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IPC-7351 - Standard Only

Generic Requirements for Surface Mount Design and Land Pattern Standard

Document #:
IPC-7351
Revision
Original Version
Product Type
Standard Only
Released:  02/01/2005
Language
English
The successor to the IPC-SM-782A is here! The document covers land pattern design for all types of passive and active components, including resistors, capacitors, MELFs, SSOPs, TSSOPs, QFPs, BGAs, QFNs and SONs. The standard provides many brand new features, including an intelligent land pattern naming convention, zero component rotations for CAD systems, and a set of three separate land pattern...
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IPC-7092 - Standard Only

Design and Assembly Process Implementation for Embedded Components

Document #:
IPC-7092
Revision
Original Version
Product Type
Standard Only
Released:  02/18/2015
Language
English
This document describes the design and assembly challenges for implementing passive and active components, in either formed or placed methodology, into a printed board. It provides useful and practical information to decision makers of formed or placed, passive or active components and helps establish inspection techniques, testing processes, and reliability validations. Users will also learn...

IPC-2292 - Standard Only

Design Standard for Printed Electronics on Flexible Substrates

Document #:
IPC-2292
Revision
Original Version
Product Type
Standard Only
Released:  03/01/2018
Language
English
IPC-2292 standard establishes specific requirements for the design of printed electronic applications and their forms of component mounting and interconnecting structures on flexible substrates. Flexible substrates, as pertaining to IPC-2292 standard, are materials or devices which have some amount of flexibility or bendability (not rigid) but are not considered to be stretchable (e.g., fabrics...

IPC-2231 - Standard Only

DFX Guidelines

Document #:
IPC-2231
Revision
Original Version
Product Type
Standard Only
Released:  05/14/2019
Language
English
The IPC-2231 standard provides guidelines for establishing a best practice methodology for use in developing a formal DFX (Design for Manufacturing, Fabrication, Assembly, Testability, Cost, Reliability, Environment, Reuse) process for layout of printed board assemblies that utilize surface mount and through hole devices.

IPC-1791 - Standard Only

Trusted Electronic Designer, Fabricator and Assembler Requirements

Document #:
IPC-1791
Revision
Original Version
Product Type
Standard Only
Released:  09/05/2018
Language
English
IPC-1791 provides minimum requirements, policies and procedures for printed board design, fabricating and assembly organizations and/or companies to become trusted sources for markets requiring high levels of confidence in the integrity of delivered products. Demonstration of the ability to meet and maintain the requirements of IPC-1791 as trusted design, fabricator or assembly organization...

IPC-1782 - Standard Only

Standard for Manufacturing and Supply Chain Traceability of Electronic Products

Document #:
IPC-1782
Revision
Original Version
Product Type
Standard Only
Released:  11/01/2016
Language
English
The lack of a uniform component traceability standard has caused an unnecessary consumption of resources (e.g., time, people, money, etc.) to track events or parts to their sources and to remedy any quality, reliability, etc., issues. Lack of a standard has also made it difficult to uniformly create and appropriately enforce the necessary contracts. This standard establishes minimum requirements...

IPC-1401 - Standard Only

Supply Chain Social Responsibility Management System Guidance

Document #:
IPC-1401
Revision
Original Version
Product Type
Standard Only
Released:  03/01/2017
Language
English
This standard helps companies achieve intended outcomes of a supply chain social responsibility management system, creating value for the company, its customers, its suppliers and other stakeholders. Users of this standard can expect the following outcomes: Enhancement of working conditions, environmental performance and ethics level of the supply chain Fulfillment of compliance obligations and...

IPC-T-50M-French

IPC-T-50M-FR: Termes et Définitions pour les Circuits Électroniques Imprimés et Assemblés

Document #:
IPC-T-50
Revision
M
Product Type
Standard Only
Released:  06/30/2015
Language
French
Ce document essentiel pour l’industrie fournit des descriptions et des illustrations de la terminologie de l’industrie d’assemblage électronique afin d’aider les utilisateurs et leur clients à casser les barrières linguistiques. La révision M contient plus de 220 termes nouveaux ou révisés, incluant la nouvelle terminologie pour les procédés de tropicalisation, d’enrobage et d’encapsulation, la...

