Standards | electronics.org

Close

Contact Us

Your results

Products

IPC-6018DS

Document #:

Revision

D

Product Type

Released: 08/04/2022

Language

English

The IPC-6018DS addendum supplements or replaces specifically identified requirements of IPC-6018D, for high frequency (microwave) printed boards that must survive the vibration, ground testing and thermal cyclic environments of space and military avionics. The IPC-6018DS addendum incorporates new requirements in areas such as copper wrap plating, dewetting, pad/land anomalies, copper cap plating...

Document #:

Revision

E

Product Type

Released: 10/28/2022

Language

Chinese

Current Revision

IPC-6012E-AM1是IPC-6012E的修订本，澄清了再流焊SnPb或HASL镀层中退润湿和焊料回缩之间的区别。该修订本还为成品印制板的最小外部导体厚度提供了修订标准，并为内部电镀层的最小厚度提供了新的接受标准。

Document #:

Revision

D

Product Type

Released: 04/01/2016

Language

English

This Addendum, when required by procurement documentation/drawings, supplements or replaces specifically identified requirements of IPC-6012D, Revision D, for rigid printed boards that must survive the vibration and thermal cycling environments of electronic interconnects within the automotive industry.

no-image-available

Document #:

Revision

D

Product Type

Released: 01/25/2019

Language

Turkish

Current Revision

Bu döküman; kaplı delikiçine sahip olan veya olmayan tek yüzlü, çift yüzlü baskı devre kartları ve kör/gömülü geçiş deliklerine sahip olan veya olmayan çok katmanlı baskı devre kartları ile metal çekirdekli kartları içeren sert baskı devre kartlarının kalifikasyonunu ve performansını kapsamaktadır. Son kaplama ve yüzey kaplama gereklilikleri, iletkenler, delikler/geçiş delikleri, kabul testlerinin...

Document #:

Revision

D

Product Type

Released: 09/22/2015

Language

English

This Addendum supplements or replaces specifically identified requirements of IPC-6012D, Revision D, for rigid printed boards that must survive the vibration, ground testing and thermal cyclic environments of space and military avionics

no-image-available

Document #:

Revision

C

Product Type

Released: 03/09/2021

Language

German

Current Revision

Ergänzung 1 zu IPC-7711/21C-DE, das Dokument enthält Verfahren für das Entfernen und Montieren von D-Pak-Komponenten.

no-image-available

Document #:

Revision

C

Product Type

Released: 03/12/2021

Language

Spanish

Current Revision

Enmienda 1 al IPC-7711/21C, el documento proporciona los procedimientos para la extracción y la instalación de componentes D-Pak.

no-image-available

Document #:

Revision

C

Product Type

Released: 11/20/2020

Language

Chinese

Current Revision

IPC-7711/21C的修订本1，本文件提供D-Pak元器件的去除和安装程序.

no-image-available

Document #:

Revision

C

Product Type

Released: 03/12/2021

Language

French

Current Revision

Amendement 1 à IPC-7711 / 21C fournit des procédures supplémentaires de retrait et d'installation

Document #:

Revision

C

Product Type

Released: 08/09/2016

Language

English

This Addendum supplements or replaces specifically identified requirements of IPC-6018C, for high frequency (microwave) printed boards that must survive the vibration, ground testing and thermal cyclic environments of space and military avionics.

Document #:

Revision

Original Version

Product Type

Released: 04/07/2020

Language

English

The IPC-1602 standard provides requirements intended to protect printed boards from contamination, physical damage, solderability degradation and moisture uptake. Consideration is given to packaging materials types and methods, production environment, handling and transport of product, and establishing baking profiles for moisture removal. IPC-1602 is now providing requirements that can be called...

no-image-available

Document #:

JEDEC/ECIA/IPC-J-STD-046

Revision

Original Version

Product Type

Released: 11/14/2016

Language

English

This standard establishes the requirements for timely customer notification of changes to electronic products and associated processes.

Document #:

Revision

Original Version

Product Type

Released: 07/01/2006

Language

English

IPC-4761 is the sole industry guideline providing PCB designers, manufacturers and uses with detailed information on all existing methods for protecting vias on printed boards, including all types of via tenting, plugging, filling and capping. Production issues, long term reliability concerns and material specification and selection are provided to aid in evaluating the benefits and concerns for...

no-image-available

Document #:

Revision

Original Version

Product Type

Released: 05/02/2015

Language

English

This standard is applicable to suppliers of, and affected customers for, electronic products and their constituent components. The goal of this notification standard is to better enable customers to manage and mitigate the disruption caused by the discontinuation of a product and to ensure continuity of supply. This standard establishes the requirements for timely customer notification of planned...

