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Document #:
Revision
Original Version
Product Type
Released:  06/01/2007
Language
English
Current Revision
Every electronics manufacturer, whether an original equipment manufacturer (OEM) or electronics manufacturing services (EMS) company, must determine if the unpopulated printed boards entering the assembly process have an adequate level of cleanliness. The question of “how clean is clean enough?” is one that has no definitive answer, as there is no "golden number" for board cleanliness. The issue...
Document #:
Revision
E
Product Type
Released:  02/20/2020
Language
English
IPC-6012E specification covers qualification and performance of rigid printed boards, including single-sided, double-sided, with or without plated-through holes, multilayer with or without blind/buried vias and metal core boards. It addresses final finish and surface plating coating requirements, conductors, holes/vias, frequency of acceptance testing and quality conformance as well as electrical...

IPC-9241 - Standard Only

Guidelines for Microsection Preparation

Document #:
Revision
Original Version
Product Type
Released:  01/13/2017
Language
English
Current Revision
This standard is intended as a guideline in the proper preparation of a metallographic sample (microsection) of a printed board. The finished microsection is used for evaluating the quality of the laminate system and plated structures (e.g. PTHs and vias). Microsection sample preparation is regarded by many as a highly developed skill. The guidelines in this standard discuss the many variables and...
Document #:
Revision
Original Version
Product Type
Released:  08/01/1985
Language
English
Current Revision
Defines a machine readable input format for Computer Numerical Control (CNC) drilling and routing machine tools used by the printed wiring board industry. The format may be used to transfer drilling and routing information between printed board designers, manufacturers and users or as the output CNC standard from converters that expand higher level design input such as IPC-D-350 data. Provides a...
Document #:
Revision
D
Product Type
Released:  09/22/2015
Language
English
This specification covers qualification and performance of rigid printed boards, including single-sided, double-sided, with or without plated-through holes, multilayer with or without blind/buried vias and metal core boards. It addresses final finish and surface plating coating requirements, conductors, holes/vias, frequency of acceptance testing and quality conformance as well as electrical...
Document #:
Revision
Original Version
Product Type
Released:  11/01/1989
Language
English
Current Revision
Covers the materials, qualification, certification and performance requirements for multilayer polymer thick film (PTF) printed, extrusion deposited, or otherwise applied conductor, insulator and through-hole technology. This specification may also be used for procurement of single and double-sided boards. 59 pages. Released November 1989.
Document #:
Revision
Original Version
Product Type
Released:  02/01/1987
Language
English
Current Revision
Describes the usage of libraries within the processing and generation of information files. The data contained within covers both the definition and usage of internal (existing within the information file) and external libraries. The libraries can be used to make generated data more compact and facilitate data exchange and archival. The subroutines within a library can be used one or more times...

IPC-D-351 - Standard Only

Printed Board Drawings in Digital Form

Document #:
Revision
Original Version
Product Type
Released:  08/01/1985
Language
English
Current Revision
Describes an intelligent, digital format for transfer of drawings between printed wiring board designers, manufacturers and customers. Also conveys additional requirements, guidelines and examples necessary to provide the data structures and concepts for drawing description in digital form. Supplements ANSI/IPC-D-350. Pertains to four basic types of drawings: master drawings, schematics, assembly...
Document #:
Revision
Original Version
Product Type
Released:  01/01/1995
Language
English
Current Revision
Describes an intelligent, digital data transfer format for describing component mounting information. Supplements IPC-D-350 and is for designers and assemblers. Data included are pin location, component orientation, etc. This document is frozen; no future updates are planned. 33 pages. Released January 1995.
Document #:
Revision
Original Version
Product Type
Released:  08/01/1985
Language
English
Current Revision
Describes the relationship between elements used in electromechanical design and packaging of printed boards. Includes descriptions for logical and physical elements necessary as input to a design system, as well as the network of interconnection description between the various electronic parts. Provides the capability of describing all elements in their final form upon design completion. The...
Document #:
Revision
Original Version
Product Type
Released:  07/10/2013
Language
English
Current Revision
Printed board flatness is largely affected by a change in intrinsic properties through exposure to variances in temperature. The worst case deviation of the printed board from flatness may be at room temperature, peak temperature during reflow, or at any temperature in between. Printed board flatness must therefore be characterized during the entire reflow thermal cycle, and not solely at room...
Document #:
Revision
Original Version
Product Type
Released:  09/01/2002
Language
English
Current Revision
This document is a tool for a customer or supplier organization's internal audit group to assess a statistical process control (SPC) system against the requirements of IPC-9191. This document should be used by customers and suppliers of any size and for any commodity. This tool can be used to perform an assessment of the use of SPC at both organizational and process levels. The questions in this...
Document #:
Revision
D
Product Type
Released:  09/01/2017
Language
English
The IPC-6013D covers qualification and performance requirements for flexible printed boards designed to IPC-2221 and IPC-2223. The flexible printed board may be single-sided, double-sided, multilayer or rigid-flex multilayer. All of these constructions may include stiffeners, PTHs, microvias, and blind/buried vias. IPC-6013D incorporates new and updated requirements for final finishes, rigid-to...

