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IPC-J-STD-001HS French Cover Image

IPC-J-STD-001 - Revision H - Addendum - Space and Military

Addendum pour les produits électroniques des applications spatiales et militaires à la norme J-STD-001H, Exigences des Assemblages Électriques et Électroniques Brasés

Document #:
IPC-J-STD-001
Revision
H
Product Type
Addendum
Released:  07/26/2022
Language
French
Current Revision
Le présent Addendum IPC-J-STD-001HS relatif aux applications spatiales et militaires présente des exigences qui complètent ou remplacent des exigences spécifiques de la norme J-STD-001H, pour les assemblages électriques et électroniques brasés qui doivent résister aux vibrations et aux importantes variations thermiques subies dans des applications spatiales et militaires.

IPC-7530 - Standard Only

Guidelines for Temperature Profiling for Mass Soldering (Reflow & Wave) Processes

Document #:
IPC-7530
Revision
Original Version
Product Type
Standard Only
Released:  05/01/2001
Language
English
During mass soldering, it is important that all solder joints reach the minimum soldering (reflow) temperature to assure metallurgical bonding of the solder alloy and the base metals to be soldered. Metallurgical bonding requires that both surfaces to be soldered, as well as the solder, reach this minimum soldering temperature for a sufficient time to allow the wetting of the solder surfaces. This...

IPC-7094 - Standard Only

Design and Assembly Process Implementation for Flip Chip and Die Size Components

Document #:
IPC-7094
Revision
Original Version
Product Type
Standard Only
Released:  03/18/2009
Language
English
Implementing flip chip technology in a direct chip attach (DCA) assembly presents some unique challenges for design, assembly, inspection and repair personnel. IPC-7094 delivers useful and practical information to anyone who is currently using or contemplating developing products that employ the very complex and high density methods needed for the flip chip technology. The concepts have become...

IPC-SM-785-English

IPC-SM-785: Guidelines for Accelerated Reliability Testing of Surface Mount Attachments

Document #:
IPC-SM-785
Revision
Original Version
Product Type
Standard Only
Released:  11/01/1992
Language
English
Guidelines for accelerated reliability testing of surface mount solder attachments when evaluating and extrapolating the results of these tests towards actual use environments of electronic assemblies. 50 pages. Released November 1992. Included in the IPC-C-103 and the IPC-C-1000 Collections

IPC-A-640 - Standard Only

Acceptance Requirements for Optical Fiber, Optical Cable, and Hybrid Wiring Harness Assemblies

Document #:
IPC-A-640
Revision
Original Version
Product Type
Standard Only
Released:  08/04/2017
Language
English
The IPC-A-640, Acceptance Requirements for Optical Fiber, Optical Cable and Hybrid Wiring Harness Assemblies standard provides acceptance requirements and technical insight for cable and wire harness assemblies incorporating optical fiber, optical cable and hybrid wiring technology. The IPC-A-640 standard includes full-color illustrations and an Excel spreadsheet Verification and Compliance...

IPC-D-640 - Standard Only

Design and Critical Process Requirements for Optical Fiber, Optical Cable and Hybrid Wiring

Document #:
IPC-D-640
Revision
Original Version
Product Type
Standard Only
Released:  09/13/2016
Language
English
This full-color document provides design and critical process requirements and technical insight for cable and wire harness assemblies incorporating optical fiber, optical cable and hybrid wiring technology. This standard also includes an Excel spreadsheet Verification and Compliance checklist.
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J-STD-013 - Standard Only

Implementation of Ball Grid Array & Other High Density Technology

Document #:
IPC-J-STD-013
Revision
Original Version
Product Type
Standard Only
Released:  07/01/1996
Language
English
This document establishes the requirements and interactions necessary for printed board assembly processes for interconnecting high performance/high pin count IC packages. Includes information on design principles, material selection, board fabrication, assembly technology, testing strategy and reliability expectations based on end-use environments. Developed by IPC, EIA, MCNC and Sematech. 96...
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IPC-J-STD-001 - Revision F - Redline Standard

J-STD-001 Revision E to Revision F Redline Comparison Document

Document #:
IPC-J-STD-001
Revision
F
Product Type
Redline Standard
Released:  10/21/2014
Language
English
J-STD-001 Revision E to Revision F Redline Comparison Document. This document is free to Task Group members participating in development of the standard and to Certification Centers with current training licenses for the associated Training and Certification program. CITs who are not members of the Task Group are encouraged to contact his or her MIT for a copy of the redline document.
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IPC-J-STD-001 - Revision G - Redline Standard