Document #:

Revision

Original Version

Product Type

Released: 07/01/1996

Language

English

This specification establishes the general requirements and responsibilities for suppliers and users of printed boards. Serving as the foundation for the IPC-6010 Board Performance Documents series, it describes quality and reliability assurance requirements that must be met. For use with IPC-6012 through IPC-6018. Supersedes IPC-RB-276, IPC-SC-320, IPC-TC-500, IPC-ML-950C. 15 pages. Released July...

Document #:

Revision

Original Version

Product Type

Released: 11/01/1999

Language

English

IPC-9191 reflects the principals of statistical process control (SPC) represented by ISO/DIS 11462-1, Guidelines for Implementation of Statistical Process Control (SPC) -- Part 1: Elements of SPC. This document outlines the SPC philosophy, implementation strategies, tools, and techniques used for relating process control and capability to final product requirements. Supersedes IPC-PC-90.

no-image-available

Document #:

Revision

Original Version

Product Type

Released: 10/01/1993

Language

English

Discusses the many variables and problems associated with the process--from sample removal to micro-etch-- and the variables common to high volume microsection. The process variables and problems are organized so that the reader can research a specific issue or overview the variables of a process area. 31 pages. Released October 1993.

Document #:

Revision

Original Version

Product Type

Released: 12/15/2010

Language

English

IPC-9631 addresses concerns and considerations related to IPC-TM-650, Method 2.6.27, Thermal Stress, Convection Reflow Assembly Simulation. This document describes how the test method is intended for use and the rationale behind some of the protocols and requirements. This document was developed with the understanding that the test method will require special equipment and the proper set-up and...

Document #:

Revision

Original Version

Product Type

Released: 09/01/2004

Language

English

This guideline standard is intended to aid in interpretation of the requirements in IPC-9191, "General Guidelines for Implementation of Statistical process Control," specifically for printed board assembly (PBA) manufacture. This document and IPC-9191 should be used together; the standards are cross-referenced to each other in the Appendices of this guideline. This standard promotes process...

Document #:

Revision

Original Version

Product Type

Released: 05/01/2001

Language

English

During mass soldering, it is important that all solder joints reach the minimum soldering (reflow) temperature to assure metallurgical bonding of the solder alloy and the base metals to be soldered. Metallurgical bonding requires that both surfaces to be soldered, as well as the solder, reach this minimum soldering temperature for a sufficient time to allow the wetting of the solder surfaces. This...

Document #:

Revision

Original Version

Product Type

Released: 03/18/2009

Language

English

Implementing flip chip technology in a direct chip attach (DCA) assembly presents some unique challenges for design, assembly, inspection and repair personnel. IPC-7094 delivers useful and practical information to anyone who is currently using or contemplating developing products that employ the very complex and high density methods needed for the flip chip technology. The concepts have become...

Document #:

Revision

Original Version

Product Type

Released: 02/01/2016

Language

English

This handbook is an essential resource for anyone involved in manufacturing or purchasing PCBs. Hundreds of real-world, full-color photos spotlight more than 650 PCB process defects, with causes and corrective actions for each. IPC-9121 supersedes the PCB sections of IPC-PE-740A. Released March 2016

Document #:

Revision

Original Version

Product Type

Released: 03/28/2011

Language

English

This standard describes the design and assembly challenges for implementing Bottom Termination surface mount Components (BTCs) whose external connections consist of metallized terminals that are an integral part of the component body. The BTCs in this document include all types and forms of bottom-only termination components intended for surface mounting. This includes such industry descriptive...

Document #:

Revision

Original Version

Product Type

Released: 03/19/2009

Language

English

This new standard supplements existing IPC-6010 series specifications with qualification and performance requirements for in-process and finished printed boards containing embedded passive circuitry (distributive capacitive planes and capacitive or resistive components). 10 pages. Released March 2009. Included in Collections C-105, C-1000 and the 6010 Series

Document #:

Revision

Original Version

Product Type

Released: 09/25/2017

Language

English

The IPC-7091 intends to provide useful and practical information to those who are designing, developing or using 3D-packaged semiconductor components or those who are considering 3D package implementation. The 3D semiconductor package may include multiple die elements—some homogeneous and some heterogeneous. The package may also include several discrete passive SMT devices, some of which are...

no-image-available

Document #:

