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JEDEC/IPC-JP002 - Standard Only

JEDEC/IPC Current Tin Whiskers Theory and Mitigation Practices Guideline

Document #:
JEDEC/IPC-JP002
Revision
Original Version
Product Type
Standard Only
Released:  03/01/2006
Language
English
Current Revision
This document will provide insight into the theory behind tin whisker formation as it is known today and, based on this knowledge, potential mitigation practices that may delay the onset of, or prevent tin whisker formation. The potential effectiveness of various mitigation practices will also be briefly discussed. References behind each of the theories and mitigation practices are provided. It...

EIA/IPC/JEDEC-J-STD-002 - Revision D - Standard Only

Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires

Document #:
EIA/IPC/JEDEC-J-STD-002
Revision
D
Product Type
Standard Only
Released:  06/24/2013
Language
English
This standard prescribes test methods, defect definitions, acceptance criteria, and illustrations for assessing the solderability of electronic component leads, terminations, solid wires, stranded wires, lugs and tabs. A test method for the resistance to dissolution/dewetting of metallization is also included in the standard. Intended for use by both vendors and users, J-STD-002D was developed by...

IPC-D-422 - Standard Only

Design Guide for Press Fit Rigid Printed Board Back Planes

Document #:
IPC-D-422
Revision
Original Version
Product Type
Standard Only
Released:  09/01/1982
Language
English
Current Revision
Contains backplane design information from the fabrication and assembly perspective. Includes sections on design and documentation; fabrication; assembly; repair; and inspection. 17 pages. Revised September 1982.
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IPC-D-354 - Standard Only

Library Format Description for Printed Boards in Digital Form

Document #:
IPC-D-354
Revision
Original Version
Product Type
Standard Only
Released:  02/01/1987
Language
English
Current Revision
Describes the usage of libraries within the processing and generation of information files. The data contained within covers both the definition and usage of internal (existing within the information file) and external libraries. The libraries can be used to make generated data more compact and facilitate data exchange and archival. The subroutines within a library can be used one or more times...
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IPC-D-351 - Standard Only

Printed Board Drawings in Digital Form

Document #:
IPC-D-351
Revision
Original Version
Product Type
Standard Only
Released:  08/01/1985
Language
English
Current Revision
Describes an intelligent, digital format for transfer of drawings between printed wiring board designers, manufacturers and customers. Also conveys additional requirements, guidelines and examples necessary to provide the data structures and concepts for drawing description in digital form. Supplements ANSI/IPC-D-350. Pertains to four basic types of drawings: master drawings, schematics, assembly...
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IPC-D-355 - Standard Only

Printed Board Automated Assembly Description in Digital Form

Document #:
IPC-D-355
Revision
Original Version
Product Type
Standard Only
Released:  01/01/1995
Language
English
Current Revision
Describes an intelligent, digital data transfer format for describing component mounting information. Supplements IPC-D-350 and is for designers and assemblers. Data included are pin location, component orientation, etc. This document is frozen; no future updates are planned. 33 pages. Released January 1995.
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IPC-D-352 - Standard Only

Electronic Design Data Description for Printed Boards in Digital Form

Document #:
IPC-D-352
Revision
Original Version
Product Type
Standard Only
Released:  08/01/1985
Language
English
Current Revision
Describes the relationship between elements used in electromechanical design and packaging of printed boards. Includes descriptions for logical and physical elements necessary as input to a design system, as well as the network of interconnection description between the various electronic parts. Provides the capability of describing all elements in their final form upon design completion. The...

IPC-CA-821 - Standard Only

General Requirements for Thermally Conductive Adhesives

Document #:
IPC-CA-821
Revision
Original Version
Product Type
Standard Only
Released:  01/01/1995
Language
English
Current Revision
Covers requirements and test methods for thermally conductive dielectric adhesives used to bond components in place. Permanent, removable and self-shimming adhesives are addressed. 18 pages. Released January 1995.

IPC-A-311 - Standard Only

Process Controls for Phototool Generation and Use

Document #:
IPC-A-311
Revision
Original Version
Product Type
Standard Only
Released:  03/01/1996
Language
English
Current Revision
Covers the information and data to be collected during the generation and use of phototools to improve artwork quality, thereby improving yields downstream. It also helps establish and maintain ISO 9000 certification and SPC by facilitating troubleshooting, standardizing the process for both experienced and inexperienced operators and by identifying process improvements for the ultimate...

