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IPC-2221 - Revision B - Standard Only

Basisrichtlinie für das Design von Leiterplatten

Document #:
IPC-2221
Revision
B
Product Type
Standard Only
Released:  11/11/2013
Language
German
Current Revision
BeschreibunginEnglisch IPC-2221B ist die Basisrichtlinie für das Design und bildet die Grundlage für alle Dokumente der IPC-2220-Serie. Sie legt die allgemeinen Anforderungen für das Design von Leiterplatten aus organischenMaterialien sowie anderen Formen der Bauteilbefestigung oder Verbindungsstrukturen fest. Die Materialien können homogen, verstärkt oder in Kombination mit anorganischen...
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IPC-2226 - Revision A - Standard Only

分野別設計基準：高密度配線(HDI)プリント基板の設計

Document #:
IPC-2226
Revision
A
Product Type
Standard Only
Released:  12/05/2019
Language
Japanese
Current Revision
本書「IPC-2226A 分野別設計基準：高密度配線(HDI)プリント基板の設計」は、IPC-2221Bと組み合わせて使用される。IPC-2226Aでは、高密度配線(HDI)プリント基板およびマイクロビア技術の設計に関する要求事項と考慮事項を確立している。リビジョンAは、HDI構造のための新規カラーコードや、ルーティング密度要因に関する新規事項、および形体サイズに関する推奨事項(アスペクト比、キャプチャランドサイズ、対象ランドサイズ)など、実質的な最新情報によって構成されている。セクション3、5および9に掲載するほぼすべてのグラフィックは、さまざまなマイクロビア形成プロセスとHDI構造に対応するよう、新たなグラフィックで改訂もしくは補完されている

IPC-7525 - Revision B - Standard Only

Designrichtlinie für Druckschablonen

Document #:
IPC-7525
Revision
B
Product Type
Standard Only
Released:  04/15/2013
Language
German
Current Revision
Dieses Dokument unterstützt Richtlinien für das Design und die Herstellung von Druckschablonen für Lotpasten und Kleber für die Oberflächenmontage für THT- und THT/SMD-Technologie. Darin eingeschlossen sind die Unterschiede zwischen bleihaltigen und bleifreien Lotpasten, Überdruckung, Doppeldruck und Stufenschablonen Designs. Enthalten sind ebenfalls Beispiele für ein Bestellformular und die...
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IPC-7530 - Revision A - Standard Only

群焊工艺温度曲线指南（再流焊和波峰焊

Document #:
IPC-7530
Revision
A
Product Type
Standard Only
Released:  05/29/2019
Language
Chinese
Current Revision
本标准的目的是为开发温度曲线提供有效和实用的信息，以生产可接受的锡铅和无铅的电子组件。该修订版将原来标准的重点从再流温度曲线扩展到包括激光焊曲线、选择焊曲线、波峰焊曲线或其他焊接曲线。该修订版还包括一个全彩色故障排除指南，用于解决可归因于分析的常见缺陷。
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IPC-6903 - Revision A - Standard Only

印刷电子设计与生产的术语及定义

Document #:
IPC-6903
Revision
A
Product Type
Standard Only
Released:  12/18/2018
Language
Chinese
Current Revision
IPC-6903A标准提供了62个印刷电子行业设计和制造相关的术语及定义。IPC-6903A标准为全球印刷电子行业提供一个共同的语言和知识
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IPC-7351 - Revision B - Standard Only

表面贴装设计及连接盘图形标准通用要求

Document #:
IPC-7351
Revision
B
Product Type
Standard Only
Released:  02/24/2020
Language
Chinese
Current Revision
本文件中的信息旨在提供表面贴装连接盘图形的适当尺寸、形状和公差，以确保为形成适当的焊料填充提供充足的区域，从而满足IPC J-STD-001 标准的要求，同时能够对这些焊点进行检验、测试及返工。设计工程师可以使用这些信息去建立标准的连接盘图形，此连接盘图形不仅可用于手工设计， 还可用于计算机辅助设计系统。无论电子元器件是被贴装到印制板的单面还是双面，是采用波峰焊、再流焊，还是其他的焊接方式，连接盘图形和元器件尺寸都应该优化，以确保形成适当的焊点和检验准则。2010年6月出版，2020年1月翻译。
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IPC-2221 - Revision A - Standard Only

Generic Standard on Printed Board Design

Document #:
IPC-2221
Revision
A
Product Type
Standard Only
Released:  06/04/2007
Language
Chinese
Current Revision
This is the Chinese language translation of IPC-2221A. Only available in electronic format. IPC-2221A is the foundation design standard for all documents in the IPC-2220 series. It establishes the generic requirements for the design of printed boards and other forms of component mounting or interconnecting structures, whether single-sided, double-sided or multilayer. Among the many updates to...

