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IPC/JEDEC-J-STD-035 - Standard Only

Acoustic Microscopy for Non-Hermetic Encapsulated Electronic Components

Document #:
IPC/JEDEC-J-STD-035
Revision
Original Version
Product Type
Standard Only
Released:  04/01/1999
Language
English
This test method defines the procedures for performing acoustic microscopy on non-hermetic encapsulated electronic components. It provides users with an acoustic microscopy process flow for detecting defects non-destructively in plastic packages while achieving reproducibility. Developed by IPC and JEDEC. 16 pages. Released April 1999. Equivalent to IEC Publicly Available Specification (PAS) 62191
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J-STD-013 - Standard Only

Implementation of Ball Grid Array & Other High Density Technology

Document #:
IPC-J-STD-013
Revision
Original Version
Product Type
Standard Only
Released:  07/01/1996
Language
English
This document establishes the requirements and interactions necessary for printed board assembly processes for interconnecting high performance/high pin count IC packages. Includes information on design principles, material selection, board fabrication, assembly technology, testing strategy and reliability expectations based on end-use environments. Developed by IPC, EIA, MCNC and Sematech. 96...

IPC-9121 - Standard Only

Troubleshooting for PCB Fabrication Processes

Document #:
IPC-9121
Revision
Original Version
Product Type
Standard Only
Released:  02/01/2016
Language
English
This handbook is an essential resource for anyone involved in manufacturing or purchasing PCBs. Hundreds of real-world, full-color photos spotlight more than 650 PCB process defects, with causes and corrective actions for each. IPC-9121 supersedes the PCB sections of IPC-PE-740A. Released March 2016

IPC-7526 - Standard Only

Stencil and Misprinted Board Cleaning Handbook

Document #:
IPC-7526
Revision
Original Version
Product Type
Standard Only
Released:  02/13/2007
Language
English
Cleaning of stencils and misprinted PCBs has taken an increasingly important role in surface mount technology. Fine and ultra-fine pitch lands, together with other advanced packages, place new demands on stencil cleaning. Paste volume is a critical issue for fine, ultra-fine, chip-scale, BGA and flip-chip components. Insufficient solder due to clogging of stencil apertures is a primary cause of...

IPC-7093 - Standard Only

Design and Assembly Process Implementation for Bottom Termination Components

Document #:
IPC-7093
Revision
Original Version
Product Type
Standard Only
Released:  03/28/2011
Language
English
This standard describes the design and assembly challenges for implementing Bottom Termination surface mount Components (BTCs) whose external connections consist of metallized terminals that are an integral part of the component body. The BTCs in this document include all types and forms of bottom-only termination components intended for surface mounting. This includes such industry descriptive...

IPC-6017 - Standard Only

Qualification and Performance Specification for Printed Boards Containing Embedded Passive Devices

Document #:
IPC-6017
Revision
Original Version
Product Type
Standard Only
Released:  03/19/2009
Language
English
This new standard supplements existing IPC-6010 series specifications with qualification and performance requirements for in-process and finished printed boards containing embedded passive circuitry (distributive capacitive planes and capacitive or resistive components). 10 pages. Released March 2009. Included in Collections C-105, C-1000 and the 6010 Series

IPC-7091 - Standard Only

Design and Assembly Process Implementation of 3D Components

Document #:
IPC-7091
Revision
Original Version
Product Type
Standard Only
Released:  09/25/2017
Language
English
The IPC-7091 intends to provide useful and practical information to those who are designing, developing or using 3D-packaged semiconductor components or those who are considering 3D package implementation. The 3D semiconductor package may include multiple die elements—some homogeneous and some heterogeneous. The package may also include several discrete passive SMT devices, some of which are...
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IPC-7351 - Standard Only

Generic Requirements for Surface Mount Design and Land Pattern Standard

Document #:
IPC-7351
Revision
Original Version
Product Type
Standard Only
Released:  02/01/2005
Language
English
The successor to the IPC-SM-782A is here! The document covers land pattern design for all types of passive and active components, including resistors, capacitors, MELFs, SSOPs, TSSOPs, QFPs, BGAs, QFNs and SONs. The standard provides many brand new features, including an intelligent land pattern naming convention, zero component rotations for CAD systems, and a set of three separate land pattern...
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IPC-6012 - Revision D - Redline Standard