Requirements for Soldered Electrical and Electronic Assemblies

Document #:
IPC-J-STD-001
Revision
G
Product Type
Redline Standard
Released:  10/31/2017
Language
English
This is a redline document showing the changes from IPC J-STD-001F with Amendment 1 to IPC J-STD-001G. This document provides a side-by-side comparison of the two documents and includes the figures and tables. The document shows the deleted/changed text in the IPC J-STD-001F with Amendment 1 pages and the new/revised text in purple highlights in the IPC J-STD-001G pages. Yellow pop-up boxes are...
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IPC-A-610 - Revision G - Redline Standard

Acceptability of Electronic Assemblies-Redline

Document #:
IPC-A-610
Revision
G
Product Type
Redline Standard
Released:  10/31/2017
Language
English
This is a redline document showing the changes from IPC-A-610F with Amendment 1 to IPC-A-610G. This document provides a side-by-side comparison of the two documents and includes the figures and tables. The document shows the deleted/changed text in the IPC-A-610F with Amendment 1 pages and the new/revised text in purple highlights in the IPC-A-610G pages. Yellow pop-up boxes are also present in...
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IPC-A-610 - Revision F - Redline Standard

IPC-A-610 Revision E to Revision F Redline Comparison Document

Document #:
IPC-A-610
Revision
F
Product Type
Redline Standard
Released:  10/21/2014
Language
English
IPC-A-610 Revision E to Revision F Redline Comparison Document. This document is free to Task Group members participating in development of the standard and to Certification Centers with current training licenses for the associated Training and Certification program. CITs who are not members of the Task Group are encouraged to contact his or her MIT for a copy of the redline document.

IPC-7526 - Standard Only

Stencil and Misprinted Board Cleaning Handbook

Document #:
IPC-7526
Revision
Original Version
Product Type
Standard Only
Released:  02/13/2007
Language
English
Cleaning of stencils and misprinted PCBs has taken an increasingly important role in surface mount technology. Fine and ultra-fine pitch lands, together with other advanced packages, place new demands on stencil cleaning. Paste volume is a critical issue for fine, ultra-fine, chip-scale, BGA and flip-chip components. Insufficient solder due to clogging of stencil apertures is a primary cause of...

IPC-7093 - Standard Only

Design and Assembly Process Implementation for Bottom Termination Components

Document #:
IPC-7093
Revision
Original Version
Product Type
Standard Only
Released:  03/28/2011
Language
English
This standard describes the design and assembly challenges for implementing Bottom Termination surface mount Components (BTCs) whose external connections consist of metallized terminals that are an integral part of the component body. The BTCs in this document include all types and forms of bottom-only termination components intended for surface mounting. This includes such industry descriptive...

IPC-7091 - Standard Only

Design and Assembly Process Implementation of 3D Components

Document #:
IPC-7091
Revision
Original Version
Product Type
Standard Only
Released:  09/25/2017
Language
English
The IPC-7091 intends to provide useful and practical information to those who are designing, developing or using 3D-packaged semiconductor components or those who are considering 3D package implementation. The 3D semiconductor package may include multiple die elements—some homogeneous and some heterogeneous. The package may also include several discrete passive SMT devices, some of which are...
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IPC-7092 - Standard Only

Design and Assembly Process Implementation for Embedded Components

Document #:
IPC-7092
Revision
Original Version
Product Type
Standard Only
Released:  02/18/2015
Language
English
This document describes the design and assembly challenges for implementing passive and active components, in either formed or placed methodology, into a printed board. It provides useful and practical information to decision makers of formed or placed, passive or active components and helps establish inspection techniques, testing processes, and reliability validations. Users will also learn...

