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IPC-D-354 - Standard Only

Library Format Description for Printed Boards in Digital Form

Document #:
IPC-D-354
Revision
Original Version
Product Type
Standard Only
Released:  02/01/1987
Language
English
Current Revision
Describes the usage of libraries within the processing and generation of information files. The data contained within covers both the definition and usage of internal (existing within the information file) and external libraries. The libraries can be used to make generated data more compact and facilitate data exchange and archival. The subroutines within a library can be used one or more times...
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IPC-D-351 - Standard Only

Printed Board Drawings in Digital Form

Document #:
IPC-D-351
Revision
Original Version
Product Type
Standard Only
Released:  08/01/1985
Language
English
Current Revision
Describes an intelligent, digital format for transfer of drawings between printed wiring board designers, manufacturers and customers. Also conveys additional requirements, guidelines and examples necessary to provide the data structures and concepts for drawing description in digital form. Supplements ANSI/IPC-D-350. Pertains to four basic types of drawings: master drawings, schematics, assembly...
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IPC-D-355 - Standard Only

Printed Board Automated Assembly Description in Digital Form

Document #:
IPC-D-355
Revision
Original Version
Product Type
Standard Only
Released:  01/01/1995
Language
English
Current Revision
Describes an intelligent, digital data transfer format for describing component mounting information. Supplements IPC-D-350 and is for designers and assemblers. Data included are pin location, component orientation, etc. This document is frozen; no future updates are planned. 33 pages. Released January 1995.
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IPC-D-352 - Standard Only

Electronic Design Data Description for Printed Boards in Digital Form

Document #:
IPC-D-352
Revision
Original Version
Product Type
Standard Only
Released:  08/01/1985
Language
English
Current Revision
Describes the relationship between elements used in electromechanical design and packaging of printed boards. Includes descriptions for logical and physical elements necessary as input to a design system, as well as the network of interconnection description between the various electronic parts. Provides the capability of describing all elements in their final form upon design completion. The...

IPC-CA-821 - Standard Only

General Requirements for Thermally Conductive Adhesives

Document #:
IPC-CA-821
Revision
Original Version
Product Type
Standard Only
Released:  01/01/1995
Language
English
Current Revision
Covers requirements and test methods for thermally conductive dielectric adhesives used to bond components in place. Permanent, removable and self-shimming adhesives are addressed. 18 pages. Released January 1995.

IPC-A-311 - Standard Only

Process Controls for Phototool Generation and Use

Document #:
IPC-A-311
Revision
Original Version
Product Type
Standard Only
Released:  03/01/1996
Language
English
Current Revision
Covers the information and data to be collected during the generation and use of phototools to improve artwork quality, thereby improving yields downstream. It also helps establish and maintain ISO 9000 certification and SPC by facilitating troubleshooting, standardizing the process for both experienced and inexperienced operators and by identifying process improvements for the ultimate...
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IPC-9708 - Standard Only

Test Methods for Characterization of Printed Board Assembly Pad Cratering

Document #:
IPC-9708
Revision
Original Version
Product Type
Standard Only
Released:  12/14/2010
Language
English
Current Revision
Mechanical bend and shock tests are routinely performed on SMT assemblies to ensure that they can sustain anticipated production, handling and end use conditions. The strains and strain rates applied to SMT assemblies during bend and shock testing can lead to a variety of failure modes in the vicinity of the solder joints. This document provides test methods to evaluate the susceptibility of...
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IPC-9706 - Standard Only

Mechanical Shock In-situ Electrical Metrology Test Guidelines for FCBGA SMT Component Solder Crack and Pad Crater/Trace Crack Detection

Document #:
IPC-9706
Revision
Original Version
Product Type
Standard Only
Released:  01/14/2014
Language
English
Current Revision
Survey-based study presents data and analysis on the EMS industry, examining trends in sources of revenue, revenue per employee, services offered, markets served, manufacturing technology, capital investment, spending on equipment and materials and market size including forecasts and potential for market expansion. This study is based on data provided by a representative sample of 120 EMS...

IPC-9641 - Standard Only

High Temperature Printed Board Flatness Guideline

Document #:
IPC-9641
Revision
Original Version
Product Type
Standard Only
Released:  07/10/2013
Language
English
Current Revision
Printed board flatness is largely affected by a change in intrinsic properties through exposure to variances in temperature. The worst case deviation of the printed board from flatness may be at room temperature, peak temperature during reflow, or at any temperature in between. Printed board flatness must therefore be characterized during the entire reflow thermal cycle, and not solely at room...

