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IPC-7711/21 - Revision B - Standard Only

Rework, Modification and Repair of Electronic Assemblies

Document #:
IPC-7711/21
Revision
B
Product Type
Standard Only
Released:  03/23/2009
Language
Swedish
Current Revision
This is the Swedish language translation of IPC-7711B/7721B IPC-7711B/7721B Rework, Modification and Repair of Electronic Assemblies has received a complete procedure by procedure update to assure applicability to both lead free and traditional SnPb soldered assemblies. This single volume includes all previously published changes and several new procedures for BGAs (including reballing) and flex...

IPC-7525 - Revision B - Standard Only

Designrichtlinie für Druckschablonen

Document #:
IPC-7525
Revision
B
Product Type
Standard Only
Released:  04/15/2013
Language
German
Current Revision
Dieses Dokument unterstützt Richtlinien für das Design und die Herstellung von Druckschablonen für Lotpasten und Kleber für die Oberflächenmontage für THT- und THT/SMD-Technologie. Darin eingeschlossen sind die Unterschiede zwischen bleihaltigen und bleifreien Lotpasten, Überdruckung, Doppeldruck und Stufenschablonen Designs. Enthalten sind ebenfalls Beispiele für ein Bestellformular und die...

IPC-7711/21 - Revision B - Standard Only

Refacerea, Modificarea și Reparația Ansamblurilor Electronice

Document #:
IPC-7711/21
Revision
B
Product Type
Standard Only
Released:  08/06/2012
Language
Romanian
Current Revision
DESCRIERE engleză IPC-7711B/7721B Refacerea, Modificarea și Reparația Ansamblurilor Electronice a fost în mod total revizuit, procedură cu procedură, pentru a se asigura aplicabilitatea atât pentru ansamblurile lipite tradițional cu aliaje SnPb cât și pentru cele fără plumb. Acest unic volum include toate modificările anterior publicate și câteva proceduri noi pentru circuite BGA (inclusiv...

IPC-7711/21 - Revision C - Standard Only

Wprowadzanie Poprawek, Modyfikacja i Naprawa Zespołów Elektronicznych

Document #:
IPC-7711/21
Revision
C
Product Type
Standard Only
Released:  05/14/2019
Language
Polish
Current Revision
Niniejszy przewodnik dostarcza procedur dla wprowadzania poprawek, napraw i modyfikacji dla elektronicznych zespołów płyt drukowanych. W tej rewizji zawarte są procedury wcześniej opublikowane jako strony zmian, uaktualnione informacje ogólne i sekcja procedur wspólnych, nowe procedury dla BGA używające systemów rozpływu na skupioną podczerwień z integralnym podgrzewaniem oraz ogólnie uaktualnione...
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IPC-7711/21 - Revision C - Standard Only

Rework, modificatie en repair van elektronische assemblages - Chapter 1

Document #:
IPC-7711/21
Revision
C
Product Type
Standard Only
Released:  04/26/2019
Language
Dutch
Current Revision
Omschrijving in het Nederlands Deze handleiding bevat procedures voor rework, repair en modificatie van geassembleerde printplaten. Inbegrepen in deze revisie zijn de eerder uitgebrachte procedures met wijzigingspagina's, een bijgewerkte sectie van de algemene informatie en gemeenschappelijke procedures, nieuwe procedures voor BGA's met behulp van gerichte IR Reflow-systemen met geïntegreerde...
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IPC-7711/21 - Revision B - Standard Only

Elektronik Takımlarda Yeniden İşlem, Modifikasyon ve Onarım

Document #:
IPC-7711/21
Revision
B
Product Type
Standard Only
Released:  11/30/2007
Language
Turkish
Current Revision
IPC-7711/7721 Elektronik Takımlarda Yeniden İşlem, Modifikasyon ve Onarım, kurşunsuz ve geleneksel Kalay-Kurşun ile lehimli takımların her ikisi için de uygulanabilirliği sağlamak için prosedür bazında eksiksiz bir güncellemesi geçerli olmuştur. Bu tek cilt daha önce yayınlanan tüm değişiklikleri, BGA'lar için (topların yenilenmesini de içeren) yeni birkaç prosedürü ve esnek-baskı devre kartı...