Qualification and Performance Specification for Rigid Printed Boards

Document #:
IPC-6012
Revision
D
Product Type
Redline Standard
Released:  10/30/2015
Language
English
Track the substantive changes in IPC-6012D with this redline product. This is the D revision in its entirety, with each change highlighted on the page. Click the text to launch a pop-up with an explanation of the change from the C revision. Available for download only. IPC-6012D covers qualification and performance of rigid printed boards, including single-sided, double-sided, with or without...
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IPC-7092 - Standard Only

Design and Assembly Process Implementation for Embedded Components

Document #:
IPC-7092
Revision
Original Version
Product Type
Standard Only
Released:  02/18/2015
Language
English
This document describes the design and assembly challenges for implementing passive and active components, in either formed or placed methodology, into a printed board. It provides useful and practical information to decision makers of formed or placed, passive or active components and helps establish inspection techniques, testing processes, and reliability validations. Users will also learn...

IPC-2231 - Standard Only

DFX Guidelines

Document #:
IPC-2231
Revision
Original Version
Product Type
Standard Only
Released:  05/14/2019
Language
English
The IPC-2231 standard provides guidelines for establishing a best practice methodology for use in developing a formal DFX (Design for Manufacturing, Fabrication, Assembly, Testability, Cost, Reliability, Environment, Reuse) process for layout of printed board assemblies that utilize surface mount and through hole devices.

IPC-1791 - Standard Only

Trusted Electronic Designer, Fabricator and Assembler Requirements

Document #:
IPC-1791
Revision
Original Version
Product Type
Standard Only
Released:  09/05/2018
Language
English
IPC-1791 provides minimum requirements, policies and procedures for printed board design, fabricating and assembly organizations and/or companies to become trusted sources for markets requiring high levels of confidence in the integrity of delivered products. Demonstration of the ability to meet and maintain the requirements of IPC-1791 as trusted design, fabricator or assembly organization...

IPC-T-50M-French

IPC-T-50M-FR: Termes et Définitions pour les Circuits Électroniques Imprimés et Assemblés

Document #:
IPC-T-50
Revision
M
Product Type
Standard Only
Released:  06/30/2015
Language
French
Ce document essentiel pour l’industrie fournit des descriptions et des illustrations de la terminologie de l’industrie d’assemblage électronique afin d’aider les utilisateurs et leur clients à casser les barrières linguistiques. La révision M contient plus de 220 termes nouveaux ou révisés, incluant la nouvelle terminologie pour les procédés de tropicalisation, d’enrobage et d’encapsulation, la...
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IPC-6012 - Revision E - Addendum - Automotive

リジッドプリント板の認定および性能仕様車載用途向け追加規格

Document #:
IPC-6012
Revision
E
Product Type
Addendum
Released:  06/14/2022
Language
Japanese
Current Revision
購入仕様書/図面でIPC-6012EA追加規格の適用を要求される場合、本追加規格は、振動および熱サイクル環境に耐えることが求められるリジッドプリント板に対し、IPC-6012E-リビジョンEに記載する具体的な特定要件を補完する、もしくは置き換えるものである。今回の本文書の改訂では、次の要求事項への更新が行われた：ランド浮き、パターン形状精度、絶縁体除去(例：ウィッキング)、ソルダマスク厚さ、清浄度、適合性と信頼性試験。
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IPC-6012 - Revision F - Addendum - Space and Military

刚性印制板的鉴定及性能规范航天和军事航空应用补充标准

Document #:
IPC-6012
Revision
F
Product Type
Addendum
Released:  04/10/2025
Language
Chinese
Current Revision
IPC-6012FS 航天补充标准为 IPC-6012F 航天和军事航空应用提供了 IPC 3 级性能等级要求的例外情况。例外情况包括更改验收标准和/或样品大小以及生产批次验收测试的测试频率。IPC-6012FS 涵盖了刚性印制板在太空旅行环境中承受振动、极端热循环和静态地面测试的要求。取代 IPC-6012ES。
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IPC-6012 - Revision E - Addendum - Automotive

刚性印制板的鉴定及性能规范汽车应用补充标准

Document #:
IPC-6012
Revision
E
Product Type
Addendum
Released:  06/14/2022
Language
Chinese
Current Revision
IPC-6012EA 附录在采购文件/图纸要求时，补充或替代 IPC-6012E 修订版 E 的明确要求，适用于必须经受住汽车行业电子互连的振动和热循环环境的刚性印制板。 本文档的修订更改包括对提升焊盘、图案特征精度、电介质去除（例如芯吸）、阻焊层厚度、清洁度和适用性以及可靠性测试参数的更新要求。
IPC-6012EM CN Cover