IPC-T-50M-French

IPC-T-50M-FR: Termes et Définitions pour les Circuits Électroniques Imprimés et Assemblés

Document #:
IPC-T-50
Revision
M
Product Type
Standard Only
Released:  06/30/2015
Language
French
Ce document essentiel pour l’industrie fournit des descriptions et des illustrations de la terminologie de l’industrie d’assemblage électronique afin d’aider les utilisateurs et leur clients à casser les barrières linguistiques. La révision M contient plus de 220 termes nouveaux ou révisés, incluant la nouvelle terminologie pour les procédés de tropicalisation, d’enrobage et d’encapsulation, la...
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IPC-A-610 - Revision G - Addendum - Telecom

IPC-A-610G 电信补充标准

Document #:
IPC-A-610
Revision
G
Product Type
Addendum
Released:  01/15/2021
Language
Chinese
Current Revision
当采购文件特别要求对电子产品IPC-A-610G可接受性的IPC-A-610GC电信附录时，对电信产品提出了特定要求。本文档中的信息通过提供其他要求来确保电气和电子组件满足要求符合GE-78-CORE的客户的要求，从而补充或替代了IPC-A-610修订版G专门确定的要求

IPC-T-50 - Revision M - Standard Only

电子电路互连与封装术语及定义

Document #:
IPC-T-50
Revision
M
Product Type
Standard Only
Released:  09/19/2016
Language
Chinese
本文件是电子互连行业不可或缺的术语标准。该文件图文并茂，可帮助用户及其客户克服语言上的沟通障碍。M版本包含超过220多条新术语或修订术语，包括敷形涂覆、灌封和封装工艺、模板设计、统计工艺控制和挠性印制板技术。也包括通用行业缩写词。
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IPC-7711/21 - Revision C - Redline Standard

Rework, Modification and Repair of Electronic Assemblies - Redline

Document #:
IPC-7711/21
Revision
C
Product Type
Redline Standard
Released:  05/30/2017
Language
English
This is a redline document showing the changes from IPC-7711/21B to IPC-7711/21C. This 790+ page document provides a side-by-side comparison of the two documents and includes the figures. The document shows the deleted/changed text in the IPC-7711/21B pages and the new/revised text in purple highlights in the IPC-7711/21C pages. Yellow pop-up boxes are also present in the IPC-7711/21C pages to...
610H German Deutch Cover Image

IPC-A-610 - Revision H - Standard Only

Abnahmekriterien für elektronische Baugruppen

Document #:
IPC-A-610
Revision
H
Product Type
Standard Only
Released:  08/10/2021
Language
German
IPC-A-610H ist die in der Elektronik-Branche weltweit am meisten verwendete Abnahme-Richtlinie für Elektronikbaugruppen. Die IPC-A-610H-Richtlinie beinhaltet eine allgemeine Aktualisierung des Dokuments, führt mehrere neue oberflächenmontierbare Bauteiltypen ein und entfernt die Kategorie „Anzustreben“ bei den Bewertungen. Teilnehmer aus 29 Ländern haben ihre Beiträge und ihr Fachwissen...
IPC-A-610H French Cover Image

IPC-A-610 - Revision H - Standard Only

Acceptabilité des Assemblages Électroniques

Document #:
IPC-A-610
Revision
H
Product Type
Standard Only
Released:  08/11/2021
Language
French
L’IPC-A-610H est le référentiel d’acceptabilité des assemblages électroniques la plus couramment utilisée dans l’industrie électronique. Le référentiel IPC-A-610H comprend une mise à jour générale du document, présente plusieurs nouveaux types de composants montés en surface et supprime les conditions d’objectif. Les participants de 29 pays ont apporté leur contribution et leur expertise pour...
IPC-A-610H Hebrew Cover Image

IPC-A-610 - Revision H - Standard Only

במקרה של חילוקי דעות בין התרגום במסמך זה לבין הגירסה האנגלית, תינתן עדיפות לגירסה האנגלית.

Document #:
IPC-A-610
Revision
H
Product Type
Standard Only
Released:  08/04/2022
Language
Hebrew
תיאור IPC-A-610Hהוא תקן הקבלה להרכבת אלקטרוניקה הנפוץ ביותר בתעשיית האלקטרוניקה. תקן IPC-A-610H כולל עדכון כללי למסמך, מציג מספר סוגי רכיבי הרכבה חדשים על פני השטח ומסיר תנאי יעד. משתתפים מ-29 מדינות סיפקו את הקלט והמומחיות שלהם כדי להביא מסמך זה לתעשיית האלקטרוניקה. זו חובה עבור מבקרים, מפעילים ואחרים שלהם עניין בקריטריוני הקבלה עבור הרכבות אלקטרוניות. IPC-A-610 פותח בסינרגיה עם J-STD-001 ו- IPC...
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IPC-J-STD-001 - Revision H - Standard Only

