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IPC/JEDEC-J-STD-609 - Revision B - Standard Only

Marking and Labeling of Components, PCBs and PCBAs to Identify Lead (Pb), Lead-Free (Pb-Free) and Other Attributes

Document #:
IPC/JEDEC-J-STD-609
Revision
B
Product Type
Standard Only
Released:  11/01/2016
Language
English
This standard provides a marking and labeling system that aids in assembly, rework, repair and recycling and provides for the identification of: those assemblies that are assembled with lead-containing or lead-free solder; components that have lead-containing or lead-free second level interconnect terminal finishes and materials; the maximum component temperature not to be exceeded during assembly...

IPC-CC-830 - Revision B - Standard with Amendment 1

Qualification and Performance of Electrical Insulating Compound for Printed Wiring Assemblies

Document #:
IPC-CC-830
Revision
B
Product Type
Standard with amendment(s)
Released:  10/23/2008
Language
English
This is the industry standard for qualification and quality conformance of conformal coating. Its intent is to show how to obtain maximum information with minimum test redundancy. Includes requirements and evaluations of material properties using standardized test vehicles. Amendment 1 updates include new qualification, retention and conformance inspection requirements for FTIR, MIR and hydrolytic...

IPC-9701 - Revision A - Standard Only

Performance Test Methods and Qualification Requirements for Surface Mount Solder Attachments

Document #:
IPC-9701
Revision
A
Product Type
Standard Only
Released:  02/01/2006
Language
English
Provides specific test methods to evaluate the performance and reliability of surface mount solder attachments of electronic assemblies. Establishes levels of performance and reliability of the solder attachments of surface mount devices to rigid, flexible and rigid-flex circuit structures. When used with IPC-SM-785, it provides an understanding of the physics of SMT solder joint failure and an...

IPC-9201 - Revision A - Standard Only

Surface Insulation Resistance Handbook

Document #:
IPC-9201
Revision
A
Product Type
Standard Only
Released:  09/19/2007
Language
English
Surface Insulation Resistance (SIR) testing is a tool used not only for characterization testing of production processes such as solder masks, soldering flux, and conformal coatings, but also for examining the electrochemical reactions at each stage of the electronic assembly production process. This handbook covers the terminology, theories, test procedures and test vehicles of SIR testing...
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IPC-QL-653 - Revision A - Standard Only

Certification of Facilities that Inspect/Test Printed Boards, Components & Materials

Document #:
IPC-QL-653
Revision
A
Product Type
Standard Only
Released:  11/01/1997
Language
English
This specification establishes the certification requirements for facilities that inspect/test printed boards, components and materials. This specification is intended to provide a minimum standardized basis for evaluating or auditing a technically oriented inspection/testing facility. Revised November 1997. 15 pages.

IPC-7530 - Revision A - Standard Only

Guidelines for Temperature Profiling for Mass Soldering (Reflow & Wave) Processes

Document #:
IPC-7530
Revision
A
Product Type
Standard Only
Released:  04/28/2017
Language
English
This standard provides useful and practical information for developing thermal profiles to produce acceptable SnPb and Pb-free electronics assemblies. This revision expands the focus of the original standard from reflow profiling to include profiling for vapor phase, laser, selective soldering and wave soldering. The revision also includes a full-color troubleshooting guide for addressing common...

IPC-6012 - Revision C - Standard Only

Qualification and Performance Specification for Rigid Printed Boards

Document #:
IPC-6012
Revision
C
Product Type
Standard Only
Released:  04/13/2010
Language
English
Dual-language (Spanish/English) DVD -- Introduces industry specifications J-STD-001 & IPC-A-610 and explains the concept of process indicators. Includes an animated examination of the invisible problems that can be created during rework to explain why it's so important to avoid unnecessary rework. Reviews each of the tools and materials for plated-through hole (PTH) rework (including low-residue...

IPC-7095 - Revision B - Standard Only

Design and Assembly Process Implementation for BGAs

Document #:
IPC-7095
Revision
B
Product Type
Standard Only
Released:  04/02/2008
Language
English
Implementing Ball Grid Array (BGA) and Fine-Pitch Ball Grid Array (FBGA) technology presents some unique challenges for design, assembly, inspection and repair personnel. IPC-7095B delivers useful and practical information to anyone currently using BGAs or considering a conversion to area array packaging formats. This has become especially important due to the change in the alloys being used, both...