IPC-6012 - Revision E - Addendum - Medical

刚性印制板的鉴定及性能规范IPC-6012E医疗应用补充标准

Document #:
IPC-6012
Revision
E
Product Type
Addendum
Released:  07/28/2021
Language
Chinese
Current Revision
采购文档/图纸要求时，IPC-6012EM附录可补充或替代IPC-6012E的特定标识要求，这些要求适用于必须满足高可靠性医疗设备应用要求的刚性印制板。 IPC-6012EM是医疗行业唯一针对刚性印制板的资格和性能规格的全球行业共识标准。
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IPC-6012 - Revision E - Addendum - Space and Military

リジッドプリント板の認定および性能仕様宇宙・軍用アビオニクス用途向け追加規格

Document #:
IPC-6012
Revision
E
Product Type
Addendum
Released:  01/18/2021
Language
Japanese
Current Revision
IPC-6012ES 宇宙用途向け追加規格では宇宙および軍用アビオニクス製品に適用される、IPC-6012Eのクラス3要件への例外事項を示している。これら例外事項には、生産ロット受入れ試験に関する許容基準やサンプルサイズおよび試験頻度などへの変更が含まれる。
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IPC-6012 - Revision E - Addendum - Space and Military

刚性印制板的鉴定及性能规范航天和军事航空应用补充标准

Document #:
IPC-6012
Revision
E
Product Type
Addendum
Released:  11/20/2020
Language
Chinese
Current Revision
IPC-6012ES附录为用于太空和军用航空电子产品的IPC-6012E的3类要求提供了例外。 例外情况包括对生产批次验收测试的验收标准和/或样本大小以及测试频率的更改。 IPC-6012ES涵盖了刚性印刷电路板的要求，以抵抗振动，极端热循环以及与太空旅行环境相关的地面测试。

IPC-T-50 - Revision M - Standard Only

电子电路互连与封装术语及定义

Document #:
IPC-T-50
Revision
M
Product Type
Standard Only
Released:  09/19/2016
Language
Chinese
本文件是电子互连行业不可或缺的术语标准。该文件图文并茂，可帮助用户及其客户克服语言上的沟通障碍。M版本包含超过220多条新术语或修订术语，包括敷形涂覆、灌封和封装工艺、模板设计、统计工艺控制和挠性印制板技术。也包括通用行业缩写词。
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IPC-7711/21 - Revision C - Redline Standard

Rework, Modification and Repair of Electronic Assemblies - Redline

Document #:
IPC-7711/21
Revision
C
Product Type
Redline Standard
Released:  05/30/2017
Language
English
This is a redline document showing the changes from IPC-7711/21B to IPC-7711/21C. This 790+ page document provides a side-by-side comparison of the two documents and includes the figures. The document shows the deleted/changed text in the IPC-7711/21B pages and the new/revised text in purple highlights in the IPC-7711/21C pages. Yellow pop-up boxes are also present in the IPC-7711/21C pages to...

IPC-6012 - Revision D - Addendum - Automotive

Ergänzung für Anwendungen der Automobilbranche zu IPC-6012D-DE Qualifikation und Leistungsspezifikation für starre Leiterplatten

Document #:
IPC-6012
Revision
D
Product Type
Addendum
Released:  01/26/2017
Language
German
Current Revision
Diese Ergänzung modifiziert oder ersetzt, falls in der Beschaffungsdokumentation oder den Zeichnungen gefordert, spezielle Anforderungen von IPC-6012D-DE für starre Leiterplatten, die Vibrationen und thermische Zyklen in den Umgebungsbedingungen für elektronische Verbindungen in der Automobilbranche überstehen müssen. Erschienen im April 2016. Übersetzt im September 2016.

