本書は、リフロー、ベーパーフェーズ(気相)、レーザー、セレクティブ、ウェーブの各ソルダリング装置を使用し、許容可能な電子組立品(SnPb及びPbフリー)を生産する上で必要となる熱プロファイルの作成において、有用かつ実用的な情報を提供するものである。本書には、プロファイル測定に起因する一般的な欠陥に対処するためのトラブルシューティングガイドも含まれている
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規格書IPC J-STD-005Bには、ソルダペーストの認定および特性評価に関する要件が記載されている。 本書では、ソルダペーストの試験方法、基準、金属含有量、粘度、ダレ、はんだボール、タック、ぬれ性について言及している。 詳細な補完情報については「IPC-HDBK-005, Guide to Solder Paste Assessment」に記載されている。
IPC J-STD-005B标准列出了焊膏鉴定和特性的要求。 它参考了焊膏的测试方法、标准和金属含量、粘度、塌陷、焊料球、粘附力和润湿性。 IPC-HDBK-005《焊膏评估指南》提供了额外支持。
IPC-7093A 标准为实施底部端子元器件(BTCs)提供了基本的设计和组装指南。具体而言，IPC-7093A 提供了与 BTCs 相关的关键设计、材料、组装、检查、维修、质量和可靠性问题的指南。
本書では、3D部品の技術を実施する際の設計/組立の課題や、課題への対処方法について述べる。ケースに収納されていない複数の半導体ダイ素子を単一パッケージのフォーマットに組み合わせる効果を考える場合、その影響は個々の部品特性にも、これまでの組立手法にも及ぶ。本規格に含まれる情報は、3D半導体パッケージの組立とプロセスに関連する最適な機能性、工程評価、最終製品の信頼性とリペアの諸問題の解決に向け焦点を当てたものである。
本标准是为设计与制造焊膏及表面贴装粘合剂用模板提供指导。本文件大部分内容是基于模板设计者、制造厂商和用户的经验编写的。
本規格「IPC-7093A」は、下面電極部品(BTC)を実装するための基本的な設計および組立のガイダンスについて記述するものである。IPC-7093Aでは特にBTCに関連する重要な設計、材料、組立、検査、リペア、品質および信頼性の問題について、そのガイドラインを提供している
IPC-J-STD-004C标准规定了用于高质量焊接互连的助焊剂的分类和特性的一般要求。 IPC-J-STD-004C标准可用于质量控制和采购目的。
規格書「IPC J-STD-004C」は、高品質のはんだ相互接続に使用するフラックスの分類および特性評価に関し、一般的な要求事項を規定するものである。規格書「IPC J-STD-004C」は、品質管理および調達目的のために使用することも可能である。
本書は、ソルダペーストの印刷および表面実装用接着剤の塗布に用いるステンシルについて、その設計と製造に関するガイダンスを提供するものである。内容の多くはステンシル設計者、製造者、およびユーザーの経験に基づくものである。
J-STD-003Cは、すず鉛または鉛フリーのはんだを使用しながら、プリント基板の表面導体、取付けランドおよびめっきスルーホールのはんだ付性を評価するための試験方法や欠陥の定義について規定し、また図を示すものである。本規格はベンダーおよびユーザーの両者による使用を目的としている。本規格はプリント基板の表面導体、取付けランドおよびめっきスルーホールがはんだと容易にぬれること、および過酷なプリント基板組立工程に耐えることに合格であると判定するためのはんだ付性試験方法を提供することを目的としている。本規格は表面導体(および取付けランド)とめっきスルーホールの両方のはんだ付性を評価するための試験方法について説明している。リビジョン「C」には、はんだ付性試験のGR&R (ゲージ繰返し性&再現性)に関する最新情報、およびアップデートされた図が掲載されている。 改訂版1は編集上の誤記を修正するとともに...