IPC-1601 - Revision A - Standard Only

Wytyczne dla obsługiwania i przechowywania płyt drukowanych

Document #:
IPC-1601
Revision
A
Product Type
Standard Only
Released:  04/26/2019
Language
Polish
Current Revision
Jedyny dokument branżowy dotyczący obsługiwania, pakowania i przechowywania płytek drukowanych. Wskazówki zawarte w tym dokumencie mają na celu ochronę płyt drukowanych przed zanieczyszczeniem, fizycznym uszkodzeniem, utratą lutowalności i wchłanianiem wilgotności. Uwzględniono rodzaje i metody materiałów opakowaniowych, środowisko produkcyjne, obsługiwanie i transport, a także profile wygrzewania...
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IPC-2221 - Revision B - Standard Only

プリント基板設計に関する共通基準

Document #:
IPC-2221
Revision
B
Product Type
Standard Only
Released:  09/20/2019
Language
Japanese
Current Revision
記述 IPC-2221Bは、IPC-2220シリーズの全文書の基本となる設計基準である。これは片面、両面、または多層を問わず、プリント基板およびその他の形状の部品実装構造または相互接続構造の設計に関し、 一般的な要求事項を規定するものである。本書、リビジョンBの多くの更新内容として、導体特性、表面仕上げ、ビアプロテクション、基板の電気試験、誘電特性、基板ハウジング、熱ストレス、コンプライアントピン、パネライゼーション、および内層・外層の銅はくの厚さに関する新規基準がある。附属書Aには、ロットの受入れおよび品質適合試験で用いられるテストクーポンの新規設計が記載されている。170ページ。 2012年出版。2015年4月翻訳。 目次をみる。pdfファイル。
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IPC-1601 - Revision A - Standard Only

印制板操作和储存指南

Document #:
IPC-1601
Revision
A
Product Type
Standard Only
Released:  04/12/2019
Language
Chinese
Current Revision
描述 关于印制板操作、包装和储存的行业指南。这些指南是为了保护印制板，避免其受到污染、物理损坏、可焊性降低、静电放电（必要时）和吸湿。本文件考虑了包装材料和方法、生产环境、操作和产品运输，建立了除湿烘烤曲线。修订本A扩大了覆盖范围，包括防潮袋（MBB）、烘烤对印刷板可焊性的影响、ESD问题、蚀刻芯和复合材料的湿度问题、干燥剂材料和HIC卡以及包装和处理要求的示例流程。2017年8月翻译。

IPC-1601 - Revision A - Standard Only

Guía para el manejo y almacenamiento de tarjetas impresas

Document #:
IPC-1601
Revision
A
Product Type
Standard Only
Released:  08/21/2018
Language
Spanish
Current Revision
La única guía de la industria para el manejo, empaquetado y almacenamiento de tarjetas impresas. Las pautas descritas en este documento tienen la intención de proteger las tarjetas impresas de contaminación, daños físicos, degradación y absorción de humedad. Se consideran los tipos de materiales y métodos de empaquetado, los entornos de producción, el manejo y transporte del producto y se...

IPC-1602 - Standard Only

Standard for Printed Board Handling and Storage

Document #:
IPC-1602
Revision
Original Version
Product Type
Standard Only
Released:  04/07/2020
Language
English
The IPC-1602 standard provides requirements intended to protect printed boards from contamination, physical damage, solderability degradation and moisture uptake. Consideration is given to packaging materials types and methods, production environment, handling and transport of product, and establishing baking profiles for moisture removal. IPC-1602 is now providing requirements that can be called...

IPC-2291 - Standard Only

Design Guideline for Printed Electronics

Document #:
IPC-2291
Revision
Original Version
Product Type
Standard Only
Released:  07/30/2013
Language
English
This guideline provides an overview of the design process flow for printed electronics based devices, modules and units, and final products.The intent of IPC/JPCA-2291 is to establish a design process flow that will facilitate and improve the practice of printed electronics design. IPC/JPCA-2291 identifies documents such as standards that can be used to assist during the design process flow. 24...

IPC-4761 - Standard Only

Design Guide for Protection of Printed Board Via Structures

Document #:
IPC-4761
Revision
Original Version
Product Type
Standard Only
Released:  07/01/2006
Language
English
IPC-4761 is the sole industry guideline providing PCB designers, manufacturers and uses with detailed information on all existing methods for protecting vias on printed boards, including all types of via tenting, plugging, filling and capping. Production issues, long term reliability concerns and material specification and selection are provided to aid in evaluating the benefits and concerns for...
IPC/DAC-2552 Cover Image

IPC-DAC-2552 - Standard Only

General Electronic Components Model Based Definition (MBD) Standard

Document #:
IPC/DAC-2552
Revision
Original Version
Product Type
Standard Only
Released:  08/02/2022
Language
English
The IPC/DAC-2552 standard was developed jointly with the Digital Association of China (DAC), with the purpose to use Model Based Definition (MBD) to realize efficient and high-quality digital design of board-level assembly, support electronic assembly virtual manufacturing, and enabling the digitalization from requirement to product realization for printed board assemblies. The IPC/DAC-2552...
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IPC-2611 - Standard Only

Generic Requirements for Electronic Product Documentation

Document #:
IPC-2611
Revision
Original Version
Product Type
Standard Only
Released:  04/30/2010
Language
English
This standard establishes the generic requirements for a document set describing electronic products, and the methodology used for revision control and configuration management of the information. The generic descriptions apply to the entire document set and are used to define and maintain the electronic product. The methodology permits different grades of completeness of the documentation, as...