IPC-7711/21 - Revision B - Standard Only

Rework, modifikation og reparation af elektronikprodukter

Document #:
IPC-7711/21
Revision
B
Product Type
Standard Only
Released:  12/19/2012
Language
Danish
Current Revision
Stor opdatering af blyfri support og forbedrede inspektionsvejledninger for reparationer og modifikationer! Denne vejledning omfatter alt, der er nødvendigt for reparation og rework af elektronikprodukter og printkort! IPC-7711B/7721B „Rework, modifikation og reparation af elektronikprodukter“ har komplette procedurer, som er blevet opdaterede for at sikre, at de er anvendelige til både blyfri og...

IPC-7711/21 - Revision B - Standard Only

Přepracování, modifikace a opravy elektronických sestav

Document #:
IPC-7711/21
Revision
B
Product Type
Standard Only
Released:  01/27/2008
Language
Czech
Current Revision
Download an update to published IPC-7711B/7721B Part 3 Procedure 6.1.(English only) Základni aktualizace pro bezolovnatou technologii a zlepšené návody pro kontrolu oprav a modifikací Tento návod obsahuje vše, čeho je zapotřebí pro opravy a přepracování elektronických sestav a desek plošných spojů! IPC 7711/7721 Přepracování,modifikace a opravy elektronických sestav prošla kompletní aktualizaci...
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IPC-7711/21 - Revision B - Standard Only

Rilavorazione, Modifica e Riparazione di Assemblati Elettronici

Document #:
IPC-7711/21
Revision
B
Product Type
Standard Only
Released:  11/30/2007
Language
Italian
Current Revision
IPC-7711B/7721B rilavorazione, modifica e riparazione di assemblaggi elettronici un completo aggiornamento procedura per procedura al fine di garantirne l'applicabilità su entrambe le modalità di brasatura con Pb e senza Pb. Questo volume singolo include tutte le modifiche precedentemente pubblicate e diverse nuove procedure inerenti i BGA (compresi reballing) e la riparazione dei circuiti...

IPC-7711/21 - Revision C - Standard Only

Az elektronikai szerelvények újramunkálása, módosítása és javítása

Document #:
IPC-7711/21
Revision
C
Product Type
Standard Only
Released:  01/10/2019
Language
Hungarian
Current Revision
LEIRÁS Angol nyelvű leírás Ezen útmutató eljárásokat tartalmaz az elektronikai szerelvények újramunkálására, javítására ás módosítására. Ezen revízióban a korábbi szabványváltozat eljárásai, az általános információs és közös eljárási részek is frissítésre kerültek. Új eljárásként a szabvány kiegészült a beépített előfűtővel rendelkező fókuszált infravörös BGA forrasztási eljárással és az összes...
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IPC-7351 - Revision B - Standard Only

表面贴装设计及连接盘图形标准通用要求

Document #:
IPC-7351
Revision
B
Product Type
Standard Only
Released:  02/24/2020
Language
Chinese
Current Revision
本文件中的信息旨在提供表面贴装连接盘图形的适当尺寸、形状和公差，以确保为形成适当的焊料填充提供充足的区域，从而满足IPC J-STD-001 标准的要求，同时能够对这些焊点进行检验、测试及返工。设计工程师可以使用这些信息去建立标准的连接盘图形，此连接盘图形不仅可用于手工设计， 还可用于计算机辅助设计系统。无论电子元器件是被贴装到印制板的单面还是双面，是采用波峰焊、再流焊，还是其他的焊接方式，连接盘图形和元器件尺寸都应该优化，以确保形成适当的焊点和检验准则。2010年6月出版，2020年1月翻译。