IPC/JEDEC-J-STD-033 - Revision C - Standard Only

Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices

Document #:
IPC/JEDEC-J-STD-033
Revision
C
Product Type
Standard Only
Released:  08/01/2014
Language
English
Provides surface mount device manufacturers and users with standardized methods for handling, packing, shipping and use of moisture/reflow sensitive components. These methods help avoid damage from moisture absorption and exposure to solder reflow temperatures that can result in yield and reliability degradation and damaged components. These procedures provide a minimum shelf life of 12 months...

IPC-T-50 - Revision K - Standard Only

Begriffe und Definitionen für Leiterplatten und elektronische Baugruppen

Document #:
IPC-T-50
Revision
K
Product Type
Standard Only
Released:  02/03/2015
Language
German
Current Revision
Das unentbehrliche Nachschlagewerk für alle Verantwortlichen entlang der Wertschöpfungskette von elektronischen Produkten. Die Revision K enthält auf mehr als 120 Seiten, mehr als 220 neue und überarbeitete Begriffe und bildliche Darstellungen. Beispiele: Access Hole, Accelerated Equivalent Soak, Capture Land, Micro Via Technology, Plating Thief, Etchback, Resin Recession, Tape Automated Bonding...
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IPC-7095 - Revision A - Standard Only

Design and Assembly Process Implementation for BGAs

Document #:
IPC-7095
Revision
A
Product Type
Standard Only
Released:  10/01/2004
Language
English
Implementing Ball Grid Array (BGA) and Fine-Pitch Ball Grid Array (FBGA) technology presents some unique challenges for design, assembly, inspection and repair personnel. Revision A of this document delivers useful and practical information to anyone who is currently using BGAs or is considering a conversion to area array packaging formats. In addition to providing guidelines for BGA inspection...

IPC-6018 - Revision C - Standard Only

Qualification and Performance Specification for High Frequency (Microwave) Printed Boards

Document #:
IPC-6018
Revision
C
Product Type
Standard Only
Released:  08/09/2016
Language
English
This specification covers qualification and performance of high frequency (microwave) boards, including single-sided, double-sided, with or without plated-through holes, multilayer with or without blind/buried vias and metal core boards. It addresses final finish and surface plating coating requirements, conductors, holes/vias, frequency of acceptance testing and quality conformance as well as...

IPC-6013 - Revision C - Standard Only

Qualification and Performance Specification for Flexible Printed Boards

Document #:
IPC-6013
Revision
C
Product Type
Standard Only
Released:  12/18/2013
Language
English
Covers qualification and performance requirements for flexible printed boards designed to IPC-2221 and IPC-2223. The flexible printed board may be single-sided, double-sided, multilayer or rigid-flex multilayer. All of these constructions may include stiffeners, PTHs, microvias, and blind/buried vias. Revision C incorporates new and updated requirements for final finishes, surface and hole plating...
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IPC/JEDEC-J-STD-609 - Revision A - Standard Only

IPC/JEDEC J-STD-609A Errata Information

Document #:
IPC/JEDEC-J-STD-609
Revision
A
Product Type
Standard Only
Released:  06/01/2012
Language
English
This is a list of reported errata to the printed copies of IPC/JEDEC J-STD-609A. Pen and ink changes should be made in accordance with your company's document control policies.
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IPC-9707 - Amendment 1

Spherical Bend Test Method for Characterization of Board Level Interconnects

Document #:
IPC/JEDEC-9707
Revision
Original Version
Product Type
Amendment
Released:  05/01/2018
Language
English
Current Revision
IPC/JEDEC-9707-AM1 is an amendment which clarifies that the standard is only applicable to transient bending during short-term test operations. The standard specifies a common method of establishing strain limits of board-level device interconnects under spherical transient bending conditions, the worst-case flexure condition that can occur during conventional printed board/system assembly...
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IPC-6012 - Revision D - Addendum with Amendment 1 - Automotive

Automotive Applications Addendum to IPC-6012D, Qualification and Performance Specification for Rigid Printed Boards