IPC-7530 - Standard Only

Guidelines for Temperature Profiling for Mass Soldering (Reflow & Wave) Processes

Document #:
IPC-7530
Revision
Original Version
Product Type
Standard Only
Released:  05/01/2001
Language
English
During mass soldering, it is important that all solder joints reach the minimum soldering (reflow) temperature to assure metallurgical bonding of the solder alloy and the base metals to be soldered. Metallurgical bonding requires that both surfaces to be soldered, as well as the solder, reach this minimum soldering temperature for a sufficient time to allow the wetting of the solder surfaces. This...

IPC-2251 - Standard Only

Design Guide for the Packaging of High Speed Electronic Circuit

Document #:
IPC-2251
Revision
Original Version
Product Type
Standard Only
Released:  11/01/2003
Language
English
This guideline addresses the major factors influencing the design of high-speed circuitry. Considerations include electrical noise, electromagnetic interference, signal propagation time, impedance, thermo-mechanical environmental protection, and heat dissipation. Supersedes IPC-D-317A. Key improvements over the IPC-D-317A document include updated impedance models for embedded microstrip, centered...
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IPC-2315 - Standard Only

Design Guide for High Density Interconnects & Microvias

Document #:
IPC-2315
Revision
Original Version
Product Type
Standard Only
Released:  06/01/2000
Language
English
Published jointly with the Japan Printed Circuits Association, IPC/JPCA-2315 provides an easy to follow tutorial on the selection of HDI and microvia design rules and structures. Addresses various considerations when designing an HDI printed wiring board including design examples and processes, selection of materials, general descriptions, and various microvia technologies. Offers designers and...

IPC-7094 - Standard Only

Design and Assembly Process Implementation for Flip Chip and Die Size Components

Document #:
IPC-7094
Revision
Original Version
Product Type
Standard Only
Released:  03/18/2009
Language
English
Implementing flip chip technology in a direct chip attach (DCA) assembly presents some unique challenges for design, assembly, inspection and repair personnel. IPC-7094 delivers useful and practical information to anyone who is currently using or contemplating developing products that employ the very complex and high density methods needed for the flip chip technology. The concepts have become...
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J-STD-013 - Standard Only

Implementation of Ball Grid Array & Other High Density Technology

Document #:
IPC-J-STD-013
Revision
Original Version
Product Type
Standard Only
Released:  07/01/1996
Language
English
This document establishes the requirements and interactions necessary for printed board assembly processes for interconnecting high performance/high pin count IC packages. Includes information on design principles, material selection, board fabrication, assembly technology, testing strategy and reliability expectations based on end-use environments. Developed by IPC, EIA, MCNC and Sematech. 96...

IPC-D-620 - Standard Only

Design and Critical Process Requirements for Cable and Wiring Harnesses

Document #:
IPC-D-620
Revision
Original Version
Product Type
Standard Only
Released:  12/08/2015
Language
English
IPC-D-620 provides design and critical process requirements for the three product classes of cable and wire harness assemblies as well as military/space applications. It is the design requirements companion to IPC/WHMA-A-620, "Requirements and Acceptance for Cable and Wire Harness Assemblies," and its associated Space Addendum Three white papers are included to provide guidance on key topics...

IPC-9121 - Standard Only

Troubleshooting for PCB Fabrication Processes

Document #:
IPC-9121
Revision
Original Version
Product Type
Standard Only
Released:  02/01/2016
Language
English
This handbook is an essential resource for anyone involved in manufacturing or purchasing PCBs. Hundreds of real-world, full-color photos spotlight more than 650 PCB process defects, with causes and corrective actions for each. IPC-9121 supersedes the PCB sections of IPC-PE-740A. Released March 2016

IPC-7093 - Standard Only

Design and Assembly Process Implementation for Bottom Termination Components

Document #:
IPC-7093
Revision
Original Version
Product Type
Standard Only
Released:  03/28/2011
Language
English
This standard describes the design and assembly challenges for implementing Bottom Termination surface mount Components (BTCs) whose external connections consist of metallized terminals that are an integral part of the component body. The BTCs in this document include all types and forms of bottom-only termination components intended for surface mounting. This includes such industry descriptive...