Revision

D

Product Type

Redline Standard

Released: 10/30/2015

Language

English

Track the substantive changes in IPC-6012D with this redline product. This is the D revision in its entirety, with each change highlighted on the page. Click the text to launch a pop-up with an explanation of the change from the C revision. Available for download only. IPC-6012D covers qualification and performance of rigid printed boards, including single-sided, double-sided, with or without...

no-image-available

Document #:

Revision

Original Version

Product Type

Released: 02/18/2015

Language

English

This document describes the design and assembly challenges for implementing passive and active components, in either formed or placed methodology, into a printed board. It provides useful and practical information to decision makers of formed or placed, passive or active components and helps establish inspection techniques, testing processes, and reliability validations. Users will also learn...

Document #:

Revision

Original Version

Product Type

Released: 05/14/2019

Language

English

The IPC-2231 standard provides guidelines for establishing a best practice methodology for use in developing a formal DFX (Design for Manufacturing, Fabrication, Assembly, Testability, Cost, Reliability, Environment, Reuse) process for layout of printed board assemblies that utilize surface mount and through hole devices.

Document #:

Revision

Original Version

Product Type

Released: 09/05/2018

Language

English

IPC-1791 provides minimum requirements, policies and procedures for printed board design, fabricating and assembly organizations and/or companies to become trusted sources for markets requiring high levels of confidence in the integrity of delivered products. Demonstration of the ability to meet and maintain the requirements of IPC-1791 as trusted design, fabricator or assembly organization...

Document #:

Revision

Original Version

Product Type

Released: 11/01/2016

Language

English

The lack of a uniform component traceability standard has caused an unnecessary consumption of resources (e.g., time, people, money, etc.) to track events or parts to their sources and to remedy any quality, reliability, etc., issues. Lack of a standard has also made it difficult to uniformly create and appropriately enforce the necessary contracts. This standard establishes minimum requirements...

Document #:

Revision

Original Version

Product Type

Released: 03/01/2017

Language

English

This standard helps companies achieve intended outcomes of a supply chain social responsibility management system, creating value for the company, its customers, its suppliers and other stakeholders. Users of this standard can expect the following outcomes: Enhancement of working conditions, environmental performance and ethics level of the supply chain Fulfillment of compliance obligations and...

Document #:

Revision

M

Product Type

Released: 06/30/2015

Language

French

Ce document essentiel pour l’industrie fournit des descriptions et des illustrations de la terminologie de l’industrie d’assemblage électronique afin d’aider les utilisateurs et leur clients à casser les barrières linguistiques. La révision M contient plus de 220 termes nouveaux ou révisés, incluant la nouvelle terminologie pour les procédés de tropicalisation, d’enrobage et d’encapsulation, la...

no-image-available

Document #:

Revision

E

Product Type

Released: 06/14/2022

Language

Japanese

Current Revision

購入仕様書/図面でIPC-6012EA追加規格の適用を要求される場合、本追加規格は、振動および熱サイクル環境に耐えることが求められるリジッドプリント板に対し、IPC-6012E-リビジョンEに記載する具体的な特定要件を補完する、もしくは置き換えるものである。今回の本文書の改訂では、次の要求事項への更新が行われた：ランド浮き、パターン形状精度、絶縁体除去(例：ウィッキング)、ソルダマスク厚さ、清浄度、適合性と信頼性試験。

no-image-available

Document #:

Revision

F

Product Type

Released: 04/10/2025

Language

Chinese

Current Revision

IPC-6012FS 航天补充标准为 IPC-6012F 航天和军事航空应用提供了 IPC 3 级性能等级要求的例外情况。例外情况包括更改验收标准和/或样品大小以及生产批次验收测试的测试频率。IPC-6012FS 涵盖了刚性印制板在太空旅行环境中承受振动、极端热循环和静态地面测试的要求。取代 IPC-6012ES。

no-image-available

Document #:

Revision

E

Product Type

Released: 06/14/2022

Language

Chinese

Current Revision

IPC-6012EA 附录在采购文件/图纸要求时，补充或替代 IPC-6012E 修订版 E 的明确要求，适用于必须经受住汽车行业电子互连的振动和热循环环境的刚性印制板。本文档的修订更改包括对提升焊盘、图案特征精度、电介质去除（例如芯吸）、阻焊层厚度、清洁度和适用性以及可靠性测试参数的更新要求。

IPC-6012EM CN Cover

Document #:

