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IPC-7092 - Standard Only

Design and Assembly Process Implementation for Embedded Components

Document #:
IPC-7092
Revision
Original Version
Product Type
Standard Only
Released:  02/18/2015
Language
English
This document describes the design and assembly challenges for implementing passive and active components, in either formed or placed methodology, into a printed board. It provides useful and practical information to decision makers of formed or placed, passive or active components and helps establish inspection techniques, testing processes, and reliability validations. Users will also learn...

IPC-2231 - Standard Only

DFX Guidelines

Document #:
IPC-2231
Revision
Original Version
Product Type
Standard Only
Released:  05/14/2019
Language
English
The IPC-2231 standard provides guidelines for establishing a best practice methodology for use in developing a formal DFX (Design for Manufacturing, Fabrication, Assembly, Testability, Cost, Reliability, Environment, Reuse) process for layout of printed board assemblies that utilize surface mount and through hole devices.

IPC-T-50M-French

IPC-T-50M-FR: Termes et Définitions pour les Circuits Électroniques Imprimés et Assemblés

Document #:
IPC-T-50
Revision
M
Product Type
Standard Only
Released:  06/30/2015
Language
French
Ce document essentiel pour l’industrie fournit des descriptions et des illustrations de la terminologie de l’industrie d’assemblage électronique afin d’aider les utilisateurs et leur clients à casser les barrières linguistiques. La révision M contient plus de 220 termes nouveaux ou révisés, incluant la nouvelle terminologie pour les procédés de tropicalisation, d’enrobage et d’encapsulation, la...
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IPC/WHMA-A-620 - Revision E - Addendum - Space and Military

航天及军事应用电子部件补充标准

Document #:
IPC/WHMA-A-620
Revision
E
Product Type
Addendum
Released:  01/27/2025
Language
Chinese
Current Revision
IPC/WHMA-A-620ES航天和军事应用电子部件补充标准为IPC/WHMA-A-620E标准提供了额外要求，以确保线缆及线束组件的可靠性，必须能够耐受在军事或太空环境中运行或遇到的振动与超温。IPC/WHMA-A-620ES不能作为一个独立的文件使用。它必须与母标准IPC/WHMA-A-620E搭配使用。IPC/WHMA-A-620ES-CN于2025年2月发布。
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IPC-A-610 - Revision G - Addendum - Telecom

IPC-A-610G 电信补充标准

Document #:
IPC-A-610
Revision
G
Product Type
Addendum
Released:  01/15/2021
Language
Chinese
Current Revision
当采购文件特别要求对电子产品IPC-A-610G可接受性的IPC-A-610GC电信附录时，对电信产品提出了特定要求。本文档中的信息通过提供其他要求来确保电气和电子组件满足要求符合GE-78-CORE的客户的要求，从而补充或替代了IPC-A-610修订版G专门确定的要求

IPC-T-50 - Revision M - Standard Only

电子电路互连与封装术语及定义

Document #:
IPC-T-50
Revision
M
Product Type
Standard Only
Released:  09/19/2016
Language
Chinese
本文件是电子互连行业不可或缺的术语标准。该文件图文并茂，可帮助用户及其客户克服语言上的沟通障碍。M版本包含超过220多条新术语或修订术语，包括敷形涂覆、灌封和封装工艺、模板设计、统计工艺控制和挠性印制板技术。也包括通用行业缩写词。
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IPC/WHMA-A-620 - Revision C - Redline Standard

Requirements and Acceptance for Cable and Wire Harness Assemblies

Document #:
IPC/WHMA-A-620
Revision
C
Product Type
Redline Standard
Released:  03/31/2017
Language
English
This is a redline document showing the changes from IPC/WHMA-A-620B to IPC/WHMA-A-620C. This document provides a side-by-side comparison of the two documents and includes the figures and tables. The document shows the deleted/changed text in the IPC/WHMA-A-620B pages and the new/revised text in purple highlights in the IPC/WHMA-A-620C pages. Yellow pop-up boxes are also present in the IPC/WHMA-A...
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IPC-7711/21 - Revision C - Redline Standard