IPC-7091 - Standard Only

Design and Assembly Process Implementation of 3D Components

Document #:
IPC-7091
Revision
Original Version
Product Type
Standard Only
Released:  09/25/2017
Language
English
The IPC-7091 intends to provide useful and practical information to those who are designing, developing or using 3D-packaged semiconductor components or those who are considering 3D package implementation. The 3D semiconductor package may include multiple die elements—some homogeneous and some heterogeneous. The package may also include several discrete passive SMT devices, some of which are...
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IPC-7351 - Standard Only

Generic Requirements for Surface Mount Design and Land Pattern Standard

Document #:
IPC-7351
Revision
Original Version
Product Type
Standard Only
Released:  02/01/2005
Language
English
The successor to the IPC-SM-782A is here! The document covers land pattern design for all types of passive and active components, including resistors, capacitors, MELFs, SSOPs, TSSOPs, QFPs, BGAs, QFNs and SONs. The standard provides many brand new features, including an intelligent land pattern naming convention, zero component rotations for CAD systems, and a set of three separate land pattern...
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IPC-7092 - Standard Only

Design and Assembly Process Implementation for Embedded Components

Document #:
IPC-7092
Revision
Original Version
Product Type
Standard Only
Released:  02/18/2015
Language
English
This document describes the design and assembly challenges for implementing passive and active components, in either formed or placed methodology, into a printed board. It provides useful and practical information to decision makers of formed or placed, passive or active components and helps establish inspection techniques, testing processes, and reliability validations. Users will also learn...

IPC-2292 - Standard Only

Design Standard for Printed Electronics on Flexible Substrates

Document #:
IPC-2292
Revision
Original Version
Product Type
Standard Only
Released:  03/01/2018
Language
English
IPC-2292 standard establishes specific requirements for the design of printed electronic applications and their forms of component mounting and interconnecting structures on flexible substrates. Flexible substrates, as pertaining to IPC-2292 standard, are materials or devices which have some amount of flexibility or bendability (not rigid) but are not considered to be stretchable (e.g., fabrics...

IPC-2231 - Standard Only

DFX Guidelines

Document #:
IPC-2231
Revision
Original Version
Product Type
Standard Only
Released:  05/14/2019
Language
English
The IPC-2231 standard provides guidelines for establishing a best practice methodology for use in developing a formal DFX (Design for Manufacturing, Fabrication, Assembly, Testability, Cost, Reliability, Environment, Reuse) process for layout of printed board assemblies that utilize surface mount and through hole devices.

IPC-1791 - Standard Only

Trusted Electronic Designer, Fabricator and Assembler Requirements

Document #:
IPC-1791
Revision
Original Version
Product Type
Standard Only
Released:  09/05/2018
Language
English
IPC-1791 provides minimum requirements, policies and procedures for printed board design, fabricating and assembly organizations and/or companies to become trusted sources for markets requiring high levels of confidence in the integrity of delivered products. Demonstration of the ability to meet and maintain the requirements of IPC-1791 as trusted design, fabricator or assembly organization...

IPC-1782 - Standard Only

Standard for Manufacturing and Supply Chain Traceability of Electronic Products

Document #:
IPC-1782
Revision
Original Version
Product Type
Standard Only
Released:  11/01/2016
Language
English
The lack of a uniform component traceability standard has caused an unnecessary consumption of resources (e.g., time, people, money, etc.) to track events or parts to their sources and to remedy any quality, reliability, etc., issues. Lack of a standard has also made it difficult to uniformly create and appropriately enforce the necessary contracts. This standard establishes minimum requirements...

IPC-1401 - Standard Only

Supply Chain Social Responsibility Management System Guidance

Document #:
IPC-1401
Revision
Original Version
Product Type
Standard Only
Released:  03/01/2017
Language
English
This standard helps companies achieve intended outcomes of a supply chain social responsibility management system, creating value for the company, its customers, its suppliers and other stakeholders. Users of this standard can expect the following outcomes: Enhancement of working conditions, environmental performance and ethics level of the supply chain Fulfillment of compliance obligations and...

IPC-T-50M-French

IPC-T-50M-FR: Termes et Définitions pour les Circuits Électroniques Imprimés et Assemblés

Document #:
IPC-T-50
Revision
M
Product Type
Standard Only
Released:  06/30/2015
Language
French
Ce document essentiel pour l’industrie fournit des descriptions et des illustrations de la terminologie de l’industrie d’assemblage électronique afin d’aider les utilisateurs et leur clients à casser les barrières linguistiques. La révision M contient plus de 220 termes nouveaux ou révisés, incluant la nouvelle terminologie pour les procédés de tropicalisation, d’enrobage et d’encapsulation, la...

IPC-T-50 - Revision M - Standard Only

电子电路互连与封装术语及定义

Document #:
IPC-T-50
Revision
M
Product Type
Standard Only
Released:  09/19/2016
Language
Chinese
本文件是电子互连行业不可或缺的术语标准。该文件图文并茂，可帮助用户及其客户克服语言上的沟通障碍。M版本包含超过220多条新术语或修订术语，包括敷形涂覆、灌封和封装工艺、模板设计、统计工艺控制和挠性印制板技术。也包括通用行业缩写词。

IPC-9121 - Amendment 2

Troubleshooting for Printed Board Fabrication Processes

Document #:
IPC-9121
Revision
Original Version
Product Type
Amendment
Released:  09/01/2019
Language
English
The amendment 2 to IPC-9121 provides new troubleshooting topics on hole quality, laser drilling, microvias, drill smear, electroless nickel, organic solderability preservative (OSP) and rigid-flex boards.

