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IPC/WHMA-A-620 - Revision B - Standard Only

Kablo ve Kablo Takımları için Kabul Gereklilikleri

Document #:
IPC/WHMA-A-620
Revision
B
Product Type
Standard Only
Released:  11/12/2014
Language
Turkish
Current Revision
Revizyon B, Kablo ve Kablo Takımlarının Kabul Gereklilikleri için endüstrinin ortak dökümanı olmayı sürdürmektedir. IPC ile Kablo Takımları Üreticileri Birliği (WHMA), bu önemli güncellemeyi geliştirmek için beraber çalışmışlardır. YENİ! Dolgu, kalıplı dolgu, ekleme, yalıtkan desteği olmayan krimp kontakları, sıralı yalıtkan yer değiştirme konnektörleri, konnektör bağlantısı, sert ve uyumlu kablo...

IPC/WHMA-A-620 - Revision C - Standard Only

דרישות וקבלה של הרכבות כבלים ורתמות חוטים

Document #:
IPC/WHMA-A-620
Revision
C
Product Type
Standard Only
Released:  06/18/2018
Language
Hebrew
Current Revision
תאור זוהי המהדורה העדכנית ביותר של תקן מוסכם לתעשייה ודרישות קבלה של הרכבות כבלים ורתמות חוטים. תקן זה כולל סעיפים חדשים לאבטחת חיווט, אבטחת בידודים ומידע מעודכן ברבים מהסעיפים, יחד עם למעלה מ- 700 תמונות ואיורים. תקן זה מפרט חומרים שיטות בדיקות וקריטריוני קבלה לייצור בלחיצה, אבטחה מכאנית וחיבורים מולחמים להרכבות ופעולות הקשורות להרכבת כבלים וחיווט. IPC/WHMA-A-620C תוכנן על ידי IPC והאיגוד לייצור...

IPC/WHMA-A-620 - Revision C - Standard Only

Kábel- és huzalköteg-szerelvények követelményei és elfogadása

Document #:
IPC/WHMA-A-620
Revision
C
Product Type
Standard Only
Released:  04/12/2019
Language
Hungarian
Current Revision
Az egyetlen ipari konszenzuson alapuló huzal és vezeték szerelvényekkel kapcsolatos követelményeket és elfogadási kritériumokat tartalmazó szabvány legújabb verziója. Új alfejezetekkel egészültek ki a biztosítóhuzallal, biztosítósodronnyal, tömítőgyűrűkkel és kábelcsatornákkal kapcsolatos részek és a szabvány számos fejezete frissítésre került. Több mint 700 fotóval és illusztrációval ez a...
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IPC-9204 - Standard Only

印刷电子柔性与可拉伸性能测试指南

Document #:
IPC-9204
Revision
B
Product Type
Standard Only
Released:  06/18/2019
Language
Chinese
Current Revision
本指南描述了可用于评估柔性的、可拉伸的和可穿戴的应用中所采用的印刷电子器件的柔性和拉伸性能的测试。26页。2017年3月发布。2019年3月翻译.
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IPC-6018 - Revision C - Standard Only

高频（微波）印制板的鉴定及性能规范

Document #:
IPC-6018
Revision
C
Product Type
Standard Only
Released:  04/11/2019
Language
Chinese
Current Revision
本规范涵盖了高频（微波）印制板鉴定和性能要求，包括有或无镀覆孔的单面板、双面板、含或不含埋孔/盲孔及金属芯的多层板。该标准涉及最终涂覆层和表面电镀涂覆层要求、导体、通孔/导通孔、验收测试的频次和质量一致性、电气与机械及环境要求。C版本在诸如HASL涂层、可选的表面镀层、边缘电镀、标记、微导通孔捕获和目标连接盘、铜盖覆电镀填塞孔、铜填充微孔、PTFE钻污和介质去除等领域中加入了许多新的要求。与IPC-6011一起使用。取代IPC-6018B和IPC-6016。 2017年12月翻译。
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IPC-9691 - Revision B - Standard Only