Revision

E

Product Type

Released: 07/28/2021

Language

Chinese

Current Revision

采购文档/图纸要求时，IPC-6012EM附录可补充或替代IPC-6012E的特定标识要求，这些要求适用于必须满足高可靠性医疗设备应用要求的刚性印制板。 IPC-6012EM是医疗行业唯一针对刚性印制板的资格和性能规格的全球行业共识标准。

no-image-available

Document #:

Revision

E

Product Type

Released: 01/18/2021

Language

Japanese

Current Revision

IPC-6012ES 宇宙用途向け追加規格では宇宙および軍用アビオニクス製品に適用される、IPC-6012Eのクラス3要件への例外事項を示している。これら例外事項には、生産ロット受入れ試験に関する許容基準やサンプルサイズおよび試験頻度などへの変更が含まれる。

no-image-available

Document #:

Revision

E

Product Type

Released: 11/20/2020

Language

Chinese

Current Revision

IPC-6012ES附录为用于太空和军用航空电子产品的IPC-6012E的3类要求提供了例外。例外情况包括对生产批次验收测试的验收标准和/或样本大小以及测试频率的更改。 IPC-6012ES涵盖了刚性印刷电路板的要求，以抵抗振动，极端热循环以及与太空旅行环境相关的地面测试。

Document #:

Revision

M

Product Type

Released: 09/19/2016

Language

Chinese

本文件是电子互连行业不可或缺的术语标准。该文件图文并茂，可帮助用户及其客户克服语言上的沟通障碍。M版本包含超过220多条新术语或修订术语，包括敷形涂覆、灌封和封装工艺、模板设计、统计工艺控制和挠性印制板技术。也包括通用行业缩写词。

no-image-available

Document #:

Revision

C

Product Type

Redline Standard

Released: 05/30/2017

Language

English

This is a redline document showing the changes from IPC-7711/21B to IPC-7711/21C. This 790+ page document provides a side-by-side comparison of the two documents and includes the figures. The document shows the deleted/changed text in the IPC-7711/21B pages and the new/revised text in purple highlights in the IPC-7711/21C pages. Yellow pop-up boxes are also present in the IPC-7711/21C pages to...

Document #:

Revision

D

Product Type

Released: 01/26/2017

Language

German

Current Revision

Diese Ergänzung modifiziert oder ersetzt, falls in der Beschaffungsdokumentation oder den Zeichnungen gefordert, spezielle Anforderungen von IPC-6012D-DE für starre Leiterplatten, die Vibrationen und thermische Zyklen in den Umgebungsbedingungen für elektronische Verbindungen in der Automobilbranche überstehen müssen. Erschienen im April 2016. Übersetzt im September 2016.

Document #:

Revision

D

Product Type

Released: 11/18/2016

Language

Chinese

Current Revision

简要介绍（英文）当采购文件/图纸有要求时，本附件补充或替代IPC-6012D中的特殊鉴定要求，以确保汽车行业的印制板的可靠性可以经受住振动和热循环环境下的电气连接。2016年4月发布。2016年8月翻译

Document #:

Revision

D

Product Type

Released: 11/18/2016

Language

Spanish

Current Revision

Esta adición suplementa o reemplaza específicamente identificado requisitos del IPC-6012D, revisión D, para los tableros impresos rígidos que tienen que sobrevivir a la vibración, ensayos/pruebas en tierra y ambientes cíclicos térmicos de espacio y aviónica militar.

Document #:

Revision

D

Product Type

Released: 06/09/2016

Language

French

Current Revision

Cet Avenant complète ou remplace les exigences de l’IPC-6012D, version D, spécifiquement identifiées pour les circuits imprimés rigides qui doivent supporter les environnements de vibration, de contrôle sur le terrain et de cyclage thermique du spatial et de l'aéronautique militaire.

Document #:

Revision

D

Product Type

Released: 12/15/2015

Language

German

Current Revision

Diese Ergänzung ergänzt oder ersetzt spezielle Anforderungen in IPC-6012D-DE, Ausgabe D für starre Leiterplatten, die Vibrationen, Bodentests und die Umgebungsbedingungen thermischer Zyklen von Raumfahrt und militärischer Luftfahrt bestehen müssen.

