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IPC-6012 - Revision D - Amendment 1

Sert Baskı Devre Kartları İçin Kalifikasyon ve Performans Spesifikasyonu

Document #:
IPC-6012
Revision
D
Product Type
Amendment
Released:  01/25/2019
Language
Turkish
Current Revision
Bu döküman; kaplı delikiçine sahip olan veya olmayan tek yüzlü, çift yüzlü baskı devre kartları ve kör/gömülü geçiş deliklerine sahip olan veya olmayan çok katmanlı baskı devre kartları ile metal çekirdekli kartları içeren sert baskı devre kartlarının kalifikasyonunu ve performansını kapsamaktadır. Son kaplama ve yüzey kaplama gereklilikleri, iletkenler, delikler/geçiş delikleri, kabul testlerinin...

IPC-6012 - Revision D - Addendum - Space and Military

Space and Military Avionics Applications Addendum to IPC-6012D, Qualification and Performance Specification for Rigid Printed Boards

Document #:
IPC-6012
Revision
D
Product Type
Addendum
Released:  09/22/2015
Language
English
This Addendum supplements or replaces specifically identified requirements of IPC-6012D, Revision D, for rigid printed boards that must survive the vibration, ground testing and thermal cyclic environments of space and military avionics

IPC/WHMA-A-620 - Revision C - Addendum - Space and Military

Space Applications Electronic Hardware Addendum to IPC/WHMA-A-620C

Document #:
IPC/WHMA-A-620
Revision
C
Product Type
Addendum
Released:  03/30/2018
Language
English
IPC/WHMA-A-620C-S provides additional requirements to IPC/WHMA-A-620C to ensure the reliability of cable and wire harness assemblies that must survive the vibration and thermal cyclic environments getting to and operating in space. The IPC/WHMA-A-620C-S space addendum cannot be used as a stand alone document, it must be used with the base standard IPC/WHMA-A-620C.
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IPC/WHMA-A-620 - Revision B - Addendum - Space and Military

Space Applications Electronic Hardware Addendum to IPC/WHMA-A-620B

Document #:
IPC/WHMA-A-620
Revision
B
Product Type
Addendum
Released:  06/01/2013
Language
English
When specifically required by procurement documentation, this Addendum supplements or replaces specifically identified requirements of IPC/WHMA-A-620, Revision B, providing additional requirements to ensure the reliability of cable and wire harness assemblies that must survive the vibration and thermal cyclic environments getting to and operating in space. The required IPC training & certification...
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IPC-A-620 - Revision A - Addendum with Amendment 1 - Space and Military

Space Applications Electronic Hardware Addendum to IPC/WHMA-A-620A

Document #:
IPC/WHMA-A-620
Revision
A
Product Type
Addendum
Released:  07/16/2012
Language
English
IPC/WHMA-A-620AS with Amendment 1 Space Applications Electronic Hardware Addendum to IPC/WHMA-A-620A Requirements and Acceptance for Cable and Wire Harness Assemblies. When specifically required by procurement documentation, this Addendum supplements or replaces specifically identified requirements of IPC/WHMA-A-620, Revision A of July 2006 by providing additional requirements to ensure the...

IPC-6018 - Revision C - Addendum - Space and Military

Space and Military Avionics Applications Addendum to IPC-6018C Qualification and Performance Specification for High Frequency (Microwave) Printed Boards

Document #:
IPC-6018
Revision
C
Product Type
Addendum
Released:  08/09/2016
Language
English
This Addendum supplements or replaces specifically identified requirements of IPC-6018C, for high frequency (microwave) printed boards that must survive the vibration, ground testing and thermal cyclic environments of space and military avionics.

IPC-1602 - Standard Only

Standard for Printed Board Handling and Storage

Document #:
IPC-1602
Revision
Original Version
Product Type
Standard Only
Released:  04/07/2020
Language
English
The IPC-1602 standard provides requirements intended to protect printed boards from contamination, physical damage, solderability degradation and moisture uptake. Consideration is given to packaging materials types and methods, production environment, handling and transport of product, and establishing baking profiles for moisture removal. IPC-1602 is now providing requirements that can be called...

IPC-2291 - Standard Only

Design Guideline for Printed Electronics

Document #:
IPC-2291
Revision
Original Version
Product Type
Standard Only
Released:  07/30/2013
Language
English
This guideline provides an overview of the design process flow for printed electronics based devices, modules and units, and final products.The intent of IPC/JPCA-2291 is to establish a design process flow that will facilitate and improve the practice of printed electronics design. IPC/JPCA-2291 identifies documents such as standards that can be used to assist during the design process flow. 24...

IPC-4761 - Standard Only

Design Guide for Protection of Printed Board Via Structures

Document #:
IPC-4761
Revision
Original Version
Product Type
Standard Only
Released:  07/01/2006
Language
English
IPC-4761 is the sole industry guideline providing PCB designers, manufacturers and uses with detailed information on all existing methods for protecting vias on printed boards, including all types of via tenting, plugging, filling and capping. Production issues, long term reliability concerns and material specification and selection are provided to aid in evaluating the benefits and concerns for...