IPC-TM-650 测试方法2.6.25耐导电阳极丝（CAF）及其他内部电化学迁移（ECM）测试用户指南

Document #:
IPC-9691
Revision
B
Product Type
Standard Only
Released:  04/11/2018
Language
Chinese
Current Revision
本文件是IPC电化学迁移（ECM）技术组的成果。本文件的目的是为如何更好地使用IPC-TM-650测试方法2.6.25《耐导电阳极丝（CAF）测试》以及其他内部电化学迁移（ECM）测试提供指南，以评估机械应力、层压板材料断裂、离子污染、压合层压板前湿气含量以及其它材料加工特性在层压材料中形成的导电路径，例如导电阳极丝（CAF），一种特殊类型的ECM失效模式，对测试结果的影响。该内部ECM测试方法提供了一个已经证实的标准，用于确定由于通孔偏移从而显著降低内部导体间绝缘电阻情况的风险，该现象发生在层压板内部，而不是在印制板的表面上
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IPC-9704 - Revision A - Standard Only

印制板应变测试指南

Document #:
IPC/JEDEC-9704
Revision
A
Product Type
Standard Only
Released:  02/01/2026
Language
Chinese
Current Revision
本文件对印制板（PWB）制造过程中印制板组件的应变测试制定了详细的指南，这些制造过程包括组装、测试、系统集成及印制板的周转/运输。 本文件建议的程序使印制板组装厂能够独立进行所要求的应变测试，并为印制板翘曲测量和风险等级评估提供了量化的方法。
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IPC-7530 - Revision A - Standard Only

群焊工艺温度曲线指南（再流焊和波峰焊

Document #:
IPC-7530
Revision
A
Product Type
Standard Only
Released:  05/29/2019
Language
Chinese
Current Revision
本标准的目的是为开发温度曲线提供有效和实用的信息，以生产可接受的锡铅和无铅的电子组件。该修订版将原来标准的重点从再流温度曲线扩展到包括激光焊曲线、选择焊曲线、波峰焊曲线或其他焊接曲线。该修订版还包括一个全彩色故障排除指南，用于解决可归因于分析的常见缺陷。

IPC-6012 - Revision B - Standard Only

Qualification and Performance Specification for Rigid Printed Boards

Document #:
IPC-6012
Revision
B
Product Type
Standard Only
Released:  09/18/2008
Language
Swedish
Current Revision
Download the free Amendment 2 (.pdf) that resolves conflict in measles criteria between J-STD-001D, IPC-A-610D, IPC-6012B and IPC-A-600G. This is the Swedish Language version of IPC-6012B. This specification covers qualification and performance of rigid printed boards, including single-sided, double-sided, with or without plated-through holes, multilayer with or without blind/buried vias and metal...
IPC-6018DS

IPC-6018 - Revision D - Addendum - Space and Military

Space and Military Avionics Applications Addendum to IPC-6018D, Qualification and Performance Specification for High Frequency (Microwave) Printed Boards

Document #:
IPC-6018
Revision
D
Product Type
Addendum
Released:  08/04/2022
Language
English
The IPC-6018DS addendum supplements or replaces specifically identified requirements of IPC-6018D, for high frequency (microwave) printed boards that must survive the vibration, ground testing and thermal cyclic environments of space and military avionics. The IPC-6018DS addendum incorporates new requirements in areas such as copper wrap plating, dewetting, pad/land anomalies, copper cap plating...

IPC-6012 - Revision E - Amendment 1

刚性印制板的鉴定及性能规范- 修订本1

Document #:
IPC-6012
Revision
E
Product Type
Amendment
Released:  10/28/2022
Language
Chinese
Current Revision
IPC-6012E-AM1是IPC-6012E的修订本，澄清了再流焊SnPb或HASL镀层中退润湿和焊料回缩之间的区别。 该修订本还为成品印制板的最小外部导体厚度提供了修订标准，并为内部电镀层的最小厚度提供了新的接受标准。

IPC/WHMA-A-620 - Revision D - Addendum - Space and Military

Space and Military Applications Electronic Hardware Addendum to IPC/WHMA-A-620D

Document #:
IPC/WHMA-A-620
Revision
D
Product Type
Addendum
Released:  10/07/2020
Language
English
IPC/WHMA-A-620D-S space addendum provides additional requirements to IPC/WHMA-A-620D standard to ensure the reliability of cable and wire harness assemblies that must survive the vibration and thermal excursions encountered getting to and operating in the military and space environments. IPC/WHMA-A-620D-S cannot be used as a standalone document. It must be used with the base standard IPC/WHMA-A...

