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IPC/WHMA-A-620 - Revision C - Addendum - Space and Military

Space Applications Electronic Hardware Addendum to IPC/WHMA-A-620C

Document #:
IPC/WHMA-A-620
Revision
C
Product Type
Addendum
Released:  03/30/2018
Language
English
IPC/WHMA-A-620C-S provides additional requirements to IPC/WHMA-A-620C to ensure the reliability of cable and wire harness assemblies that must survive the vibration and thermal cyclic environments getting to and operating in space. The IPC/WHMA-A-620C-S space addendum cannot be used as a stand alone document, it must be used with the base standard IPC/WHMA-A-620C.
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IPC/WHMA-A-620 - Revision B - Addendum - Space and Military

Space Applications Electronic Hardware Addendum to IPC/WHMA-A-620B

Document #:
IPC/WHMA-A-620
Revision
B
Product Type
Addendum
Released:  06/01/2013
Language
English
When specifically required by procurement documentation, this Addendum supplements or replaces specifically identified requirements of IPC/WHMA-A-620, Revision B, providing additional requirements to ensure the reliability of cable and wire harness assemblies that must survive the vibration and thermal cyclic environments getting to and operating in space. The required IPC training & certification...
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IPC-A-620 - Revision A - Addendum with Amendment 1 - Space and Military

Space Applications Electronic Hardware Addendum to IPC/WHMA-A-620A

Document #:
IPC/WHMA-A-620
Revision
A
Product Type
Addendum
Released:  07/16/2012
Language
English
IPC/WHMA-A-620AS with Amendment 1 Space Applications Electronic Hardware Addendum to IPC/WHMA-A-620A Requirements and Acceptance for Cable and Wire Harness Assemblies. When specifically required by procurement documentation, this Addendum supplements or replaces specifically identified requirements of IPC/WHMA-A-620, Revision A of July 2006 by providing additional requirements to ensure the...

IPC-9191 - Standard Only

General Guidelines for Implementation of Statistical Process Control (SPC)

Document #:
IPC-9191
Revision
Original Version
Product Type
Standard Only
Released:  11/01/1999
Language
English
IPC-9191 reflects the principals of statistical process control (SPC) represented by ISO/DIS 11462-1, Guidelines for Implementation of Statistical Process Control (SPC) -- Part 1: Elements of SPC. This document outlines the SPC philosophy, implementation strategies, tools, and techniques used for relating process control and capability to final product requirements. Supersedes IPC-PC-90.

IPC-8497 - Standard Only

Cleaning Methods and Contamination Assessment for Optical Assembly

Document #:
IPC-8497
Revision
Original Version
Product Type
Standard Only
Released:  12/01/2005
Language
English
This standard describes the methods of inspecting and cleaning all optical interfaces so that interconnectivity integrity of the optical signal is maintained. The information provided focuses on techniques and methods to accomplish maximum quality of the interface and describes methods of contamination prevention. The target audience for this standard are Manufacturing Operators, Manufacturing...

IPC-9194 - Standard Only

Implementation of Statistical Process Control (SPC) Applied to Printed Board Assembly Manufacture Guideline

Document #:
IPC-9194
Revision
Original Version
Product Type
Standard Only
Released:  09/01/2004
Language
English
This guideline standard is intended to aid in interpretation of the requirements in IPC-9191, "General Guidelines for Implementation of Statistical process Control," specifically for printed board assembly (PBA) manufacture. This document and IPC-9191 should be used together; the standards are cross-referenced to each other in the Appendices of this guideline. This standard promotes process...

IPC-7530 - Standard Only

Guidelines for Temperature Profiling for Mass Soldering (Reflow & Wave) Processes

Document #:
IPC-7530
Revision
Original Version
Product Type
Standard Only
Released:  05/01/2001
Language
English
During mass soldering, it is important that all solder joints reach the minimum soldering (reflow) temperature to assure metallurgical bonding of the solder alloy and the base metals to be soldered. Metallurgical bonding requires that both surfaces to be soldered, as well as the solder, reach this minimum soldering temperature for a sufficient time to allow the wetting of the solder surfaces. This...

IPC-7094 - Standard Only

Design and Assembly Process Implementation for Flip Chip and Die Size Components

Document #:
IPC-7094
Revision
Original Version
Product Type
Standard Only
Released:  03/18/2009
Language
English
Implementing flip chip technology in a direct chip attach (DCA) assembly presents some unique challenges for design, assembly, inspection and repair personnel. IPC-7094 delivers useful and practical information to anyone who is currently using or contemplating developing products that employ the very complex and high density methods needed for the flip chip technology. The concepts have become...
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IPC/WHMA-A-620 - Revision E - Redline Standard