IPC-T-50 - Revision H - Standard Only

电子电路互连与封装术语及定义

Document #:
IPC-T-50
Revision
H
Product Type
Standard Only
Released:  09/17/2009
Language
Chinese
Description in English 本文件是电子互连行业不可或缺的一份术语标准。该文件图文并茂，可帮助用户及其客户克服语言上的沟通障碍。H版本包含200多条新术语或修订术语，新术语涉及球栅阵列和芯片尺寸封装、导通孔保护、导体图形、组装工艺、基材和选择性电镀工艺等。还包括通用工业缩写词和根据技术分类排序的术语索引，以便于查找。全文276页，于 2008年7月公布。

IPC-9121 - Amendment 1

Troubleshooting for PCB Fabrication Processes

Document #:
IPC-9121
Revision
Original Version
Product Type
Amendment
Released:  04/02/2018
Language
English
IPC-9121 AM1 is an amendment to IPC-9121 which provides updates to the Hole Preparation/Protection and Interconnect Formation sections, covering troubleshooting topics and guidance on nonconductive plugging paste, microvias and pattern plating rim voids. IPC-9121 AM1 also includes a new section on Flexible Circuits.
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IPC/DAC-2552 -Standard Only

通用电子元器件基于模型的定义

Document #:
IPC/DAC-2552
Revision
Original Version
Product Type
Standard Only
Released:  10/25/2024
Language
Chinese
Current Revision
本标准是由IPC与广东省数字化学会（DAC）联合开发和发布的国际标准，目的旨在解决业内各厂家提供的电子元器件几何模型及语义信息参差不齐，导致使用方需要重复建模处理且无法复用等问题。 定义如何将电子元器件的设计、仿真、制造等领域的属性关联到电子元器件的三维模型及对应的子部件上的数字化建模，通过规范各供应商按模型交付，工具间（CAD/CAE等）数据集成打通的方式，可实现高效
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IPC-1602 - Standard Only

印制板操作和储存标准

Document #:
IPC-1602
Revision
Original Version
Product Type
Standard Only
Released:  10/04/2023
Language
Chinese
Current Revision
IPC-1602 标准提供了保护印制板，避免其受到污染、物理损坏、可焊性降低和吸湿的要求。要考虑包装的材料类型和方法、生产环境、产品的操作和运输，以及为除水汽建立烘烤曲线。IPC-1602 提供了可在采购文件中列出的要求。IPC-1602 标准扩充了防潮袋 (MBB) 的覆盖范围、烘烤对印刷板可焊性的影响、ESD 问题、蚀刻的芯板和压合结构的的湿气关注、干燥剂材料和湿度指示卡（HIC），以及传递对包装和操作要求的范例。IPC-1602替代了原IPC-1601A即印制板操作和存储指南的许多建议性要求，而改为强制性要求
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IPC-1602 - Standard Only

プリント基板の取扱いと保管に関する規格

Document #:
IPC-1602
Revision
Original Version
Product Type
Standard Only
Released:  08/11/2023
Language
Japanese
Current Revision
規格書「IPC-1602」はプリント基板を汚染や物理的損傷、はんだ付性の低下や吸湿から保護することを目的とし、その要求事項を取りまとめたものである。梱包資材の種類や梱包方法、製品の製造環境、取扱いと輸送、また、水分除去を目的としたベーキングプロファイルの策定などに関し、懸念事項が示されている。今回のIPC-1602では、調達文書に記載可能な要求事項についても触れている。本規格書「IPC-1602」では、防湿袋(MBB)、プリント基板をベーキングすることによるはんだ付性への影響、ESD問題、エッチング後のコア材・複合材の湿気に関する懸念事項、乾燥剤とHICカード、梱包/取扱いに関する要求事項のフローダウン例など幅広い内容を網羅している。
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IPC-2221 Appendix A - Version 4

IPC-2221 Appendix A Version 4.0 April 2022

Document #:
IPC-2221
Revision
Original Version
Product Type
Appendix
Released:  07/26/2023
Language
English
Current Revision
Appendix A to IPC-2221 provides an overview of designs, limitations and intended uses for IPC-2221 test coupons used for conformance evaluations to IPC-601X printed board performance specifications.
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IPC-2231 - Standard Only

卓越设计（DFX）指南

Document #:
IPC-2231
Revision
Original Version
Product Type
Standard Only
Released:  04/09/2020
Language
Chinese
Current Revision
本文件提供了制定最佳实践方法的指南，用于在开发正式DFX（面向可制造性、可制作性、可组装性、可测试性、成本、可靠性、环境、重用性设计）的过程中对采用表面贴装和通孔器件的印制板组件进行布局。