IPC-6012 - Revision D - Addendum - Automotive

Automotive Applications Addendum to IPC-6012D, Qualification and Performance Specification for Rigid Printed Boards

Document #:
IPC-6012
Revision
D
Product Type
Addendum
Released:  04/01/2016
Language
English
This Addendum, when required by procurement documentation/drawings, supplements or replaces specifically identified requirements of IPC-6012D, Revision D, for rigid printed boards that must survive the vibration and thermal cycling environments of electronic interconnects within the automotive industry.
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IPC-6012 - Revision D - Amendment 1

Sert Baskı Devre Kartları İçin Kalifikasyon ve Performans Spesifikasyonu

Document #:
IPC-6012
Revision
D
Product Type
Amendment
Released:  01/25/2019
Language
Turkish
Current Revision
Bu döküman; kaplı delikiçine sahip olan veya olmayan tek yüzlü, çift yüzlü baskı devre kartları ve kör/gömülü geçiş deliklerine sahip olan veya olmayan çok katmanlı baskı devre kartları ile metal çekirdekli kartları içeren sert baskı devre kartlarının kalifikasyonunu ve performansını kapsamaktadır. Son kaplama ve yüzey kaplama gereklilikleri, iletkenler, delikler/geçiş delikleri, kabul testlerinin...

IPC-6012 - Revision D - Addendum - Space and Military

Space and Military Avionics Applications Addendum to IPC-6012D, Qualification and Performance Specification for Rigid Printed Boards

Document #:
IPC-6012
Revision
D
Product Type
Addendum
Released:  09/22/2015
Language
English
This Addendum supplements or replaces specifically identified requirements of IPC-6012D, Revision D, for rigid printed boards that must survive the vibration, ground testing and thermal cyclic environments of space and military avionics

IPC/WHMA-A-620 - Revision C - Addendum - Space and Military

Space Applications Electronic Hardware Addendum to IPC/WHMA-A-620C

Document #:
IPC/WHMA-A-620
Revision
C
Product Type
Addendum
Released:  03/30/2018
Language
English
IPC/WHMA-A-620C-S provides additional requirements to IPC/WHMA-A-620C to ensure the reliability of cable and wire harness assemblies that must survive the vibration and thermal cyclic environments getting to and operating in space. The IPC/WHMA-A-620C-S space addendum cannot be used as a stand alone document, it must be used with the base standard IPC/WHMA-A-620C.
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IPC/WHMA-A-620 - Revision B - Addendum - Space and Military

Space Applications Electronic Hardware Addendum to IPC/WHMA-A-620B

Document #:
IPC/WHMA-A-620
Revision
B
Product Type
Addendum
Released:  06/01/2013
Language
English
When specifically required by procurement documentation, this Addendum supplements or replaces specifically identified requirements of IPC/WHMA-A-620, Revision B, providing additional requirements to ensure the reliability of cable and wire harness assemblies that must survive the vibration and thermal cyclic environments getting to and operating in space. The required IPC training & certification...
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IPC-A-620 - Revision A - Addendum with Amendment 1 - Space and Military

Space Applications Electronic Hardware Addendum to IPC/WHMA-A-620A

Document #:
IPC/WHMA-A-620
Revision
A
Product Type
Addendum
Released:  07/16/2012
Language
English
IPC/WHMA-A-620AS with Amendment 1 Space Applications Electronic Hardware Addendum to IPC/WHMA-A-620A Requirements and Acceptance for Cable and Wire Harness Assemblies. When specifically required by procurement documentation, this Addendum supplements or replaces specifically identified requirements of IPC/WHMA-A-620, Revision A of July 2006 by providing additional requirements to ensure the...

IPC-6018 - Revision C - Addendum - Space and Military

Space and Military Avionics Applications Addendum to IPC-6018C Qualification and Performance Specification for High Frequency (Microwave) Printed Boards

Document #:
IPC-6018
Revision
C
Product Type
Addendum
Released:  08/09/2016
Language
English
This Addendum supplements or replaces specifically identified requirements of IPC-6018C, for high frequency (microwave) printed boards that must survive the vibration, ground testing and thermal cyclic environments of space and military avionics.

