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Document #:

IPC/JEDEC-J-STD-609

Revision

Product Type

Standard Only

Released: 11/01/2016

Language

English

This standard provides a marking and labeling system that aids in assembly, rework, repair and recycling and provides for the identification of: those assemblies that are assembled with lead-containing or lead-free solder; components that have lead-containing or lead-free second level interconnect terminal finishes and materials; the maximum component temperature not to be exceeded during assembly...

Document #:

IPC-CC-830

Revision

Product Type

Standard with amendment(s)

Released: 10/23/2008

Language

English

This is the industry standard for qualification and quality conformance of conformal coating. Its intent is to show how to obtain maximum information with minimum test redundancy. Includes requirements and evaluations of material properties using standardized test vehicles. Amendment 1 updates include new qualification, retention and conformance inspection requirements for FTIR, MIR and hydrolytic...

Document #:

IPC-9701

Revision

Product Type

Standard Only

Released: 02/01/2006

Language

English

Provides specific test methods to evaluate the performance and reliability of surface mount solder attachments of electronic assemblies. Establishes levels of performance and reliability of the solder attachments of surface mount devices to rigid, flexible and rigid-flex circuit structures. When used with IPC-SM-785, it provides an understanding of the physics of SMT solder joint failure and an...

Document #:

IPC-9201

Revision

Product Type

Standard Only

Released: 09/19/2007

Language

English

Surface Insulation Resistance (SIR) testing is a tool used not only for characterization testing of production processes such as solder masks, soldering flux, and conformal coatings, but also for examining the electrochemical reactions at each stage of the electronic assembly production process. This handbook covers the terminology, theories, test procedures and test vehicles of SIR testing...

Document #:

IPC-QL-653

Revision

Product Type

Standard Only

Released: 11/01/1997

Language

English

This specification establishes the certification requirements for facilities that inspect/test printed boards, components and materials. This specification is intended to provide a minimum standardized basis for evaluating or auditing a technically oriented inspection/testing facility. Revised November 1997. 15 pages.

Document #:

IPC-7530

Revision

Product Type

Standard Only

Released: 04/28/2017

Language

English

This standard provides useful and practical information for developing thermal profiles to produce acceptable SnPb and Pb-free electronics assemblies. This revision expands the focus of the original standard from reflow profiling to include profiling for vapor phase, laser, selective soldering and wave soldering. The revision also includes a full-color troubleshooting guide for addressing common...

Document #:

IPC-6012

Revision

Product Type

Standard Only

Released: 04/13/2010

Language

English

Dual-language (Spanish/English) DVD -- Introduces industry specifications J-STD-001 & IPC-A-610 and explains the concept of process indicators. Includes an animated examination of the invisible problems that can be created during rework to explain why it's so important to avoid unnecessary rework. Reviews each of the tools and materials for plated-through hole (PTH) rework (including low-residue...

Document #:

IPC-7525

Revision

Product Type

Standard Only

Released: 10/24/2011

Language

English

This document provides guidelines for the design and fabrication of stencils for solder paste and surface mount adhesive with discussion on through-hole and mixed technology. This includes differences for tin lead and lead-free solder paste, overprint, two-print and step stencil designs. A sample order form and user inspection checklist are also included.

Document #:

IPC-7095

Revision

Product Type

Standard Only

Released: 04/02/2008

Language

English

Implementing Ball Grid Array (BGA) and Fine-Pitch Ball Grid Array (FBGA) technology presents some unique challenges for design, assembly, inspection and repair personnel. IPC-7095B delivers useful and practical information to anyone currently using BGAs or considering a conversion to area array packaging formats. This has become especially important due to the change in the alloys being used, both...

Document #:

IPC/JEDEC-J-STD-033

Revision

Product Type

Standard Only

Released: 08/01/2014

Language

English

Provides surface mount device manufacturers and users with standardized methods for handling, packing, shipping and use of moisture/reflow sensitive components. These methods help avoid damage from moisture absorption and exposure to solder reflow temperatures that can result in yield and reliability degradation and damaged components. These procedures provide a minimum shelf life of 12 months...

