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Document #:
Revision
B
Product Type
Released:  10/20/2023
Language
English
Current Revision
IPC-1782B establishes minimum requirements for manufacturing and supply chain traceability based on perceived risk. IPC-1782B applies to all products, processes, assemblies, parts, components, equipment used and other items as defined by users and suppliers in the manufacture of printed board assemblies, as well as mechanical assembly and printed board fabrication. IPC-1782B is applicable both for...
Document #:
Revision
A
Product Type
Released:  02/28/2022
Language
English
Current Revision
The IPC-D-620A standard provides design and critical process requirements for cable and wire harness assemblies as well as military/space applications. IPC-D-620A is the design requirements companion to IPC/WHMA-A-620, "Requirements and Acceptance for Cable and Wire Harness Assemblies," and its associated Space Addendum. Three white papers are included to provide guidance on key topics discussed...
Document #:
Revision
C
Product Type
Released:  11/20/2020
Language
English
Current Revision
The IPC-2581C standard specifies the XML schema that represents the intelligent data file format used to describe printed board and printed board assembly products with details sufficient for tooling, manufacturing, assembly, and inspection requirements. This format may be used for transmitting information between a printed board designer and a manufacturing or assembly facility. The data is most...
Document #:
Revision
N
Product Type
Released:  11/30/2021
Language
English
IPC-T-50N document is designed to provide definitions for terms commonly used in the electronics industry. The definitions are intended to provide sufficient clarity of detail such that a reader utilizing English as a second language could understand the subtleties of the meaning. IPC-T-50N contains over 550 new or revised terms, including new terminology for via structures, surface mount device...
Document #:
Revision
M
Product Type
Released:  05/26/2015
Language
English
This essential industry standard provides descriptions and illustrations of electronic interconnect industry terminology to help users and their customers break down language barriers. Revision M contains over 220 new or revised terms, including new terminology for conformal coatings, potting and encapsulation processes, stencil design, statistical process control, and flexible printed board...
Document #:
Revision
K
Product Type
Released:  07/17/2013
Language
English
This essential industry standard provides descriptions and illustrations of electronic interconnect industry terminology to help users and their customers break down language barriers. Revision K contains more than 220 new or revised terms, including new terminology for thermal properties, etchback, assembly processing, hole drilling, and microvia technology. Also includes commonly used industry...

IPC-T-50 - Revision J - Standard Only

SUPERSEDED BY T-50K

Document #:
Revision
J
Product Type
Released:  10/18/2011
Language
English
This essential industry standard provides descriptions and illustrations of electronics interconnect industry terminology to help users and their customers break down language barriers. Revision J contains nearly 400 new or revised terms, including new terminology for chip scale and area array packaging, cable and wire harness technology, assembly processing, moisture sensitive components, and...
Document #:
Revision
Original Version
Product Type
Released:  05/27/2025
Language
English
Current Revision
This standard identifies categories and establishes a designation system and qualification/quality conformance requirements and test methods for conductive yarns used in e-textiles. The standard enables suppliers of conductive yarns to demonstrate their products’ performance against real-world processing and end-use environments, leveraging eight IPC Test Methods developed specifically for...
Document #:
Revision
Original Version
Product Type
Released:  04/10/2025
Language
English
Current Revision
This standard defines classification levels and testing thresholds to assess the reliability of e-textile wearables in their intended end-use environments. It establishes baseline criteria for evaluating durability under mechanical stressors—such as abrasion, flexing, and UV exposure—and environmental conditions including perspiration, washing, water/saltwater, alkalis, and acids. Supported by 14...
Document #:
Revision
Original Version
Product Type
Released:  01/10/2025
Language
English
Current Revision
IPC-9716 provides requirements for automated optical inspection (AOI) systems to define, set up, establish, and apply process control for manufacturing printed board assemblies, including general and specific process and AOI system conditions. Requirements include inspection parameters, lighting conditions, calibration, detectability, resolution, threshold limits, program setups, measurement...
Document #:
Revision
Original Version
Product Type
Released:  12/05/2019
Language
English
Current Revision
The IPC-8921 standard provides and defines industry test methods and guidance for providing performance data on key characteristics and durability of woven and knitted e-textiles integrated with conductive fibers, conductive yarns and/or wires. The IPC-8921 standard also provides classifications for woven and knitted e-textiles, fibers, yarns and wires and includes 20 new terms and definitions for...