Rework, Modification and Repair of Electronic Assemblies - Redline

Document #:
IPC-7711/21
Revision
C
Product Type
Redline Standard
Released:  05/30/2017
Language
English
This is a redline document showing the changes from IPC-7711/21B to IPC-7711/21C. This 790+ page document provides a side-by-side comparison of the two documents and includes the figures. The document shows the deleted/changed text in the IPC-7711/21B pages and the new/revised text in purple highlights in the IPC-7711/21C pages. Yellow pop-up boxes are also present in the IPC-7711/21C pages to...
610H German Deutch Cover Image

IPC-A-610 - Revision H - Standard Only

Abnahmekriterien für elektronische Baugruppen

Document #:
IPC-A-610
Revision
H
Product Type
Standard Only
Released:  08/10/2021
Language
German
IPC-A-610H ist die in der Elektronik-Branche weltweit am meisten verwendete Abnahme-Richtlinie für Elektronikbaugruppen. Die IPC-A-610H-Richtlinie beinhaltet eine allgemeine Aktualisierung des Dokuments, führt mehrere neue oberflächenmontierbare Bauteiltypen ein und entfernt die Kategorie „Anzustreben“ bei den Bewertungen. Teilnehmer aus 29 Ländern haben ihre Beiträge und ihr Fachwissen...
IPC-A-610H French Cover Image

IPC-A-610 - Revision H - Standard Only

Acceptabilité des Assemblages Électroniques

Document #:
IPC-A-610
Revision
H
Product Type
Standard Only
Released:  08/11/2021
Language
French
L’IPC-A-610H est le référentiel d’acceptabilité des assemblages électroniques la plus couramment utilisée dans l’industrie électronique. Le référentiel IPC-A-610H comprend une mise à jour générale du document, présente plusieurs nouveaux types de composants montés en surface et supprime les conditions d’objectif. Les participants de 29 pays ont apporté leur contribution et leur expertise pour...
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IPC-4552 - Amendment 1

Specification for Electroless Nickel/Immersion Gold (ENIG) Plating for Printed Circuit Boards

Document #:
IPC-4552
Revision
Original Version
Product Type
Amendment
Released:  06/12/2012
Language
English
Specification for Electroless Nickel/Immersion Gold (ENIG) Plating for Printed Circuit Boards Amendment 1 to IPC-4552 replaces the Table 3-1 Requirements of Electroless Nickel Immersion Gold Plating plus also replaces all of sections 3.2.1 Immersion Nickel Thickness and 3.2.2 Immersion Gold Thickness in the original release of the IPC-4552. The Amendment 1 permits the use of thinner gold (≥4 µm...
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IPC-4552 - Amendment 2

Specification for Electroless Nickel/Immersion Gold (ENIG) Plating for Printed Circuit Boards

Document #:
IPC-4552
Revision
Original Version
Product Type
Amendment
Released:  09/01/2012
Language
English
Specification for Electroless Nickel/Immersion Gold (ENIG) Plating for Printed Circuit Boards Amendment 2 to IPC-4552 is a new section in the original release of the IPC-4552. The Amendment 2 provides the “rules” by which any rework and/or repair of a printed board's ENIG surface finish is allowed. Effective September 2012.
IPC-A-610H Hebrew Cover Image

IPC-A-610 - Revision H - Standard Only

במקרה של חילוקי דעות בין התרגום במסמך זה לבין הגירסה האנגלית, תינתן עדיפות לגירסה האנגלית.

Document #:
IPC-A-610
Revision
H
Product Type
Standard Only
Released:  08/04/2022
Language
Hebrew
תיאור IPC-A-610Hהוא תקן הקבלה להרכבת אלקטרוניקה הנפוץ ביותר בתעשיית האלקטרוניקה. תקן IPC-A-610H כולל עדכון כללי למסמך, מציג מספר סוגי רכיבי הרכבה חדשים על פני השטח ומסיר תנאי יעד. משתתפים מ-29 מדינות סיפקו את הקלט והמומחיות שלהם כדי להביא מסמך זה לתעשיית האלקטרוניקה. זו חובה עבור מבקרים, מפעילים ואחרים שלהם עניין בקריטריוני הקבלה עבור הרכבות אלקטרוניות. IPC-A-610 פותח בסינרגיה עם J-STD-001 ו- IPC...
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IPC-4556 - Amendment 1

Specification for Electroless Nickel/Electroless Palladium/Immersion Gold (ENEPIG) Plating for Printed Circuit Boards