Requirements and Acceptance for Cable and Wire Harness Assemblies

Document #:
IPC/WHMA-A-620
Revision
E
Product Type
Redline Standard
Released:  03/06/2023
Language
English
IPC/WHMA-A-620E-RL is a redline document showing the difference from IPC/WHMA-A-620D to IPC/WHMA-A-620E. IPC/WHMA-A-620E-RL provides a side-by-side comparison of the two documents and includes the figures and tables. The document shows deleted/changed text in the IPC/WHMA-A-620D pages and new/revised text in the IPC/WHMA-A-620E pages. Due to the complexity of this document, it is only available in...
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IPC-A-610 - Revision G - Redline Standard

Acceptability of Electronic Assemblies-Redline

Document #:
IPC-A-610
Revision
G
Product Type
Redline Standard
Released:  10/31/2017
Language
English
This is a redline document showing the changes from IPC-A-610F with Amendment 1 to IPC-A-610G. This document provides a side-by-side comparison of the two documents and includes the figures and tables. The document shows the deleted/changed text in the IPC-A-610F with Amendment 1 pages and the new/revised text in purple highlights in the IPC-A-610G pages. Yellow pop-up boxes are also present in...
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IPC-A-610 - Revision F - Redline Standard

IPC-A-610 Revision E to Revision F Redline Comparison Document

Document #:
IPC-A-610
Revision
F
Product Type
Redline Standard
Released:  10/21/2014
Language
English
IPC-A-610 Revision E to Revision F Redline Comparison Document. This document is free to Task Group members participating in development of the standard and to Certification Centers with current training licenses for the associated Training and Certification program. CITs who are not members of the Task Group are encouraged to contact his or her MIT for a copy of the redline document.

IPC-7093 - Standard Only

Design and Assembly Process Implementation for Bottom Termination Components

Document #:
IPC-7093
Revision
Original Version
Product Type
Standard Only
Released:  03/28/2011
Language
English
This standard describes the design and assembly challenges for implementing Bottom Termination surface mount Components (BTCs) whose external connections consist of metallized terminals that are an integral part of the component body. The BTCs in this document include all types and forms of bottom-only termination components intended for surface mounting. This includes such industry descriptive...

IPC-7091 - Standard Only

Design and Assembly Process Implementation of 3D Components

Document #:
IPC-7091
Revision
Original Version
Product Type
Standard Only
Released:  09/25/2017
Language
English
The IPC-7091 intends to provide useful and practical information to those who are designing, developing or using 3D-packaged semiconductor components or those who are considering 3D package implementation. The 3D semiconductor package may include multiple die elements—some homogeneous and some heterogeneous. The package may also include several discrete passive SMT devices, some of which are...
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IPC-7092 - Standard Only

Design and Assembly Process Implementation for Embedded Components

Document #:
IPC-7092
Revision
Original Version
Product Type
Standard Only
Released:  02/18/2015
Language
English
This document describes the design and assembly challenges for implementing passive and active components, in either formed or placed methodology, into a printed board. It provides useful and practical information to decision makers of formed or placed, passive or active components and helps establish inspection techniques, testing processes, and reliability validations. Users will also learn...

IPC-2231 - Standard Only

DFX Guidelines

Document #:
IPC-2231
Revision
Original Version
Product Type
Standard Only
Released:  05/14/2019
Language
English
The IPC-2231 standard provides guidelines for establishing a best practice methodology for use in developing a formal DFX (Design for Manufacturing, Fabrication, Assembly, Testability, Cost, Reliability, Environment, Reuse) process for layout of printed board assemblies that utilize surface mount and through hole devices.

IPC-T-50M-French

IPC-T-50M-FR: Termes et Définitions pour les Circuits Électroniques Imprimés et Assemblés

Document #:
IPC-T-50
Revision
M
Product Type
Standard Only
Released:  06/30/2015
Language
French
Ce document essentiel pour l’industrie fournit des descriptions et des illustrations de la terminologie de l’industrie d’assemblage électronique afin d’aider les utilisateurs et leur clients à casser les barrières linguistiques. La révision M contient plus de 220 termes nouveaux ou révisés, incluant la nouvelle terminologie pour les procédés de tropicalisation, d’enrobage et d’encapsulation, la...
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IPC/WHMA-A-620 - Revision E - Addendum - Space and Military

航天及军事应用电子部件补充标准

Document #:
IPC/WHMA-A-620
Revision
E
Product Type
Addendum
Released:  01/27/2025
Language
Chinese
Current Revision
IPC/WHMA-A-620ES航天和军事应用电子部件补充标准为IPC/WHMA-A-620E标准提供了额外要求，以确保线缆及线束组件的可靠性，必须能够耐受在军事或太空环境中运行或遇到的振动与超温。IPC/WHMA-A-620ES不能作为一个独立的文件使用。它必须与母标准IPC/WHMA-A-620E搭配使用。IPC/WHMA-A-620ES-CN于2025年2月发布。
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IPC-A-610 - Revision G - Addendum - Telecom

IPC-A-610G 电信补充标准

Document #:
IPC-A-610
Revision
G
Product Type
Addendum
Released:  01/15/2021
Language
Chinese
Current Revision
当采购文件特别要求对电子产品IPC-A-610G可接受性的IPC-A-610GC电信附录时，对电信产品提出了特定要求。本文档中的信息通过提供其他要求来确保电气和电子组件满足要求符合GE-78-CORE的客户的要求，从而补充或替代了IPC-A-610修订版G专门确定的要求

