM-L Assemblies

Document #:
IPC-2225
Revision
Original Version
Product Type
Standard Only
Released:  05/01/1998
Language
English
Current Revision
Used in conjunction with IPC-2221A, IPC-2225 establishes the requirements and other considerations (thermal, electrical, electromechanical and mechanical) for the design of Single Chip Module (SCM-L), MCM or MCM-L assemblies. Key concepts include adhesive interconnection information, typical die attach materials, microvia material properties and relationships with DFM and DFE.

IPC-NC-349 - Standard Only

Computer Numerical Control Formatting for Drillers and Routers

Document #:
IPC-NC-349
Revision
Original Version
Product Type
Standard Only
Released:  08/01/1985
Language
English
Current Revision
Defines a machine readable input format for Computer Numerical Control (CNC) drilling and routing machine tools used by the printed wiring board industry. The format may be used to transfer drilling and routing information between printed board designers, manufacturers and users or as the output CNC standard from converters that expand higher level design input such as IPC-D-350 data. Provides a...

IPC-6012 - Revision D - Standard Only

Qualification and Performance Specification for Rigid Printed Boards

Document #:
IPC-6012
Revision
D
Product Type
Standard Only
Released:  09/22/2015
Language
English
This specification covers qualification and performance of rigid printed boards, including single-sided, double-sided, with or without plated-through holes, multilayer with or without blind/buried vias and metal core boards. It addresses final finish and surface plating coating requirements, conductors, holes/vias, frequency of acceptance testing and quality conformance as well as electrical...

IPC-TF-870 - Standard Only

Qualification and Performance of Polymer Thick Film Printed Boards

Document #:
IPC-TF-870
Revision
Original Version
Product Type
Standard Only
Released:  11/01/1989
Language
English
Current Revision
Covers the materials, qualification, certification and performance requirements for multilayer polymer thick film (PTF) printed, extrusion deposited, or otherwise applied conductor, insulator and through-hole technology. This specification may also be used for procurement of single and double-sided boards. 59 pages. Released November 1989.

IPC-D-422 - Standard Only

Design Guide for Press Fit Rigid Printed Board Back Planes

Document #:
IPC-D-422
Revision
Original Version
Product Type
Standard Only
Released:  09/01/1982
Language
English
Current Revision
Contains backplane design information from the fabrication and assembly perspective. Includes sections on design and documentation; fabrication; assembly; repair; and inspection. 17 pages. Revised September 1982.
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IPC-D-354 - Standard Only

Library Format Description for Printed Boards in Digital Form

Document #:
IPC-D-354
Revision
Original Version
Product Type
Standard Only
Released:  02/01/1987
Language
English
Current Revision
Describes the usage of libraries within the processing and generation of information files. The data contained within covers both the definition and usage of internal (existing within the information file) and external libraries. The libraries can be used to make generated data more compact and facilitate data exchange and archival. The subroutines within a library can be used one or more times...
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IPC-D-351 - Standard Only

Printed Board Drawings in Digital Form

Document #:
IPC-D-351
Revision
Original Version
Product Type
Standard Only
Released:  08/01/1985
Language
English
Current Revision
Describes an intelligent, digital format for transfer of drawings between printed wiring board designers, manufacturers and customers. Also conveys additional requirements, guidelines and examples necessary to provide the data structures and concepts for drawing description in digital form. Supplements ANSI/IPC-D-350. Pertains to four basic types of drawings: master drawings, schematics, assembly...
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IPC-D-355 - Standard Only

Printed Board Automated Assembly Description in Digital Form

Document #:
IPC-D-355
Revision
Original Version
Product Type
Standard Only
Released:  01/01/1995
Language
English
Current Revision
Describes an intelligent, digital data transfer format for describing component mounting information. Supplements IPC-D-350 and is for designers and assemblers. Data included are pin location, component orientation, etc. This document is frozen; no future updates are planned. 33 pages. Released January 1995.
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IPC-D-352 - Standard Only

Electronic Design Data Description for Printed Boards in Digital Form

Document #:
IPC-D-352
Revision
Original Version
Product Type
Standard Only
Released:  08/01/1985
Language
English
Current Revision
Describes the relationship between elements used in electromechanical design and packaging of printed boards. Includes descriptions for logical and physical elements necessary as input to a design system, as well as the network of interconnection description between the various electronic parts. Provides the capability of describing all elements in their final form upon design completion. The...

IPC-A-311 - Standard Only

Process Controls for Phototool Generation and Use

Document #:
IPC-A-311
Revision
Original Version
Product Type
Standard Only
Released:  03/01/1996
Language
English
Current Revision
Covers the information and data to be collected during the generation and use of phototools to improve artwork quality, thereby improving yields downstream. It also helps establish and maintain ISO 9000 certification and SPC by facilitating troubleshooting, standardizing the process for both experienced and inexperienced operators and by identifying process improvements for the ultimate...