IPC-6012 - Revision B - Standard Only

Qualification and Performance Specification for Rigid Printed Boards

Document #:
IPC-6012
Revision
B
Product Type
Standard Only
Released:  09/18/2008
Language
Swedish
Current Revision
Download the free Amendment 2 (.pdf) that resolves conflict in measles criteria between J-STD-001D, IPC-A-610D, IPC-6012B and IPC-A-600G. This is the Swedish Language version of IPC-6012B. This specification covers qualification and performance of rigid printed boards, including single-sided, double-sided, with or without plated-through holes, multilayer with or without blind/buried vias and metal...
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IPC-2221 - Revision A - Standard Only

Generic Standard on Printed Board Design

Document #:
IPC-2221
Revision
A
Product Type
Standard Only
Released:  06/04/2007
Language
Chinese
Current Revision
This is the Chinese language translation of IPC-2221A. Only available in electronic format. IPC-2221A is the foundation design standard for all documents in the IPC-2220 series. It establishes the generic requirements for the design of printed boards and other forms of component mounting or interconnecting structures, whether single-sided, double-sided or multilayer. Among the many updates to...

IPC-1601 - Revision A - Standard Only

Wytyczne dla obsługiwania i przechowywania płyt drukowanych

Document #:
IPC-1601
Revision
A
Product Type
Standard Only
Released:  04/26/2019
Language
Polish
Current Revision
Jedyny dokument branżowy dotyczący obsługiwania, pakowania i przechowywania płytek drukowanych. Wskazówki zawarte w tym dokumencie mają na celu ochronę płyt drukowanych przed zanieczyszczeniem, fizycznym uszkodzeniem, utratą lutowalności i wchłanianiem wilgotności. Uwzględniono rodzaje i metody materiałów opakowaniowych, środowisko produkcyjne, obsługiwanie i transport, a także profile wygrzewania...
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IPC-4202 - Revision B - Standard Only

挠性印制板用挠性基底电介质

Document #:
IPC-4202
Revision
B
Product Type
Standard Only
Released:  07/30/2019
Language
Chinese
Current Revision
本文档提供了全面的数据，帮助用户更轻松的确定挠性基底电介质材料的材料性能和兼容性，以制造挠性印制电路板。标准包括灵活的基础材料规格单，这些规格单针对已使用规格材料类型的最新属性进行了更新。标准建立了最新的分类体系、鉴定和质量符合性要求，其中包括高频介电特性。随着市场上的应用，标准还增加了碳氟化合物膜的新规格单。全文共23页。2017年3月发布。

IPC-4101 - Revision C - Standard Only

Spezifikation für Basismaterialien für starre Leiterplatten und Multilayerleiterplatten

Document #:
IPC-4101
Revision
C
Product Type
Standard Only
Released:  08/30/2009
Language
German
Current Revision
Beschreibungin Englisch Diese Spezifikation beinhaltet die Anforderungen an Basismaterialien, hier als Laminate oder Prepregs bezeichnet, die hauptsächlich in starren Leiterplatten oder Multilayerleiterplatten für elektrische und elektronische Schaltungen verwendet werden. Das Dokument enthält 66 einzelne Spezifikationsblätter, die nach Suchbegriffen sortiert sind. Diese Suchbegriffe erlauben es...
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IPC-2221 - Revision B - Standard Only

プリント基板設計に関する共通基準

Document #:
IPC-2221
Revision
B
Product Type
Standard Only
Released:  09/20/2019
Language
Japanese
Current Revision
記述 IPC-2221Bは、IPC-2220シリーズの全文書の基本となる設計基準である。これは片面、両面、または多層を問わず、プリント基板およびその他の形状の部品実装構造または相互接続構造の設計に関し、 一般的な要求事項を規定するものである。本書、リビジョンBの多くの更新内容として、導体特性、表面仕上げ、ビアプロテクション、基板の電気試験、誘電特性、基板ハウジング、熱ストレス、コンプライアントピン、パネライゼーション、および内層・外層の銅はくの厚さに関する新規基準がある。附属書Aには、ロットの受入れおよび品質適合試験で用いられるテストクーポンの新規設計が記載されている。170ページ。 2012年出版。2015年4月翻訳。 目次をみる。pdfファイル。
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IPC-1720 - Revision A - Standard Only