IPC-1756 - Standard Only

Manufacturing Process Data Management

Document #:
Revision
Original Version
Product Type
Released:  04/05/2010
Language
English
Current Revision
IPC-1756 establishes the requirements for exchanging manufacturing data between suppliers and customers for electrical and electronic products. IPC-1756 establishes 23 fields for declaration of manufacturing data supported by Scriba and other tools developed for use between users and suppliers. The type of manufacturing information includes sensitivity to moisture and high temperature, different...
Document #:
Revision
Original Version
Product Type
Released:  01/01/2009
Language
English
Current Revision
This document describes a PWB fabrication data quality rating system used by fabricators to evaluate incoming data package integrity. Includes information on conformance to both fabricator and customer design rules and can be used by printed board designers as an output quality check. 16 pages. Released February 1999.
Document #:
Revision
Original Version
Product Type
Released:  03/01/2000
Language
English
Current Revision
This voluntary standard establishes minimum requirements for the design, installation, operation and maintenance of electrically heated process equipment in order to minimize electrical hazards and prevent fires that may occur in combustible tanks, tank liners and drying equipment.

IPC-A-600 - Revision K - Standard Only

Abnahmekriterien für Leiterplatten

Document #:
Revision
K
Product Type
Released:  01/18/2021
Language
German
Current Revision
IPC-A-600K-DE ist das ultimative, illustrierte Handbuch für Annahmekriterien von Leiterplatten! Diese Richtlinie im Vierfarb-Druck enthält Bilder und Illustrationen der Zustände „Anzustreben“, „Zulässig“ und „Fehler“, die an unbestückten Leiterplatten im Innern oder auf der Oberfläche beobachtbar sind. Stellen Sie sicher, dass Ihre Mitarbeiter, Prüfer und Ingenieure über die aktuellste Version...

IPC-1601 - Revision A - Standard Only

Printed Board Handling and Storage Guidelines

Document #:
Revision
A
Product Type
Released:  06/27/2016
Language
English
The industry's sole guideline on the handling, packaging and storage of printed boards. The guidelines in this document are intended to protect printed boards from contamination, physical damage, solderability degradation and moisture uptake. Consideration is given to packaging material types and methods, production environment, handling and transport of product, and establishing baking profiles...

IPC-A-600 - Revision K - Standard Only

Acceptabilité des circuits imprimés

Document #:
Revision
K
Product Type
Released:  03/12/2021
Language
French
Current Revision
LʼIPC-A-600K est le guide illustré de référence sur lʼacceptabilité des circuits imprimés ! LʼIPC-A-600K est un document en quatre couleurs fournissant des photographies et des illustrations de la cible, des conditions « objectif », acceptables et non conformes qui sont observables en interne ou en externe sur des circuits imprimés nus. Veillez à ce que vos opérateurs, inspecteurs et ingénieurs...