IPC-T-50 - Revision M - Standard Only

电子电路互连与封装术语及定义

Document #:
IPC-T-50
Revision
M
Product Type
Standard Only
Released:  09/19/2016
Language
Chinese
本文件是电子互连行业不可或缺的术语标准。该文件图文并茂，可帮助用户及其客户克服语言上的沟通障碍。M版本包含超过220多条新术语或修订术语，包括敷形涂覆、灌封和封装工艺、模板设计、统计工艺控制和挠性印制板技术。也包括通用行业缩写词。

IPC-9121 - Amendment 2

Troubleshooting for Printed Board Fabrication Processes

Document #:
IPC-9121
Revision
Original Version
Product Type
Amendment
Released:  09/01/2019
Language
English
The amendment 2 to IPC-9121 provides new troubleshooting topics on hole quality, laser drilling, microvias, drill smear, electroless nickel, organic solderability preservative (OSP) and rigid-flex boards.

IPC-T-50 - Revision H - Standard Only

电子电路互连与封装术语及定义

Document #:
IPC-T-50
Revision
H
Product Type
Standard Only
Released:  09/17/2009
Language
Chinese
Description in English 本文件是电子互连行业不可或缺的一份术语标准。该文件图文并茂，可帮助用户及其客户克服语言上的沟通障碍。H版本包含200多条新术语或修订术语，新术语涉及球栅阵列和芯片尺寸封装、导通孔保护、导体图形、组装工艺、基材和选择性电镀工艺等。还包括通用工业缩写词和根据技术分类排序的术语索引，以便于查找。全文276页，于 2008年7月公布。

IPC-9121 - Amendment 1

Troubleshooting for PCB Fabrication Processes

Document #:
IPC-9121
Revision
Original Version
Product Type
Amendment
Released:  04/02/2018
Language
English
IPC-9121 AM1 is an amendment to IPC-9121 which provides updates to the Hole Preparation/Protection and Interconnect Formation sections, covering troubleshooting topics and guidance on nonconductive plugging paste, microvias and pattern plating rim voids. IPC-9121 AM1 also includes a new section on Flexible Circuits.
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IPC/DAC-2552 -Standard Only

通用电子元器件基于模型的定义

Document #:
IPC/DAC-2552
Revision
Original Version
Product Type
Standard Only
Released:  10/25/2024
Language
Chinese
Current Revision
本标准是由IPC与广东省数字化学会（DAC）联合开发和发布的国际标准，目的旨在解决业内各厂家提供的电子元器件几何模型及语义信息参差不齐，导致使用方需要重复建模处理且无法复用等问题。 定义如何将电子元器件的设计、仿真、制造等领域的属性关联到电子元器件的三维模型及对应的子部件上的数字化建模，通过规范各供应商按模型交付，工具间（CAD/CAE等）数据集成打通的方式，可实现高效
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IPC-1602 - Standard Only

印制板操作和储存标准

Document #:
IPC-1602
Revision
Original Version
Product Type
Standard Only
Released:  10/04/2023
Language
Chinese
Current Revision
IPC-1602 标准提供了保护印制板，避免其受到污染、物理损坏、可焊性降低和吸湿的要求。要考虑包装的材料类型和方法、生产环境、产品的操作和运输，以及为除水汽建立烘烤曲线。IPC-1602 提供了可在采购文件中列出的要求。IPC-1602 标准扩充了防潮袋 (MBB) 的覆盖范围、烘烤对印刷板可焊性的影响、ESD 问题、蚀刻的芯板和压合结构的的湿气关注、干燥剂材料和湿度指示卡（HIC），以及传递对包装和操作要求的范例。IPC-1602替代了原IPC-1601A即印制板操作和存储指南的许多建议性要求，而改为强制性要求
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IPC-1602 - Standard Only

プリント基板の取扱いと保管に関する規格

Document #:
IPC-1602
Revision
Original Version
Product Type
Standard Only
Released:  08/11/2023
Language
Japanese
Current Revision
規格書「IPC-1602」はプリント基板を汚染や物理的損傷、はんだ付性の低下や吸湿から保護することを目的とし、その要求事項を取りまとめたものである。梱包資材の種類や梱包方法、製品の製造環境、取扱いと輸送、また、水分除去を目的としたベーキングプロファイルの策定などに関し、懸念事項が示されている。今回のIPC-1602では、調達文書に記載可能な要求事項についても触れている。本規格書「IPC-1602」では、防湿袋(MBB)、プリント基板をベーキングすることによるはんだ付性への影響、ESD問題、エッチング後のコア材・複合材の湿気に関する懸念事項、乾燥剤とHICカード、梱包/取扱いに関する要求事項のフローダウン例など幅広い内容を網羅している。
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IPC-2221 Appendix A - Version 4