Document #:

IPC-T-50

Revision

Product Type

Standard Only

Released: 02/03/2015

Language

German

Current Revision

Das unentbehrliche Nachschlagewerk für alle Verantwortlichen entlang der Wertschöpfungskette von elektronischen Produkten. Die Revision K enthält auf mehr als 120 Seiten, mehr als 220 neue und überarbeitete Begriffe und bildliche Darstellungen. Beispiele: Access Hole, Accelerated Equivalent Soak, Capture Land, Micro Via Technology, Plating Thief, Etchback, Resin Recession, Tape Automated Bonding...

Document #:

IPC-7095

Revision

Product Type

Standard Only

Released: 10/01/2004

Language

English

Implementing Ball Grid Array (BGA) and Fine-Pitch Ball Grid Array (FBGA) technology presents some unique challenges for design, assembly, inspection and repair personnel. Revision A of this document delivers useful and practical information to anyone who is currently using BGAs or is considering a conversion to area array packaging formats. In addition to providing guidelines for BGA inspection...

Document #:

IPC-7711/21

Revision

Product Type

Standard Only

Released: 11/30/2007

Language

English

This guide includes everything needed for repair and rework of electronic assemblies and printed circuit boards. IPC-7711B/7721B Rework, Modification and Repair of Electronic Assemblies has received a complete procedure by procedure update to assure applicability to both lead free and traditional SnPb soldered assemblies. This single volume includes all previously published changes and several new...

Document #:

IPC-6018

Revision

Product Type

Standard Only

Released: 08/09/2016

Language

English

This specification covers qualification and performance of high frequency (microwave) boards, including single-sided, double-sided, with or without plated-through holes, multilayer with or without blind/buried vias and metal core boards. It addresses final finish and surface plating coating requirements, conductors, holes/vias, frequency of acceptance testing and quality conformance as well as...

Document #:

IPC-6013

Revision

Product Type

Standard Only

Released: 12/18/2013

Language

English

Covers qualification and performance requirements for flexible printed boards designed to IPC-2221 and IPC-2223. The flexible printed board may be single-sided, double-sided, multilayer or rigid-flex multilayer. All of these constructions may include stiffeners, PTHs, microvias, and blind/buried vias. Revision C incorporates new and updated requirements for final finishes, surface and hole plating...

Document #:

IPC/JEDEC-J-STD-609

Revision

Product Type

Standard Only

Released: 06/01/2012

Language

English

This is a list of reported errata to the printed copies of IPC/JEDEC J-STD-609A. Pen and ink changes should be made in accordance with your company's document control policies.

Document #:

IPC-A-610

Revision

Product Type

Standard Only

Released: 08/11/2021

Language

Spanish

Current Revision

IPC-A-610H es la norma de aceptación de ensambles electrónicos más utilizada en la industria electrónica. La norma IPC-A-610H incluye una actualización general del documento, introduce varios nuevos tipos de componentes de montaje en superficie y elimina las condiciones ideales. Participantes de 29 países proporcionaron su apoyo y conocimientos especializados para traer este documento a la...

Document #:

IPC-A-610

Revision

Product Type

Standard Only

Released: 07/27/2021

Language

Danish

Current Revision

IPC-A-610H er den mest udbredte godkendelsesstandard for elektronikprodukter i elektronikindustrien. IPC-A-610H standarden inkluderer en generel opdatering af dokumentet, introducere flere nye overflademonterede komponenttyper og fjerner ”Ønskelig” tilstand. Deltagere fra 29 lande leverede deres input og ekspertise til at bringe dette dokument til elektronikindustrien. Dette er en ”skal have”...