IPC-T-50 - Revision M - Standard Only

电子电路互连与封装术语及定义

Document #:
IPC-T-50
Revision
M
Product Type
Standard Only
Released:  09/19/2016
Language
Chinese
本文件是电子互连行业不可或缺的术语标准。该文件图文并茂，可帮助用户及其客户克服语言上的沟通障碍。M版本包含超过220多条新术语或修订术语，包括敷形涂覆、灌封和封装工艺、模板设计、统计工艺控制和挠性印制板技术。也包括通用行业缩写词。
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IPC/WHMA-A-620 - Revision C - Redline Standard

Requirements and Acceptance for Cable and Wire Harness Assemblies

Document #:
IPC/WHMA-A-620
Revision
C
Product Type
Redline Standard
Released:  03/31/2017
Language
English
This is a redline document showing the changes from IPC/WHMA-A-620B to IPC/WHMA-A-620C. This document provides a side-by-side comparison of the two documents and includes the figures and tables. The document shows the deleted/changed text in the IPC/WHMA-A-620B pages and the new/revised text in purple highlights in the IPC/WHMA-A-620C pages. Yellow pop-up boxes are also present in the IPC/WHMA-A...
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IPC-7711/21 - Revision C - Redline Standard

Rework, Modification and Repair of Electronic Assemblies - Redline

Document #:
IPC-7711/21
Revision
C
Product Type
Redline Standard
Released:  05/30/2017
Language
English
This is a redline document showing the changes from IPC-7711/21B to IPC-7711/21C. This 790+ page document provides a side-by-side comparison of the two documents and includes the figures. The document shows the deleted/changed text in the IPC-7711/21B pages and the new/revised text in purple highlights in the IPC-7711/21C pages. Yellow pop-up boxes are also present in the IPC-7711/21C pages to...
610H German Deutch Cover Image

IPC-A-610 - Revision H - Standard Only

Abnahmekriterien für elektronische Baugruppen

Document #:
IPC-A-610
Revision
H
Product Type
Standard Only
Released:  08/10/2021
Language
German
IPC-A-610H ist die in der Elektronik-Branche weltweit am meisten verwendete Abnahme-Richtlinie für Elektronikbaugruppen. Die IPC-A-610H-Richtlinie beinhaltet eine allgemeine Aktualisierung des Dokuments, führt mehrere neue oberflächenmontierbare Bauteiltypen ein und entfernt die Kategorie „Anzustreben“ bei den Bewertungen. Teilnehmer aus 29 Ländern haben ihre Beiträge und ihr Fachwissen...
IPC-A-610H French Cover Image

IPC-A-610 - Revision H - Standard Only

Acceptabilité des Assemblages Électroniques

Document #:
IPC-A-610
Revision
H
Product Type
Standard Only
Released:  08/11/2021
Language
French
L’IPC-A-610H est le référentiel d’acceptabilité des assemblages électroniques la plus couramment utilisée dans l’industrie électronique. Le référentiel IPC-A-610H comprend une mise à jour générale du document, présente plusieurs nouveaux types de composants montés en surface et supprime les conditions d’objectif. Les participants de 29 pays ont apporté leur contribution et leur expertise pour...
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IPC-9242: Guidelines for Microsection Evaluation

IPC-9691C: User Guide for the IPC-TM-650, Method 2.6.25 Conductive Anodic Filament (CAF) Resistance and Other Internal Electrochemical Migration Testing

IPC-A-630A: Acceptability Standard for Manufacture, Inspection, and Testing of Electronic Enclosures

IPC-4556A: Specification for Electroless Nickel/Electroless Palladium/ Immersion Gold (ENEPIG) Plating for Printed Boards

IPC-7527A: Requirements for Solder Paste Application

IPC-4204C: Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Boards

IPC-J-STD-002F: Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires

IPC-4101F: Specifications for Base Materials for Rigid and Multilayer Printed Boards

IPC-1755B: Responsible Sourcing of Minerals Data Exchange Standard

IPC-2223F: Sectional Design Standard for Flexible/Rigid-Flexible Printed Boards

IPC-HDBK-9798A: Handbook and Guide to Supplement IPC-9797

IPC-WP-011: Guidance for Strain Gage Limits for Assemblies

J-STD-046A: Customer Notification Standard for Product/Process Changes by Electronic Product Suppliers

J-STD-048A: Notification Standard for Product Discontinuance

IPC-T-50P: Terms and Definitions for Interconnecting and Packaging Electronic Circuits

IPC-1401B: Corporate Social Responsibility Management System Standard

IPC -1751B: Generic Requirements for Declaration Process Management

IPC-6013F: Qualification and Performance Specification for Flexible/Rigid-Flexible Printed Boards

IPC-4413 - Am1: Specification for Finished Fabric Woven from Low Dk Glass for Printed Boards