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IPC-9703 - Standard Only

IPC/JEDEC Mechanical Shock Test Guidelines for Solder Joint Reliability

Document #:
IPC/JEDEC-9703
Revision
Original Version
Product Type
Standard Only
Released:  03/18/2009
Language
English
Establishes mechanical drop and shock and test guidelines for assessing solder joint reliability of printed board assemblies from system to component level. This document addresses methods to define mechanical shock use-conditions, methods to define system level, system printed board level and component test board level testing that correlate to such use conditions and guidance on the use of...

IPC-7530 - Standard Only

Guidelines for Temperature Profiling for Mass Soldering (Reflow & Wave) Processes

Document #:
IPC-7530
Revision
Original Version
Product Type
Standard Only
Released:  05/01/2001
Language
English
During mass soldering, it is important that all solder joints reach the minimum soldering (reflow) temperature to assure metallurgical bonding of the solder alloy and the base metals to be soldered. Metallurgical bonding requires that both surfaces to be soldered, as well as the solder, reach this minimum soldering temperature for a sufficient time to allow the wetting of the solder surfaces. This...

IPC-7094 - Standard Only

Design and Assembly Process Implementation for Flip Chip and Die Size Components

Document #:
IPC-7094
Revision
Original Version
Product Type
Standard Only
Released:  03/18/2009
Language
English
Implementing flip chip technology in a direct chip attach (DCA) assembly presents some unique challenges for design, assembly, inspection and repair personnel. IPC-7094 delivers useful and practical information to anyone who is currently using or contemplating developing products that employ the very complex and high density methods needed for the flip chip technology. The concepts have become...

IPC-SM-785-English

IPC-SM-785: Guidelines for Accelerated Reliability Testing of Surface Mount Attachments

Document #:
IPC-SM-785
Revision
Original Version
Product Type
Standard Only
Released:  11/01/1992
Language
English
Guidelines for accelerated reliability testing of surface mount solder attachments when evaluating and extrapolating the results of these tests towards actual use environments of electronic assemblies. 50 pages. Released November 1992. Included in the IPC-C-103 and the IPC-C-1000 Collections
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IPC/JEDEC-J-STD-035 - Standard Only

Acoustic Microscopy for Non-Hermetic Encapsulated Electronic Components

Document #:
IPC/JEDEC-J-STD-035
Revision
Original Version
Product Type
Standard Only
Released:  04/01/1999
Language
English
This test method defines the procedures for performing acoustic microscopy on non-hermetic encapsulated electronic components. It provides users with an acoustic microscopy process flow for detecting defects non-destructively in plastic packages while achieving reproducibility. Developed by IPC and JEDEC. 16 pages. Released April 1999. Equivalent to IEC Publicly Available Specification (PAS) 62191
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IPC/WHMA-A-620 - Revision E - Redline Standard

Requirements and Acceptance for Cable and Wire Harness Assemblies

Document #:
IPC/WHMA-A-620
Revision
E
Product Type
Redline Standard
Released:  03/06/2023
Language
English
IPC/WHMA-A-620E-RL is a redline document showing the difference from IPC/WHMA-A-620D to IPC/WHMA-A-620E. IPC/WHMA-A-620E-RL provides a side-by-side comparison of the two documents and includes the figures and tables. The document shows deleted/changed text in the IPC/WHMA-A-620D pages and new/revised text in the IPC/WHMA-A-620E pages. Due to the complexity of this document, it is only available in...

IPC-9202 - Standard Only

Material and Process Characterization/Qualification Test Protocol for Assessing Electrochemical Performance

Document #:
IPC-9202
Revision
Original Version
Product Type
Standard Only
Released:  10/20/2011
Language
English
This document provides tests that record changes in surface insulation resistance (SIR) on a representative sample of a printed circuit assembly. It quantifies any deleterious effects that might arise from solder flux or other process residues left on external surfaces after soldering, which can cause unwanted electrochemical reactions that grossly affect reliability. It uses test vehicles that...

IPC-9709 - Standard Only

Test Guidelines for Acoustic Emission Measurement during Mechanical Testing

Document #:
IPC-9709
Revision
Original Version
Product Type
Standard Only
Released:  09/13/2011
Language
English
Surface mount pad cratering typically initiates prior to detection by existing electrical monitoring test methods. There are limited instrumentation techniques that are currently available that can identify non-electrical damage and its location to a high degree of accuracy. This guideline document establishes an acoustic emission (AE) method to evaluate the performance and reliability of surface...

IPC-9203 - Standard Only

Users Guide to IPC-9202 and the IPC-B-52 Standard Test Vehicle

Document #:
IPC-9203
Revision
Original Version
Product Type
Standard Only
Released:  04/27/2012
Language
English
While there are a variety of industry test vehicles for the examination of materials compatibility, most available test boards leave something to be desired as there is often a dramatic difference in materials between such test boards and produced assemblies. A test vehicle was needed which could be used for both ion chromatography and SIR testing that would be more representative of mainstream...