IPC-6012 - Revision D - Addendum - Automotive

刚性印制板的鉴定及性能规范汽车要求附件

Document #:
IPC-6012
Revision
D
Product Type
Addendum
Released:  11/18/2016
Language
Chinese
Current Revision
简要介绍 （英文） 当采购文件/图纸有要求时，本附件补充或替代IPC-6012D中的特殊鉴定要求，以确保汽车行业的印制板的可靠性可以经受住振动和热循环环境下的电气连接。2016年4月发布。2016年8月翻译

IPC-6012 - Revision D - Addendum - Space and Military

Adición de aplicaciones de aviónica militar y espacial del IPC-6012D, Clasificación y especificación de rendimiento para los tableros impresos rígidos

Document #:
IPC-6012
Revision
D
Product Type
Addendum
Released:  11/18/2016
Language
Spanish
Current Revision
Esta adición suplementa o reemplaza específicamente identificado requisitos del IPC-6012D, revisión D, para los tableros impresos rígidos que tienen que sobrevivir a la vibración, ensayos/pruebas en tierra y ambientes cíclicos térmicos de espacio y aviónica militar.

IPC-6012 - Revision D - Addendum - Space and Military

Avenant pour les Applications Spatiales et Aéronautiques Militaires de l’IPC-6012D, Spécification de la Qualification et des Performances des Circuits Imprimés Rigides

Document #:
IPC-6012
Revision
D
Product Type
Addendum
Released:  06/09/2016
Language
French
Current Revision
Cet Avenant complète ou remplace les exigences de l’IPC-6012D, version D, spécifiquement identifiées pour les circuits imprimés rigides qui doivent supporter les environnements de vibration, de contrôle sur le terrain et de cyclage thermique du spatial et de l'aéronautique militaire.

IPC-6012 - Revision D - Addendum - Space and Military

Ergänzung zu IPC-6012D-DE Qualifikation und Leistungsspezifikation für starre Leiterplatten für Raumfahrt-Anwendungen

Document #:
IPC-6012
Revision
D
Product Type
Addendum
Released:  12/15/2015
Language
German
Current Revision
Diese Ergänzung ergänzt oder ersetzt spezielle Anforderungen in IPC-6012D-DE, Ausgabe D für starre Leiterplatten, die Vibrationen, Bodentests und die Umgebungsbedingungen thermischer Zyklen von Raumfahrt und militärischer Luftfahrt bestehen müssen.
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IPC-4552 - Amendment 1

Specification for Electroless Nickel/Immersion Gold (ENIG) Plating for Printed Circuit Boards

Document #:
IPC-4552
Revision
Original Version
Product Type
Amendment
Released:  06/12/2012
Language
English
Specification for Electroless Nickel/Immersion Gold (ENIG) Plating for Printed Circuit Boards Amendment 1 to IPC-4552 replaces the Table 3-1 Requirements of Electroless Nickel Immersion Gold Plating plus also replaces all of sections 3.2.1 Immersion Nickel Thickness and 3.2.2 Immersion Gold Thickness in the original release of the IPC-4552. The Amendment 1 permits the use of thinner gold (≥4 µm...
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IPC-4552 - Amendment 2

Specification for Electroless Nickel/Immersion Gold (ENIG) Plating for Printed Circuit Boards

Document #:
IPC-4552
Revision
Original Version
Product Type
Amendment
Released:  09/01/2012
Language
English
Specification for Electroless Nickel/Immersion Gold (ENIG) Plating for Printed Circuit Boards Amendment 2 to IPC-4552 is a new section in the original release of the IPC-4552. The Amendment 2 provides the “rules” by which any rework and/or repair of a printed board's ENIG surface finish is allowed. Effective September 2012.
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IPC-4556 - Amendment 1

Specification for Electroless Nickel/Electroless Palladium/Immersion Gold (ENEPIG) Plating for Printed Circuit Boards

Document #:
IPC-4556
Revision
Original Version
Product Type
Amendment
Released:  01/01/2016
Language
English
The Amendment 1 to IPC-4556 made the following changes to the base specification: a) It added the absolute value of the maximum thickness for the immersion gold of 0.070 μm [2.8 μin] that accompanies the statistically valid minimum immersion gold thickness; b) It added two more photomicrograph images to provide better information on identifying nickel hyper corrosion; c) It added the basis of...