IPC-7092 - Standard Only

埋入式元器件涉及和组装工艺的实施

Document #:
IPC-7092
Revision
Original Version
Product Type
Standard Only
Released:  01/20/2020
Language
Chinese
Current Revision
本标准描述了在印制板中以成形或放置方式实现的有源和无源元器件在设计和组装方面的挑战。包括内部电子元器件的完整结构可用于表面贴装和／或通孔元器件连接。在组装过程中，多层结构变成准备为进一步加工的完整产品，它可由有机、无机（陶瓷）或两类兼有的材料制成。
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IPC-D-620 - Standard Only

线缆及线束组件的设计与关键工艺要求

Document #:
IPC-D-620
Revision
Original Version
Product Type
Standard Only
Released:  03/24/2022
Language
Chinese
Current Revision
IPC-D-620 为线缆和线束组件以及军事/航空应用的三个产品类别提供了设计与关键工艺要求。 它是 IPC/WHMA-A-620“线缆及线束组件的要求与验收”及其相关航空附录的设计要求伴侣 包括三份白皮书，为标准中讨论的关键主题提供指导。 这些是： IPC-WP-113, Guidance for the Development and Implementation of a Red Plague Control Plan (RPCP) IPC-WP-114, Guidance for the Development and Implementation of a White Plague Control Plan (WPCP) IPC-WP-116, Guidance for the Development and Implementation of a Foreign Object...

IPC-7530 - Standard Only

Útmutató tömegforrasztási (reflow és hullám) folyamatok hőmérsékleti profiljának kialakításához

Document #:
IPC-7530
Revision
Original Version
Product Type
Standard Only
Released:  04/19/2014
Language
Hungarian
Current Revision
MEGHATÁROZÁS> angolul MEGHATÁROZÁS angolul A tömegforrasztás során alapvető fontosságú, hogy mindegyik forraszkötés elérje a minimális forrasztási hőmérsékletet ezzel biztosítható, hogy a forraszanyag és az összeforrasztandó fémfelületek között diffúziós kötés jöjjön létre. A diffúziós kötésnek mindkét forrasztandó fémfelület és a forraszanyag között létre kell jönnie. Ehhez a minimális...

IPC-7093 - Standard Only

底部端子元器件(BTC)设计和组装工艺的实施

Document #:
IPC-7093
Revision
Original Version
Product Type
Standard Only
Released:  03/28/2011
Language
Chinese
Current Revision
本标准描述了采用底部端子表面贴装元器件(BTC)在设计和组装方面的挑战，BTC元器件外部连接由构成元器件整体一部分的金属端子组成。本文件中BTC包括了仅有底部端子并要实施表面贴装的所有类型元器件。包括QFN、 DFN、 SON、 LGA、MLP 和MLF等业界描述性术语。这里所含信息的焦点放在BTCs元器件的关键设计、组装、检验、维修以及和BTC相关的可靠性问题上。 这份文件的目标读者是与电子设计、组装、检验和维修等过程有关的经理、设计和工艺工程师、操作员和技术员。本文件的目的是给正考虑采用锡/铅、无铅、粘合剂或其它形式互连工艺来组装BTC类元器件的那些公司提供实际而有用的资讯。虽然本文件不是包含一切的秘方，但它识别了影响进行稳健和可靠组装的许多特性，可给正面临组装制程问题的元器件供应商提供指导性的信息。全文共68页。2011年3月发布。2014年5月翻译。

IPC-1601 - Standard Only

Handhabung und Lagerung von Leiterplatten

Document #:
IPC-1601
Revision
Original Version
Product Type
Standard Only
Released:  08/30/2010
Language
German
Current Revision
BeschreibunginEnglisch Der einzige Industrie-Standard für das Handling, die Verpackung und Lagerung von Leiterplatten. Die Anwendung dieser Richtlinie soll Leiterplatten schützen vor Verunreinigung, mechanischer Beschädigung, Verschlechterung der Lötbarkeit und Feuchteaufnahme. Berücksichtigt werden Verpackungsmaterialien- und methoden, Produktionsumgebung, Handling und Transport der Produkte...
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IPC-1782 - Standard Only

电子产品的制造和供应链可追溯性标准

Document #:
IPC-1782
Revision
Original Version
Product Type
Standard Only
Released:  04/12/2019
Language
Chinese
Current Revision
缺乏统一的元器件可追溯性标准已经导致不必要的资源消耗（例如时间、人力、金钱等）来跟踪事件或部件的来源，并补救相关质量、可靠性等问题。标准缺失也导致难以一致地创建和适当地执行必要的合同。 本标准建立了制造商和供应链可追溯性的最低要求，此要求是基于供需双方协商确定（AABUS）的感知风险。本标准适用于所有产品，制程，组件，部件，元器件，所使用的设备以及由供需双方在印制电路板组件制造以及机械组装中定义的其他项目。