Document #:

IPC-4554

Revision

Original Version

Product Type

Amendment

Released: 09/01/2013

Language

English

Current Revision

IPC-4554, "Specification for Immersion Tin Plating for Printed Circuit Boards," is the third document in a series of specifications [the first two are: IPC-4552 which addresses electroless nickel/immersion gold (ENIG) and IPC-4553 which addresses immersion silver (IAg)] that set the requirements for printed circuit board surface finishes that are alternates to eutectic tin-lead. IPC-4554, a full...

Document #:

IPC-A-610

Revision

Product Type

Standard Only

Released: 04/12/2022

Language

Czech

Current Revision

IPC-A-610H je nejpoužívanější standard pro provádění přejímek elektronických sestav. Standard IPC-A-610H obsahuje obecnou aktualizaci dokumentu, představuje několik nových typů komponent pro povrchovou montáž, a odstraňuje cílové podmínky. Účastníci z 29 zemí poskytli své příspěvky a odborné znalosti, aby tento dokument přinesli elektronickému průmyslu.

Jde o nepostradatelnou příručku pro...

Document #:

IPC/JEDEC-9707

Revision

Original Version

Product Type

Amendment

Released: 05/01/2018

Language

English

Current Revision

IPC/JEDEC-9707-AM1 is an amendment which clarifies that the standard is only applicable to transient bending during short-term test operations. The standard specifies a common method of establishing strain limits of board-level device interconnects under spherical transient bending conditions, the worst-case flexure condition that can occur during conventional printed board/system assembly...

Document #:

IPC-A-610

Revision

Product Type

Standard Only

Released: 04/21/2021

Language

Chinese

Current Revision

IPC-A-610H是电子行业广泛采用的电子组件验收标准。IPC-A-610H标准中包含了本文件的一般更新内容，介绍了一些新型表面贴装元器件，同时删除了目标条件。本文件在电子行业成功问世离不开来自29个国家/地区的参与者，这些参与者在本文件编制期间投入了大量的精力并贡献了宝贵的专业知识。该标准是检查人员、操作人员及其他与电子组件验收要求相关的人员必须掌握的技术标准。与IPC-A-610一起制定的标准还有J-STD-001和IPC/WHMA-A-620。

Document #:

IPC-A-610

Revision

Product Type

Standard Only

Released: 05/04/2022

Language

Dutch

Current Revision

IPC-A-610 is het meest gebruikte acceptatiedocument voor elektronica-assemblage. Bijgewerkt met deelnemers uit 17 landen die input en expertise leveren, brengt dit document de nieuwste criteria samen met veel nieuwe en herziene grafische afbeeldingen uit de industrie. Dit is een must-have voor inspecteurs, operators en anderen die geïnteresseerd zijn in de acceptatiecriteria voor elektronische...

Document #:

IPC-A-610

Revision

Product Type

Standard Only

Released: 01/10/2022

Language

Korean

Current Revision

IPC-A-610H는 전자 산업에서 가장 널리 사용되는 전자 어셈블리 허용 표준이다. IPC-A-610H 표준은 문서에 대한 일반 업데이트를 포함하며, 몇 가지 새로운 표면 실장 소자 유형을 도입하고 대상 조건을 제거한다. 29개국에서 온 참가자들은 이 문서를 전자 산업에 가져오기 위해 그들의 조언과 전문지식을 제공했다. 이는 전자 어셈블리의 허용 기준에 관심이 있는 검사자, 작업자 및 기타 사용자에게 반드시 필요한 사항이다. IPC-A-610은 J-STD-001 및 IPC/WHMA-A-620과 함께 개발되었다.

Document #:

IPC-A-610

Revision

Product Type

Standard Only

Released: 04/12/2022

Language

Hungarian

Current Revision

Az IPC-A-610 a világon legszélesebb körben használt elektronikai szerelvényekkel foglalkozó szabvány. Az IPC-A-610H szabvány jó néhány dokumentum általános frissítését tartalmazza, számos új felületszerelt alkatrésztípus követelményeivel kiegészült és megszüntetésre került a cél állapot kritérium. A szabvány 29 országból beérkező újabb észrevételek, szakvélemények alapján biztosítja az...