Exigences Relatives aux Assemblages Électroniques et Électriques Brasés

Document #:
IPC-J-STD-001
Revision
H
Product Type
Standard Only
Released:  01/10/2022
Language
French
Le référentiel IPC-J-STD-001H est reconnu internationalement pour ses critères relatifs aux procédés et matériaux de brasage. Mise à jour grâce aux contributions et expertises de participants de 27 pays, le référentiel IPC-J-STD-001H fournit à l’industrie les critères les plus récents, ainsi que des recommandations sur l’utilisation des rayons X pour inspecter l’état des brasures de trous...
J-STD-001H Korean Cover Image

IPC-J-STD-001 - Revision H - Standard Only

솔더링된 전기 및 전자 어셈블리 요건

Document #:
IPC-J-STD-001
Revision
H
Product Type
Standard Only
Released:  01/11/2022
Language
Korean
IPC-J-STD-001H는 솔더 공정 및 물질에 대한 기준으로 세계적으로 인정받고 있습니다. 인풋과 전문지식을 제공하는 27개국의 참가자로 업데이트된 IPC-J-STD-001H 표준은 다른 방법으로 볼 수 없는 스루홀 솔더 상태를 검사하기 위한 X-ray 사용에 대한 지침을 포함하여 업계에 최신 기준을 제시합니다. IPC-J-STD-001H는 전기 및 전자 어셈블리의 공정 및 허용 기준에 관심이 있는 전자 업계 종사자들에게 필수 입니다. J-STD-001은 IPC-A-610과 함께 개발되었으며, 요건에 대한 추가 정보와 설명을 원하는 사용자를 위해 IPC-HDBK-001이 지원합니다. IPC-J-STD-001H를 구입한 경우 IPC-A-610H도 함께 구입하여 사용해야 합니다.
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IPC-A-610 - Revision H - Standard Only

電子組件的可接受性

Document #:
IPC-A-610
Revision
H
Product Type
Standard Only
Released:  09/21/2021
Language
Chinese (Zhōngwén)
IPC-A-610H是電子行業廣泛採用的電子組件驗收標準。IPC-A-610H標準中包含了本檔的一般更新內容，介紹了一些新型表面貼裝元器件，同時刪除了目標條件。 本檔在電子行業成功問世離不開來自29個國家/地區的參與者，這些參與者在本檔編制期間投入了大量的精力並貢獻了寶貴的專業知識。 該標準是檢查人員、操作人員及其他與電子組件驗收要求相關的人員必須掌握的技術標準。 與IPC-A-610一起制定的標準還有J-STD-001和IPC/WHMA-A-620。
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IPC-A-610 - Revision H - Standard Only

電子組立品の許容基準

Document #:
IPC-A-610
Revision
H
Product Type
Standard Only
Released:  09/21/2021
Language
Japanese
IPC-A-610Hは、エレクトロニクス業界で最も広く使用されている電子組立品の受入れの規格である。IPC-A-610Hでは、文書への一般的な更新内容、および新規に採用された表面実装部品のタイプが含まれており、また、この改版からは「目標とするコンディション(状態)」は削除されている。 この改版にあたっては29か国からの参加者から情報と専門知識が寄せられ、最新の基準を業界に提供している。 本書は、電子組立品の受入れ基準に関心のある検査員、オペレータおよび関係者にとって必須の文書といえる。 IPC-A-610は、J-STD-001およびIPC/WHMA-A-620との相乗作用のもと開発されたものである。
J-STD-001H ZH Cover

IPC-J-STD-001 - Revision H - Standard Only

焊接的電氣和電子組件要求

Document #:
IPC-J-STD-001
Revision
H
Product Type
Standard Only
Released:  07/27/2021
Language
Chinese (Zhōngwén)
IPC-J-STD-001H是全球公認的焊接工藝和材料標準。 此次更新由27個國家/地區參與者參與編制，這些參與者在本檔更新期間投入了大量的精力並貢獻了寶貴的專業知識。IPC-J-STD-001H標準是業內最新標準，包含了有關使用X射線方法檢查其他方法難以檢測的通孔焊料狀況的指導資訊。 IPC-J-STD-001H是關注電子行業電氣和電子組件工藝和驗收標準的人員必須掌握的技術標準。 J-STD-001是與IPC-A-610一起制定的標準，由IPC-HDBK-001提供支援，其中包含了一些額外資訊和要求釋義。如果您已購買了IPC-J-STD-001H，您還需要購買並使用IPC-A-610H，二種標準需要配合使用。