IPC-2152 - Standard Only

Designrichtlinie für die Bestimmung der Stromtragfähigkeit von Leiterplatten

Document #:
IPC-2152
Revision
Original Version
Product Type
Standard Only
Released:  08/30/2009
Language
German
Current Revision
Beschreibung in Englisch Der einzige Industrie-Standard zur Bestimmung der geeigneten Dimensionierung von Leitern auf Innen- und Aussenlagen von Leiterplatten, in Bezug auf die geforderte Stromtragfähigkeit und die zulässige Temperaturerhöhung von Leitern. Dieser Standard beschäftigt sich mit dem Einfluss von Thermischer Leitfähigkeit, Durchkontaktierungen, Kupferflächen, Verlustleistung und...
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IPC-7530 - Revision A - Standard Only

量産はんだ付プロセス( リフローおよびウェーブ) のための温度プロファイルガイドライン

Document #:
IPC-7530
Revision
A
Product Type
Standard Only
Released:  08/12/2022
Language
Japanese
本規格は、許容可能な電子組立品(SnPbおよびPbフリー)を製造するうえで必要となる熱プロファイルの作成において、有用かつ実用的な情報を提供するものである。今回の改版では、旧版でのリフロープロファイルから、ベーパーフェーズ、レーザー、セレクティブおよびウェーブソルダリングのプロファイルに至るまで対象範囲が拡大されている。また、プロファイル作成時に発生し得る一般的な不具合事象に対処するためのトラブルシューティングガイドをフルカラーで掲載している。

IPC-2221 - Revision A - Standard Only

Basisrichtlinie für das Design von Leiterplatten

Document #:
IPC-2221
Revision
A
Product Type
Standard Only
Released:  10/24/2007
Language
German
This is the German Language version of IPC-2221A. IPC-2221A is the foundation design standard for all documents in the IPC-2220 series. It establishes the generic requirements for the design of printed boards and other forms of component mounting or interconnecting structures, whether single-sided, double-sided or multilayer. Among the many updates to Revision A are new criteria for surface...
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IPC-7095 - Revision C - Standard Only

BGA设计与组装工艺的实施

Document #:
IPC-7095
Revision
C
Product Type
Standard Only
Released:  04/19/2017
Language
Chinese
在设计，组装，检查和维修过程中实施球栅阵列（BGA）和细节距球栅阵列（FBGA）技术提出了了一些独特的挑战。IPC-7095C为当前使用BGA或FBGA的人员提供了有用且实用的信息。由于焊球中合金，焊球形状，封装程序等的改变，许多问题变得尤为重要。C版主要重点是为组装后出现的一些新的机械失效问题如坑裂或层压缺陷提供信息。 除了提供BGA检查和维修的指引外，IPC-7095C还解决了与BGA相关的可靠性问题和无铅焊点的使用标准。该标准中有许多X射线和内窥镜的照片和插图以确认行业中BGA组装工艺的实施中的遇到的一些情况。全文共176页。2013年1月出版。2016年11月翻译。

IPC-7525 - Revision B - Standard Only

模板设计指导

Document #:
IPC-7525
Revision
B
Product Type
Standard Only
Released:  02/26/2014
Language
Chinese
中文描述 本文件为设计与制造焊膏及表面贴装胶用模板提供 指导以及采用通孔或者倒装芯片器件的混装技术模 板设计，其中包括锡铅和无铅焊膏、套印、二次印 刷和阶梯模板设计之间的差别。该文件同时提供了 样品定购单和用户检验检查表

IPC-7351 - Revision A - Standard Only

Basisanforderungen an das SMT-Design und SMD-Anschlussflächen-Richtlinie

Document #:
IPC-7351
Revision
A
Product Type
Standard Only
Released:  09/17/2008
Language
German
NEW! IPC-7351A includes both the standard and an IPC-7351A land pattern calculator on CD-ROM for accessing component and land pattern dimensional data.The calculator includes the document’s mathematical algorithms so users can build a land pattern for a corresponding surface mount part quickly and accurately.The tool also allows for modification of dimensional attributes of IPC-approved land...

IPC-2223 - Revision A - Standard Only

Sectional Design Standard for Flexible Printed Boards

Document #:
IPC-2223
Revision
A
Product Type
Standard Only
Released:  09/05/2007
Language
German
This is the German Language version of IPC-2223A. Used in conjunction with IPC-2221A, IPC-2223 establishes the requirements for the design of single-sided, double-sided, multilayer, or rigid-flex flexible circuits. Revision A includes updated design rules for panel sizes, hole spacing, bend radii, shielding, palletization, nonfunctional lands, coverlayer access/spacing and conductor edge spacing...