Document #:
IPC-4556
Revision
Original Version
Product Type
Amendment
Released:  01/01/2016
Language
English
The Amendment 1 to IPC-4556 made the following changes to the base specification: a) It added the absolute value of the maximum thickness for the immersion gold of 0.070 μm [2.8 μin] that accompanies the statistically valid minimum immersion gold thickness; b) It added two more photomicrograph images to provide better information on identifying nickel hyper corrosion; c) It added the basis of...
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IPC/WHMA-A-620 - Revision C - Addendum - Rail Transit

线缆及线束组件的要求与验收轨道交通补充标准Rail Transit Addendum to IPC/WHMA-A-620C

Document #:
IPC/WHMA-A-620
Revision
C
Product Type
Addendum
Released:  06/22/2022
Language
Chinese
Current Revision
IPC/WHMA-A-620C-R 轨道交通补充标准提供了对 IPC/WHMA-A-620C 标准的补充要求，描述了用于轨道交通行业的线缆、线束及其组件的相关要求，如生产压接、机械固定和焊接互连的材料、方法、测试和验收标准等，以保证其在高速铁路环境下电缆线束及其组件的高度可靠性和环境适应性。
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IPC-A-610 - Revision H - Standard Only

電子組件的可接受性

Document #:
IPC-A-610
Revision
H
Product Type
Standard Only
Released:  09/21/2021
Language
Chinese (Zhōngwén)
IPC-A-610H是電子行業廣泛採用的電子組件驗收標準。IPC-A-610H標準中包含了本檔的一般更新內容，介紹了一些新型表面貼裝元器件，同時刪除了目標條件。 本檔在電子行業成功問世離不開來自29個國家/地區的參與者，這些參與者在本檔編制期間投入了大量的精力並貢獻了寶貴的專業知識。 該標準是檢查人員、操作人員及其他與電子組件驗收要求相關的人員必須掌握的技術標準。 與IPC-A-610一起制定的標準還有J-STD-001和IPC/WHMA-A-620。
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IPC-A-610 - Revision H - Standard Only

電子組立品の許容基準

Document #:
IPC-A-610
Revision
H
Product Type
Standard Only
Released:  09/21/2021
Language
Japanese
IPC-A-610Hは、エレクトロニクス業界で最も広く使用されている電子組立品の受入れの規格である。IPC-A-610Hでは、文書への一般的な更新内容、および新規に採用された表面実装部品のタイプが含まれており、また、この改版からは「目標とするコンディション(状態)」は削除されている。 この改版にあたっては29か国からの参加者から情報と専門知識が寄せられ、最新の基準を業界に提供している。 本書は、電子組立品の受入れ基準に関心のある検査員、オペレータおよび関係者にとって必須の文書といえる。 IPC-A-610は、J-STD-001およびIPC/WHMA-A-620との相乗作用のもと開発されたものである。

IPC-T-50 - Revision H - Standard Only

电子电路互连与封装术语及定义

Document #:
IPC-T-50
Revision
H
Product Type
Standard Only
Released:  09/17/2009
Language
Chinese
Description in English 本文件是电子互连行业不可或缺的一份术语标准。该文件图文并茂，可帮助用户及其客户克服语言上的沟通障碍。H版本包含200多条新术语或修订术语，新术语涉及球栅阵列和芯片尺寸封装、导通孔保护、导体图形、组装工艺、基材和选择性电镀工艺等。还包括通用工业缩写词和根据技术分类排序的术语索引，以便于查找。全文276页，于 2008年7月公布。
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IPC-A-610 - Revision E - Standard Only

Acceptanskrav för kretskort

Document #:
IPC-A-610
Revision
E
Product Type
Standard Only
Released:  04/13/2010
Language
Swedish
IEC är på väg att godkänna IPC-A-610 som den globala rekommenderade internationella standarden för elektroniktillverkning. IPC-A-610 är den mest använda standarden i världen för elektroniktillverkning. IPC-A-610E är ett måste för alla kvalitetssäkrings- och produktionsavdelningar och illustrerar industrigodkända acceptanskriterier genom fyrfärgsbilder och illustrationer. Områden inkluderar...
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IPC-TM-650 - Standard Only