Document #:

Revision

H

Product Type

Released: 06/06/2014

Language

Japanese

これは明確に記述されたプリント回路板の受け入れ基準の指標である。この4色の文章は、対象の実装されていないプリント板の外部又は内部の写真・説明図、受け入れ基準及び基準不適合を示している。作業者、検査者、技術者は、最新の知られている技術情報を知る様にしなければならない。改訂H版は、90以上の写真・説明図を、銅めっき、導電体で充填したホール上部の銅めっき、プリント板のミーズリングに関わるホール周辺/バレルの分離の最新情報、層間剥離及びハローイング、積層のボイド/クラック、エッチバック、ブラインド及びベリードビアの充填状況、及びフレキシブルプリント回路について示している。

Document #:

Revision

H

Product Type

Released: 04/15/2013

Language

French

Le guide définitif illustré de l’acceptabilité des circuits imprimés. Ce document de référence en couleur défini et illustre avec des photos et des dessins, les critères « objectifs », « acceptables » et « non conformes » qui sont observables en interne ou en surface des circuits imprimés. Assurez vous que vos opérateurs, vos contrôleurs et vos ingénieurs possèdent les informations les plus...

no-image-available

Document #:

Revision

J

Product Type

Released: 01/11/2017

Language

German

Das ultimative, illustrierte Handbuch für Annahmekriterien von Leiterplatten! Dieses Dokument im Vierfarben-Druck enthält Bilder und Illustrationen der Zustände „Anzustreben“, „Zulässig“ und „Fehler“, die an unbestückten Leiterplatten im Innern oder auf der Oberfläche beobachtbar sind. Stellen Sie sicher, dass Ihre Bediener, Prüfer und Ingenieure über die aktuellste Version dieses Branchen-Konsens...

no-image-available

Document #:

Revision

H

Product Type

Released: 04/04/2013

Language

Polish

Pełne, ilustrowane wydanie przewodnika dla kryteriów dopuszczenia płyt drukowanych. Niniejszy czterokolorowy dokument dostarcza fotografii i ilustracji stanów docelowych, dopuszczalnych i niezgodnych, które są dostrzegalne wewnętrznie lub zewnętrznie na gołych płytkach drukowanych. Upewnij się, że Twoi operatorzy, inspektorzy i inżynierowie posiadają najnowsze informacje uzgodnione w przemyśle...

no-image-available

Document #:

Revision

J

Product Type

Released: 09/29/2016

Language

French

Le guide définitif illustré de l’acceptabilité des circuits imprimés. Ce document de référence en couleur défini et illustre avec des photos et des dessins, les critères « objectifs », « acceptables » et « non conformes » qui sont observables en interne ou en surface des circuits imprimés. Assurez vous que vos opérateurs, vos contrôleurs et vos ingénieurs possèdent les informations les plus...

Document #:

Revision

H

Product Type

Released: 04/13/2010

Language

German

Dieses Handbuch beschreibt die Abnahmekriterien für unbestückte Leiterplatten. Das Dokument enthält farbige Abbildungen und Fotos definiert die Abnahmekriterien ür folgende Zustände: Anzustreben, Zulässig und Fehler für äußerlich sichtbare und innere sichtbare Zustände von unbestückten Leiterplatten. Dadurch stehen Anwendern und Prüfern durch die Industrie anerkannte Informationen zur Verfügung...

no-image-available

Document #:

Revision

J

Product Type

Released: 07/30/2019

Language

Chinese (Zhōngwén)

印製板可接受性的權威指南！這份有4種顏色的文件針對印製板裸板，不管是從內部還是外觀可觀察的目標，可接受和不符合情況提供了圖片和解釋。確保操作員，檢驗員和工程師擁有最新的行業知識信息。有120條新或修訂的圖片和解釋，J版本提供新的知識點，例如微導通孔接觸尺寸，電鍍，空洞和填充，伴隨著介質去除的更新和延伸（凹蝕，去鑽污和芯吸），電鍍摺皺和板邊連接器的表面鍍層，SMT和BGA焊盤，標記，孔對位，分層，蓋覆電鍍，導通孔填充和撓性電路。本文件與IPC- 6012D和IPC-6013R裡面的可接受性要求同點。取代了IPC-A-600H.180頁。於2016年5月發布。2016年6月翻譯。

no-image-available

Document #:

Revision

J

Product Type

Released: 08/13/2020

Language

Thai

คู่มือภาพประกอบที่ชัดเจนถึงการยอมรับของบอร์ดพิมพ์! เอกสารสี่สีนี้จัดให้มีภาพถ่ายและภาพประกอบของสภาวะเป้าหมาย ยอมรับได้ และที่ไม่เป็นไปตามข้อกำหนด ซึ่งสามารถสังเกตเห็นได้จากภายในหรือภายนอกบนบอร์ดพิมพ์เปล่า ตรวจสอบให้แน่ใจว่าพนักงาน ผู้ตรวจสอบ และวิศวกรของคุณ มีข้อมูลที่สอดคล้องกับมติอุตสาหกรรมฉบับล่าสุด ด้วยจำนวน 120 ภาพถ่ายใหม่หรือภาพประกอบที่มีการแก้ไข ฉบับปรับปรุง J...