IPC-7093 - Standard Only

Design and Assembly Process Implementation for Bottom Termination Components

Document #:
IPC-7093
Revision
Original Version
Product Type
Standard Only
Released:  03/28/2011
Language
English
This standard describes the design and assembly challenges for implementing Bottom Termination surface mount Components (BTCs) whose external connections consist of metallized terminals that are an integral part of the component body. The BTCs in this document include all types and forms of bottom-only termination components intended for surface mounting. This includes such industry descriptive...

IPC-6017 - Standard Only

Qualification and Performance Specification for Printed Boards Containing Embedded Passive Devices

Document #:
IPC-6017
Revision
Original Version
Product Type
Standard Only
Released:  03/19/2009
Language
English
This new standard supplements existing IPC-6010 series specifications with qualification and performance requirements for in-process and finished printed boards containing embedded passive circuitry (distributive capacitive planes and capacitive or resistive components). 10 pages. Released March 2009. Included in Collections C-105, C-1000 and the 6010 Series

IPC-7091 - Standard Only

Design and Assembly Process Implementation of 3D Components

Document #:
IPC-7091
Revision
Original Version
Product Type
Standard Only
Released:  09/25/2017
Language
English
The IPC-7091 intends to provide useful and practical information to those who are designing, developing or using 3D-packaged semiconductor components or those who are considering 3D package implementation. The 3D semiconductor package may include multiple die elements—some homogeneous and some heterogeneous. The package may also include several discrete passive SMT devices, some of which are...
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IPC-6012 - Revision D - Redline Standard

Qualification and Performance Specification for Rigid Printed Boards

Document #:
IPC-6012
Revision
D
Product Type
Redline Standard
Released:  10/30/2015
Language
English
Track the substantive changes in IPC-6012D with this redline product. This is the D revision in its entirety, with each change highlighted on the page. Click the text to launch a pop-up with an explanation of the change from the C revision. Available for download only. IPC-6012D covers qualification and performance of rigid printed boards, including single-sided, double-sided, with or without...
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IPC-7092 - Standard Only

Design and Assembly Process Implementation for Embedded Components

Document #:
IPC-7092
Revision
Original Version
Product Type
Standard Only
Released:  02/18/2015
Language
English
This document describes the design and assembly challenges for implementing passive and active components, in either formed or placed methodology, into a printed board. It provides useful and practical information to decision makers of formed or placed, passive or active components and helps establish inspection techniques, testing processes, and reliability validations. Users will also learn...

IPC-2231 - Standard Only

DFX Guidelines

Document #:
IPC-2231
Revision
Original Version
Product Type
Standard Only
Released:  05/14/2019
Language
English
The IPC-2231 standard provides guidelines for establishing a best practice methodology for use in developing a formal DFX (Design for Manufacturing, Fabrication, Assembly, Testability, Cost, Reliability, Environment, Reuse) process for layout of printed board assemblies that utilize surface mount and through hole devices.

IPC-T-50M-French

IPC-T-50M-FR: Termes et Définitions pour les Circuits Électroniques Imprimés et Assemblés

Document #:
IPC-T-50
Revision
M
Product Type
Standard Only
Released:  06/30/2015
Language
French
Ce document essentiel pour l’industrie fournit des descriptions et des illustrations de la terminologie de l’industrie d’assemblage électronique afin d’aider les utilisateurs et leur clients à casser les barrières linguistiques. La révision M contient plus de 220 termes nouveaux ou révisés, incluant la nouvelle terminologie pour les procédés de tropicalisation, d’enrobage et d’encapsulation, la...
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IPC-6012 - Revision E - Addendum - Automotive

リジッドプリント板の認定および性能仕様車載用途向け追加規格

Document #:
IPC-6012
Revision
E
Product Type
Addendum
Released:  06/14/2022
Language
Japanese
Current Revision
購入仕様書/図面でIPC-6012EA追加規格の適用を要求される場合、本追加規格は、振動および熱サイクル環境に耐えることが求められるリジッドプリント板に対し、IPC-6012E-リビジョンEに記載する具体的な特定要件を補完する、もしくは置き換えるものである。今回の本文書の改訂では、次の要求事項への更新が行われた：ランド浮き、パターン形状精度、絶縁体除去(例：ウィッキング)、ソルダマスク厚さ、清浄度、適合性と信頼性試験。
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IPC-6012 - Revision F - Addendum - Space and Military

刚性印制板的鉴定及性能规范航天和军事航空应用补充标准

Document #:
IPC-6012
Revision
F
Product Type
Addendum
Released:  04/10/2025
Language
Chinese
Current Revision
IPC-6012FS 航天补充标准为 IPC-6012F 航天和军事航空应用提供了 IPC 3 级性能等级要求的例外情况。例外情况包括更改验收标准和/或样品大小以及生产批次验收测试的测试频率。IPC-6012FS 涵盖了刚性印制板在太空旅行环境中承受振动、极端热循环和静态地面测试的要求。取代 IPC-6012ES。
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IPC/WHMA-A-620 - Revision E - Addendum - Space and Military