组装资格认证纲要

Document #:
IPC-1720
Revision
A
Product Type
Standard Only
Released:  10/05/2012
Language
Chinese
Current Revision
简要介绍 （英文） IPC-1720A由IPC OEM委员会开发，分为电子组件制造商的能力和有详细、实质性信息的供应商的OEM客户。本程序简化了审核过程且降低了审核频率，从而减少了文书工作且提高了效率。公司和分公司的描述，分公司能力简介 ，设备概况（现场审核前），技术概况要求，质量概况，以及制造概况。A版本由一个单一的，易使用的电子文档微软（ Word TM模板）组成，提供了具有合并和整理数据的电子功能。共56页。2004年7月发布。
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IPC-1601 - Revision A - Standard Only

印制板操作和储存指南

Document #:
IPC-1601
Revision
A
Product Type
Standard Only
Released:  04/12/2019
Language
Chinese
Current Revision
描述 关于印制板操作、包装和储存的行业指南。这些指南是为了保护印制板，避免其受到污染、物理损坏、可焊性降低、静电放电（必要时）和吸湿。本文件考虑了包装材料和方法、生产环境、操作和产品运输，建立了除湿烘烤曲线。修订本A扩大了覆盖范围，包括防潮袋（MBB）、烘烤对印刷板可焊性的影响、ESD问题、蚀刻芯和复合材料的湿度问题、干燥剂材料和HIC卡以及包装和处理要求的示例流程。2017年8月翻译。

IPC-1601 - Revision A - Standard Only

Guía para el manejo y almacenamiento de tarjetas impresas

Document #:
IPC-1601
Revision
A
Product Type
Standard Only
Released:  08/21/2018
Language
Spanish
Current Revision
La única guía de la industria para el manejo, empaquetado y almacenamiento de tarjetas impresas. Las pautas descritas en este documento tienen la intención de proteger las tarjetas impresas de contaminación, daños físicos, degradación y absorción de humedad. Se consideran los tipos de materiales y métodos de empaquetado, los entornos de producción, el manejo y transporte del producto y se...
IPC-6018DS

IPC-6018 - Revision D - Addendum - Space and Military

Space and Military Avionics Applications Addendum to IPC-6018D, Qualification and Performance Specification for High Frequency (Microwave) Printed Boards

Document #:
IPC-6018
Revision
D
Product Type
Addendum
Released:  08/04/2022
Language
English
The IPC-6018DS addendum supplements or replaces specifically identified requirements of IPC-6018D, for high frequency (microwave) printed boards that must survive the vibration, ground testing and thermal cyclic environments of space and military avionics. The IPC-6018DS addendum incorporates new requirements in areas such as copper wrap plating, dewetting, pad/land anomalies, copper cap plating...

IPC-6012 - Revision E - Amendment 1

刚性印制板的鉴定及性能规范- 修订本1

Document #:
IPC-6012
Revision
E
Product Type
Amendment
Released:  10/28/2022
Language
Chinese
Current Revision
IPC-6012E-AM1是IPC-6012E的修订本，澄清了再流焊SnPb或HASL镀层中退润湿和焊料回缩之间的区别。 该修订本还为成品印制板的最小外部导体厚度提供了修订标准，并为内部电镀层的最小厚度提供了新的接受标准。

IPC-6012 - Revision D - Addendum - Automotive

Automotive Applications Addendum to IPC-6012D, Qualification and Performance Specification for Rigid Printed Boards

Document #:
IPC-6012
Revision
D
Product Type
Addendum
Released:  04/01/2016
Language
English
This Addendum, when required by procurement documentation/drawings, supplements or replaces specifically identified requirements of IPC-6012D, Revision D, for rigid printed boards that must survive the vibration and thermal cycling environments of electronic interconnects within the automotive industry.
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IPC-6012 - Revision D - Amendment 1

Sert Baskı Devre Kartları İçin Kalifikasyon ve Performans Spesifikasyonu

Document #:
IPC-6012
Revision
D
Product Type
Amendment
Released:  01/25/2019
Language
Turkish
Current Revision
Bu döküman; kaplı delikiçine sahip olan veya olmayan tek yüzlü, çift yüzlü baskı devre kartları ve kör/gömülü geçiş deliklerine sahip olan veya olmayan çok katmanlı baskı devre kartları ile metal çekirdekli kartları içeren sert baskı devre kartlarının kalifikasyonunu ve performansını kapsamaktadır. Son kaplama ve yüzey kaplama gereklilikleri, iletkenler, delikler/geçiş delikleri, kabul testlerinin...