no-image-available

Document #:

Revision

J

Product Type

Released: 01/26/2017

Language

Spanish

La guía ilustrada definitiva para aceptabilidad de tablero de circuito impreso. Este documento de cuatro colores ofrece fotografías e ilustraciones de las condiciones ideal, aceptables y noconforme que son internamente o externamente observable en tableros impresos sin componentes. Asegúrese de que sus ingenieros, inspectores y operadores tengan la información más actualizada de consenso de la...

Document #:

Revision

Original Version

Product Type

Released: 09/01/2019

Language

English

The amendment 2 to IPC-9121 provides new troubleshooting topics on hole quality, laser drilling, microvias, drill smear, electroless nickel, organic solderability preservative (OSP) and rigid-flex boards.

Document #:

Revision

H

Product Type

Released: 09/17/2009

Language

Chinese

Description in English 本文件是电子互连行业不可或缺的一份术语标准。该文件图文并茂，可帮助用户及其客户克服语言上的沟通障碍。H版本包含200多条新术语或修订术语，新术语涉及球栅阵列和芯片尺寸封装、导通孔保护、导体图形、组装工艺、基材和选择性电镀工艺等。还包括通用工业缩写词和根据技术分类排序的术语索引，以便于查找。全文276页，于 2008年7月公布。

Document #:

Revision

J

Product Type

Released: 11/13/2016

Language

Chinese

印制板可接受性的权威指南！这份有4种颜色的文件针对印制板裸板，不管是从内部还是外观可观察的目标、可接受和不符合情况提供了图片和解释。确保操作员、检验员和工程师拥有最新的行业知识信息。有120条新或修订的图片和解释，J版本提供新的知识点，例如微导通孔接触尺寸，电镀，空洞和填充，伴随着介质去除的更新和延伸（凹蚀、去钻污和芯吸），电镀折皱和板边连接器的表面镀层，SMT和BGA焊盘，标记，孔对位，分层，盖覆电镀，导通孔填充和挠性电路。本文件与IPC-6012D和IPC-6013R 里面的可接受性要求同点。取代了IPC-A-600H。

Document #:

Revision

H

Product Type

Released: 04/13/2010

Language

Chinese

配有大量插图的印制电路板可接受性权威指南标准！本文件配有大量的彩色图片和示意图，提供了可从裸板内部或外部观察到的目标条件、可接受条件及不符合条件。确保操作员、检验人员及工程师掌握行业最新的信息。H版有90多幅图片为新增或经修订，新增的内容涉及铜包覆电镀、填塞孔的铜盖覆电镀及孔壁分离，更新和扩充了印制板的白斑覆盖、分层和晕圈、层压板空洞/裂缝、凹蚀、盲导通孔和埋导通孔的填塞及挠性电路等内容。本文件中的一些要求已与IPC-6012C及IPC-6013B相关的可接受性要求保持了同步。

Document #:

Revision

Original Version

Product Type

Released: 04/02/2018

Language

English

IPC-9121 AM1 is an amendment to IPC-9121 which provides updates to the Hole Preparation/Protection and Interconnect Formation sections, covering troubleshooting topics and guidance on nonconductive plugging paste, microvias and pattern plating rim voids. IPC-9121 AM1 also includes a new section on Flexible Circuits.

no-image-available

Document #:

Revision

C

Product Type

Released: 09/24/2019

Language

Chinese

Current Revision

本补充标准提供的要求，是对已发布的IPC-6018C 中要求的补充和某些情况下的替代，以确保用于航天和军事航空电子设备中的印制电路板能够在振动、静态测试和热循环环境条件下的可靠性。2016年7月发布，2019年8月翻译。.

no-image-available

Document #:

Revision

Original Version

Product Type

Released: 04/11/2019

Language

English

The IPC-1791-Am1 provides revisions and clarifications for requirements pertaining to CAGE Code, citizenship, security, foreign person access, traceability records and NIST SP 800-171 compliance.

no-image-available

Document #:

Revision

H

Product Type

Released: 08/01/2010

Language

English

This is a list of reported errata to the printed copies of IPC-A-600H. Pen and ink changes should be made in accordance with your company's document control policies.

no-image-available

Document #:

