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IPC-1782 - Revision B - Standard Only

Standard for Manufacturing and Supply Chain Traceability of Electronic Products

Document #:
IPC-1782
Revision
B
Product Type
Standard Only
Released:  10/20/2023
Language
English
Current Revision
IPC-1782B establishes minimum requirements for manufacturing and supply chain traceability based on perceived risk. IPC-1782B applies to all products, processes, assemblies, parts, components, equipment used and other items as defined by users and suppliers in the manufacture of printed board assemblies, as well as mechanical assembly and printed board fabrication. IPC-1782B is applicable both for...
IPC-9797A Cover Image

IPC-9797 - Revision A - Standard Only

Press-fit Standard for Automotive Requirements and other High-Reliability Applications

Document #:
IPC-9797
Revision
A
Product Type
Standard Only
Released:  05/18/2023
Language
English
Current Revision
IPC-9797A is the only industry-consensus standard for Requirements and Acceptance of Press-fit Pins. IPC-9797 describes materials, methods, tests and acceptance criteria for solderless press-fit pin connections. IPC-9797 is supported by IPC-HDBK-9798 “Handbook for Press-fit Standard for Automotive Requirements and other High-Reliability Applications” for those wanting additional information and...
IPC-D-620A Cover Image

IPC-D-620 - Revision A - Standard Only

Design and Critical Process Requirements for Cable and Wiring Harnesses

Document #:
IPC-D-620
Revision
A
Product Type
Standard Only
Released:  02/28/2022
Language
English
Current Revision
The IPC-D-620A standard provides design and critical process requirements for cable and wire harness assemblies as well as military/space applications. IPC-D-620A is the design requirements companion to IPC/WHMA-A-620, "Requirements and Acceptance for Cable and Wire Harness Assemblies," and its associated Space Addendum. Three white papers are included to provide guidance on key topics discussed...

IPC-2581 - Revision C - Standard Only

Generic Requirements for Printed Board Assembly Products Manufacturing Description Data and Transfer Methodology

Document #:
IPC-2581
Revision
C
Product Type
Standard Only
Released:  11/20/2020
Language
English
Current Revision
The IPC-2581C standard specifies the XML schema that represents the intelligent data file format used to describe printed board and printed board assembly products with details sufficient for tooling, manufacturing, assembly, and inspection requirements. This format may be used for transmitting information between a printed board designer and a manufacturing or assembly facility. The data is most...
IPC-T-50N Cover Image

IPC-T-50 - Revision N - Standard Only

Terms and Definitions for Interconnecting and Packaging Electronic Circuits

Document #:
IPC-T-50
Revision
N
Product Type
Standard Only
Released:  11/30/2021
Language
English
IPC-T-50N document is designed to provide definitions for terms commonly used in the electronics industry. The definitions are intended to provide sufficient clarity of detail such that a reader utilizing English as a second language could understand the subtleties of the meaning. IPC-T-50N contains over 550 new or revised terms, including new terminology for via structures, surface mount device...

IPC-T-50 - Revision M - Standard Only

Terms and Definitions for Interconnecting and Packaging Electronic Circuits

Document #:
IPC-T-50
Revision
M
Product Type
Standard Only
Released:  05/26/2015
Language
English
This essential industry standard provides descriptions and illustrations of electronic interconnect industry terminology to help users and their customers break down language barriers. Revision M contains over 220 new or revised terms, including new terminology for conformal coatings, potting and encapsulation processes, stencil design, statistical process control, and flexible printed board...

IPC-T-50 - Revision K - Standard Only

Terms and Definitions for Interconnecting and Packaging Electronic Circuits

Document #:
IPC-T-50
Revision
K
Product Type
Standard Only
Released:  07/17/2013
Language
English
This essential industry standard provides descriptions and illustrations of electronic interconnect industry terminology to help users and their customers break down language barriers. Revision K contains more than 220 new or revised terms, including new terminology for thermal properties, etchback, assembly processing, hole drilling, and microvia technology. Also includes commonly used industry...
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IPC-T-50 - Revision J - Standard Only

SUPERSEDED BY T-50K

Document #:
IPC-T-50
Revision
J
Product Type
Standard Only
Released:  10/18/2011
Language
English
This essential industry standard provides descriptions and illustrations of electronics interconnect industry terminology to help users and their customers break down language barriers. Revision J contains nearly 400 new or revised terms, including new terminology for chip scale and area array packaging, cable and wire harness technology, assembly processing, moisture sensitive components, and...
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IPC-TM-650 - Standard Only

Test Methods Manual

Document #:
IPC-TM-650
Revision
Original Version
Product Type
Standard Only
Language
English
Current Revision
Contains over 150 industry approved test techniques and procedures for chemical, mechanical, electrical, and environmental tests on all forms of printed boards and connectors. New and updated test methods are available for download at https://www.ipc.org/test-methods.
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IPC-9716 - Standard Only

Requirements for Automated Optical Inspection (AOI) Process Control for Printed Board Assemblies