IPC-6012 - Revision D - Addendum - Space and Military

Space and Military Avionics Applications Addendum to IPC-6012D, Qualification and Performance Specification for Rigid Printed Boards

Document #:
IPC-6012
Revision
D
Product Type
Addendum
Released:  09/22/2015
Language
English
This Addendum supplements or replaces specifically identified requirements of IPC-6012D, Revision D, for rigid printed boards that must survive the vibration, ground testing and thermal cyclic environments of space and military avionics

IPC-6018 - Revision C - Addendum - Space and Military

Space and Military Avionics Applications Addendum to IPC-6018C Qualification and Performance Specification for High Frequency (Microwave) Printed Boards

Document #:
IPC-6018
Revision
C
Product Type
Addendum
Released:  08/09/2016
Language
English
This Addendum supplements or replaces specifically identified requirements of IPC-6018C, for high frequency (microwave) printed boards that must survive the vibration, ground testing and thermal cyclic environments of space and military avionics.

IPC-1602 - Standard Only

Standard for Printed Board Handling and Storage

Document #:
IPC-1602
Revision
Original Version
Product Type
Standard Only
Released:  04/07/2020
Language
English
The IPC-1602 standard provides requirements intended to protect printed boards from contamination, physical damage, solderability degradation and moisture uptake. Consideration is given to packaging materials types and methods, production environment, handling and transport of product, and establishing baking profiles for moisture removal. IPC-1602 is now providing requirements that can be called...

IPC-4552 - Standard with Amendment 1&2

Specification for Electroless Nickel/Immersion Gold (ENIG) Plating for Printed Circuit Boards

Document #:
IPC-4552
Revision
Original Version
Product Type
Standard with amendment(s)
Released:  06/26/2013
Language
English
In answer to numerous industry requests for guidance on electroless nickel/immersion gold (ENIG), IPC-4552 was developed. Containing full color photographs, this specification sets the requirements for the use of ENIG as a surface finish for printed boards. It includes requirements for ENIG deposit thicknesses based on performance criteria. It is an invaluable resource for use by suppliers, board...

IPC-4761 - Standard Only

Design Guide for Protection of Printed Board Via Structures

Document #:
IPC-4761
Revision
Original Version
Product Type
Standard Only
Released:  07/01/2006
Language
English
IPC-4761 is the sole industry guideline providing PCB designers, manufacturers and uses with detailed information on all existing methods for protecting vias on printed boards, including all types of via tenting, plugging, filling and capping. Production issues, long term reliability concerns and material specification and selection are provided to aid in evaluating the benefits and concerns for...

IPC-4821 - Standard Only

Specification for Embedded Passive Device Capacitor Materials for Rigid and Multilayer Printed Boards

Document #:
IPC-4821
Revision
Original Version
Product Type
Standard Only
Released:  05/01/2006
Language
English
This document describes materials that can be used for the fabrication of embedded passive capacitor devices within the finished printed circuit board substrate. For this document, embedded passive devices and the phrase embedded passives are considered to be equivalent. It provides information on general designations and associated characteristics of embedded passive device (EPD) capacitor...
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IPC-4554 - Standard with Amendment

Specification for Immersion Tin Plating for Printed Circuit Boards

Document #:
IPC-4554
Revision
Original Version
Product Type
Standard with amendment(s)
Released:  08/10/2012
Language
English
IPC-4554, Specification for Immersion Tin Plating for Printed Circuit Boards, is included in the IPC-455X series of specifications that set the requirements for printed board surface finishes that are alternates to non-coplanar finishes, most often referred to as tin-lead HASL finish. This specification is a full-color document that is intended for use by the supplier or printed board fabricator...
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IPC-SMEMA 3.1 - Standard Only

SMEMA3.1 - Fiducial Mark Standard

Document #:
IPC-SMEMA 3.1
Revision
Original Version
Product Type
Standard Only
Released:  02/12/2007
Language
English
This SMEMA standard is for fiducial marks. It was developed to facilitate the accurate placement of components on printed circuit boards.