Revision

Original Version

Product Type

Development Packet

Released: 06/06/2012

Language

English

Current Revision

This document has been created to help define criteria that will yield better test methods for use by the electronics and related industries. Key objectives to validating a new test method procedure are covered, including the usage of objective evidence to verify that the elements defined within a method fulfill the intended use and that the method yields repeatable and reproducible results when...

no-image-available

Document #:

Revision

E

Product Type

Released: 04/28/2020

Language

Chinese

IPC-6012E建立并规定了刚性印制板生产的鉴定及性能要求，适用于已完成的单双面板、带孔或不带镀覆孔、带或不带埋盲孔/微导通孔、无源和金属芯印制板。规范涉及成品印制板材料、外观、尺寸、导体精度、结构完整性、阻焊膜、电气和清洁度要求，并规定了刚性印制板的鉴定测试、验收测试及质量一致性测试的频次。与IPC-6011一起使用。取代IPC-6012D。2020年3月发布。2020年4月翻译。 Single-Device DRM-Protected Document This document has single-device/user digital rights management (DRM) protection. This document will only be accessible by a single user on a single device. If you are...

no-image-available

Document #:

Revision

Original Version

Product Type

Released: 10/04/2023

Language

Chinese

Current Revision

IPC-1602 标准提供了保护印制板，避免其受到污染、物理损坏、可焊性降低和吸湿的要求。要考虑包装的材料类型和方法、生产环境、产品的操作和运输，以及为除水汽建立烘烤曲线。IPC-1602 提供了可在采购文件中列出的要求。IPC-1602 标准扩充了防潮袋 (MBB) 的覆盖范围、烘烤对印刷板可焊性的影响、ESD 问题、蚀刻的芯板和压合结构的的湿气关注、干燥剂材料和湿度指示卡（HIC），以及传递对包装和操作要求的范例。IPC-1602替代了原IPC-1601A即印制板操作和存储指南的许多建议性要求，而改为强制性要求

no-image-available

Document #:

Revision

Original Version

Product Type

Released: 08/11/2023

Language

Japanese

Current Revision

規格書「IPC-1602」はプリント基板を汚染や物理的損傷、はんだ付性の低下や吸湿から保護することを目的とし、その要求事項を取りまとめたものである。梱包資材の種類や梱包方法、製品の製造環境、取扱いと輸送、また、水分除去を目的としたベーキングプロファイルの策定などに関し、懸念事項が示されている。今回のIPC-1602では、調達文書に記載可能な要求事項についても触れている。本規格書「IPC-1602」では、防湿袋(MBB)、プリント基板をベーキングすることによるはんだ付性への影響、ESD問題、エッチング後のコア材・複合材の湿気に関する懸念事項、乾燥剤とHICカード、梱包/取扱いに関する要求事項のフローダウン例など幅広い内容を網羅している。

Document #:

Revision

D

Product Type

Released: 07/22/2016

Language

Chinese

此标准涵盖刚性印制板的鉴定和性能，包括单面、双面板、带孔或不带镀覆孔、带或不带盲孔/埋孔和金属芯的多层板。该规范涉及最终产品和表面处理涂敷要求、导体、通孔/过孔、验收测试频次和质量一致性以及电气、机械和环境要求。D版本中新增了HASL涂敷、选择表面处理、边缘电镀、标示、微盲孔、填孔的铜包覆电镀、电介质移除等。此规范取代6012C版本和IPC-6016，与IPC-6011配套使用。全文59页。2015年9月发布。2015年12月翻译

IPC-6011 Cover Image

Document #:

Revision

Original Version

Product Type

Released: 12/13/2021

Language

Chinese

Current Revision

本规范规定了印制板供应商和用户的一般要求和责任。作为 IPC-6010 板性能文档系列的基础，它描述了必须满足的质量和可靠性保证要求。用于 IPC-6012 到 IPC-6018。取代 IPC-RB-276、IPC-SC-320、IPC-TC-500、IPC-ML-950C。 15 页。 1996 年 7 月发行。

Document #:

Revision

G

Product Type

Released: 04/23/2008

Language

Japanese

Download the free Amendment 1 (.pdf) that resolves conflict in measles criteria between J-STD-001D, IPC-A-610D, IPC-6012B and IPC-A-600G. This is the Japanese Language version of IPC-A-600G. Purchase of the print version includes one English color copy and one Japanese black and white copy. The Japanese language electronic copy is in color. The definitive illustrated guide to printed circuit board...

no-image-available

Document #:

Revision

Original Version

Product Type

Released: 04/09/2020

Language

Chinese

Current Revision

本文件提供了制定最佳实践方法的指南，用于在开发正式DFX（面向可制造性、可制作性、可组装性、可测试性、成本、可靠性、环境、重用性设计）的过程中对采用表面贴装和通孔器件的印制板组件进行布局。

Document #:

Revision

G

Product Type

Released: 01/13/2009

Language

Polish

Download the free Amendment 1 (.pdf) that resolves conflict in measles criteria between J-STD-001D, IPC-A-610D, IPC-6012B and IPC-A-600G. This is the Polish Language version of IPC-A-600G. Purchase of the print version includes one English color copy and one Polish black and white copy. The Polish language electronic copy is in color. The definitive illustrated guide to printed circuit board...

no-image-available

Document #:

Revision

G

Product Type

Released: 09/17/2008

Language

Swedish

This is the Swedish Language version of IPC-A-600G. The definitive illustrated guide to printed circuit board acceptability! This four-color document provides photographs and illustrations of the target, acceptable and nonconforming conditions that are either internally or externally observable on bare printed boards. Make sure your operators, inspectors, and engineers have the most current...

no-image-available

Document #:

Revision

E

Product Type

Released: 01/22/2021

Language

Japanese

IPC-6012Eの規格は、片面基板、両面基板、めっきスルーホール有り・無しの基板、ブラインドビア/ベリードビア有り・無しの多層基板およびメタルコア基板を含む、リジッドプリント板の認定および性能について記載している。本書は最終仕上げ処理および表面めっきコーティングの要件、導体、ホール/ビア、受入れ試験頻度、品質適合性、および電気的、機械的、環境的要件に対応している。IPC-6012Eではバックドリル構造、表面処理の代替工法、銅ラップめっき、マーキングインク、はんだ付性試験、めっきオーバーハング (はみ出し)、断面評価、熱衝撃、マイクロビア構造のための性能に基づく試験などの分野で新規かつ広範におよぶ多くの要件が採用されている。IPC-6011との併用可。IPC-6012Dに優先する。

Document #:

Revision

Original Version

Product Type

Released: 01/20/2020

Language

Chinese

Current Revision

本标准描述了在印制板中以成形或放置方式实现的有源和无源元器件在设计和组装方面的挑战。包括内部电子元器件的完整结构可用于表面贴装和／或通孔元器件连接。在组装过程中，多层结构变成准备为进一步加工的完整产品，它可由有机、无机（陶瓷）或两类兼有的材料制成。

no-image-available

Document #:

Revision

G

Product Type

Released: 07/30/2004

Language

Chinese

This is the Chinese Language version of IPC-A-600G. The definitive illustrated guide to printed circuit board acceptability! This four-color document provides photographs and illustrations of the target, acceptable and nonconforming conditions that are either internally or externally observable on bare printed boards. Make sure your operators, inspectors, and engineers have the most current...

Coming Soon

IPC-9242: Guidelines for Microsection Evaluation

IPC-9691C: User Guide for the IPC-TM-650, Method 2.6.25 Conductive Anodic Filament (CAF) Resistance and Other Internal Electrochemical Migration Testing

IPC-A-630A: Acceptability Standard for Manufacture, Inspection, and Testing of Electronic Enclosures

IPC-4556A: Specification for Electroless Nickel/Electroless Palladium/ Immersion Gold (ENEPIG) Plating for Printed Boards

IPC-7527A: Requirements for Solder Paste Application

IPC-4204C: Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Boards

IPC-J-STD-002F: Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires

IPC-4101F: Specifications for Base Materials for Rigid and Multilayer Printed Boards

IPC-1755B: Responsible Sourcing of Minerals Data Exchange Standard

IPC-2223F: Sectional Design Standard for Flexible/Rigid-Flexible Printed Boards

IPC-HDBK-9798A: Handbook and Guide to Supplement IPC-9797

IPC-WP-011: Guidance for Strain Gage Limits for Assemblies

J-STD-046A: Customer Notification Standard for Product/Process Changes by Electronic Product Suppliers

J-STD-048A: Notification Standard for Product Discontinuance

IPC-T-50P: Terms and Definitions for Interconnecting and Packaging Electronic Circuits

IPC-1401B: Corporate Social Responsibility Management System Standard

IPC -1751B: Generic Requirements for Declaration Process Management

IPC-6013F: Qualification and Performance Specification for Flexible/Rigid-Flexible Printed Boards

IPC-4413 - Am1: Specification for Finished Fabric Woven from Low Dk Glass for Printed Boards