IPC-T-50 - Revision H - Standard Only

电子电路互连与封装术语及定义

Document #:
IPC-T-50
Revision
H
Product Type
Standard Only
Released:  09/17/2009
Language
Chinese
Description in English 本文件是电子互连行业不可或缺的一份术语标准。该文件图文并茂，可帮助用户及其客户克服语言上的沟通障碍。H版本包含200多条新术语或修订术语，新术语涉及球栅阵列和芯片尺寸封装、导通孔保护、导体图形、组装工艺、基材和选择性电镀工艺等。还包括通用工业缩写词和根据技术分类排序的术语索引，以便于查找。全文276页，于 2008年7月公布。
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IPC-9716 - Standard Only

自動光学検査(AOI)を用いたプリント基板の工程管理に関する要求事項

Document #:
IPC-9716
Revision
Original Version
Product Type
Standard Only
Released:  06/27/2025
Language
Japanese
Current Revision
本規格は、自動光学検査(AOI)システムを用いてプリント基板組立品を製造する際の工程管理を定義、設定、確立、適用するための要求事項を規定するものである。ここでは一般工程、特殊工程およびAOIシステムの条件等を範囲としている。 要求事項には、検査パラメータ、照明条件、校正、検出可能性、分解能、閾値の限度、プログラムセットアップ、測定システム解析(MSA)、保守、検証プロトコルが含まれる。
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IPC-A-610 - Revision E - Standard Only

Acceptanskrav för kretskort

Document #:
IPC-A-610
Revision
E
Product Type
Standard Only
Released:  04/13/2010
Language
Swedish
IEC är på väg att godkänna IPC-A-610 som den globala rekommenderade internationella standarden för elektroniktillverkning. IPC-A-610 är den mest använda standarden i världen för elektroniktillverkning. IPC-A-610E är ett måste för alla kvalitetssäkrings- och produktionsavdelningar och illustrerar industrigodkända acceptanskriterier genom fyrfärgsbilder och illustrationer. Områden inkluderar...
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IPC-TM-650 - Standard Only

Method Development Packet

Document #:
IPC-TM-650
Revision
Original Version
Product Type
Development Packet
Released:  06/06/2012
Language
English
Current Revision
This document has been created to help define criteria that will yield better test methods for use by the electronics and related industries. Key objectives to validating a new test method procedure are covered, including the usage of objective evidence to verify that the elements defined within a method fulfill the intended use and that the method yields repeatable and reproducible results when...

J-STD-001F-Turkish

J-STD-001F-TR: Lehimli Elektrikli ve Elektronik Takımların Gereklilikleri

Document #:
IPC-J-STD-001
Revision
F
Product Type
Standard Only
Released:  11/16/2016
Language
Turkish
J-STD-001F lehimleme malzemeleri ve proseslerini de kapsayan tek ortak-endüstri standardı olarak dünya çapında kabul edilmektedir. Bu revizyon, geleneksel lehim alaşımlarının yanısıra kurşunsuz üretim için de destek içermektedir. Bazı önemli değişikliklere örnek olarak kaplı delik-içi minimum dolgu gereklilikleri, iki yeni yüzey montaj sonlandırma türü kriterleri ve genişletilmiş koruyucu kaplama...
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IPC-9111 - Standard Only

プリント基板組立工程のトラブルシューティング Troubleshooting for Printed Board Assembly Processes

Document #:
IPC-9111
Revision
Original Version
Product Type
Standard Only
Released:  07/13/2023
Language
Japanese
Current Revision
IPC-9111ハンドブックは、プリント基板組立品の製造あるいは購入に携わるすべての人にとって貴重な資料となるものである。 組立工程における問題点を取り上げながら、その原因や解決策とともに紹介している。 また、よりよい理解を目的とし、文書全体に多くの写真を掲載している。 IPC-9111は、IPC-PE-740Aの「プリント基板組立」の項目部分を後継する文書である
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IPC-A-610 - Revision G - Standard Only

Dopuszczalność Zespołów Elektronicznych

Document #:
IPC-A-610
Revision
G
Product Type
Standard Only
Released:  05/21/2019
Language
Polish
IPC-A-610 jest najpowszechniej na świecie używanym standardem dla pakietów elektronicznych. Uaktualniany przez uczestników z 17 krajów dostarczających wkładu i ekspertyz, niniejszy dokument dostarcza przemysłowi najnowszych kryteriów wraz z wieloma nowymi i ulepszonymi grafikami. Jest to nieoceniony dokument dla inspektorów, operatorów i innych zainteresowanych kryteriami dopuszczalności zespołów...
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IPC-7527 - Standard Only