IPC-9707 - Standard Only

Spherical Bend Test Method for Characterization of Board Level Interconnects

Document #:
IPC/JEDEC-9707
Revision
Original Version
Product Type
Standard Only
Released:  09/13/2011
Language
English
This standard on spherical transient bend testing is intended to characterize the maximum allowable strain that a surface mount component's board level interconnects can withstand in flexural loading. Whereas four-point monotonic bend test methods only address simple planar bending, spherical bend tests establish strain limits of board level interconnects under worst-case flexure conditions that...
IPC/DAC-2552 Cover Image

IPC-DAC-2552 - Standard Only

General Electronic Components Model Based Definition (MBD) Standard

Document #:
IPC/DAC-2552
Revision
Original Version
Product Type
Standard Only
Released:  08/02/2022
Language
English
The IPC/DAC-2552 standard was developed jointly with the Digital Association of China (DAC), with the purpose to use Model Based Definition (MBD) to realize efficient and high-quality digital design of board-level assembly, support electronic assembly virtual manufacturing, and enabling the digitalization from requirement to product realization for printed board assemblies. The IPC/DAC-2552...
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IPC-HDBK-9798 - Handbook

Handbook for Press-fit Standard for Automotive Requirements and other High-Reliability Applications

Document #:
IPC-HDBK-9798
Revision
Original Version
Product Type
Handbook
Released:  06/21/2022
Language
English
Current Revision
IPC-HDBK-9798 provides guidelines and supporting information for manufacturing electronic assemblies using compliant press-fit technology. The intent is to explain the ‘‘how-to’’ and ‘‘why’’ information, and fundamentals for these processes. This handbook is supporting the IPC-9797 standard.

IPC-9797 - Standard Only

Press-fit Standard for Automotive Requirements and other High-Reliability Applications

Document #:
IPC-9797
Revision
Original Version
Product Type
Standard Only
Released:  06/01/2020
Language
English
IPC-9797 is the only industry-consensus standard for Requirements and Acceptance of Press-fit Pins. IPC-9797 prescribes practices for the characterization, qualification and acceptance requirements of compliant press-fit technology for printed boards that cover the manufacturability and reliability needs for high reliability applications intended for use in harsh environments such as automotive...

IPC-8497 - Standard Only

Cleaning Methods and Contamination Assessment for Optical Assembly

Document #:
IPC-8497
Revision
Original Version
Product Type
Standard Only
Released:  12/01/2005
Language
English
This standard describes the methods of inspecting and cleaning all optical interfaces so that interconnectivity integrity of the optical signal is maintained. The information provided focuses on techniques and methods to accomplish maximum quality of the interface and describes methods of contamination prevention. The target audience for this standard are Manufacturing Operators, Manufacturing...
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IPC-MS-810 - Standard Only

Guidelines for High Volume Microsection

Document #:
IPC-MS-810
Revision
Original Version
Product Type
Standard Only
Released:  10/01/1993
Language
English
Discusses the many variables and problems associated with the process--from sample removal to micro-etch-- and the variables common to high volume microsection. The process variables and problems are organized so that the reader can research a specific issue or overview the variables of a process area. 31 pages. Released October 1993.
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IPC-2611 - Standard Only

Generic Requirements for Electronic Product Documentation

Document #:
IPC-2611
Revision
Original Version
Product Type
Standard Only
Released:  04/30/2010
Language
English
This standard establishes the generic requirements for a document set describing electronic products, and the methodology used for revision control and configuration management of the information. The generic descriptions apply to the entire document set and are used to define and maintain the electronic product. The methodology permits different grades of completeness of the documentation, as...

IPC-9631 - Standard Only

User Guide for IPC-TM-650, Method 2.6.27, Thermal Stress, Convection Reflow Assembly Simulation

Document #:
IPC-9631
Revision
Original Version
Product Type
Standard Only
Released:  12/15/2010
Language
English
IPC-9631 addresses concerns and considerations related to IPC-TM-650, Method 2.6.27, Thermal Stress, Convection Reflow Assembly Simulation. This document describes how the test method is intended for use and the rationale behind some of the protocols and requirements. This document was developed with the understanding that the test method will require special equipment and the proper set-up and...
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IPC-9703 - Standard Only

IPC/JEDEC Mechanical Shock Test Guidelines for Solder Joint Reliability

Document #:
IPC/JEDEC-9703
Revision
Original Version
Product Type
Standard Only
Released:  03/18/2009
Language
English
Establishes mechanical drop and shock and test guidelines for assessing solder joint reliability of printed board assemblies from system to component level. This document addresses methods to define mechanical shock use-conditions, methods to define system level, system printed board level and component test board level testing that correlate to such use conditions and guidance on the use of...