IPC-A-600 - Revision H - Standard Only

プリント板の受け入れ

Document #:
IPC-A-600
Revision
H
Product Type
Standard Only
Released:  06/06/2014
Language
Japanese
これは明確に記述されたプリント回路板の受け入れ基準の指標である。この4色の文章は、対象の実装されていないプリント板の外部又は内部の写真・説明図、受け入れ基準及び基準不適合を示している。作業者、検査者、技術者は、最新の知られている技術情報を知る様にしなければならない。改訂H版は、90以上の写真・説明図を、銅めっき、導電体で充填したホール上部の銅めっき、プリント板のミーズリングに関わるホール周辺/バレルの分離の最新情報、層間剥離及びハローイング、積層のボイド/クラック、エッチバック、ブラインド及びベリードビアの充填状況、及びフレキシブルプリント回路について示している。

IPC-A-600 - Revision H - Standard Only

Acceptabilité des Circuits Imprimés

Document #:
IPC-A-600
Revision
H
Product Type
Standard Only
Released:  04/15/2013
Language
French
Le guide définitif illustré de l’acceptabilité des circuits imprimés. Ce document de référence en couleur défini et illustre avec des photos et des dessins, les critères « objectifs », « acceptables » et « non conformes » qui sont observables en interne ou en surface des circuits imprimés. Assurez vous que vos opérateurs, vos contrôleurs et vos ingénieurs possèdent les informations les plus...
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IPC-A-600 - Revision J - Standard Only

Abnahmekriterien für Leiterplatten

Document #:
IPC-A-600
Revision
J
Product Type
Standard Only
Released:  01/11/2017
Language
German
Das ultimative, illustrierte Handbuch für Annahmekriterien von Leiterplatten! Dieses Dokument im Vierfarben-Druck enthält Bilder und Illustrationen der Zustände „Anzustreben“, „Zulässig“ und „Fehler“, die an unbestückten Leiterplatten im Innern oder auf der Oberfläche beobachtbar sind. Stellen Sie sicher, dass Ihre Bediener, Prüfer und Ingenieure über die aktuellste Version dieses Branchen-Konsens...
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IPC-A-600 - Revision H - Standard Only

Kryteria Dopuszczenia Płyt Drukowanych

Document #:
IPC-A-600
Revision
H
Product Type
Standard Only
Released:  04/04/2013
Language
Polish
Pełne, ilustrowane wydanie przewodnika dla kryteriów dopuszczenia płyt drukowanych. Niniejszy czterokolorowy dokument dostarcza fotografii i ilustracji stanów docelowych, dopuszczalnych i niezgodnych, które są dostrzegalne wewnętrznie lub zewnętrznie na gołych płytkach drukowanych. Upewnij się, że Twoi operatorzy, inspektorzy i inżynierowie posiadają najnowsze informacje uzgodnione w przemyśle...
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IPC-A-600 - Revision J - Standard Only

Acceptabilité des Circuits Imprimés

Document #:
IPC-A-600
Revision
J
Product Type
Standard Only
Released:  09/29/2016
Language
French
Le guide définitif illustré de l’acceptabilité des circuits imprimés. Ce document de référence en couleur défini et illustre avec des photos et des dessins, les critères « objectifs », « acceptables » et « non conformes » qui sont observables en interne ou en surface des circuits imprimés. Assurez vous que vos opérateurs, vos contrôleurs et vos ingénieurs possèdent les informations les plus...

IPC-A-600 - Revision H - Standard Only

Abnahmekriterien für Leiterplatten

Document #:
IPC-A-600
Revision
H
Product Type
Standard Only
Released:  04/13/2010
Language
German
Dieses Handbuch beschreibt die Abnahmekriterien für unbestückte Leiterplatten. Das Dokument enthält farbige Abbildungen und Fotos definiert die Abnahmekriterien ür folgende Zustände: Anzustreben, Zulässig und Fehler für äußerlich sichtbare und innere sichtbare Zustände von unbestückten Leiterplatten. Dadurch stehen Anwendern und Prüfern durch die Industrie anerkannte Informationen zur Verfügung...
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IPC-A-600 - Revision J - Standard Only

印製板的可接受性

Document #:
IPC-A-600
Revision
J
Product Type
Standard Only
Released:  07/30/2019
Language
Chinese (Zhōngwén)
印製板可接受性的權威指南！ 這份有4種顏色的文件針對印製板裸板，不管是從內部還是外觀可觀察的目標，可接受和不符合情況提供了圖片和解釋。確保操作員，檢驗員和工程師擁有最新的行業知識信息。有120條新或修訂的圖片和解釋，J版本提供新的知識點，例如微導通孔接觸尺寸，電鍍，空洞和填充，伴隨著介質去除的更新和延伸（凹蝕，去鑽污和芯吸），電鍍摺皺和板邊連接器的表面鍍層，SMT和BGA焊盤，標記，孔對位，分層，蓋覆電鍍，導通孔填充和撓性電路。本文件與IPC- 6012D和IPC-6013R裡面的可接受性要求同點。取代了IPC-A-600H.180頁。於2016年5月發布。2016年6月翻譯。
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IPC-A-600 - Revision J - Standard Only