IPC-9707 - Standard Only

Spherical Bend Test Method for Characterization of Board Level Interconnects

Document #:
IPC/JEDEC-9707
Revision
Original Version
Product Type
Standard Only
Released:  09/13/2011
Language
English
This standard on spherical transient bend testing is intended to characterize the maximum allowable strain that a surface mount component's board level interconnects can withstand in flexural loading. Whereas four-point monotonic bend test methods only address simple planar bending, spherical bend tests establish strain limits of board level interconnects under worst-case flexure conditions that...
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IPC-HDBK-9798 - Handbook

Handbook for Press-fit Standard for Automotive Requirements and other High-Reliability Applications

Document #:
IPC-HDBK-9798
Revision
Original Version
Product Type
Handbook
Released:  06/21/2022
Language
English
Current Revision
IPC-HDBK-9798 provides guidelines and supporting information for manufacturing electronic assemblies using compliant press-fit technology. The intent is to explain the ‘‘how-to’’ and ‘‘why’’ information, and fundamentals for these processes. This handbook is supporting the IPC-9797 standard.

IPC-9797 - Standard Only

Press-fit Standard for Automotive Requirements and other High-Reliability Applications

Document #:
IPC-9797
Revision
Original Version
Product Type
Standard Only
Released:  06/01/2020
Language
English
IPC-9797 is the only industry-consensus standard for Requirements and Acceptance of Press-fit Pins. IPC-9797 prescribes practices for the characterization, qualification and acceptance requirements of compliant press-fit technology for printed boards that cover the manufacturability and reliability needs for high reliability applications intended for use in harsh environments such as automotive...

IPC-8497 - Standard Only

Cleaning Methods and Contamination Assessment for Optical Assembly

Document #:
IPC-8497
Revision
Original Version
Product Type
Standard Only
Released:  12/01/2005
Language
English
This standard describes the methods of inspecting and cleaning all optical interfaces so that interconnectivity integrity of the optical signal is maintained. The information provided focuses on techniques and methods to accomplish maximum quality of the interface and describes methods of contamination prevention. The target audience for this standard are Manufacturing Operators, Manufacturing...
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IPC-MS-810 - Standard Only

Guidelines for High Volume Microsection

Document #:
IPC-MS-810
Revision
Original Version
Product Type
Standard Only
Released:  10/01/1993
Language
English
Discusses the many variables and problems associated with the process--from sample removal to micro-etch-- and the variables common to high volume microsection. The process variables and problems are organized so that the reader can research a specific issue or overview the variables of a process area. 31 pages. Released October 1993.

IPC-9631 - Standard Only

User Guide for IPC-TM-650, Method 2.6.27, Thermal Stress, Convection Reflow Assembly Simulation

Document #:
IPC-9631
Revision
Original Version
Product Type
Standard Only
Released:  12/15/2010
Language
English
IPC-9631 addresses concerns and considerations related to IPC-TM-650, Method 2.6.27, Thermal Stress, Convection Reflow Assembly Simulation. This document describes how the test method is intended for use and the rationale behind some of the protocols and requirements. This document was developed with the understanding that the test method will require special equipment and the proper set-up and...
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IPC-9703 - Standard Only

IPC/JEDEC Mechanical Shock Test Guidelines for Solder Joint Reliability

Document #:
IPC/JEDEC-9703
Revision
Original Version
Product Type
Standard Only
Released:  03/18/2009
Language
English
Establishes mechanical drop and shock and test guidelines for assessing solder joint reliability of printed board assemblies from system to component level. This document addresses methods to define mechanical shock use-conditions, methods to define system level, system printed board level and component test board level testing that correlate to such use conditions and guidance on the use of...

IPC-7530 - Standard Only

Guidelines for Temperature Profiling for Mass Soldering (Reflow & Wave) Processes

Document #:
IPC-7530
Revision
Original Version
Product Type
Standard Only
Released:  05/01/2001
Language
English
During mass soldering, it is important that all solder joints reach the minimum soldering (reflow) temperature to assure metallurgical bonding of the solder alloy and the base metals to be soldered. Metallurgical bonding requires that both surfaces to be soldered, as well as the solder, reach this minimum soldering temperature for a sufficient time to allow the wetting of the solder surfaces. This...

IPC-7094 - Standard Only

Design and Assembly Process Implementation for Flip Chip and Die Size Components

Document #:
IPC-7094
Revision
Original Version
Product Type
Standard Only
Released:  03/18/2009
Language
English
Implementing flip chip technology in a direct chip attach (DCA) assembly presents some unique challenges for design, assembly, inspection and repair personnel. IPC-7094 delivers useful and practical information to anyone who is currently using or contemplating developing products that employ the very complex and high density methods needed for the flip chip technology. The concepts have become...

