Standards

Your results

Products

Document #:

IPC-2221

Revision

Product Type

Standard Only

Released: 11/11/2013

Language

German

Current Revision

BeschreibunginEnglisch IPC-2221B ist die Basisrichtlinie für das Design und bildet die Grundlage für alle Dokumente der IPC-2220-Serie. Sie legt die allgemeinen Anforderungen für das Design von Leiterplatten aus organischenMaterialien sowie anderen Formen der Bauteilbefestigung oder Verbindungsstrukturen fest. Die Materialien können homogen, verstärkt oder in Kombination mit anorganischen...

Document #:

IPC-2226

Revision

Product Type

Standard Only

Released: 12/05/2019

Language

Japanese

Current Revision

本書「IPC-2226A 分野別設計基準：高密度配線(HDI)プリント基板の設計」は、IPC-2221Bと組み合わせて使用される。IPC-2226Aでは、高密度配線(HDI)プリント基板およびマイクロビア技術の設計に関する要求事項と考慮事項を確立している。リビジョンAは、HDI構造のための新規カラーコードや、ルーティング密度要因に関する新規事項、および形体サイズに関する推奨事項(アスペクト比、キャプチャランドサイズ、対象ランドサイズ)など、実質的な最新情報によって構成されている。セクション3、5および9に掲載するほぼすべてのグラフィックは、さまざまなマイクロビア形成プロセスとHDI構造に対応するよう、新たなグラフィックで改訂もしくは補完されている

Document #:

IPC-7525

Revision

Product Type

Standard Only

Released: 04/15/2013

Language

German

Current Revision

Dieses Dokument unterstützt Richtlinien für das Design und die Herstellung von Druckschablonen für Lotpasten und Kleber für die Oberflächenmontage für THT- und THT/SMD-Technologie. Darin eingeschlossen sind die Unterschiede zwischen bleihaltigen und bleifreien Lotpasten, Überdruckung, Doppeldruck und Stufenschablonen Designs. Enthalten sind ebenfalls Beispiele für ein Bestellformular und die...

Document #:

IPC-7530

Revision

Product Type

Standard Only

Released: 05/29/2019

Language

Chinese

Current Revision

本标准的目的是为开发温度曲线提供有效和实用的信息，以生产可接受的锡铅和无铅的电子组件。该修订版将原来标准的重点从再流温度曲线扩展到包括激光焊曲线、选择焊曲线、波峰焊曲线或其他焊接曲线。该修订版还包括一个全彩色故障排除指南，用于解决可归因于分析的常见缺陷。

Document #:

IPC-6903

Revision

Product Type

Standard Only

Released: 12/18/2018

Language

Chinese

Current Revision

IPC-6903A标准提供了62个印刷电子行业设计和制造相关的术语及定义。IPC-6903A标准为全球印刷电子行业提供一个共同的语言和知识

Document #:

IPC-7351

Revision

Product Type

Standard Only

Released: 02/24/2020

Language

Chinese

Current Revision

本文件中的信息旨在提供表面贴装连接盘图形的适当尺寸、形状和公差，以确保为形成适当的焊料填充提供充足的区域，从而满足IPC J-STD-001 标准的要求，同时能够对这些焊点进行检验、测试及返工。设计工程师可以使用这些信息去建立标准的连接盘图形，此连接盘图形不仅可用于手工设计，还可用于计算机辅助设计系统。无论电子元器件是被贴装到印制板的单面还是双面，是采用波峰焊、再流焊，还是其他的焊接方式，连接盘图形和元器件尺寸都应该优化，以确保形成适当的焊点和检验准则。2010年6月出版，2020年1月翻译。

Document #:

IPC-2221

Revision

Product Type

Standard Only

Released: 06/04/2007

Language

Chinese

Current Revision

This is the Chinese language translation of IPC-2221A. Only available in electronic format. IPC-2221A is the foundation design standard for all documents in the IPC-2220 series. It establishes the generic requirements for the design of printed boards and other forms of component mounting or interconnecting structures, whether single-sided, double-sided or multilayer. Among the many updates to...