IPC-A-142 - Standard Only

Specification for Finished Fabric Woven from Aramid for Printed Boards

Document #:
IPC-A-142
Revision
Original Version
Product Type
Standard Only
Released:  06/01/1990
Language
English
Current Revision
Covers finished fabrics woven from aramid yarns that are intended as reinforcing material in laminated plastics for electrical and electronic use. All fabrics covered by this specification are plain weave. 9 pages. Released June 1990.
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IPC-9503 - Standard Only

Moisture Sensitivity Classification for Non-IC Components

Document #:
IPC-9503
Revision
Original Version
Product Type
Standard Only
Released:  04/01/1999
Language
English
Current Revision
This standard identifies the moisture sensitivity classification level of passive surface mount devices and through-hole components, subjected to reflow soldering, so that they can be properly packaged, stored, and handled to avoid subsequent thermal/mechanical damage during assembly solder reflow attachment and/or repair operation. This standard may be used to determine what classification level...

IPC-9591 - Standard Only

Performance Parameters (Mechanical, Electrical, Environmental and Quality/Reliability) for Air Moving Devices

Document #:
IPC-9591
Revision
Original Version
Product Type
Standard Only
Released:  04/01/2006
Language
English
Current Revision
This document standardizes the performance parameters for air moving devices. The phrase "air moving device" (or "air mover") refers to equipment such as, fans, blowers and other forced air movement technologies. These air moving devices are used in the electronics industry for the cooling of heat-producing components, and range from small devices mounted directly to hot components such as...

IPC-9641 - Standard Only

High Temperature Printed Board Flatness Guideline

Document #:
IPC-9641
Revision
Original Version
Product Type
Standard Only
Released:  07/10/2013
Language
English
Current Revision
Printed board flatness is largely affected by a change in intrinsic properties through exposure to variances in temperature. The worst case deviation of the printed board from flatness may be at room temperature, peak temperature during reflow, or at any temperature in between. Printed board flatness must therefore be characterized during the entire reflow thermal cycle, and not solely at room...

IPC-9199 - Standard Only

Statistical Process Control (SPC) Quality Rating

Document #:
IPC-9199
Revision
Original Version
Product Type
Standard Only
Released:  09/01/2002
Language
English
Current Revision
This document is a tool for a customer or supplier organization's internal audit group to assess a statistical process control (SPC) system against the requirements of IPC-9191. This document should be used by customers and suppliers of any size and for any commodity. This tool can be used to perform an assessment of the use of SPC at both organizational and process levels. The questions in this...

IPC-6013 - Revision D - Standard Only

Qualification and Performance Specification for Flexible/Rigid-Flexible Printed Boards

Document #:
IPC-6013
Revision
D
Product Type
Standard Only
Released:  09/01/2017
Language
English
The IPC-6013D covers qualification and performance requirements for flexible printed boards designed to IPC-2221 and IPC-2223. The flexible printed board may be single-sided, double-sided, multilayer or rigid-flex multilayer. All of these constructions may include stiffeners, PTHs, microvias, and blind/buried vias. IPC-6013D incorporates new and updated requirements for final finishes, rigid-to...

IPC-2612 - Standard Only

Sectional Requirements for Electronic Diagramming Documentation (Schematic and Logic Descriptions)

Document #:
IPC-2612
Revision
Original Version
Product Type
Standard Only
Released:  04/30/2010
Language
English
Current Revision
This standard establishes the requirements for the documentation of electronic diagrams used as the foundation for defining the electrical interconnectivity of electronic products. The description pertains to either schematic diagrams, logic diagrams or Boolean truth tables and includes methodology for defining circuit flow, electrical or functional restrictions, or maintenance test procedures...

IPC-4101 - Revision D - Standard with Amendment 1

Specification for Base Materials for Rigid and Multilayer Printed Boards

Document #:
IPC-4101
Revision
D
Product Type
Standard with amendment(s)
Released:  05/12/2014
Language
English
IPC-4101D-WAM1 covers the requirements for base materials that are referred to as laminate or prepreg. These are to be used primarily for rigid and multilayer printed boards for electrical and electronic circuits. This document contains 65 individual specification sheets that can be searched using keywords. These keywords allow the document's user to find materials of a similar nature, but with...