IPC-7711/21 - Revision C - Standard Only

Rework, Modification and Repair of Electronic Assemblies

Document #:
Revision
C
Product Type
Released:  02/01/2017
Language
English
This guide provides procedures for rework, repair and modification of printed board assemblies. Included in this revision are the procedures previously released as change pages, an updated general information and common procedures section, new procedures for BGAs using focused IR Reflow Systems with integral preheater and general updates to all other procedures.

IPC-A-600 - Revision M - Standard Only

プリント基板の受入れ

Document #:
Revision
M
Product Type
Released:  11/25/2025
Language
Japanese
Current Revision
プリント基板の受入れに関する図解付きガイドの決定版!この4色刷りの文書では、ベアプリント基板の内部または外部から観察可能なコンディションについて、目標、許容可能、不適合といったそれぞれ状態を写真とイラストで解説している。本書は、オペレータ/検査担当者/エンジニアに必要な最新の業界コンセンサス情報を提供するものである。この改版(M版)では多数の写真と図を更新するとともに、プリント基板の端部めっき、キャビティ、端部のバリ、ディウェッティング、導体厚さ、アニュラリング(位置合わせ)内の銅の侵入、めっきボイド等のトピックを新規に、あるいは拡張して解説している。本書の内容は、IPC-6012FとIPC-6013Eに記載する許容要件と同期している。IPC-A-600Kに優先する。

IPC-6011 - Revision A - Redline Standard

Redline Comparison IPC-6011 to IPC-6011A

Document #:
Revision
A
Product Type
Released:  04/29/2025
Language
English
Current Revision
IPC-6011A Redline document shows the changes from IPC-6011 to IPC-6011A in a side-by-side comparison of the two documents. The IPC-6011A Redline is available in electronic format only.

IPC-T-50- Revision N - Standard Only

电子电路互连与封装术语及定义

Document #:
Revision
N
Product Type
Released:  01/13/2023
Language
Chinese
Current Revision
IPC-T-50N-CN文件旨在为电子行业中常用的词汇和术语提供其定义。本文件所规定的定义充分详细地阐明了术语,以便以英语为第二语言的读者能够理解含义的细微之处。IPC-T-50N-CN包含550多个新的或修订的术语,包括通孔结构、表面贴装器件类型、焊料凸点、焊料合金、焊接、退润湿、电路板制造工艺和测试的新术语。

Coming Soon

IPC-9242: Guidelines for Microsection Evaluation

IPC-9691C: User Guide for the IPC-TM-650, Method 2.6.25 Conductive Anodic Filament (CAF) Resistance and Other Internal Electrochemical Migration Testing

IPC-A-630A: Acceptability Standard for Manufacture, Inspection, and Testing of Electronic Enclosures

IPC-4556A: Specification for Electroless Nickel/Electroless Palladium/ Immersion Gold (ENEPIG) Plating for Printed Boards

IPC-7527A: Requirements for Solder Paste Application

IPC-4204C: Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Boards

IPC-J-STD-002F: Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires

IPC-4101F: Specifications for Base Materials for Rigid and Multilayer Printed Boards

IPC-1755B: Responsible Sourcing of Minerals Data Exchange Standard

IPC-2223F: Sectional Design Standard for Flexible/Rigid-Flexible Printed Boards

IPC-HDBK-9798A: Handbook and Guide to Supplement IPC-9797

IPC-WP-011: Guidance for Strain Gage Limits for Assemblies

J-STD-046A: Customer Notification Standard for Product/Process Changes by Electronic Product Suppliers

J-STD-048A: Notification Standard for Product Discontinuance

IPC-T-50P: Terms and Definitions for Interconnecting and Packaging Electronic Circuits

IPC-1401B: Corporate Social Responsibility Management System Standard

IPC -1751B: Generic Requirements for Declaration Process Management

IPC-6013F: Qualification and Performance Specification for Flexible/Rigid-Flexible Printed Boards

IPC-4413 - Am1: Specification for Finished Fabric Woven from Low Dk Glass for Printed Boards