航天及军事应用电子部件补充标准

Document #:
IPC/WHMA-A-620
Revision
E
Product Type
Addendum
Released:  01/27/2025
Language
Chinese
Current Revision
IPC/WHMA-A-620ES航天和军事应用电子部件补充标准为IPC/WHMA-A-620E标准提供了额外要求，以确保线缆及线束组件的可靠性，必须能够耐受在军事或太空环境中运行或遇到的振动与超温。IPC/WHMA-A-620ES不能作为一个独立的文件使用。它必须与母标准IPC/WHMA-A-620E搭配使用。IPC/WHMA-A-620ES-CN于2025年2月发布。
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IPC-6012 - Revision E - Addendum - Automotive

刚性印制板的鉴定及性能规范汽车应用补充标准

Document #:
IPC-6012
Revision
E
Product Type
Addendum
Released:  06/14/2022
Language
Chinese
Current Revision
IPC-6012EA 附录在采购文件/图纸要求时，补充或替代 IPC-6012E 修订版 E 的明确要求，适用于必须经受住汽车行业电子互连的振动和热循环环境的刚性印制板。 本文档的修订更改包括对提升焊盘、图案特征精度、电介质去除（例如芯吸）、阻焊层厚度、清洁度和适用性以及可靠性测试参数的更新要求。
IPC-6012EM CN Cover

IPC-6012 - Revision E - Addendum - Medical

刚性印制板的鉴定及性能规范IPC-6012E医疗应用补充标准

Document #:
IPC-6012
Revision
E
Product Type
Addendum
Released:  07/28/2021
Language
Chinese
Current Revision
采购文档/图纸要求时，IPC-6012EM附录可补充或替代IPC-6012E的特定标识要求，这些要求适用于必须满足高可靠性医疗设备应用要求的刚性印制板。 IPC-6012EM是医疗行业唯一针对刚性印制板的资格和性能规格的全球行业共识标准。
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IPC-6012 - Revision E - Addendum - Space and Military

リジッドプリント板の認定および性能仕様宇宙・軍用アビオニクス用途向け追加規格

Document #:
IPC-6012
Revision
E
Product Type
Addendum
Released:  01/18/2021
Language
Japanese
Current Revision
IPC-6012ES 宇宙用途向け追加規格では宇宙および軍用アビオニクス製品に適用される、IPC-6012Eのクラス3要件への例外事項を示している。これら例外事項には、生産ロット受入れ試験に関する許容基準やサンプルサイズおよび試験頻度などへの変更が含まれる。
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IPC-6012 - Revision E - Addendum - Space and Military

刚性印制板的鉴定及性能规范航天和军事航空应用补充标准

Document #:
IPC-6012
Revision
E
Product Type
Addendum
Released:  11/20/2020
Language
Chinese
Current Revision
IPC-6012ES附录为用于太空和军用航空电子产品的IPC-6012E的3类要求提供了例外。 例外情况包括对生产批次验收测试的验收标准和/或样本大小以及测试频率的更改。 IPC-6012ES涵盖了刚性印刷电路板的要求，以抵抗振动，极端热循环以及与太空旅行环境相关的地面测试。
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Coming Soon

IPC-9242: Guidelines for Microsection Evaluation

IPC-9691C: User Guide for the IPC-TM-650, Method 2.6.25 Conductive Anodic Filament (CAF) Resistance and Other Internal Electrochemical Migration Testing

IPC-A-630A: Acceptability Standard for Manufacture, Inspection, and Testing of Electronic Enclosures

IPC-4556A: Specification for Electroless Nickel/Electroless Palladium/ Immersion Gold (ENEPIG) Plating for Printed Boards

IPC-7527A: Requirements for Solder Paste Application

IPC-4204C: Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Boards

IPC-J-STD-002F: Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires

IPC-4101F: Specifications for Base Materials for Rigid and Multilayer Printed Boards

IPC-1755B: Responsible Sourcing of Minerals Data Exchange Standard

IPC-2223F: Sectional Design Standard for Flexible/Rigid-Flexible Printed Boards

IPC-HDBK-9798A: Handbook and Guide to Supplement IPC-9797

IPC-WP-011: Guidance for Strain Gage Limits for Assemblies

J-STD-046A: Customer Notification Standard for Product/Process Changes by Electronic Product Suppliers

J-STD-048A: Notification Standard for Product Discontinuance

IPC-T-50P: Terms and Definitions for Interconnecting and Packaging Electronic Circuits

IPC-1401B: Corporate Social Responsibility Management System Standard

IPC -1751B: Generic Requirements for Declaration Process Management

IPC-6013F: Qualification and Performance Specification for Flexible/Rigid-Flexible Printed Boards

IPC-4413 - Am1: Specification for Finished Fabric Woven from Low Dk Glass for Printed Boards