IPC J-STD-001HA/IPC-A-610HA is the automotive addendum to J-STD-001H and IPC-A-610H. It provides criteria to ensure the reliability of soldered automotive electrical and electronic assemblies in the field under harsh environments and considers automated high-volume production. IPC J-STD-001HA/IPC-A-610HA addendum is not a standalone document, and it must be used in conjunction with J-STD-001H and...
IPC J-STD-001HS space and military addendum, supplements or replaces specifically identified requirements of IPC J-STD-001H requirements for soldered electrical and electronic assemblies that must survive the vibration and thermal cyclic environments of getting to and operating in space and military applications.
이 가이드는 인쇄 보드 어셈블리들의 리웤, 수리 및 변경을 위한 절차들을 제공한다. 이 개정에 포함된 것은 통합된 예열기가 있는 초점이 맞는 IR 리플로우 시스템들 및 모든 다른 절차들에 대한 일반적인 최신으로 갱신된 사항들을 사용하는 BGAs에 대한 변경 사항 페이지들, 최신으로 갱신된 일반적인 정보 및 공통적인 절차들 섹션, 새로운 절차들로서 이전에 공개된 절차들이다. 색깔이 있는 삽화들이 많은 절차들에 포함된다. 300개 이상의 페이지들. 2017.01에 발간됨. 번역되었다
本規格は、以下の電子グレードはんだ合金の用語、要求事項および試験方法を規定している：電子はんだ付用途のやに入り/やになし棒はんだ、リボンはんだ、糸はんだ、粉末はんだ、および「特殊な」電子グレードはんだ。本書は品質管理規格であり、製造工程における材料の性能に直接的に関連付けることを意図するものではない。エレクトロニクス以外の用途に使用されるはんだは、ASTM B-32を使用して調達することが望ましい。 本規格は、エレクトロニクス業界内で使用されるはんだ付材料の要求事項と試験方法を規定する3つの共同業界基準のうちの1つである。ほかの2つの基準は以下のとおりである：IPC/EIA J-STD-004はんだ付用フラックスに関する要求事項、IPC/EIA J-STD-005ソルダペーストに関する要求事項。 このリビジョン「C」は、はんだ合金への意図的な添加...
Описание английско Стандарт IPC-7711/21B «Восстановление, модификация и ремонт электронных сборок» был полностью обновлен по каждой процедуре, чтобы обеспечить возможность их применения как для бессвинцовых, так и для традиционных оловянно-свинцовых электронных сборок. Это однотомное издание содержит все ранее опубликованные изменения и несколько новых процедур для компонентов BGA (включая...
This is the Swedish language translation of IPC-7711B/7721B IPC-7711B/7721B Rework, Modification and Repair of Electronic Assemblies has received a complete procedure by procedure update to assure applicability to both lead free and traditional SnPb soldered assemblies. This single volume includes all previously published changes and several new procedures for BGAs (including reballing) and flex...
Dieses Dokument unterstützt Richtlinien für das Design und die Herstellung von Druckschablonen für Lotpasten und Kleber für die Oberflächenmontage für THT- und THT/SMD-Technologie. Darin eingeschlossen sind die Unterschiede zwischen bleihaltigen und bleifreien Lotpasten, Überdruckung, Doppeldruck und Stufenschablonen Designs. Enthalten sind ebenfalls Beispiele für ein Bestellformular und die...
DESCRIERE engleză IPC-7711B/7721B Refacerea, Modificarea și Reparația Ansamblurilor Electronice a fost în mod total revizuit, procedură cu procedură, pentru a se asigura aplicabilitatea atât pentru ansamblurile lipite tradițional cu aliaje SnPb cât și pentru cele fără plumb. Acest unic volum include toate modificările anterior publicate și câteva proceduri noi pentru circuite BGA (inclusiv...
Niniejszy przewodnik dostarcza procedur dla wprowadzania poprawek, napraw i modyfikacji dla elektronicznych zespołów płyt drukowanych. W tej rewizji zawarte są procedury wcześniej opublikowane jako strony zmian, uaktualnione informacje ogólne i sekcja procedur wspólnych, nowe procedury dla BGA używające systemów rozpływu na skupioną podczerwień z integralnym podgrzewaniem oraz ogólnie uaktualnione...