IPC-7530 - Standard Only

Guidelines for Temperature Profiling for Mass Soldering (Reflow & Wave) Processes

Document #:
IPC-7530
Revision
Original Version
Product Type
Standard Only
Released:  05/01/2001
Language
English
During mass soldering, it is important that all solder joints reach the minimum soldering (reflow) temperature to assure metallurgical bonding of the solder alloy and the base metals to be soldered. Metallurgical bonding requires that both surfaces to be soldered, as well as the solder, reach this minimum soldering temperature for a sufficient time to allow the wetting of the solder surfaces. This...

IPC-2251 - Standard Only

Design Guide for the Packaging of High Speed Electronic Circuit

Document #:
IPC-2251
Revision
Original Version
Product Type
Standard Only
Released:  11/01/2003
Language
English
This guideline addresses the major factors influencing the design of high-speed circuitry. Considerations include electrical noise, electromagnetic interference, signal propagation time, impedance, thermo-mechanical environmental protection, and heat dissipation. Supersedes IPC-D-317A. Key improvements over the IPC-D-317A document include updated impedance models for embedded microstrip, centered...
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IPC-2315 - Standard Only

Design Guide for High Density Interconnects & Microvias

Document #:
IPC-2315
Revision
Original Version
Product Type
Standard Only
Released:  06/01/2000
Language
English
Published jointly with the Japan Printed Circuits Association, IPC/JPCA-2315 provides an easy to follow tutorial on the selection of HDI and microvia design rules and structures. Addresses various considerations when designing an HDI printed wiring board including design examples and processes, selection of materials, general descriptions, and various microvia technologies. Offers designers and...

IPC-7094 - Standard Only

Design and Assembly Process Implementation for Flip Chip and Die Size Components

Document #:
IPC-7094
Revision
Original Version
Product Type
Standard Only
Released:  03/18/2009
Language
English
Implementing flip chip technology in a direct chip attach (DCA) assembly presents some unique challenges for design, assembly, inspection and repair personnel. IPC-7094 delivers useful and practical information to anyone who is currently using or contemplating developing products that employ the very complex and high density methods needed for the flip chip technology. The concepts have become...

IPC-SM-785-English

IPC-SM-785: Guidelines for Accelerated Reliability Testing of Surface Mount Attachments

Document #:
IPC-SM-785
Revision
Original Version
Product Type
Standard Only
Released:  11/01/1992
Language
English
Guidelines for accelerated reliability testing of surface mount solder attachments when evaluating and extrapolating the results of these tests towards actual use environments of electronic assemblies. 50 pages. Released November 1992. Included in the IPC-C-103 and the IPC-C-1000 Collections
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IPC/JEDEC-J-STD-035 - Standard Only

Acoustic Microscopy for Non-Hermetic Encapsulated Electronic Components

Document #:
IPC/JEDEC-J-STD-035
Revision
Original Version
Product Type
Standard Only
Released:  04/01/1999
Language
English
This test method defines the procedures for performing acoustic microscopy on non-hermetic encapsulated electronic components. It provides users with an acoustic microscopy process flow for detecting defects non-destructively in plastic packages while achieving reproducibility. Developed by IPC and JEDEC. 16 pages. Released April 1999. Equivalent to IEC Publicly Available Specification (PAS) 62191
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Coming Soon

IPC-9242: Guidelines for Microsection Evaluation

IPC-9691C: User Guide for the IPC-TM-650, Method 2.6.25 Conductive Anodic Filament (CAF) Resistance and Other Internal Electrochemical Migration Testing

IPC-A-630A: Acceptability Standard for Manufacture, Inspection, and Testing of Electronic Enclosures

IPC-4556A: Specification for Electroless Nickel/Electroless Palladium/ Immersion Gold (ENEPIG) Plating for Printed Boards

IPC-7527A: Requirements for Solder Paste Application

IPC-4204C: Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Boards

IPC-J-STD-002F: Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires

IPC-4101F: Specifications for Base Materials for Rigid and Multilayer Printed Boards

IPC-1755B: Responsible Sourcing of Minerals Data Exchange Standard

IPC-2223F: Sectional Design Standard for Flexible/Rigid-Flexible Printed Boards

IPC-HDBK-9798A: Handbook and Guide to Supplement IPC-9797

IPC-WP-011: Guidance for Strain Gage Limits for Assemblies

J-STD-046A: Customer Notification Standard for Product/Process Changes by Electronic Product Suppliers

J-STD-048A: Notification Standard for Product Discontinuance

IPC-T-50P: Terms and Definitions for Interconnecting and Packaging Electronic Circuits

IPC-1401B: Corporate Social Responsibility Management System Standard

IPC -1751B: Generic Requirements for Declaration Process Management

IPC-6013F: Qualification and Performance Specification for Flexible/Rigid-Flexible Printed Boards

IPC-4413 - Am1: Specification for Finished Fabric Woven from Low Dk Glass for Printed Boards