ソルダペースト印刷に関する要求事項

Document #:
IPC-7527
Revision
Original Version
Product Type
Standard Only
Released:  08/16/2023
Language
Japanese
Current Revision
本規格は、ソルダペースト印刷の外観的(視覚的)な品質に関する許容基準を取りまとめたものである。ソルダペーストの特性評価に関し、本書では標準化された専門用語を採用し説明している。本書ではソルダペーストの印刷/堆積に関する問題について、一般的な説明および想定される原因をユーザーに提供する。本規格は、ソルダペースト印刷工程でのトラブルシューティングに使用可能な、有益な見識を提供するものである。

IPC-A-610 - Revision D - Standard Only

Acceptability of Electronic Assemblies

Document #:
IPC-A-610
Revision
D
Product Type
Standard Only
Released:  08/20/2008
Language
Czech
This is the Czech Language version of IPC-A-610D Lead free acceptance criteria and pictures now included! Reformatted-easier to find acceptance criteria! IPC-A-610 is the most widely used electronics assembly standard in the world. A must for all quality assurance and assembly departments, IPC-A-610D illustrates industry-accepted workmanship criteria for electronics assemblies through full-color...
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IPC-A-610 - Revision E - Standard Only

电子组件的可接受性

Document #:
IPC-A-610
Revision
E
Product Type
Standard Only
Released:  04/13/2010
Language
Chinese
IEC正在签署将IPC-A-610作为全球首选的电子组装国际验收标准的文件。 IPC-A-610是全球应用最广泛的电子组装标准。作为所有质量保证和组装部门的必备文件，它通过彩色图片和示意图图示了业界公认的工艺要求。主要内容包括挠性电路的连接、母子板、部件叠装、无铅、通孔元器件朝向和焊接要求、SMT（新端子类型）和分立布线组件、机械组装、清洗、标记、涂覆层和层压板要求。 对于所有检验人员、操作人员和培训员，IPC-A-610是一个无价之宝。E版本共有809张关于可接受性要求的图片和示意图，其中165张为新增或修订的。最新版本的清晰性和准确度经过了认真地审查。本文件中的一些要求已与业界一致同意的其他文件的相关要求同步，可与材料和工艺标准IPC J-STD-001配套使用。 下载IPC-A-610E版本相对于D版本的主要修订变化文件，本文件为PDF文件（只有英文版）。

IPC-A-610 - Revision E - Standard Only

Abnahmekriterien für elektronische Baugruppen

Document #:
IPC-A-610
Revision
E
Product Type
Standard Only
Released:  08/26/2010
Language
German
Die IPC-A-610 befindet sich im Anerkennungsverfahren durch die IEC (International Electrotechnical Commision) als weltweit bevorzugter und international anerkannter Standard für elektronische Baugruppen. IPC-A-610 ist der meist benutzte Standard für elektronische Baugruppen weltweit. IPC-A-610E zeigt die von der Industrie akzeptierten Kriterien für die Verarbeitungsgüte von elektronischen...
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IPC-A-610 - Revision D - Standard Only

Abnahmekriterien für elektronische Baugruppen

Document #:
IPC-A-610
Revision
D
Product Type
Standard Only
Released:  02/01/2005
Language
German
This is the German Language version of IPC-A-610D Lead free acceptance criteria and pictures now included! Reformatted-easier to find acceptance criteria! IPC-A-610 is the most widely used electronics assembly standard in the world. A must for all quality assurance and assembly departments, IPC-A-610D illustrates industry-accepted workmanship criteria for electronics assemblies through full-color...