Document #:
IPC-9716
Revision
Original Version
Product Type
Standard Only
Released:  01/10/2025
Language
English
Current Revision
IPC-9716 provides requirements for automated optical inspection (AOI) systems to define, set up, establish, and apply process control for manufacturing printed board assemblies, including general and specific process and AOI system conditions. Requirements include inspection parameters, lighting conditions, calibration, detectability, resolution, threshold limits, program setups, measurement...
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IPC-T-50- Revision N - Standard Only

电子电路互连与封装术语及定义

Document #:
IPC-T-50
Revision
N
Product Type
Standard Only
Released:  01/13/2023
Language
Chinese
Current Revision
IPC-T-50N-CN文件旨在为电子行业中常用的词汇和术语提供其定义。本文件所规定的定义充分详细地阐明了术语，以便以英语为第二语言的读者能够理解含义的细微之处。IPC-T-50N-CN包含550多个新的或修订的术语，包括通孔结构、表面贴装器件类型、焊料凸点、焊料合金、焊接、退润湿、电路板制造工艺和测试的新术语。

IPC-1782 - Revision A - Standard Only

Standard for Manufacturing and Supply Chain Traceability of Electronic Products

Document #:
IPC-1782
Revision
A
Product Type
Standard Only
Released:  01/13/2021
Language
English
The IPC-1782A standard establishes minimum requirements for manufacturing and supply chain traceability based on perceived risk. IPC-1782A applies to all products, processes, assemblies, parts, components, equipment and other items used in the manufacture of printed board assemblies and in mechanical assembly.
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IPC-D-620 - Revision A - Standard Only

Design and Critical Process Requirements for Cable and Wiring Harnesses

Document #:
IPC-D-620
Revision
A
Product Type
Standard Only
Language
English
The IPC-D-620A standard provides design and critical process requirements for cable and wire harness assemblies as well as military/space applications. IPC-D-620A is the design requirements companion to IPC/WHMA-A-620, "Requirements and Acceptance for Cable and Wire Harness Assemblies," and its associated Space Addendum. Three white papers are included to provide guidance on key topics discussed...

IPC-T-50 - Revision K - Standard Only

Begriffe und Definitionen für Leiterplatten und elektronische Baugruppen

Document #:
IPC-T-50
Revision
K
Product Type
Standard Only
Released:  02/03/2015
Language
German
Current Revision
Das unentbehrliche Nachschlagewerk für alle Verantwortlichen entlang der Wertschöpfungskette von elektronischen Produkten. Die Revision K enthält auf mehr als 120 Seiten, mehr als 220 neue und überarbeitete Begriffe und bildliche Darstellungen. Beispiele: Access Hole, Accelerated Equivalent Soak, Capture Land, Micro Via Technology, Plating Thief, Etchback, Resin Recession, Tape Automated Bonding...
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IPC-2581 - Revision B - Standard Only

Generic Requirements for Printed Board Assembly Products Manufacturing Description Data and Transfer Methodology

Document #:
IPC-2581
Revision
B
Product Type
Standard Only
Released:  09/01/2013
Language
English
This standard specifies the XML schema that represents the intelligent data file format used to describe printed board and printed board assembly products with details sufficient for tooling, manufacturing, assembly, and inspection requirements. This format may be used for transmitting information between a printed board designer and a manufacturing or assembly facility. The data is most useful...
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IPC-9707 - Amendment 1

Spherical Bend Test Method for Characterization of Board Level Interconnects

Document #:
IPC/JEDEC-9707
Revision
Original Version
Product Type
Amendment
Released:  05/01/2018
Language
English
Current Revision
IPC/JEDEC-9707-AM1 is an amendment which clarifies that the standard is only applicable to transient bending during short-term test operations. The standard specifies a common method of establishing strain limits of board-level device interconnects under spherical transient bending conditions, the worst-case flexure condition that can occur during conventional printed board/system assembly...
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IPC-9797 - Revision A - Standard Only

符合汽车应用要求及其他高可靠性应用要求的压接标准

Document #:
IPC-9797
Revision
A
Product Type
Standard Only
Released:  09/10/2025
Language
Chinese
Current Revision
IPC-9797A 是针对压接技术的要求及验收达成共识的唯一行业标准。IPC-9797A 规定了无焊压接针连接的材料、方法、测试和验收准则。IPC-9797A 得到了 IPC-HDBK-9798 “汽车应用及其他高可靠性应用要求的压接标准使用手册”的支持，供希望了解压接技术更多信息和解释的人员使用
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IPC-9797 - Revision A - Standard Only

車載要件およびその他高信頼性用途のプレスフィット規格

Document #:
IPC-9797
Revision
A
Product Type
Standard Only
Released:  04/29/2025
Language
Japanese
Current Revision
IPC-9797Aはプレスフィットピンの要求事項および許容基準に関する、業界合意による唯一の規格である。IPC-9797は、無はんだによるプレスフィットピン接続の材料、工法、試験、許容基準について記述するものである。 プレスフィット技術に関する詳細な情報と説明については、IPC-HDBK-9798 “車載要求事項およびその他高信頼性用途のプレスフィット規格のためのハンドブック”にて補足しているので、そちらを参照のこと。