การยอมรับของบอร์ดพิมพ์

Document #:
IPC-A-600
Revision
J
Product Type
Standard Only
Released:  08/13/2020
Language
Thai
คู่มือภาพประกอบที่ชัดเจนถึงการยอมรับของบอร์ดพิมพ์! เอกสารสี่สีนี้จัดให้มีภาพถ่ายและภาพประกอบของสภาวะเป้าหมาย ยอมรับได้ และที่ไม่เป็นไปตามข้อกำหนด ซึ่งสามารถสังเกตเห็นได้จากภายในหรือภายนอกบนบอร์ดพิมพ์เปล่า ตรวจสอบให้แน่ใจว่าพนักงาน ผู้ตรวจสอบ และวิศวกรของคุณ มีข้อมูลที่สอดคล้องกับมติอุตสาหกรรมฉบับล่าสุด ด้วยจำนวน 120 ภาพถ่ายใหม่หรือภาพประกอบที่มีการแก้ไข ฉบับปรับปรุง J...
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IPC-A-600 - Revision J - Standard Only

Aceptabilidad de Tableros Impresos

Document #:
IPC-A-600
Revision
J
Product Type
Standard Only
Released:  01/26/2017
Language
Spanish
La guía ilustrada definitiva para aceptabilidad de tablero de circuito impreso. Este documento de cuatro colores ofrece fotografías e ilustraciones de las condiciones ideal, aceptables y noconforme que son internamente o externamente observable en tableros impresos sin componentes. Asegúrese de que sus ingenieros, inspectores y operadores tengan la información más actualizada de consenso de la...

IPC-9121 - Amendment 2

Troubleshooting for Printed Board Fabrication Processes

Document #:
IPC-9121
Revision
Original Version
Product Type
Amendment
Released:  09/01/2019
Language
English
The amendment 2 to IPC-9121 provides new troubleshooting topics on hole quality, laser drilling, microvias, drill smear, electroless nickel, organic solderability preservative (OSP) and rigid-flex boards.

IPC-T-50 - Revision H - Standard Only

电子电路互连与封装术语及定义

Document #:
IPC-T-50
Revision
H
Product Type
Standard Only
Released:  09/17/2009
Language
Chinese
Description in English 本文件是电子互连行业不可或缺的一份术语标准。该文件图文并茂，可帮助用户及其客户克服语言上的沟通障碍。H版本包含200多条新术语或修订术语，新术语涉及球栅阵列和芯片尺寸封装、导通孔保护、导体图形、组装工艺、基材和选择性电镀工艺等。还包括通用工业缩写词和根据技术分类排序的术语索引，以便于查找。全文276页，于 2008年7月公布。

IPC-A-600 - Revision J - Standard Only

印制板的可接受性

Document #:
IPC-A-600
Revision
J
Product Type
Standard Only
Released:  11/13/2016
Language
Chinese
印制板可接受性的权威指南！ 这份有4种颜色的文件针对印制板裸板，不管是从内部还是外观可观察的目标、可接受和不符合情况提供了图片和解释。确保操作员、检验员和工程师拥有最新的行业知识信息。有120条新或修订的图片和解释，J版本提供新的知识点，例如微导通孔接触尺寸，电镀，空洞和填充，伴随着介质去除的更新和延伸（凹蚀、去钻污和芯吸），电镀折皱和板边连接器的表面镀层，SMT和BGA焊盘，标记，孔对位，分层，盖覆电镀，导通孔填充和挠性电路。本文件与IPC-6012D和IPC-6013R 里面的可接受性要求同点。取代了IPC-A-600H。

IPC-A-600 - Revision H - Standard Only

印制板的可接受性

Document #:
IPC-A-600
Revision
H
Product Type
Standard Only
Released:  04/13/2010
Language
Chinese
配有大量插图的印制电路板可接受性权威指南标准！本文件配有大量的彩色图片和示意图，提供了可从裸板内部或外部观察到的目标条件、可接受条件及不符合条件。确保操作员、检验人员及工程师掌握行业最新的信息。H版有90多幅图片为新增或经修订，新增的内容涉及铜包覆电镀、填塞孔的铜盖覆电镀及孔壁分离，更新和扩充了印制板的白斑覆盖、分层和晕圈、层压板空洞/裂缝、凹蚀、盲导通孔和埋导通孔的填塞及挠性电路等内容。本文件中的一些要求已与IPC-6012C及IPC-6013B相关的可接受性要求保持了同步。