Document #:
IPC-6012
Revision
D
Product Type
Addendum with amendment(s)
Released:  12/01/2018
Language
English
The IPC-6012DA-WAM1 Addendum, when required by procurement documentation/drawings, supplements or replaces specifically identified requirements of IPC-6012D, Revision D, for rigid printed boards that must survive the vibration and thermal cycling environments of electronic interconnects within the automotive industry. The amendment changes to this document includes updated requirements for lifted...
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IPC-6012 - Revision D - Amendment 1

Qualification and Performance Specification for Rigid Printed Boards

Document #:
IPC-6012
Revision
D
Product Type
Amendment
Released:  09/01/2017
Language
English
The IPC-6012D-AM1 makes changes to the existing acceptance criteria for copper wrap plating measurements as defined by IPC-6012D. The IPC-6012D-AM1 implements a dual criterion for Class 3 copper wrap plating, based on design effectivity (before and after January 01, 2018), so as not to impose onto legacy designs any additional qualification activity associated with adopting acceptance requirements...
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IPC/WHMA-A-620 - Revision B - Amendment 1

Requirements and Acceptance for Cable and Wire Harness Assemblies

Document #:
IPC/WHMA-A-620
Revision
B
Product Type
Amendment
Released:  08/01/2013
Language
English
This amendment provides resolution to some internal conflicts, aligns common criteria to other IPC standards, and corrects some editorial errors. This amendment is only to be used in conjunction with IPC/WHMA-A-620 Revision B, October 2012. Follow your company policy and procedures to make pen and ink changes or notations to the published IPC/WHMA-A-620 Revision B. When there are changes to a...
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IPC/WHMA-A-620 - Revision E - Standard Only

Anforderungen und Abnahmekriterien für Kabel- und Kabelbaum-Baugruppen

Document #:
IPC/WHMA-A-620
Revision
E
Product Type
Standard Only
Released:  03/05/2025
Language
German
Current Revision
IPC/WHMA-A-620E ist die einzige, im Branchenkonsens entwickelte Richtlinie für Anforderungen und Abnahmekriterien für Kabel- und Kabelbaum-Baugruppen. IPC/WHMA-A-620E beschreibt Materialien, Methoden, Tests und Abnahmekriterien für die Herstellung gecrimpter, mechanisch gesicherter oder gelöteter Verbindungen und die zu den Kabel- und Kabelbaum-Baugruppen zugehörigen Montageaktivitäten. IPC/WHMA-A...

IPC/JEDEC-J-STD-033 - Revision D - Standard Only

Manejo, embalaje, transporte y uso de componentes sensibles a la humedad/reflujo y/o al proceso

Document #:
IPC/JEDEC-J-STD-033
Revision
D
Product Type
Standard Only
Released:  02/18/2019
Language
Spanish
Current Revision
El IPC/JEDEC J-STD-033D proporciona a los fabricantes de dispositivos de montaje superficial y a los usuarios con métodos estandarizados para la manejo, embalaje, transporte y uso de componentes sensibles a la humedad/reflujo. Estos métodos ayudan a evitar daños por la absorción de humedad y por la exposición a las temperaturas de la soldadura por reflujo que pueden tener como resultado una...
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IPC/WHMA-A-620 - Revision E - Standard Only

Exigences et acceptabilité des assemblages de câbles et de faisceaux de fils

Document #:
IPC/WHMA-A-620
Revision
E
Product Type
Standard Only
Released:  04/29/2025
Language
French
Current Revision
IPC/WHMA-A-620E est la seule norme consensuelle de l’industrie pour les exigences et l’acceptation des assemblages de câbles et de faisceaux de fils. IPC/WHMA-A-620E décrit les matériaux, les méthodes, les tests et les critères d’acceptation pour la production d’ensembles interconnectés brasés, sertis et mécaniquement sécurisés, ainsi que les activités d’assemblage qui y sont associées pour...
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IPC/WHMA-A-620 - Revision E - Standard Only

Requisitos y aceptación para ensambles con cables compuestos y mazos/ arneses de cables

Document #:
IPC/WHMA-A-620
Revision
E
Product Type
Standard Only
Released:  05/02/2025
Language
Spanish
Current Revision
El IPC/WHMA-A-620E es el único estándar consensuado por el sector sobre Requisitos y aceptabilidad de ensambles de cables y mazos de cables. El estándar IPC/WHMA-A-620E describe los materiales, métodos, pruebas y criterios de aceptabilidad para la producción de interconexiones crimpadas, mecánicamente aseguradas o soldadas y las actividades de ensamble relacionadas que estén asociadas con...