IPC-9707 - Standard Only

Spherical Bend Test Method for Characterization of Board Level Interconnects

Document #:
IPC/JEDEC-9707
Revision
Original Version
Product Type
Standard Only
Released:  09/13/2011
Language
English
This standard on spherical transient bend testing is intended to characterize the maximum allowable strain that a surface mount component's board level interconnects can withstand in flexural loading. Whereas four-point monotonic bend test methods only address simple planar bending, spherical bend tests establish strain limits of board level interconnects under worst-case flexure conditions that...
IPC/DAC-2552 Cover Image

IPC-DAC-2552 - Standard Only

General Electronic Components Model Based Definition (MBD) Standard

Document #:
IPC/DAC-2552
Revision
Original Version
Product Type
Standard Only
Released:  08/02/2022
Language
English
The IPC/DAC-2552 standard was developed jointly with the Digital Association of China (DAC), with the purpose to use Model Based Definition (MBD) to realize efficient and high-quality digital design of board-level assembly, support electronic assembly virtual manufacturing, and enabling the digitalization from requirement to product realization for printed board assemblies. The IPC/DAC-2552...
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IPC-HDBK-9798 - Handbook

Handbook for Press-fit Standard for Automotive Requirements and other High-Reliability Applications

Document #:
IPC-HDBK-9798
Revision
Original Version
Product Type
Handbook
Released:  06/21/2022
Language
English
Current Revision
IPC-HDBK-9798 provides guidelines and supporting information for manufacturing electronic assemblies using compliant press-fit technology. The intent is to explain the ‘‘how-to’’ and ‘‘why’’ information, and fundamentals for these processes. This handbook is supporting the IPC-9797 standard.

IPC-9797 - Standard Only

Press-fit Standard for Automotive Requirements and other High-Reliability Applications

Document #:
IPC-9797
Revision
Original Version
Product Type
Standard Only
Released:  06/01/2020
Language
English
IPC-9797 is the only industry-consensus standard for Requirements and Acceptance of Press-fit Pins. IPC-9797 prescribes practices for the characterization, qualification and acceptance requirements of compliant press-fit technology for printed boards that cover the manufacturability and reliability needs for high reliability applications intended for use in harsh environments such as automotive...

IPC-D-620 - Standard Only

Design and Critical Process Requirements for Cable and Wiring Harnesses

Document #:
IPC-D-620
Revision
Original Version
Product Type
Standard Only
Released:  12/08/2015
Language
English
IPC-D-620 provides design and critical process requirements for the three product classes of cable and wire harness assemblies as well as military/space applications. It is the design requirements companion to IPC/WHMA-A-620, "Requirements and Acceptance for Cable and Wire Harness Assemblies," and its associated Space Addendum Three white papers are included to provide guidance on key topics...

IPC-1791 - Standard Only

Trusted Electronic Designer, Fabricator and Assembler Requirements

Document #:
IPC-1791
Revision
Original Version
Product Type
Standard Only
Released:  09/05/2018
Language
English
IPC-1791 provides minimum requirements, policies and procedures for printed board design, fabricating and assembly organizations and/or companies to become trusted sources for markets requiring high levels of confidence in the integrity of delivered products. Demonstration of the ability to meet and maintain the requirements of IPC-1791 as trusted design, fabricator or assembly organization...
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Coming Soon

IPC-9242: Guidelines for Microsection Evaluation

IPC-9691C: User Guide for the IPC-TM-650, Method 2.6.25 Conductive Anodic Filament (CAF) Resistance and Other Internal Electrochemical Migration Testing

IPC-A-630A: Acceptability Standard for Manufacture, Inspection, and Testing of Electronic Enclosures

IPC-4556A: Specification for Electroless Nickel/Electroless Palladium/ Immersion Gold (ENEPIG) Plating for Printed Boards

IPC-7527A: Requirements for Solder Paste Application

IPC-4204C: Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Boards

IPC-J-STD-002F: Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires

IPC-4101F: Specifications for Base Materials for Rigid and Multilayer Printed Boards

IPC-1755B: Responsible Sourcing of Minerals Data Exchange Standard

IPC-2223F: Sectional Design Standard for Flexible/Rigid-Flexible Printed Boards

IPC-HDBK-9798A: Handbook and Guide to Supplement IPC-9797

IPC-WP-011: Guidance for Strain Gage Limits for Assemblies

J-STD-046A: Customer Notification Standard for Product/Process Changes by Electronic Product Suppliers

J-STD-048A: Notification Standard for Product Discontinuance

IPC-T-50P: Terms and Definitions for Interconnecting and Packaging Electronic Circuits

IPC-1401B: Corporate Social Responsibility Management System Standard

IPC -1751B: Generic Requirements for Declaration Process Management

IPC-6013F: Qualification and Performance Specification for Flexible/Rigid-Flexible Printed Boards

IPC-4413 - Am1: Specification for Finished Fabric Woven from Low Dk Glass for Printed Boards