IPC-2221 Appendix A Version 4.0 April 2022

Document #:
IPC-2221
Revision
Original Version
Product Type
Appendix
Released:  07/26/2023
Language
English
Current Revision
Appendix A to IPC-2221 provides an overview of designs, limitations and intended uses for IPC-2221 test coupons used for conformance evaluations to IPC-601X printed board performance specifications.
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IPC-2231 - Standard Only

卓越设计（DFX）指南

Document #:
IPC-2231
Revision
Original Version
Product Type
Standard Only
Released:  04/09/2020
Language
Chinese
Current Revision
本文件提供了制定最佳实践方法的指南，用于在开发正式DFX（面向可制造性、可制作性、可组装性、可测试性、成本、可靠性、环境、重用性设计）的过程中对采用表面贴装和通孔器件的印制板组件进行布局。

IPC-7092 - Standard Only

埋入式元器件涉及和组装工艺的实施

Document #:
IPC-7092
Revision
Original Version
Product Type
Standard Only
Released:  01/20/2020
Language
Chinese
Current Revision
本标准描述了在印制板中以成形或放置方式实现的有源和无源元器件在设计和组装方面的挑战。包括内部电子元器件的完整结构可用于表面贴装和／或通孔元器件连接。在组装过程中，多层结构变成准备为进一步加工的完整产品，它可由有机、无机（陶瓷）或两类兼有的材料制成。
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IPC-D-620 - Standard Only

线缆及线束组件的设计与关键工艺要求

Document #:
IPC-D-620
Revision
Original Version
Product Type
Standard Only
Released:  03/24/2022
Language
Chinese
Current Revision
IPC-D-620 为线缆和线束组件以及军事/航空应用的三个产品类别提供了设计与关键工艺要求。 它是 IPC/WHMA-A-620“线缆及线束组件的要求与验收”及其相关航空附录的设计要求伴侣 包括三份白皮书，为标准中讨论的关键主题提供指导。 这些是： IPC-WP-113, Guidance for the Development and Implementation of a Red Plague Control Plan (RPCP) IPC-WP-114, Guidance for the Development and Implementation of a White Plague Control Plan (WPCP) IPC-WP-116, Guidance for the Development and Implementation of a Foreign Object...

IPC-7530 - Standard Only

Útmutató tömegforrasztási (reflow és hullám) folyamatok hőmérsékleti profiljának kialakításához

Document #:
IPC-7530
Revision
Original Version
Product Type
Standard Only
Released:  04/19/2014
Language
Hungarian
Current Revision
MEGHATÁROZÁS> angolul MEGHATÁROZÁS angolul A tömegforrasztás során alapvető fontosságú, hogy mindegyik forraszkötés elérje a minimális forrasztási hőmérsékletet ezzel biztosítható, hogy a forraszanyag és az összeforrasztandó fémfelületek között diffúziós kötés jöjjön létre. A diffúziós kötésnek mindkét forrasztandó fémfelület és a forraszanyag között létre kell jönnie. Ehhez a minimális...

IPC-7093 - Standard Only

底部端子元器件(BTC)设计和组装工艺的实施

Document #:
IPC-7093
Revision
Original Version
Product Type
Standard Only
Released:  03/28/2011
Language
Chinese
Current Revision
本标准描述了采用底部端子表面贴装元器件(BTC)在设计和组装方面的挑战，BTC元器件外部连接由构成元器件整体一部分的金属端子组成。本文件中BTC包括了仅有底部端子并要实施表面贴装的所有类型元器件。包括QFN、 DFN、 SON、 LGA、MLP 和MLF等业界描述性术语。这里所含信息的焦点放在BTCs元器件的关键设计、组装、检验、维修以及和BTC相关的可靠性问题上。 这份文件的目标读者是与电子设计、组装、检验和维修等过程有关的经理、设计和工艺工程师、操作员和技术员。本文件的目的是给正考虑采用锡/铅、无铅、粘合剂或其它形式互连工艺来组装BTC类元器件的那些公司提供实际而有用的资讯。虽然本文件不是包含一切的秘方，但它识别了影响进行稳健和可靠组装的许多特性，可给正面临组装制程问题的元器件供应商提供指导性的信息。全文共68页。2011年3月发布。2014年5月翻译。