IPC-4556 - Standard Only

Specification for Electroless Nickel/Electroless Palladium/Immersion Gold (ENEPIG) Plating for Printed Circuit Boards

Document #:
IPC-4556
Revision
Original Version
Product Type
Standard Only
Released:  02/05/2013
Language
English
This specification sets the requirements for the use of electroless nickel/electroless palladium/immersion gold (ENEPIG) as a surface finish for printed boards. It establishes requirements for ENEPIG deposit thicknesses for applications including soldering, wire bonding and as a contact finish. It is intended for use by chemical suppliers, printed board manufacturers, electronics manufacturing...

IPC-6011 - Standard Only

Generic Performance Specification for Printed Boards

Document #:
IPC-6011
Revision
Original Version
Product Type
Standard Only
Released:  07/01/1996
Language
English
This specification establishes the general requirements and responsibilities for suppliers and users of printed boards. Serving as the foundation for the IPC-6010 Board Performance Documents series, it describes quality and reliability assurance requirements that must be met. For use with IPC-6012 through IPC-6018. Supersedes IPC-RB-276, IPC-SC-320, IPC-TC-500, IPC-ML-950C. 15 pages. Released July...

IPC-9191 - Standard Only

General Guidelines for Implementation of Statistical Process Control (SPC)

Document #:
IPC-9191
Revision
Original Version
Product Type
Standard Only
Released:  11/01/1999
Language
English
IPC-9191 reflects the principals of statistical process control (SPC) represented by ISO/DIS 11462-1, Guidelines for Implementation of Statistical Process Control (SPC) -- Part 1: Elements of SPC. This document outlines the SPC philosophy, implementation strategies, tools, and techniques used for relating process control and capability to final product requirements. Supersedes IPC-PC-90.
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IPC-MS-810 - Standard Only

Guidelines for High Volume Microsection

Document #:
IPC-MS-810
Revision
Original Version
Product Type
Standard Only
Released:  10/01/1993
Language
English
Discusses the many variables and problems associated with the process--from sample removal to micro-etch-- and the variables common to high volume microsection. The process variables and problems are organized so that the reader can research a specific issue or overview the variables of a process area. 31 pages. Released October 1993.

IPC-9631 - Standard Only

User Guide for IPC-TM-650, Method 2.6.27, Thermal Stress, Convection Reflow Assembly Simulation

Document #:
IPC-9631
Revision
Original Version
Product Type
Standard Only
Released:  12/15/2010
Language
English
IPC-9631 addresses concerns and considerations related to IPC-TM-650, Method 2.6.27, Thermal Stress, Convection Reflow Assembly Simulation. This document describes how the test method is intended for use and the rationale behind some of the protocols and requirements. This document was developed with the understanding that the test method will require special equipment and the proper set-up and...

IPC-9194 - Standard Only

Implementation of Statistical Process Control (SPC) Applied to Printed Board Assembly Manufacture Guideline

Document #:
IPC-9194
Revision
Original Version
Product Type
Standard Only
Released:  09/01/2004
Language
English
This guideline standard is intended to aid in interpretation of the requirements in IPC-9191, "General Guidelines for Implementation of Statistical process Control," specifically for printed board assembly (PBA) manufacture. This document and IPC-9191 should be used together; the standards are cross-referenced to each other in the Appendices of this guideline. This standard promotes process...