Document #:

IPC-1601

Revision

Product Type

Standard Only

Released: 04/26/2019

Language

Polish

Current Revision

Jedyny dokument branżowy dotyczący obsługiwania, pakowania i przechowywania płytek drukowanych. Wskazówki zawarte w tym dokumencie mają na celu ochronę płyt drukowanych przed zanieczyszczeniem, fizycznym uszkodzeniem, utratą lutowalności i wchłanianiem wilgotności. Uwzględniono rodzaje i metody materiałów opakowaniowych, środowisko produkcyjne, obsługiwanie i transport, a także profile wygrzewania...

Document #:

IPC-2221

Revision

Product Type

Standard Only

Released: 09/20/2019

Language

Japanese

Current Revision

記述 IPC-2221Bは、IPC-2220シリーズの全文書の基本となる設計基準である。これは片面、両面、または多層を問わず、プリント基板およびその他の形状の部品実装構造または相互接続構造の設計に関し、一般的な要求事項を規定するものである。本書、リビジョンBの多くの更新内容として、導体特性、表面仕上げ、ビアプロテクション、基板の電気試験、誘電特性、基板ハウジング、熱ストレス、コンプライアントピン、パネライゼーション、および内層・外層の銅はくの厚さに関する新規基準がある。附属書Aには、ロットの受入れおよび品質適合試験で用いられるテストクーポンの新規設計が記載されている。170ページ。 2012年出版。2015年4月翻訳。目次をみる。pdfファイル。

Document #:

IPC-1601

Revision

Product Type

Standard Only

Released: 04/12/2019

Language

Chinese

Current Revision

描述关于印制板操作、包装和储存的行业指南。这些指南是为了保护印制板，避免其受到污染、物理损坏、可焊性降低、静电放电（必要时）和吸湿。本文件考虑了包装材料和方法、生产环境、操作和产品运输，建立了除湿烘烤曲线。修订本A扩大了覆盖范围，包括防潮袋（MBB）、烘烤对印刷板可焊性的影响、ESD问题、蚀刻芯和复合材料的湿度问题、干燥剂材料和HIC卡以及包装和处理要求的示例流程。2017年8月翻译。

Document #:

IPC-1601

Revision

Product Type

Standard Only

Released: 08/21/2018

Language

Spanish

Current Revision

La única guía de la industria para el manejo, empaquetado y almacenamiento de tarjetas impresas. Las pautas descritas en este documento tienen la intención de proteger las tarjetas impresas de contaminación, daños físicos, degradación y absorción de humedad. Se consideran los tipos de materiales y métodos de empaquetado, los entornos de producción, el manejo y transporte del producto y se...

Document #:

IPC-1602

Revision

Original Version

Product Type

Standard Only

Released: 04/07/2020

Language

English

The IPC-1602 standard provides requirements intended to protect printed boards from contamination, physical damage, solderability degradation and moisture uptake. Consideration is given to packaging materials types and methods, production environment, handling and transport of product, and establishing baking profiles for moisture removal. IPC-1602 is now providing requirements that can be called...

Document #:

IPC-2291

Revision

Original Version

Product Type

Standard Only

Released: 07/30/2013

Language

English

This guideline provides an overview of the design process flow for printed electronics based devices, modules and units, and final products.The intent of IPC/JPCA-2291 is to establish a design process flow that will facilitate and improve the practice of printed electronics design. IPC/JPCA-2291 identifies documents such as standards that can be used to assist during the design process flow. 24...

Document #:

IPC-4761

Revision

Original Version

Product Type

Standard Only

Released: 07/01/2006

Language

English

IPC-4761 is the sole industry guideline providing PCB designers, manufacturers and uses with detailed information on all existing methods for protecting vias on printed boards, including all types of via tenting, plugging, filling and capping. Production issues, long term reliability concerns and material specification and selection are provided to aid in evaluating the benefits and concerns for...

Document #:

IPC/DAC-2552

Revision

Original Version

Product Type

Standard Only

Released: 08/02/2022

Language

English

The IPC/DAC-2552 standard was developed jointly with the Digital Association of China (DAC), with the purpose to use Model Based Definition (MBD) to realize efficient and high-quality digital design of board-level assembly, support electronic assembly virtual manufacturing, and enabling the digitalization from requirement to product realization for printed board assemblies. The IPC/DAC-2552...