IPC-4101 - Revision D - Standard Only

Specification for Base Materials for Rigid and Multilayer Printed Boards

Document #:
IPC-4101
Revision
D
Product Type
Standard Only
Released:  05/12/2014
Language
English
This specification covers the requirements for base materials that are referred to as laminate or prepreg. These are to be used primarily for rigid and multilayer printed boards for electrical and electronic circuits. This document contains 64 individual specification sheets that can be searched using keywords. These keywords allow the document's user to find materials of a similar nature, but...
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IPC-2223 - Revision D - Standard Only

Sectional Design Standard for Flexible/Rigid-Flexible Printed Boards

Document #:
IPC-2223
Revision
D
Product Type
Standard Only
Released:  09/20/2016
Language
English
Used in conjunction with IPC-2221, IPC-2223 establishes the specific requirements for the design of flexible printed boards and forms of component mounting and interconnecting structures. The flexible materials used in the structures are comprised of insulating films, reinforced and/or non-reinforced dielectric in combination with metallic materials. Revision D provides new design guidance and...

IPC-4130 - Standard Only

Specification & Characterization Methods for Nonwoven "E" Glass Mat

Document #:
IPC-4130
Revision
Original Version
Product Type
Standard Only
Released:  09/01/1998
Language
English
Current Revision
Determines the nomenclature, definitions and requirements for materials made from nonwoven "E" glass fibers. IPC-4130 also includes specification sheets for selecting and purchasing these materials. 14 pages. Released September 1998. Equivalent to IEC Publicly Available Specification (PAS) 62212

IPC-3408 - Standard Only

General Requirements for Anisotropically Conductive Adhesives Films

Document #:
IPC-3408
Revision
Original Version
Product Type
Standard Only
Released:  11/01/1996
Language
English
Current Revision
This document covers requirements and test methods for anisotropically conductive adhesive films used to bond and electrically connect components. Applications include the following: flexible PWB-to-glass, flexible PWB-to-rigid PWB, flip chip-to-glass, flip chip-to-flexible PWB, flip chip-to-rigid PWB, and fine pitch SMD. The adhesive film may be supplied pre-attached to a flexible circuit or...

IPC-3406 - Standard Only

Guidelines for Electrically Conductive Surface Mount Adhesives

Document #:
IPC-3406
Revision
Original Version
Product Type
Standard Only
Released:  07/01/1996
Language
English
Current Revision
IPC-3406 offers guidelines for selecting electrically conductive adhesives for use in electronics manufacturing as solder alternatives. The process discussion attempts to stay within the bounds of the existing solder assembly infrastructure. Both major types of adhesives, isotropic (conducting equally in all directions) and anisotropic (unidirectional conductivity) are covered. Polymer adhesives...
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Coming Soon

IPC-9242: Guidelines for Microsection Evaluation

IPC-9691C: User Guide for the IPC-TM-650, Method 2.6.25 Conductive Anodic Filament (CAF) Resistance and Other Internal Electrochemical Migration Testing

IPC-A-630A: Acceptability Standard for Manufacture, Inspection, and Testing of Electronic Enclosures

IPC-4556A: Specification for Electroless Nickel/Electroless Palladium/ Immersion Gold (ENEPIG) Plating for Printed Boards

IPC-7527A: Requirements for Solder Paste Application

IPC-4204C: Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Boards

IPC-J-STD-002F: Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires

IPC-4101F: Specifications for Base Materials for Rigid and Multilayer Printed Boards

IPC-1755B: Responsible Sourcing of Minerals Data Exchange Standard

IPC-2223F: Sectional Design Standard for Flexible/Rigid-Flexible Printed Boards

IPC-HDBK-9798A: Handbook and Guide to Supplement IPC-9797

IPC-WP-011: Guidance for Strain Gage Limits for Assemblies

J-STD-046A: Customer Notification Standard for Product/Process Changes by Electronic Product Suppliers

J-STD-048A: Notification Standard for Product Discontinuance

IPC-T-50P: Terms and Definitions for Interconnecting and Packaging Electronic Circuits

IPC-1401B: Corporate Social Responsibility Management System Standard

IPC -1751B: Generic Requirements for Declaration Process Management

IPC-6013F: Qualification and Performance Specification for Flexible/Rigid-Flexible Printed Boards

IPC-4413 - Am1: Specification for Finished Fabric Woven from Low Dk Glass for Printed Boards