This SMEMA standard is for fiducial marks. It was developed to facilitate the accurate placement of components on printed circuit boards.
Products
001H-DE und IPC-A-610H-DE enthält Kriterien zur Sicherstellung der Zuverlässigkeit gelöteter elektrischer und elektronischer Automotive-Baugruppen im Feld unter rauen Umgebungsbedingungen und berücksichtigt die Bedingungen einer automatisierten Großserienproduktion. Die Ergänzung IPC J-STD-001HA-DE/IPC-A-610HA-DE ist kein eigenständiges Dokument. Diese Ergänzung fordert, dass sie in Verbindung mit...
Le présent Addendum IPC-J-STD-001HS relatif aux applications spatiales et militaires présente des exigences qui complètent ou remplacent des exigences spécifiques de la norme J-STD-001H, pour les assemblages électriques et électroniques brasés qui doivent résister aux vibrations et aux importantes variations thermiques subies dans des applications spatiales et militaires.
IPC J-STD-001HS 航天和军用附录，补充或替代 IPC J-STD-001H 对焊接电气和电子组件的具体要求，这些组件必须能够承受进入航天和军事应用并在其中运行的振动和热循环环境。
During mass soldering, it is important that all solder joints reach the minimum soldering (reflow) temperature to assure metallurgical bonding of the solder alloy and the base metals to be soldered. Metallurgical bonding requires that both surfaces to be soldered, as well as the solder, reach this minimum soldering temperature for a sufficient time to allow the wetting of the solder surfaces. This...
Implementing flip chip technology in a direct chip attach (DCA) assembly presents some unique challenges for design, assembly, inspection and repair personnel. IPC-7094 delivers useful and practical information to anyone who is currently using or contemplating developing products that employ the very complex and high density methods needed for the flip chip technology. The concepts have become...
Guidelines for accelerated reliability testing of surface mount solder attachments when evaluating and extrapolating the results of these tests towards actual use environments of electronic assemblies. 50 pages. Released November 1992. Included in the IPC-C-103 and the IPC-C-1000 Collections
The IPC-A-640, Acceptance Requirements for Optical Fiber, Optical Cable and Hybrid Wiring Harness Assemblies standard provides acceptance requirements and technical insight for cable and wire harness assemblies incorporating optical fiber, optical cable and hybrid wiring technology. The IPC-A-640 standard includes full-color illustrations and an Excel spreadsheet Verification and Compliance...
This full-color document provides design and critical process requirements and technical insight for cable and wire harness assemblies incorporating optical fiber, optical cable and hybrid wiring technology. This standard also includes an Excel spreadsheet Verification and Compliance checklist.
This document establishes the requirements and interactions necessary for printed board assembly processes for interconnecting high performance/high pin count IC packages. Includes information on design principles, material selection, board fabrication, assembly technology, testing strategy and reliability expectations based on end-use environments. Developed by IPC, EIA, MCNC and Sematech. 96...
J-STD-001 Revision E to Revision F Redline Comparison Document. This document is free to Task Group members participating in development of the standard and to Certification Centers with current training licenses for the associated Training and Certification program. CITs who are not members of the Task Group are encouraged to contact his or her MIT for a copy of the redline document.
This is a redline document showing the changes from IPC J-STD-001F with Amendment 1 to IPC J-STD-001G. This document provides a side-by-side comparison of the two documents and includes the figures and tables. The document shows the deleted/changed text in the IPC J-STD-001F with Amendment 1 pages and the new/revised text in purple highlights in the IPC J-STD-001G pages. Yellow pop-up boxes are...
This is a redline document showing the changes from IPC-A-610F with Amendment 1 to IPC-A-610G. This document provides a side-by-side comparison of the two documents and includes the figures and tables. The document shows the deleted/changed text in the IPC-A-610F with Amendment 1 pages and the new/revised text in purple highlights in the IPC-A-610G pages. Yellow pop-up boxes are also present in...
IPC-A-610 Revision E to Revision F Redline Comparison Document. This document is free to Task Group members participating in development of the standard and to Certification Centers with current training licenses for the associated Training and Certification program. CITs who are not members of the Task Group are encouraged to contact his or her MIT for a copy of the redline document.
Cleaning of stencils and misprinted PCBs has taken an increasingly important role in surface mount technology. Fine and ultra-fine pitch lands, together with other advanced packages, place new demands on stencil cleaning. Paste volume is a critical issue for fine, ultra-fine, chip-scale, BGA and flip-chip components. Insufficient solder due to clogging of stencil apertures is a primary cause of...
This standard describes the design and assembly challenges for implementing Bottom Termination surface mount Components (BTCs) whose external connections consist of metallized terminals that are an integral part of the component body. The BTCs in this document include all types and forms of bottom-only termination components intended for surface mounting. This includes such industry descriptive...
The IPC-7091 intends to provide useful and practical information to those who are designing, developing or using 3D-packaged semiconductor components or those who are considering 3D package implementation. The 3D semiconductor package may include multiple die elements—some homogeneous and some heterogeneous. The package may also include several discrete passive SMT devices, some of which are...
This document describes the design and assembly challenges for implementing passive and active components, in either formed or placed methodology, into a printed board. It provides useful and practical information to decision makers of formed or placed, passive or active components and helps establish inspection techniques, testing processes, and reliability validations. Users will also learn...
IPC J-STD-001JS 航天和军事补充标准补充或取代了 IPC J-STD-001J 中针对焊接电气和电子组件的特定要求，这些组件必须能在航天和军事应用振动与热循环环境下运行。
This file shows significant changes in J-STD-001 from Revision D to Revision E.
This file shows significant changes in IPC-A-610 from Revision D to Revision E.
Ce document essentiel pour l’industrie fournit des descriptions et des illustrations de la terminologie de l’industrie d’assemblage électronique afin d’aider les utilisateurs et leur clients à casser les barrières linguistiques. La révision M contient plus de 220 termes nouveaux ou révisés, incluant la nouvelle terminologie pour les procédés de tropicalisation, d’enrobage et d’encapsulation, la...
当采购文件特别要求对电子产品IPC-A-610G可接受性的IPC-A-610GC电信附录时，对电信产品提出了特定要求。本文档中的信息通过提供其他要求来确保电气和电子组件满足要求符合GE-78-CORE的客户的要求，从而补充或替代了IPC-A-610修订版G专门确定的要求
Coming Soon
IPC-9242: Guidelines for Microsection Evaluation
IPC-A-630A: Acceptability Standard for Manufacture, Inspection, and Testing of Electronic Enclosures
IPC-7527A: Requirements for Solder Paste Application
IPC-4204C: Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Boards
IPC-J-STD-002F: Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires
IPC-4101F: Specifications for Base Materials for Rigid and Multilayer Printed Boards
IPC-1755B: Responsible Sourcing of Minerals Data Exchange Standard
IPC-2223F: Sectional Design Standard for Flexible/Rigid-Flexible Printed Boards
IPC-HDBK-9798A: Handbook and Guide to Supplement IPC-9797
IPC-WP-011: Guidance for Strain Gage Limits for Assemblies
J-STD-048A: Notification Standard for Product Discontinuance
IPC-T-50P: Terms and Definitions for Interconnecting and Packaging Electronic Circuits
IPC-1401B: Corporate Social Responsibility Management System Standard
IPC -1751B: Generic Requirements for Declaration Process Management
IPC-6013F: Qualification and Performance Specification for Flexible/Rigid-Flexible Printed Boards
IPC-4413 - Am1: Specification for Finished Fabric Woven from Low Dk Glass for Printed Boards