IPC-9301 - Standard Only

Numerical Analysis Guidelines for Microelectronics Packaging Design and Reliability

Document #:
IPC/JEDEC-9301
Revision
Original Version
Product Type
Standard Only
Released:  01/15/2019
Language
English
Current Revision
The IPC/JEDEC-9301document is an effort to standardize and document some of the basic tenets of a typical Finite Element Analysis (FEA) model, as well as, to educate new designers (and in some cases even experienced designers) on the basic information and best practices that should be captured and provided to technical reviewers of the results of FEA data.

IPC-9702 - Standard with Amendment 1

Monotonic Bend Characterization of Board-Level Interconnects

Document #:
IPC-9702
Revision
Original Version
Product Type
Standard with amendment(s)
Released:  08/18/2015
Language
English
Current Revision
This publication is intended to characterize the frature strength of a component's board level-interconnect by providing a common method of establishing the fracture resistance to flexural loading that may occur during conventional non-cyclic board assembly and test operations. The document is applicable to surface mount components attached to printed wiring boards using conventional solder reflow...

IPC-7621 - Standard Only

Guideline for Design, Material Selection and General Application of Encapsulation of Electronic Circuit Assembly by Low Pressure Molding with Thermoplastics

Document #:
IPC-7621
Revision
Original Version
Product Type
Standard Only
Released:  02/14/2018
Language
English
Current Revision
Encapsulation, for the purpose of IPC-7621 standard, is defined as a low pressure molded thermoplastic, e.g., polyamide, which is brought to a liquid state and injection molded and (rather quickly) returned to a temperature below its melting point., forming a durable yet pliable (rubbery-like) form. The desired performance characteristics of low pressure molding (LPM) encapsulation depend on the...

IPC-6903 - Standard Only

Terms and Definitions for the Design and Manufacture of Printed Electronics (Additive Circuitry)

Document #:
IPC-6903
Revision
D
Product Type
Standard Only
Released:  10/29/2015
Language
English
This standard provides industry-approved terms and definitions to create a common language for users and suppliers to develop electronics products that utilize printed electronics alone or as additive processes combined with traditional rigid, flexible and rigid-flex PWB assemblies Released October 2015.

IPC/JPCA-6901 - Standard Only

Application Categories for Printed Electronics

Document #:
IPC/JPCA-6901
Revision
Original Version
Product Type
Standard Only
Released:  08/26/2015
Language
English
Current Revision
This standard establishes a Market Classification System and Level Classification System for printed electronics assemblies and provides a list of performance criteria and testing methods. It provides a standardized product category structure for designing and manufacturing printed electronics and assemblies which conform to industry-established performance metrics as determined by accepted...

IPC-6013 - Revision D - Standard Only

Qualification and Performance Specification for Flexible/Rigid-Flexible Printed Boards

Document #:
IPC-6013
Revision
D
Product Type
Standard Only
Released:  09/01/2017
Language
English
The IPC-6013D covers qualification and performance requirements for flexible printed boards designed to IPC-2221 and IPC-2223. The flexible printed board may be single-sided, double-sided, multilayer or rigid-flex multilayer. All of these constructions may include stiffeners, PTHs, microvias, and blind/buried vias. IPC-6013D incorporates new and updated requirements for final finishes, rigid-to...

IPC-2612 - Standard Only

Sectional Requirements for Electronic Diagramming Documentation (Schematic and Logic Descriptions)

Document #:
IPC-2612
Revision
Original Version
Product Type
Standard Only
Released:  04/30/2010
Language
English
Current Revision
This standard establishes the requirements for the documentation of electronic diagrams used as the foundation for defining the electrical interconnectivity of electronic products. The description pertains to either schematic diagrams, logic diagrams or Boolean truth tables and includes methodology for defining circuit flow, electrical or functional restrictions, or maintenance test procedures...
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IPC-2223 - Revision D - Standard Only

Sectional Design Standard for Flexible/Rigid-Flexible Printed Boards

Document #:
IPC-2223
Revision
D
Product Type
Standard Only
Released:  09/20/2016
Language
English
Used in conjunction with IPC-2221, IPC-2223 establishes the specific requirements for the design of flexible printed boards and forms of component mounting and interconnecting structures. The flexible materials used in the structures are comprised of insulating films, reinforced and/or non-reinforced dielectric in combination with metallic materials. Revision D provides new design guidance and...
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IPC-2612-01 - Standard Only