IPC-SM-785-English

IPC-SM-785: Guidelines for Accelerated Reliability Testing of Surface Mount Attachments

Document #:
IPC-SM-785
Revision
Original Version
Product Type
Standard Only
Released:  11/01/1992
Language
English
Guidelines for accelerated reliability testing of surface mount solder attachments when evaluating and extrapolating the results of these tests towards actual use environments of electronic assemblies. 50 pages. Released November 1992. Included in the IPC-C-103 and the IPC-C-1000 Collections
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IPC/JEDEC-J-STD-035 - Standard Only

Acoustic Microscopy for Non-Hermetic Encapsulated Electronic Components

Document #:
IPC/JEDEC-J-STD-035
Revision
Original Version
Product Type
Standard Only
Released:  04/01/1999
Language
English
This test method defines the procedures for performing acoustic microscopy on non-hermetic encapsulated electronic components. It provides users with an acoustic microscopy process flow for detecting defects non-destructively in plastic packages while achieving reproducibility. Developed by IPC and JEDEC. 16 pages. Released April 1999. Equivalent to IEC Publicly Available Specification (PAS) 62191
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IPC/WHMA-A-620 - Revision E - Redline Standard

Requirements and Acceptance for Cable and Wire Harness Assemblies

Document #:
IPC/WHMA-A-620
Revision
E
Product Type
Redline Standard
Released:  03/06/2023
Language
English
IPC/WHMA-A-620E-RL is a redline document showing the difference from IPC/WHMA-A-620D to IPC/WHMA-A-620E. IPC/WHMA-A-620E-RL provides a side-by-side comparison of the two documents and includes the figures and tables. The document shows deleted/changed text in the IPC/WHMA-A-620D pages and new/revised text in the IPC/WHMA-A-620E pages. Due to the complexity of this document, it is only available in...

IPC-9202 - Standard Only

Material and Process Characterization/Qualification Test Protocol for Assessing Electrochemical Performance

Document #:
IPC-9202
Revision
Original Version
Product Type
Standard Only
Released:  10/20/2011
Language
English
This document provides tests that record changes in surface insulation resistance (SIR) on a representative sample of a printed circuit assembly. It quantifies any deleterious effects that might arise from solder flux or other process residues left on external surfaces after soldering, which can cause unwanted electrochemical reactions that grossly affect reliability. It uses test vehicles that...

IPC-9709 - Standard Only

Test Guidelines for Acoustic Emission Measurement during Mechanical Testing

Document #:
IPC-9709
Revision
Original Version
Product Type
Standard Only
Released:  09/13/2011
Language
English
Surface mount pad cratering typically initiates prior to detection by existing electrical monitoring test methods. There are limited instrumentation techniques that are currently available that can identify non-electrical damage and its location to a high degree of accuracy. This guideline document establishes an acoustic emission (AE) method to evaluate the performance and reliability of surface...

IPC-9203 - Standard Only

Users Guide to IPC-9202 and the IPC-B-52 Standard Test Vehicle

Document #:
IPC-9203
Revision
Original Version
Product Type
Standard Only
Released:  04/27/2012
Language
English
While there are a variety of industry test vehicles for the examination of materials compatibility, most available test boards leave something to be desired as there is often a dramatic difference in materials between such test boards and produced assemblies. A test vehicle was needed which could be used for both ion chromatography and SIR testing that would be more representative of mainstream...

IPC-7093 - Standard Only

Design and Assembly Process Implementation for Bottom Termination Components

Document #:
IPC-7093
Revision
Original Version
Product Type
Standard Only
Released:  03/28/2011
Language
English
This standard describes the design and assembly challenges for implementing Bottom Termination surface mount Components (BTCs) whose external connections consist of metallized terminals that are an integral part of the component body. The BTCs in this document include all types and forms of bottom-only termination components intended for surface mounting. This includes such industry descriptive...