IPC/WHMA-A-620 - Revision D - Standard Only

Godkendelseskrav for kabler og for produkter med wire harness

Document #:
IPC/WHMA-A-620
Revision
D
Product Type
Standard Only
Released:  11/20/2020
Language
Danish
Current Revision
IPC/WHMA-A-620D er den eneste industriudviklede standard for ” Godkendelseskrav for kabler og for produkter med wire harness”. IPC/WHMA-A-620D beskriver materialer, metoder, test og godkendelseskriterier for fremstilling af crimpede samlinger, mekanisk sikrede og loddede forbindelser samt de tilhørende monteringsprocesser som er forbundet med kabel og harness produkter. IPC/WHMA-A-620D blev...
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IPC/WHMA-A-620 - Revision E - Standard Only

ケーブルおよびワイヤーハーネス組立品の要求事項および許容基準 Requirements and Acceptance for Cable and Wire Harness Assemblies

Document #:
IPC/WHMA-A-620
Revision
E
Product Type
Standard Only
Released:  07/13/2023
Language
Japanese
Current Revision
IPC/WHMA-A-620Eは、ケーブルおよびワイヤーハーネス組立品の要求事項および許容基準に関する、唯一の業界合意文書(規格書)である。IPC/WHMA-A-620Eでは、ケーブルおよびハーネス組立品に関係する配線の圧着、機械的固定、またははんだ付を行うための材料、方法、試験、および許容基準、ならびに関連組立活動について説明している。 IPC/WHMA-A-620Eは、IPCおよびThe Wire Harness Manufacturers Association (WHMA) (IPCの関連団体)により作成されたものである。
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IPC/WHMA-A-620 - Revision D - Standard Only

Wymagania i akceptacje dla montażu kabli i wiązek przewodów

Document #:
IPC/WHMA-A-620
Revision
D
Product Type
Standard Only
Released:  03/12/2021
Language
Polish
Current Revision
IPC/WHMA-A-620D jest jedynym standardem branżowym dotyczącym Wymagań i Akceptacji dla Montażu Kabli i Wiązek Przewodów. IPC/WHMA-A-620D opisuje materiały, metody, testy i kryteria akceptacji dla tworzenia zagniatanych, mechanicznie zabezpieczonych i lutowanych połączeń oraz powiązanych czynności montażowych związanych z zespołami kabli i wiązek przewodów. IPC/WHMA-A-620D został opracowany przez...
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Coming Soon

IPC-9242: Guidelines for Microsection Evaluation

IPC-9691C: User Guide for the IPC-TM-650, Method 2.6.25 Conductive Anodic Filament (CAF) Resistance and Other Internal Electrochemical Migration Testing

IPC-A-630A: Acceptability Standard for Manufacture, Inspection, and Testing of Electronic Enclosures

IPC-4556A: Specification for Electroless Nickel/Electroless Palladium/ Immersion Gold (ENEPIG) Plating for Printed Boards

IPC-7527A: Requirements for Solder Paste Application

IPC-4204C: Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Boards

IPC-J-STD-002F: Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires

IPC-4101F: Specifications for Base Materials for Rigid and Multilayer Printed Boards

IPC-1755B: Responsible Sourcing of Minerals Data Exchange Standard

IPC-2223F: Sectional Design Standard for Flexible/Rigid-Flexible Printed Boards

IPC-HDBK-9798A: Handbook and Guide to Supplement IPC-9797

IPC-WP-011: Guidance for Strain Gage Limits for Assemblies

J-STD-046A: Customer Notification Standard for Product/Process Changes by Electronic Product Suppliers

J-STD-048A: Notification Standard for Product Discontinuance

IPC-T-50P: Terms and Definitions for Interconnecting and Packaging Electronic Circuits

IPC-1401B: Corporate Social Responsibility Management System Standard

IPC -1751B: Generic Requirements for Declaration Process Management

IPC-6013F: Qualification and Performance Specification for Flexible/Rigid-Flexible Printed Boards

IPC-4413 - Am1: Specification for Finished Fabric Woven from Low Dk Glass for Printed Boards