Sectional Requirements for Electronic Diagramming Symbol Generation Methodology

Document #:
IPC-2612-1
Revision
Original Version
Product Type
Standard Only
Released:  04/30/2010
Language
English
Current Revision
This standard establishes the requirements for generation of electronic symbols used in the documentation of electronic diagrams that define the electrical interconnectivity of electronic products. The descriptions pertain to schematic symbols, logic symbols or Boolean truth tables required to define the circuit configuration. Where appropriate, the standard also includes methodology for defining...
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IPC/WHMA-A-620 - Revision C - Standard Only

Requirements and Acceptance for Cable and Wire Harness Assemblies

Document #:
IPC/WHMA-A-620
Revision
C
Product Type
Standard Only
Released:  10/02/2017
Language
English
This is the only industry-consensus standard for Requirements and Acceptance of Cable and Wire Harness Assemblies, and it includes new sections for safety wiring, safety cable, grommets, and raceways along with updated information across many of the sections. With over 700 photographs and illustrations, this standard describes materials, methods, tests and acceptance criteria for producing crimped...

IPC-1601 - Revision A - Standard Only

Printed Board Handling and Storage Guidelines

Document #:
IPC-1601
Revision
A
Product Type
Standard Only
Released:  06/27/2016
Language
English
The industry's sole guideline on the handling, packaging and storage of printed boards. The guidelines in this document are intended to protect printed boards from contamination, physical damage, solderability degradation and moisture uptake. Consideration is given to packaging material types and methods, production environment, handling and transport of product, and establishing baking profiles...

IPC-2221 - Revision B - Standard Only

Generic Standard on Printed Board Design

Document #:
IPC-2221
Revision
B
Product Type
Standard Only
Released:  11/20/2012
Language
English
IPC-2221B is the foundation design standard for all documents in the IPC-2220 series. It establishes the generic requirements for the design of printed boards and other forms of component mounting or interconnecting structures, whether single-sided, double-sided or multilayer. Among the many updates to Revision B are new criteria for conductor characteristics, surface finishes, via protection...

IPC-2222 - Revision A - Standard Only

Sectional Design Standard for Rigid Organic Printed Boards

Document #:
IPC-2222
Revision
A
Product Type
Standard Only
Released:  12/14/2010
Language
English
Used in conjunction with IPC-2221, IPC-2222 establishes the specific requirements for the design of rigid organic printed boards and other forms of component mounting and interconnecting structures. This standard applies to single-sided, double-sided or multi-layered boards. Key concepts in this document are: rigid laminate properties, design requirements for printed board assembly and design...
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IPC-A-620 - Revision B - Standard Only

Requirements and Acceptance for Cable and Wire Harness Assemblies

Document #:
IPC/WHMA-A-620
Revision
B
Product Type
Standard Only
Released:  10/30/2012
Language
English
Amendment 1 to IPC/WHMA-A-620B This amendment provides resolution to some internal conflicts, aligns common criteria to other IPC standards, and corrects some editorial errors. This amendment is only to be used in conjunction with IPC/WHMA-A-620 Revision B, October 2012. Follow your company policy and procedures to make pen and ink changes or notations to the published IPC/WHMA-A-620 Revision B...
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Coming Soon

IPC-9242: Guidelines for Microsection Evaluation

IPC-9691C: User Guide for the IPC-TM-650, Method 2.6.25 Conductive Anodic Filament (CAF) Resistance and Other Internal Electrochemical Migration Testing

IPC-A-630A: Acceptability Standard for Manufacture, Inspection, and Testing of Electronic Enclosures

IPC-4556A: Specification for Electroless Nickel/Electroless Palladium/ Immersion Gold (ENEPIG) Plating for Printed Boards

IPC-7527A: Requirements for Solder Paste Application

IPC-4204C: Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Boards

IPC-J-STD-002F: Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires

IPC-4101F: Specifications for Base Materials for Rigid and Multilayer Printed Boards

IPC-1755B: Responsible Sourcing of Minerals Data Exchange Standard

IPC-2223F: Sectional Design Standard for Flexible/Rigid-Flexible Printed Boards

IPC-HDBK-9798A: Handbook and Guide to Supplement IPC-9797

IPC-WP-011: Guidance for Strain Gage Limits for Assemblies

J-STD-046A: Customer Notification Standard for Product/Process Changes by Electronic Product Suppliers

J-STD-048A: Notification Standard for Product Discontinuance

IPC-T-50P: Terms and Definitions for Interconnecting and Packaging Electronic Circuits

IPC-1401B: Corporate Social Responsibility Management System Standard

IPC -1751B: Generic Requirements for Declaration Process Management

IPC-6013F: Qualification and Performance Specification for Flexible/Rigid-Flexible Printed Boards

IPC-4413 - Am1: Specification for Finished Fabric Woven from Low Dk Glass for Printed Boards