Document #:

IPC-2611

Revision

Original Version

Product Type

Standard Only

Released: 04/30/2010

Language

English

This standard establishes the generic requirements for a document set describing electronic products, and the methodology used for revision control and configuration management of the information. The generic descriptions apply to the entire document set and are used to define and maintain the electronic product. The methodology permits different grades of completeness of the documentation, as...

Document #:

IPC-7530

Revision

Original Version

Product Type

Standard Only

Released: 05/01/2001

Language

English

During mass soldering, it is important that all solder joints reach the minimum soldering (reflow) temperature to assure metallurgical bonding of the solder alloy and the base metals to be soldered. Metallurgical bonding requires that both surfaces to be soldered, as well as the solder, reach this minimum soldering temperature for a sufficient time to allow the wetting of the solder surfaces. This...

Document #:

IPC-2251

Revision

Original Version

Product Type

Standard Only

Released: 11/01/2003

Language

English

This guideline addresses the major factors influencing the design of high-speed circuitry. Considerations include electrical noise, electromagnetic interference, signal propagation time, impedance, thermo-mechanical environmental protection, and heat dissipation. Supersedes IPC-D-317A. Key improvements over the IPC-D-317A document include updated impedance models for embedded microstrip, centered...

Document #:

IPC-2315

Revision

Original Version

Product Type

Standard Only

Released: 06/01/2000

Language

English

Published jointly with the Japan Printed Circuits Association, IPC/JPCA-2315 provides an easy to follow tutorial on the selection of HDI and microvia design rules and structures. Addresses various considerations when designing an HDI printed wiring board including design examples and processes, selection of materials, general descriptions, and various microvia technologies. Offers designers and...

Document #:

IPC-7094

Revision

Original Version

Product Type

Standard Only

Released: 03/18/2009

Language

English

Implementing flip chip technology in a direct chip attach (DCA) assembly presents some unique challenges for design, assembly, inspection and repair personnel. IPC-7094 delivers useful and practical information to anyone who is currently using or contemplating developing products that employ the very complex and high density methods needed for the flip chip technology. The concepts have become...

Document #:

IPC-J-STD-013

Revision

Original Version

Product Type

Standard Only

Released: 07/01/1996

Language

English

This document establishes the requirements and interactions necessary for printed board assembly processes for interconnecting high performance/high pin count IC packages. Includes information on design principles, material selection, board fabrication, assembly technology, testing strategy and reliability expectations based on end-use environments. Developed by IPC, EIA, MCNC and Sematech. 96...

Document #:

IPC-D-620

Revision

Original Version

Product Type

Standard Only

Released: 12/08/2015

Language

English

IPC-D-620 provides design and critical process requirements for the three product classes of cable and wire harness assemblies as well as military/space applications. It is the design requirements companion to IPC/WHMA-A-620, "Requirements and Acceptance for Cable and Wire Harness Assemblies," and its associated Space Addendum Three white papers are included to provide guidance on key topics...

Document #:

IPC-9121

Revision

Original Version

Product Type

Standard Only

Released: 02/01/2016

Language

English

This handbook is an essential resource for anyone involved in manufacturing or purchasing PCBs. Hundreds of real-world, full-color photos spotlight more than 650 PCB process defects, with causes and corrective actions for each. IPC-9121 supersedes the PCB sections of IPC-PE-740A. Released March 2016

Document #:

IPC-7093

Revision

Original Version

Product Type

Standard Only

Released: 03/28/2011

Language

English

This standard describes the design and assembly challenges for implementing Bottom Termination surface mount Components (BTCs) whose external connections consist of metallized terminals that are an integral part of the component body. The BTCs in this document include all types and forms of bottom-only termination components intended for surface mounting. This includes such industry descriptive...

Document #:

IPC-7091

Revision

Original Version

Product Type

Standard Only

Released: 09/25/2017

Language

English

The IPC-7091 intends to provide useful and practical information to those who are designing, developing or using 3D-packaged semiconductor components or those who are considering 3D package implementation. The 3D semiconductor package may include multiple die elements—some homogeneous and some heterogeneous. The package may also include several discrete passive SMT devices, some of which are...