IPC-2251 - Standard Only

Design Guide for the Packaging of High Speed Electronic Circuit

Document #:
IPC-2251
Revision
Original Version
Product Type
Standard Only
Released:  11/01/2003
Language
English
This guideline addresses the major factors influencing the design of high-speed circuitry. Considerations include electrical noise, electromagnetic interference, signal propagation time, impedance, thermo-mechanical environmental protection, and heat dissipation. Supersedes IPC-D-317A. Key improvements over the IPC-D-317A document include updated impedance models for embedded microstrip, centered...
no-image-available

IPC-2315 - Standard Only

Design Guide for High Density Interconnects & Microvias

Document #:
IPC-2315
Revision
Original Version
Product Type
Standard Only
Released:  06/01/2000
Language
English
Published jointly with the Japan Printed Circuits Association, IPC/JPCA-2315 provides an easy to follow tutorial on the selection of HDI and microvia design rules and structures. Addresses various considerations when designing an HDI printed wiring board including design examples and processes, selection of materials, general descriptions, and various microvia technologies. Offers designers and...

IPC-7094 - Standard Only

Design and Assembly Process Implementation for Flip Chip and Die Size Components

Document #:
IPC-7094
Revision
Original Version
Product Type
Standard Only
Released:  03/18/2009
Language
English
Implementing flip chip technology in a direct chip attach (DCA) assembly presents some unique challenges for design, assembly, inspection and repair personnel. IPC-7094 delivers useful and practical information to anyone who is currently using or contemplating developing products that employ the very complex and high density methods needed for the flip chip technology. The concepts have become...

IPC/JPCA-4104 - Standard Only

Specification for High Density Interconnect (HDI) and Microvia Materials

Document #:
IPC-4104
Revision
Original Version
Product Type
Standard Only
Released:  05/01/1999
Language
English
Covers the various conductive and dielectric materials that can be used for the fabrication of HDI and microvias. The 23 specification sheets included in IPC/JPCA-4104 cover the qualification and conformance requirements for such materials as photoimageable dielectric dry films and liquids, epoxy blends and coated foils. IPC/JPCA-4104 also includes six new test methods developed specifically for...

J-STD-012 - Standard Only

Implementation of Flip Chip & Chip Scale Technology

Document #:
IPC-J-STD-012
Revision
Original Version
Product Type
Standard Only
Released:  01/01/1996
Language
English
This informative document describes the implementation of flip chip and related chip scale semiconductor packaging technologies. The areas discussed include design considerations, assembly processes, technology choices, application and reliability data. Chip packaging variations include flip chip, HDI, micro BGA, micro SMT and SLICC. Also provides general information on implementing flip chip and...
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Coming Soon

IPC-9242: Guidelines for Microsection Evaluation

IPC-9691C: User Guide for the IPC-TM-650, Method 2.6.25 Conductive Anodic Filament (CAF) Resistance and Other Internal Electrochemical Migration Testing

IPC-A-630A: Acceptability Standard for Manufacture, Inspection, and Testing of Electronic Enclosures

IPC-4556A: Specification for Electroless Nickel/Electroless Palladium/ Immersion Gold (ENEPIG) Plating for Printed Boards

IPC-7527A: Requirements for Solder Paste Application

IPC-4204C: Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Boards

IPC-J-STD-002F: Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires

IPC-4101F: Specifications for Base Materials for Rigid and Multilayer Printed Boards

IPC-1755B: Responsible Sourcing of Minerals Data Exchange Standard

IPC-2223F: Sectional Design Standard for Flexible/Rigid-Flexible Printed Boards

IPC-HDBK-9798A: Handbook and Guide to Supplement IPC-9797

IPC-WP-011: Guidance for Strain Gage Limits for Assemblies

J-STD-046A: Customer Notification Standard for Product/Process Changes by Electronic Product Suppliers

J-STD-048A: Notification Standard for Product Discontinuance

IPC-T-50P: Terms and Definitions for Interconnecting and Packaging Electronic Circuits

IPC-1401B: Corporate Social Responsibility Management System Standard

IPC -1751B: Generic Requirements for Declaration Process Management

IPC-6013F: Qualification and Performance Specification for Flexible/Rigid-Flexible Printed Boards

IPC-4413 - Am1: Specification for Finished Fabric Woven from Low Dk Glass for Printed Boards