IPC-A-610 - Revision G - Standard Only

Abnahmekriterien für elektronische Baugruppen

Document #:
IPC-A-610
Revision
G
Product Type
Standard Only
Released:  05/24/2018
Language
German
IPC-A-610 ist die weltweit am meisten verwendete Abnahme-Richtlinie zur Elektronik-Montage. Aktualisiert durch das Fachwissen von Experten aus 17 Ländern, bietet dieses Dokument der Branche aktuellste Kriterien und neue bzw. aktualisierte Illustrationen. Es ist ein absolutes Muss für Prüfer, Montagemitarbeiter und Andere, die ein Interesse an Abnahmekriterien für elektronische Baugruppen haben...
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IPC-A-610 - Revision F - Standard Only

Abnahmekriterien für elektronische Baugruppen

Document #:
IPC-A-610
Revision
F
Product Type
Standard Only
Released:  07/13/2015
Language
German
IPC-A-610 ist die weltweit am meisten verwendete Richtlinie zur Elektronik-Montage. Die IPC-A-610F, ein Muss für alle Qualitätssicherungs- und Montageabteilungen, illustriert anerkannte Abnahmekriterien für die Verarbeitungsqualität elektronischer Baugruppen. Sie enthält detaillierte Angaben über sowohl zulässige Zustände als auch Fehlerzustände und wird durch farbige Bilder und Illustrationen...

IPC-A-610 - Revision G - Standard Only

Kritéria přijatelnosti elektronických sestav

Document #:
IPC-A-610
Revision
G
Product Type
Standard Only
Released:  01/24/2019
Language
Czech
IPC-A-610 je nejpoužívanější dokument pro provádění přejímek elektronických sestav. Aktualizován účastníky ze 17 zemí zajišťuje poznatky a expertizu. Tento dokument přináší průmyslu nejnovější kritéria spolu s mnoha novými a revidovanými ilustracemi Jde o nutno příručku pro kontrolory, operátory a další pracovníky, kterých se týkají kritéria přijatelnosti elektronických sestav. IPC-A-610 je...
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IPC-A-610 - Revision E - Standard Only

Kritéria přijatelnosti elektronických sestav

Document #:
IPC-A-610
Revision
E
Product Type
Standard Only
Released:  04/13/2010
Language
Czech
IEC pracuje na uznání standardu IPC-A-610 jako celosvětově doporučené normy pro přejímky elektronických sestav. IPC-A-610 je celosvětově nejpoužívanější standard pro montáž elektronických sestav. Je nezbytný pro zajištění kvality a montáže, IPC-A-610E názorně objasňuje kritéria přijatelnosti elektronických sestav prostřednictvím barevných fotografií a ilustrací. Témata zahrnují ohebná připojení...

IPC-A-610 - Revision G - Standard Only

电⼦组件的可接受性

Document #:
IPC-A-610
Revision
G
Product Type
Standard Only
Released:  02/20/2018
Language
Chinese
中文描述 IPC-A-610是一份使用非常广泛的电子组件验收文件。标准委员会的成员来自17个国家，他们提供数据和专业知识来完成升版工作，这份文件带来了最新的标准，以及许多新的修订的行业图片。 这是一份检查员、操作者和其他感兴趣人员必须具备的电子组件接收标准的文件。IPC-A-610是和J-STD-001协同开发的，并在本修订版中首次使用了IPC/WHMA-A-620。2017年11月翻译。
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IPC-9242: Guidelines for Microsection Evaluation

IPC-9691C: User Guide for the IPC-TM-650, Method 2.6.25 Conductive Anodic Filament (CAF) Resistance and Other Internal Electrochemical Migration Testing

IPC-A-630A: Acceptability Standard for Manufacture, Inspection, and Testing of Electronic Enclosures

IPC-4556A: Specification for Electroless Nickel/Electroless Palladium/ Immersion Gold (ENEPIG) Plating for Printed Boards

IPC-7527A: Requirements for Solder Paste Application

IPC-4204C: Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Boards

IPC-J-STD-002F: Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires

IPC-4101F: Specifications for Base Materials for Rigid and Multilayer Printed Boards

IPC-1755B: Responsible Sourcing of Minerals Data Exchange Standard

IPC-2223F: Sectional Design Standard for Flexible/Rigid-Flexible Printed Boards

IPC-HDBK-9798A: Handbook and Guide to Supplement IPC-9797

IPC-WP-011: Guidance for Strain Gage Limits for Assemblies

J-STD-046A: Customer Notification Standard for Product/Process Changes by Electronic Product Suppliers

J-STD-048A: Notification Standard for Product Discontinuance

IPC-T-50P: Terms and Definitions for Interconnecting and Packaging Electronic Circuits

IPC-1401B: Corporate Social Responsibility Management System Standard

IPC -1751B: Generic Requirements for Declaration Process Management

IPC-6013F: Qualification and Performance Specification for Flexible/Rigid-Flexible Printed Boards

IPC-4413 - Am1: Specification for Finished Fabric Woven from Low Dk Glass for Printed Boards