IPC-9121 - Amendment 1

Troubleshooting for PCB Fabrication Processes

Document #:
IPC-9121
Revision
Original Version
Product Type
Amendment
Released:  04/02/2018
Language
English
IPC-9121 AM1 is an amendment to IPC-9121 which provides updates to the Hole Preparation/Protection and Interconnect Formation sections, covering troubleshooting topics and guidance on nonconductive plugging paste, microvias and pattern plating rim voids. IPC-9121 AM1 also includes a new section on Flexible Circuits.
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IPC-6018 - Revision C - Addendum - Space and Military

高频（微波）印制板的鉴定及性能规范航天和军事航空电子应用补充标准

Document #:
IPC-6018
Revision
C
Product Type
Addendum
Released:  09/24/2019
Language
Chinese
Current Revision
本补充标准提供的要求，是对已发布的IPC-6018C 中要求的补充和某些情况下的替代， 以确保用于航天和军事航空电子设备中的印制电路板能够在振动、静态测试和热循环环境条件下的可靠性。2016年7月发布，2019年8月翻译。.
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IPC-4103 - Amendment 2

Specification for Base Materials for High Speed/High Frequency Applications

Document #:
IPC-4103
Revision
Original Version
Product Type
Amendment
Released:  11/01/2015
Language
English
The Amendment 2 to IPC-4103A-WAM1 made four fundamental changes to the base standard: All references to the epoxy curative of DICY (dicyandiamide) were removed; Opaque foreign inclusions were more specifically defined and limited; The optional properties of thermal conductivity for both laminates and bonding layers were added; and The dielectric constant (permittivity) ranges were specifically...
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IPC-A-600 - Revision H - Errata

IPC-A-600H Errata Information

Document #:
IPC-A-600
Revision
H
Product Type
Errata
Released:  08/01/2010
Language
English
This is a list of reported errata to the printed copies of IPC-A-600H. Pen and ink changes should be made in accordance with your company's document control policies.
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IPC-TM-650 - Standard Only

Method Development Packet

Document #:
IPC-TM-650
Revision
Original Version
Product Type
Development Packet
Released:  06/06/2012
Language
English
Current Revision
This document has been created to help define criteria that will yield better test methods for use by the electronics and related industries. Key objectives to validating a new test method procedure are covered, including the usage of objective evidence to verify that the elements defined within a method fulfill the intended use and that the method yields repeatable and reproducible results when...
351-400 of 481

Coming Soon

IPC-9242: Guidelines for Microsection Evaluation

IPC-9691C: User Guide for the IPC-TM-650, Method 2.6.25 Conductive Anodic Filament (CAF) Resistance and Other Internal Electrochemical Migration Testing

IPC-A-630A: Acceptability Standard for Manufacture, Inspection, and Testing of Electronic Enclosures

IPC-4556A: Specification for Electroless Nickel/Electroless Palladium/ Immersion Gold (ENEPIG) Plating for Printed Boards

IPC-7527A: Requirements for Solder Paste Application

IPC-4204C: Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Boards

IPC-J-STD-002F: Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires

IPC-4101F: Specifications for Base Materials for Rigid and Multilayer Printed Boards

IPC-1755B: Responsible Sourcing of Minerals Data Exchange Standard

IPC-2223F: Sectional Design Standard for Flexible/Rigid-Flexible Printed Boards

IPC-HDBK-9798A: Handbook and Guide to Supplement IPC-9797

IPC-WP-011: Guidance for Strain Gage Limits for Assemblies

J-STD-046A: Customer Notification Standard for Product/Process Changes by Electronic Product Suppliers

J-STD-048A: Notification Standard for Product Discontinuance

IPC-T-50P: Terms and Definitions for Interconnecting and Packaging Electronic Circuits

IPC-1401B: Corporate Social Responsibility Management System Standard

IPC -1751B: Generic Requirements for Declaration Process Management

IPC-6013F: Qualification and Performance Specification for Flexible/Rigid-Flexible Printed Boards

IPC-4413 - Am1: Specification for Finished Fabric Woven from Low Dk Glass for Printed Boards