IPC-T-50- Revision N - Standard Only

电子电路互连与封装术语及定义

Document #:
Revision
N
Product Type
Released:  01/13/2023
Language
Chinese
Current Revision
IPC-T-50N-CN文件旨在为电子行业中常用的词汇和术语提供其定义。本文件所规定的定义充分详细地阐明了术语,以便以英语为第二语言的读者能够理解含义的细微之处。IPC-T-50N-CN包含550多个新的或修订的术语,包括通孔结构、表面贴装器件类型、焊料凸点、焊料合金、焊接、退润湿、电路板制造工艺和测试的新术语。
Document #:
Revision
A
Product Type
Released:  01/13/2021
Language
English
The IPC-1782A standard establishes minimum requirements for manufacturing and supply chain traceability based on perceived risk. IPC-1782A applies to all products, processes, assemblies, parts, components, equipment and other items used in the manufacture of printed board assemblies and in mechanical assembly.
Document #:
Revision
A
Product Type
Language
English
The IPC-D-620A standard provides design and critical process requirements for cable and wire harness assemblies as well as military/space applications. IPC-D-620A is the design requirements companion to IPC/WHMA-A-620, "Requirements and Acceptance for Cable and Wire Harness Assemblies," and its associated Space Addendum. Three white papers are included to provide guidance on key topics discussed...
Document #:
Revision
K
Product Type
Released:  02/03/2015
Language
German
Current Revision
Das unentbehrliche Nachschlagewerk für alle Verantwortlichen entlang der Wertschöpfungskette von elektronischen Produkten. Die Revision K enthält auf mehr als 120 Seiten, mehr als 220 neue und überarbeitete Begriffe und bildliche Darstellungen. Beispiele: Access Hole, Accelerated Equivalent Soak, Capture Land, Micro Via Technology, Plating Thief, Etchback, Resin Recession, Tape Automated Bonding...
Document #:
Revision
B
Product Type
Released:  09/01/2013
Language
English
This standard specifies the XML schema that represents the intelligent data file format used to describe printed board and printed board assembly products with details sufficient for tooling, manufacturing, assembly, and inspection requirements. This format may be used for transmitting information between a printed board designer and a manufacturing or assembly facility. The data is most useful...
Document #:
Revision
Original Version
Product Type
Released:  08/02/2022
Language
English
The IPC/DAC-2552 standard was developed jointly with the Digital Association of China (DAC), with the purpose to use Model Based Definition (MBD) to realize efficient and high-quality digital design of board-level assembly, support electronic assembly virtual manufacturing, and enabling the digitalization from requirement to product realization for printed board assemblies. The IPC/DAC-2552...
Document #:
Revision
Original Version
Product Type
Released:  12/08/2015
Language
English
IPC-D-620 provides design and critical process requirements for the three product classes of cable and wire harness assemblies as well as military/space applications. It is the design requirements companion to IPC/WHMA-A-620, "Requirements and Acceptance for Cable and Wire Harness Assemblies," and its associated Space Addendum Three white papers are included to provide guidance on key topics...
Document #:
Revision
Original Version
Product Type
Released:  11/01/2016
Language
English
The lack of a uniform component traceability standard has caused an unnecessary consumption of resources (e.g., time, people, money, etc.) to track events or parts to their sources and to remedy any quality, reliability, etc., issues. Lack of a standard has also made it difficult to uniformly create and appropriately enforce the necessary contracts. This standard establishes minimum requirements...
Document #:
Revision
M
Product Type
Released:  06/30/2015
Language
French
Ce document essentiel pour l’industrie fournit des descriptions et des illustrations de la terminologie de l’industrie d’assemblage électronique afin d’aider les utilisateurs et leur clients à casser les barrières linguistiques. La révision M contient plus de 220 termes nouveaux ou révisés, incluant la nouvelle terminologie pour les procédés de tropicalisation, d’enrobage et d’encapsulation, la...