IPC-6017 - Standard Only

Qualification and Performance Specification for Printed Boards Containing Embedded Passive Devices

Document #:
IPC-6017
Revision
Original Version
Product Type
Standard Only
Released:  03/19/2009
Language
English
This new standard supplements existing IPC-6010 series specifications with qualification and performance requirements for in-process and finished printed boards containing embedded passive circuitry (distributive capacitive planes and capacitive or resistive components). 10 pages. Released March 2009. Included in Collections C-105, C-1000 and the 6010 Series

IPC-7091 - Standard Only

Design and Assembly Process Implementation of 3D Components

Document #:
IPC-7091
Revision
Original Version
Product Type
Standard Only
Released:  09/25/2017
Language
English
The IPC-7091 intends to provide useful and practical information to those who are designing, developing or using 3D-packaged semiconductor components or those who are considering 3D package implementation. The 3D semiconductor package may include multiple die elements—some homogeneous and some heterogeneous. The package may also include several discrete passive SMT devices, some of which are...
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IPC-6012 - Revision D - Redline Standard

Qualification and Performance Specification for Rigid Printed Boards

Document #:
IPC-6012
Revision
D
Product Type
Redline Standard
Released:  10/30/2015
Language
English
Track the substantive changes in IPC-6012D with this redline product. This is the D revision in its entirety, with each change highlighted on the page. Click the text to launch a pop-up with an explanation of the change from the C revision. Available for download only. IPC-6012D covers qualification and performance of rigid printed boards, including single-sided, double-sided, with or without...
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IPC-7092 - Standard Only

Design and Assembly Process Implementation for Embedded Components

Document #:
IPC-7092
Revision
Original Version
Product Type
Standard Only
Released:  02/18/2015
Language
English
This document describes the design and assembly challenges for implementing passive and active components, in either formed or placed methodology, into a printed board. It provides useful and practical information to decision makers of formed or placed, passive or active components and helps establish inspection techniques, testing processes, and reliability validations. Users will also learn...

IPC-2231 - Standard Only

DFX Guidelines

Document #:
IPC-2231
Revision
Original Version
Product Type
Standard Only
Released:  05/14/2019
Language
English
The IPC-2231 standard provides guidelines for establishing a best practice methodology for use in developing a formal DFX (Design for Manufacturing, Fabrication, Assembly, Testability, Cost, Reliability, Environment, Reuse) process for layout of printed board assemblies that utilize surface mount and through hole devices.

IPC-T-50M-French

IPC-T-50M-FR: Termes et Définitions pour les Circuits Électroniques Imprimés et Assemblés

Document #:
IPC-T-50
Revision
M
Product Type
Standard Only
Released:  06/30/2015
Language
French
Ce document essentiel pour l’industrie fournit des descriptions et des illustrations de la terminologie de l’industrie d’assemblage électronique afin d’aider les utilisateurs et leur clients à casser les barrières linguistiques. La révision M contient plus de 220 termes nouveaux ou révisés, incluant la nouvelle terminologie pour les procédés de tropicalisation, d’enrobage et d’encapsulation, la...
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IPC-6012 - Revision E - Addendum - Automotive

リジッドプリント板の認定および性能仕様車載用途向け追加規格

Document #:
IPC-6012
Revision
E
Product Type
Addendum
Released:  06/14/2022
Language
Japanese
Current Revision
購入仕様書/図面でIPC-6012EA追加規格の適用を要求される場合、本追加規格は、振動および熱サイクル環境に耐えることが求められるリジッドプリント板に対し、IPC-6012E-リビジョンEに記載する具体的な特定要件を補完する、もしくは置き換えるものである。今回の本文書の改訂では、次の要求事項への更新が行われた：ランド浮き、パターン形状精度、絶縁体除去(例：ウィッキング)、ソルダマスク厚さ、清浄度、適合性と信頼性試験。
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IPC-6012 - Revision F - Addendum - Space and Military

刚性印制板的鉴定及性能规范航天和军事航空应用补充标准

Document #:
IPC-6012
Revision
F
Product Type
Addendum
Released:  04/10/2025
Language
Chinese
Current Revision
IPC-6012FS 航天补充标准为 IPC-6012F 航天和军事航空应用提供了 IPC 3 级性能等级要求的例外情况。例外情况包括更改验收标准和/或样品大小以及生产批次验收测试的测试频率。IPC-6012FS 涵盖了刚性印制板在太空旅行环境中承受振动、极端热循环和静态地面测试的要求。取代 IPC-6012ES。
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IPC/WHMA-A-620 - Revision E - Addendum - Space and Military

航天及军事应用电子部件补充标准

Document #:
IPC/WHMA-A-620
Revision
E
Product Type
Addendum
Released:  01/27/2025
Language
Chinese
Current Revision
IPC/WHMA-A-620ES航天和军事应用电子部件补充标准为IPC/WHMA-A-620E标准提供了额外要求，以确保线缆及线束组件的可靠性，必须能够耐受在军事或太空环境中运行或遇到的振动与超温。IPC/WHMA-A-620ES不能作为一个独立的文件使用。它必须与母标准IPC/WHMA-A-620E搭配使用。IPC/WHMA-A-620ES-CN于2025年2月发布。
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IPC-6012 - Revision E - Addendum - Automotive

