This space applications addendum was for the previous Revision D of J-STD-001, February 2005. J-STD-001DS can only be used with J-STD-001D and J-STD-001ES can only be used with J-STD-001E.
Products
Telecom Addendum to IPC-A-610D Acceptability of Electronic Assemblies Telecom Addendum Published August 2009. When specifically required by procurement documentation, this Addendum supplements or replaces specifically identified requirements of IPC-A-610, Revision D of February 2005 by providing additional requirements to ensure compliance to GR-78-CORE.
Ergänzung 1 zu IPC-7711/21C-DE, das Dokument enthält Verfahren für das Entfernen und Montieren von D-Pak-Komponenten.
Enmienda 1 al IPC-7711/21C, el documento proporciona los procedimientos para la extracción y la instalación de componentes D-Pak.
IPC-7711/21C的修订本1，本文件提供D-Pak元器件的去除和安装程序.
Amendement 1 à IPC-7711 / 21C fournit des procédures supplémentaires de retrait et d'installation
This Addendum supplements or replaces specifically identified requirements of IPC-6018C, for high frequency (microwave) printed boards that must survive the vibration, ground testing and thermal cyclic environments of space and military avionics.
The IPC-1602 standard provides requirements intended to protect printed boards from contamination, physical damage, solderability degradation and moisture uptake. Consideration is given to packaging materials types and methods, production environment, handling and transport of product, and establishing baking profiles for moisture removal. IPC-1602 is now providing requirements that can be called...
In answer to numerous industry requests for guidance on electroless nickel/immersion gold (ENIG), IPC-4552 was developed. Containing full color photographs, this specification sets the requirements for the use of ENIG as a surface finish for printed boards. It includes requirements for ENIG deposit thicknesses based on performance criteria. It is an invaluable resource for use by suppliers, board...
Die Richtlinie IPC J-STD-001HS-DE Ergänzung für Raumfahrt-Anwendungen ergänzt oder ersetzt spezifisch identifizierte Anforderungen von IPC J-STD-001H-DE für gelötete elektrische und elektronische Baugruppen, die Schwingungen und die Umgebungsbedingungen thermischer Zyklen von Raumfahrt und militärischen Anwendungen überstehen müssen.
IPC-4761 is the sole industry guideline providing PCB designers, manufacturers and uses with detailed information on all existing methods for protecting vias on printed boards, including all types of via tenting, plugging, filling and capping. Production issues, long term reliability concerns and material specification and selection are provided to aid in evaluating the benefits and concerns for...
“IPC J-STD-001JS 宇宙・軍事用途向け追加規格”は、IPC J-STD-001Jの要求事項のうち特定の要件を補完する/置き換えるものであり、宇宙および軍事用途において、輸送時や運用時の振動/熱サイクル環境に耐えることが求められる電気・電子組立品を対象としている。
This document describes materials that can be used for the fabrication of embedded passive capacitor devices within the finished printed circuit board substrate. For this document, embedded passive devices and the phrase embedded passives are considered to be equivalent. It provides information on general designations and associated characteristics of embedded passive device (EPD) capacitor...
This is a three-page list of common terms and definitions use when discussing solder reflow processes and equipment.
IPC J-STD-001JA/IPC-A-610JAは、J-STD-001JおよびIPC-A-610Jの車載用途向け追加規格である。本書は、自動化された大量生産という条件を考慮しながら、過酷な環境下にある車載用電気・電子組立品について、そのはんだ付け信頼性を保証するための基準を提供するものである。 IPC J-STD-001JA/IPC-A-610JA(Addendum：追加規格)は独立した文書として使用するのではなく、J-STD-001JおよびIPC-A-610Jと併用する必要がある。
IPC J-STD-001JS 航太和軍事補充標準補充或取代了 IPC J-STD-001J 中針對焊接電氣和電子元件的特定要求，這些元件必須能在航太和軍事應用振動與熱迴圈環境下運行。
IPC-4554, Specification for Immersion Tin Plating for Printed Circuit Boards, is included in the IPC-455X series of specifications that set the requirements for printed board surface finishes that are alternates to non-coplanar finishes, most often referred to as tin-lead HASL finish. This specification is a full-color document that is intended for use by the supplier or printed board fabricator...
This is a seven-page list of electronics cleaning terms and definitions as they relate to printed circuit assembly cleaning.
This is a four-page list of common terms and definitions use when discussing screen printing processes and equipment.
This SMEMA standard is for fiducial marks. It was developed to facilitate the accurate placement of components on printed circuit boards.
001H-DE und IPC-A-610H-DE enthält Kriterien zur Sicherstellung der Zuverlässigkeit gelöteter elektrischer und elektronischer Automotive-Baugruppen im Feld unter rauen Umgebungsbedingungen und berücksichtigt die Bedingungen einer automatisierten Großserienproduktion. Die Ergänzung IPC J-STD-001HA-DE/IPC-A-610HA-DE ist kein eigenständiges Dokument. Diese Ergänzung fordert, dass sie in Verbindung mit...
This specification sets the requirements for the use of electroless nickel/electroless palladium/immersion gold (ENEPIG) as a surface finish for printed boards. It establishes requirements for ENEPIG deposit thicknesses for applications including soldering, wire bonding and as a contact finish. It is intended for use by chemical suppliers, printed board manufacturers, electronics manufacturing...
Le présent Addendum IPC-J-STD-001HS relatif aux applications spatiales et militaires présente des exigences qui complètent ou remplacent des exigences spécifiques de la norme J-STD-001H, pour les assemblages électriques et électroniques brasés qui doivent résister aux vibrations et aux importantes variations thermiques subies dans des applications spatiales et militaires.
IPC J-STD-001HS 航天和军用附录，补充或替代 IPC J-STD-001H 对焊接电气和电子组件的具体要求，这些组件必须能够承受进入航天和军事应用并在其中运行的振动和热循环环境。
Coming Soon
IPC-9242: Guidelines for Microsection Evaluation
IPC-A-630A: Acceptability Standard for Manufacture, Inspection, and Testing of Electronic Enclosures
IPC-7527A: Requirements for Solder Paste Application
IPC-4204C: Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Boards
IPC-J-STD-002F: Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires
IPC-4101F: Specifications for Base Materials for Rigid and Multilayer Printed Boards
IPC-1755B: Responsible Sourcing of Minerals Data Exchange Standard
IPC-2223F: Sectional Design Standard for Flexible/Rigid-Flexible Printed Boards
IPC-HDBK-9798A: Handbook and Guide to Supplement IPC-9797
IPC-WP-011: Guidance for Strain Gage Limits for Assemblies
J-STD-048A: Notification Standard for Product Discontinuance
IPC-T-50P: Terms and Definitions for Interconnecting and Packaging Electronic Circuits
IPC-1401B: Corporate Social Responsibility Management System Standard
IPC -1751B: Generic Requirements for Declaration Process Management
IPC-6013F: Qualification and Performance Specification for Flexible/Rigid-Flexible Printed Boards
IPC-4413 - Am1: Specification for Finished Fabric Woven from Low Dk Glass for Printed Boards