IPC-1601 - Standard Only

Handhabung und Lagerung von Leiterplatten

Document #:
IPC-1601
Revision
Original Version
Product Type
Standard Only
Released:  08/30/2010
Language
German
Current Revision
BeschreibunginEnglisch Der einzige Industrie-Standard für das Handling, die Verpackung und Lagerung von Leiterplatten. Die Anwendung dieser Richtlinie soll Leiterplatten schützen vor Verunreinigung, mechanischer Beschädigung, Verschlechterung der Lötbarkeit und Feuchteaufnahme. Berücksichtigt werden Verpackungsmaterialien- und methoden, Produktionsumgebung, Handling und Transport der Produkte...
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IPC-1782 - Standard Only

电子产品的制造和供应链可追溯性标准

Document #:
IPC-1782
Revision
Original Version
Product Type
Standard Only
Released:  04/12/2019
Language
Chinese
Current Revision
缺乏统一的元器件可追溯性标准已经导致不必要的资源消耗（例如时间、人力、金钱等）来跟踪事件或部件的来源，并补救相关质量、可靠性等问题。标准缺失也导致难以一致地创建和适当地执行必要的合同。 本标准建立了制造商和供应链可追溯性的最低要求，此要求是基于供需双方协商确定（AABUS）的感知风险。本标准适用于所有产品，制程，组件，部件，元器件，所使用的设备以及由供需双方在印制电路板组件制造以及机械组装中定义的其他项目。

IPC-2152 - Standard Only

Designrichtlinie für die Bestimmung der Stromtragfähigkeit von Leiterplatten

Document #:
IPC-2152
Revision
Original Version
Product Type
Standard Only
Released:  08/30/2009
Language
German
Current Revision
Beschreibung in Englisch Der einzige Industrie-Standard zur Bestimmung der geeigneten Dimensionierung von Leitern auf Innen- und Aussenlagen von Leiterplatten, in Bezug auf die geforderte Stromtragfähigkeit und die zulässige Temperaturerhöhung von Leitern. Dieser Standard beschäftigt sich mit dem Einfluss von Thermischer Leitfähigkeit, Durchkontaktierungen, Kupferflächen, Verlustleistung und...
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Coming Soon

IPC-9242: Guidelines for Microsection Evaluation

IPC-9691C: User Guide for the IPC-TM-650, Method 2.6.25 Conductive Anodic Filament (CAF) Resistance and Other Internal Electrochemical Migration Testing

IPC-A-630A: Acceptability Standard for Manufacture, Inspection, and Testing of Electronic Enclosures

IPC-4556A: Specification for Electroless Nickel/Electroless Palladium/ Immersion Gold (ENEPIG) Plating for Printed Boards

IPC-7527A: Requirements for Solder Paste Application

IPC-4204C: Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Boards

IPC-J-STD-002F: Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires

IPC-4101F: Specifications for Base Materials for Rigid and Multilayer Printed Boards

IPC-1755B: Responsible Sourcing of Minerals Data Exchange Standard

IPC-2223F: Sectional Design Standard for Flexible/Rigid-Flexible Printed Boards

IPC-HDBK-9798A: Handbook and Guide to Supplement IPC-9797

IPC-WP-011: Guidance for Strain Gage Limits for Assemblies

J-STD-046A: Customer Notification Standard for Product/Process Changes by Electronic Product Suppliers

J-STD-048A: Notification Standard for Product Discontinuance

IPC-T-50P: Terms and Definitions for Interconnecting and Packaging Electronic Circuits

IPC-1401B: Corporate Social Responsibility Management System Standard

IPC -1751B: Generic Requirements for Declaration Process Management

IPC-6013F: Qualification and Performance Specification for Flexible/Rigid-Flexible Printed Boards

IPC-4413 - Am1: Specification for Finished Fabric Woven from Low Dk Glass for Printed Boards