刚性印制板的鉴定及性能规范汽车应用补充标准

Document #:
IPC-6012
Revision
E
Product Type
Addendum
Released:  06/14/2022
Language
Chinese
Current Revision
IPC-6012EA 附录在采购文件/图纸要求时，补充或替代 IPC-6012E 修订版 E 的明确要求，适用于必须经受住汽车行业电子互连的振动和热循环环境的刚性印制板。 本文档的修订更改包括对提升焊盘、图案特征精度、电介质去除（例如芯吸）、阻焊层厚度、清洁度和适用性以及可靠性测试参数的更新要求。
IPC-6012EM CN Cover

IPC-6012 - Revision E - Addendum - Medical

刚性印制板的鉴定及性能规范IPC-6012E医疗应用补充标准

Document #:
IPC-6012
Revision
E
Product Type
Addendum
Released:  07/28/2021
Language
Chinese
Current Revision
采购文档/图纸要求时，IPC-6012EM附录可补充或替代IPC-6012E的特定标识要求，这些要求适用于必须满足高可靠性医疗设备应用要求的刚性印制板。 IPC-6012EM是医疗行业唯一针对刚性印制板的资格和性能规格的全球行业共识标准。
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IPC-6012 - Revision E - Addendum - Space and Military

リジッドプリント板の認定および性能仕様宇宙・軍用アビオニクス用途向け追加規格

Document #:
IPC-6012
Revision
E
Product Type
Addendum
Released:  01/18/2021
Language
Japanese
Current Revision
IPC-6012ES 宇宙用途向け追加規格では宇宙および軍用アビオニクス製品に適用される、IPC-6012Eのクラス3要件への例外事項を示している。これら例外事項には、生産ロット受入れ試験に関する許容基準やサンプルサイズおよび試験頻度などへの変更が含まれる。
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IPC-6012 - Revision E - Addendum - Space and Military

刚性印制板的鉴定及性能规范航天和军事航空应用补充标准

Document #:
IPC-6012
Revision
E
Product Type
Addendum
Released:  11/20/2020
Language
Chinese
Current Revision
IPC-6012ES附录为用于太空和军用航空电子产品的IPC-6012E的3类要求提供了例外。 例外情况包括对生产批次验收测试的验收标准和/或样本大小以及测试频率的更改。 IPC-6012ES涵盖了刚性印刷电路板的要求，以抵抗振动，极端热循环以及与太空旅行环境相关的地面测试。
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Coming Soon

IPC-9242: Guidelines for Microsection Evaluation

IPC-9691C: User Guide for the IPC-TM-650, Method 2.6.25 Conductive Anodic Filament (CAF) Resistance and Other Internal Electrochemical Migration Testing

IPC-A-630A: Acceptability Standard for Manufacture, Inspection, and Testing of Electronic Enclosures

IPC-4556A: Specification for Electroless Nickel/Electroless Palladium/ Immersion Gold (ENEPIG) Plating for Printed Boards

IPC-7527A: Requirements for Solder Paste Application

IPC-4204C: Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Boards

IPC-J-STD-002F: Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires

IPC-4101F: Specifications for Base Materials for Rigid and Multilayer Printed Boards

IPC-1755B: Responsible Sourcing of Minerals Data Exchange Standard

IPC-2223F: Sectional Design Standard for Flexible/Rigid-Flexible Printed Boards

IPC-HDBK-9798A: Handbook and Guide to Supplement IPC-9797

IPC-WP-011: Guidance for Strain Gage Limits for Assemblies

J-STD-046A: Customer Notification Standard for Product/Process Changes by Electronic Product Suppliers

J-STD-048A: Notification Standard for Product Discontinuance

IPC-T-50P: Terms and Definitions for Interconnecting and Packaging Electronic Circuits

IPC-1401B: Corporate Social Responsibility Management System Standard

IPC -1751B: Generic Requirements for Declaration Process Management

IPC-6013F: Qualification and Performance Specification for Flexible/Rigid-Flexible Printed Boards

IPC-4413 - Am1: Specification for Finished Fabric Woven from Low Dk Glass for Printed Boards