Method Development Packet

Document #:
IPC-TM-650
Revision
Original Version
Product Type
Development Packet
Released:  06/06/2012
Language
English
Current Revision
This document has been created to help define criteria that will yield better test methods for use by the electronics and related industries. Key objectives to validating a new test method procedure are covered, including the usage of objective evidence to verify that the elements defined within a method fulfill the intended use and that the method yields repeatable and reproducible results when...
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IPC/WHMA-A-620 - Standard Only

IPC/WHMA-A-620 Test Data Tables

Document #:
IPC/WHMA-A-620
Revision
Original Version
Product Type
Test Data Tables
Released:  01/01/2012
Language
English
Current Revision
These tables are from IPC/WHMA-A-620 Revision B Chapter 19 Testing. They are provided in an electronic format that permits users to edit the tables to add user-specific criteria. These files are authorized for copying/reproduction.
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IPC-A-610 - Revision G - Standard Only

Dopuszczalność Zespołów Elektronicznych

Document #:
IPC-A-610
Revision
G
Product Type
Standard Only
Released:  05/21/2019
Language
Polish
IPC-A-610 jest najpowszechniej na świecie używanym standardem dla pakietów elektronicznych. Uaktualniany przez uczestników z 17 krajów dostarczających wkładu i ekspertyz, niniejszy dokument dostarcza przemysłowi najnowszych kryteriów wraz z wieloma nowymi i ulepszonymi grafikami. Jest to nieoceniony dokument dla inspektorów, operatorów i innych zainteresowanych kryteriami dopuszczalności zespołów...

IPC-4556 - Standard Only

印制板化学镍/钯/浸金（ENEPIG）规范

Document #:
IPC-4556
Revision
Original Version
Product Type
Standard Only
Released:  11/26/2018
Language
Chinese
Current Revision
本规范规定了使用化学镍/钯/浸金（ENEPIG）作为印制板表面处理的要求。本规范规定了ENEPIG应用于焊接、金属线键合和接触面涂覆层的沉积厚度规格。本规范适用于化学药水供应商、印制板制造商、电子制造服务业（EMS）和原始设备制造商（OEM）。ENEPIG是沉积在以铜为基底金属上的一个三层的表面处理。它是一种多功能的表面处理，适用于焊接和金、铝和铜金属线键合。它也适合作为软薄膜和钢凸圆接触的配合表面。其它应用包括使用低插入力（LIF）和零插入力（ZIF）板边连接器和压入式应用。化学钯层形成的扩散阻挡层，阻碍镍扩散到金表面。浸金防止钯层在加工前与污染物反应，否则可能会影响连接制程，如金属线键合和焊接。全文共82页，2013年发布。2018年10月翻译。
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Coming Soon

IPC-9242: Guidelines for Microsection Evaluation

IPC-9691C: User Guide for the IPC-TM-650, Method 2.6.25 Conductive Anodic Filament (CAF) Resistance and Other Internal Electrochemical Migration Testing

IPC-A-630A: Acceptability Standard for Manufacture, Inspection, and Testing of Electronic Enclosures

IPC-4556A: Specification for Electroless Nickel/Electroless Palladium/ Immersion Gold (ENEPIG) Plating for Printed Boards

IPC-7527A: Requirements for Solder Paste Application

IPC-4204C: Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Boards

IPC-J-STD-002F: Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires

IPC-4101F: Specifications for Base Materials for Rigid and Multilayer Printed Boards

IPC-1755B: Responsible Sourcing of Minerals Data Exchange Standard

IPC-2223F: Sectional Design Standard for Flexible/Rigid-Flexible Printed Boards

IPC-HDBK-9798A: Handbook and Guide to Supplement IPC-9797

IPC-WP-011: Guidance for Strain Gage Limits for Assemblies

J-STD-046A: Customer Notification Standard for Product/Process Changes by Electronic Product Suppliers

J-STD-048A: Notification Standard for Product Discontinuance

IPC-T-50P: Terms and Definitions for Interconnecting and Packaging Electronic Circuits

IPC-1401B: Corporate Social Responsibility Management System Standard

IPC -1751B: Generic Requirements for Declaration Process Management

IPC-6013F: Qualification and Performance Specification for Flexible/Rigid-Flexible Printed Boards

IPC-4413 - Am1: Specification for Finished Fabric Woven from Low Dk Glass for Printed Boards