IPC-2222 - Revision A - Standard Only

Norme Sectionnelle de Conception pour les Circuits Imprimés Organiques Rigides

Document #:
IPC-2222
Revision
A
Product Type
Standard Only
Released:  08/24/2015
Language
French
Utilisée conjointement avec l‘IPC-2221, l‘IPC-2222 établit les exigences spécifiques pour la conception des circuits imprimés organiques rigides et d'autres formes de structures de montage et d'interconnexion de composants. Cette norme s'applique aux circuits simple-face, double-face ou multicouches. Les concepts clés de ce document sont : les propriétés du stratifié rigide, les exigences de...
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IPC-9121 - Amendment 1

印制板制造工艺问题解答 修订本1

Document #:
IPC-9121
Revision
Original Version
Product Type
Amendment
Released:  10/08/2020
Language
Chinese
Current Revision
本手册可供任何生产制造或采购印制板的人员作为基本资源。数百张真实的全彩色照片聚焦了650多个印刷电路板工艺缺陷，每个缺陷都有其分析原因和纠正措施。IPC-9121是取代1997年12月发布 的IPC-PE-740A中的PCB部分。2016年3月发布9121英文母标准，2018年年4月发布修订本1，修订本1于2020年4月翻译。详情参见目录。
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IPC-9121 - Standard Only

印制板制造工艺问题解答

Document #:
IPC-9121
Revision
Original Version
Product Type
Standard Only
Released:  12/18/2018
Language
Chinese
本手册可供任何生产制造或采购印制板的人员作为基本资源。数百张真实的全彩色照片聚焦了650多个印刷电路板工艺缺陷，每个缺陷都有其分析原因和纠正措施。IPC-9121是取代1997年12月发布 的IPC-PE-740A中的PCB部分。本标准于2016年3月发布，2018年7月翻译。

IPC-7530 - Standard Only

群焊工艺温度曲线指南（再流焊和波峰焊)

Document #:
IPC-7530
Revision
Original Version
Product Type
Standard Only
Released:  11/18/2016
Language
Chinese
在群焊过程中，所有焊点均达到最低焊接（再流焊）温度是重要的以确保焊料合金和被焊基底金属之间形成冶金结合而达到焊接。冶金结合要求被焊接的两表面以及焊料需达到最低焊接温度并且维持充足的时间，以使焊料表面润湿。本文件提供了适当的温度曲线测试工具与有关温度曲线的各种技术和方法指南。共18页， 于2001年5月发行。

IPC-1401 - Standard Only

供应链社会责任管理体系指南

Document #:
IPC-1401
Revision
Original Version
Product Type
Standard Only
Released:  04/07/2017
Language
Chinese
本标准协助企业实现其供应链社会责任管理体系的预期结果，为企业自身、其客户、其供应商以及其他利益相关者创造价值。这些预期结果包括： 改进供应链的工作条件、环保绩效和道德水平 履行社会责任合规义务，降低供应链风险和成本 实现社会责任目标，包括提升客户满意度、企业及其供应链的竞争优势

IPC-1601 - Standard Only

印制板操作和贮存指南

Document #:
IPC-1601
Revision
Original Version
Product Type
Standard Only
Released:  08/30/2010
Language
Chinese
简要介绍 （英文） 行业内唯一一份关于印制板操作、包装和贮存的指南。本文件中的指南是为了保护印制板，避免其受到污染、物理损伤、可焊性降低和吸潮。还给出了以下需考虑的因素：包装材料类型和方法、生产环境、产品操作和运输、建立推荐的湿气水平、建立去除湿气的烘烤曲线以及烘烤对印制板可靠性的影响。 全文共18页，2010年8月正式发布英文版；2011年5月发布中文版。
101-162 of 162

Coming Soon

IPC-9242: Guidelines for Microsection Evaluation

IPC-9691C: User Guide for the IPC-TM-650, Method 2.6.25 Conductive Anodic Filament (CAF) Resistance and Other Internal Electrochemical Migration Testing

IPC-A-630A: Acceptability Standard for Manufacture, Inspection, and Testing of Electronic Enclosures

IPC-4556A: Specification for Electroless Nickel/Electroless Palladium/ Immersion Gold (ENEPIG) Plating for Printed Boards

IPC-7527A: Requirements for Solder Paste Application

IPC-4204C: Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Boards

IPC-J-STD-002F: Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires

IPC-4101F: Specifications for Base Materials for Rigid and Multilayer Printed Boards

IPC-1755B: Responsible Sourcing of Minerals Data Exchange Standard

IPC-2223F: Sectional Design Standard for Flexible/Rigid-Flexible Printed Boards

IPC-HDBK-9798A: Handbook and Guide to Supplement IPC-9797

IPC-WP-011: Guidance for Strain Gage Limits for Assemblies

J-STD-046A: Customer Notification Standard for Product/Process Changes by Electronic Product Suppliers

J-STD-048A: Notification Standard for Product Discontinuance

IPC-T-50P: Terms and Definitions for Interconnecting and Packaging Electronic Circuits

IPC-1401B: Corporate Social Responsibility Management System Standard

IPC -1751B: Generic Requirements for Declaration Process Management

IPC-6013F: Qualification and Performance Specification for Flexible/Rigid-Flexible Printed Boards

IPC-4413 - Am1: Specification for Finished Fabric Woven from Low Dk Glass for Printed Boards