IPC-9641 - Standard Only

High Temperature Printed Board Flatness Guideline

Document #:
IPC-9641
Revision
Original Version
Product Type
Standard Only
Released:  07/10/2013
Language
English
Current Revision
Printed board flatness is largely affected by a change in intrinsic properties through exposure to variances in temperature. The worst case deviation of the printed board from flatness may be at room temperature, peak temperature during reflow, or at any temperature in between. Printed board flatness must therefore be characterized during the entire reflow thermal cycle, and not solely at room...

IPC-9199 - Standard Only

Statistical Process Control (SPC) Quality Rating

Document #:
IPC-9199
Revision
Original Version
Product Type
Standard Only
Released:  09/01/2002
Language
English
Current Revision
This document is a tool for a customer or supplier organization's internal audit group to assess a statistical process control (SPC) system against the requirements of IPC-9191. This document should be used by customers and suppliers of any size and for any commodity. This tool can be used to perform an assessment of the use of SPC at both organizational and process levels. The questions in this...

IPC-7621 - Standard Only

Guideline for Design, Material Selection and General Application of Encapsulation of Electronic Circuit Assembly by Low Pressure Molding with Thermoplastics

Document #:
IPC-7621
Revision
Original Version
Product Type
Standard Only
Released:  02/14/2018
Language
English
Current Revision
Encapsulation, for the purpose of IPC-7621 standard, is defined as a low pressure molded thermoplastic, e.g., polyamide, which is brought to a liquid state and injection molded and (rather quickly) returned to a temperature below its melting point., forming a durable yet pliable (rubbery-like) form. The desired performance characteristics of low pressure molding (LPM) encapsulation depend on the...

IPC-6903 - Standard Only

Terms and Definitions for the Design and Manufacture of Printed Electronics (Additive Circuitry)

Document #:
IPC-6903
Revision
D
Product Type
Standard Only
Released:  10/29/2015
Language
English
This standard provides industry-approved terms and definitions to create a common language for users and suppliers to develop electronics products that utilize printed electronics alone or as additive processes combined with traditional rigid, flexible and rigid-flex PWB assemblies Released October 2015.

IPC/JPCA-6901 - Standard Only

Application Categories for Printed Electronics

Document #:
IPC/JPCA-6901
Revision
Original Version
Product Type
Standard Only
Released:  08/26/2015
Language
English
Current Revision
This standard establishes a Market Classification System and Level Classification System for printed electronics assemblies and provides a list of performance criteria and testing methods. It provides a standardized product category structure for designing and manufacturing printed electronics and assemblies which conform to industry-established performance metrics as determined by accepted...

IPC-6013 - Revision D - Standard Only

Qualification and Performance Specification for Flexible/Rigid-Flexible Printed Boards

Document #:
IPC-6013
Revision
D
Product Type
Standard Only
Released:  09/01/2017
Language
English
The IPC-6013D covers qualification and performance requirements for flexible printed boards designed to IPC-2221 and IPC-2223. The flexible printed board may be single-sided, double-sided, multilayer or rigid-flex multilayer. All of these constructions may include stiffeners, PTHs, microvias, and blind/buried vias. IPC-6013D incorporates new and updated requirements for final finishes, rigid-to...
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Coming Soon

IPC-9242: Guidelines for Microsection Evaluation

IPC-9691C: User Guide for the IPC-TM-650, Method 2.6.25 Conductive Anodic Filament (CAF) Resistance and Other Internal Electrochemical Migration Testing

IPC-A-630A: Acceptability Standard for Manufacture, Inspection, and Testing of Electronic Enclosures

IPC-4556A: Specification for Electroless Nickel/Electroless Palladium/ Immersion Gold (ENEPIG) Plating for Printed Boards

IPC-7527A: Requirements for Solder Paste Application

IPC-4204C: Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Boards

IPC-J-STD-002F: Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires

IPC-4101F: Specifications for Base Materials for Rigid and Multilayer Printed Boards

IPC-1755B: Responsible Sourcing of Minerals Data Exchange Standard

IPC-2223F: Sectional Design Standard for Flexible/Rigid-Flexible Printed Boards

IPC-HDBK-9798A: Handbook and Guide to Supplement IPC-9797

IPC-WP-011: Guidance for Strain Gage Limits for Assemblies

J-STD-046A: Customer Notification Standard for Product/Process Changes by Electronic Product Suppliers

J-STD-048A: Notification Standard for Product Discontinuance

IPC-T-50P: Terms and Definitions for Interconnecting and Packaging Electronic Circuits

IPC-1401B: Corporate Social Responsibility Management System Standard

IPC -1751B: Generic Requirements for Declaration Process Management

IPC-6013F: Qualification and Performance Specification for Flexible/Rigid-Flexible Printed Boards

IPC-4413 - Am1: Specification for Finished Fabric Woven from Low Dk Glass for Printed Boards