IPC-T-50 - Revision M - Standard Only

电子电路互连与封装术语及定义

Document #:
Revision
M
Product Type
Released:  09/19/2016
Language
Chinese
本文件是电子互连行业不可或缺的术语标准。该文件图文并茂,可帮助用户及其客户克服语言上的沟通障碍。M版本包含超过220多条新术语或修订术语,包括敷形涂覆、灌封和封装工艺、模板设计、统计工艺控制和挠性印制板技术。也包括通用行业缩写词。

IPC-T-50 - Revision H - Standard Only

电子电路互连与封装术语及定义

Document #:
Revision
H
Product Type
Released:  09/17/2009
Language
Chinese
Description in English 本文件是电子互连行业不可或缺的一份术语标准。该文件图文并茂,可帮助用户及其客户克服语言上的沟通障碍。H版本包含200多条新术语或修订术语,新术语涉及球栅阵列和芯片尺寸封装、导通孔保护、导体图形、组装工艺、基材和选择性电镀工艺等。还包括通用工业缩写词和根据技术分类排序的术语索引,以便于查找。全文276页,于 2008年7月公布。
Document #:
Revision
Original Version
Product Type
Released:  06/27/2025
Language
Japanese
Current Revision
本規格は、自動光学検査(AOI)システムを用いてプリント基板組立品を製造する際の工程管理を定義、設定、確立、適用するための要求事項を規定するものである。ここでは一般工程、特殊工程およびAOIシステムの条件等を範囲としている。 要求事項には、検査パラメータ、照明条件、校正、検出可能性、分解能、閾値の限度、プログラムセットアップ、測定システム解析(MSA)、保守、検証プロトコルが含まれる。

IPC/DAC-2552 -Standard Only

通用电子元器件基于模型的定义

Document #:
Revision
Original Version
Product Type
Released:  10/25/2024
Language
Chinese
Current Revision
本标准是由IPC与广东省数字化学会(DAC)联合开发和发布的国际标准,目的旨在解决业内各厂家提供的电子元器件几何模型及语义信息参差不齐,导致使用方需要重复建模处理且无法复用等问题。 定义如何将电子元器件的设计、仿真、制造等领域的属性关联到电子元器件的三维模型及对应的子部件上的数字化建模,通过规范各供应商按模型交付,工具间(CAD/CAE等)数据集成打通的方式,可实现高效
Document #:
Revision
Original Version
Product Type
Released:  01/13/2021
Language
Chinese
Current Revision
IPC-8921标准提供并定义了工业测试方法和指南,以提供与导电纤维、导电纱和/或导线相结合的机织和针织型电子织物的关键特性和耐久性的性能数据。 IPC-8921标准还提供了机织和针织电子纺织品、纤维、纱线和电线的经典说明,并包括20个新的电子纺织品术语和定义。

Coming Soon

IPC-9242: Guidelines for Microsection Evaluation

IPC-9691C: User Guide for the IPC-TM-650, Method 2.6.25 Conductive Anodic Filament (CAF) Resistance and Other Internal Electrochemical Migration Testing

IPC-A-630A: Acceptability Standard for Manufacture, Inspection, and Testing of Electronic Enclosures

IPC-4556A: Specification for Electroless Nickel/Electroless Palladium/ Immersion Gold (ENEPIG) Plating for Printed Boards

IPC-7527A: Requirements for Solder Paste Application

IPC-4204C: Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Boards

IPC-J-STD-002F: Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires

IPC-4101F: Specifications for Base Materials for Rigid and Multilayer Printed Boards

IPC-1755B: Responsible Sourcing of Minerals Data Exchange Standard

IPC-2223F: Sectional Design Standard for Flexible/Rigid-Flexible Printed Boards

IPC-HDBK-9798A: Handbook and Guide to Supplement IPC-9797

IPC-WP-011: Guidance for Strain Gage Limits for Assemblies

J-STD-046A: Customer Notification Standard for Product/Process Changes by Electronic Product Suppliers

J-STD-048A: Notification Standard for Product Discontinuance

IPC-T-50P: Terms and Definitions for Interconnecting and Packaging Electronic Circuits

IPC-1401B: Corporate Social Responsibility Management System Standard

IPC -1751B: Generic Requirements for Declaration Process Management

IPC-6013F: Qualification and Performance Specification for Flexible/Rigid-Flexible Printed Boards

IPC-4413 - Am1: Specification for Finished Fabric Woven from Low Dk Glass for Printed Boards