Omschrijving in het Nederlands Deze handleiding bevat procedures voor rework, repair en modificatie van geassembleerde printplaten. Inbegrepen in deze revisie zijn de eerder uitgebrachte procedures met wijzigingspagina's, een bijgewerkte sectie van de algemene informatie en gemeenschappelijke procedures, nieuwe procedures voor BGA's met behulp van gerichte IR Reflow-systemen met geïntegreerde...
本标准的目的是为开发温度曲线提供有效和实用的信息，以生产可接受的锡铅和无铅的电子组件。该修订版将原来标准的重点从再流温度曲线扩展到包括激光焊曲线、选择焊曲线、波峰焊曲线或其他焊接曲线。该修订版还包括一个全彩色故障排除指南，用于解决可归因于分析的常见缺陷。
IPC-7711/7721 Elektronik Takımlarda Yeniden İşlem, Modifikasyon ve Onarım, kurşunsuz ve geleneksel Kalay-Kurşun ile lehimli takımların her ikisi için de uygulanabilirliği sağlamak için prosedür bazında eksiksiz bir güncellemesi geçerli olmuştur. Bu tek cilt daha önce yayınlanan tüm değişiklikleri, BGA'lar için (topların yenilenmesini de içeren) yeni birkaç prosedürü ve esnek-baskı devre kartı...
Stor opdatering af blyfri support og forbedrede inspektionsvejledninger for reparationer og modifikationer! Denne vejledning omfatter alt, der er nødvendigt for reparation og rework af elektronikprodukter og printkort! IPC-7711B/7721B „Rework, modifikation og reparation af elektronikprodukter“ har komplette procedurer, som er blevet opdaterede for at sikre, at de er anvendelige til både blyfri og...
Download an update to published IPC-7711B/7721B Part 3 Procedure 6.1.(English only) Základni aktualizace pro bezolovnatou technologii a zlepšené návody pro kontrolu oprav a modifikací Tento návod obsahuje vše, čeho je zapotřebí pro opravy a přepracování elektronických sestav a desek plošných spojů! IPC 7711/7721 Přepracování,modifikace a opravy elektronických sestav prošla kompletní aktualizaci...
IPC-7711B/7721B rilavorazione, modifica e riparazione di assemblaggi elettronici un completo aggiornamento procedura per procedura al fine di garantirne l'applicabilità su entrambe le modalità di brasatura con Pb e senza Pb. Questo volume singolo include tutte le modifiche precedentemente pubblicate e diverse nuove procedure inerenti i BGA (compresi reballing) e la riparazione dei circuiti...
LEIRÁS Angol nyelvű leírás Ezen útmutató eljárásokat tartalmaz az elektronikai szerelvények újramunkálására, javítására ás módosítására. Ezen revízióban a korábbi szabványváltozat eljárásai, az általános információs és közös eljárási részek is frissítésre kerültek. Új eljárásként a szabvány kiegészült a beépített előfűtővel rendelkező fókuszált infravörös BGA forrasztási eljárással és az összes...
This Addendum supplements or replaces specifically identified requirements of IPC J-STD-001, Revision F, for soldered electrical and electronic assemblies that must survive the vibration and thermal cyclic environments of getting to and operating in space.
When specifically required by procurement documentation, this Addendum supplements or replaces specifically identified requirements of IPC J-STD-001, Revision E of April 2010 by providing additional requirements to ensure the reliability of soldered electrical and electronic assemblies that must survive the vibration and thermal cyclic environments getting to and operating in space. The required...
The IPC J-STD-001GA/IPC-A-610GA automotive addendum to J-STD-001G and IPC-A-610G provides criteria to ensure the reliability of mission-critical soldered automotive electrical and electronic assemblies in the field under harsh environments and considers the conditions of automated high-volume production. The IPC J-STD-001GA/IPC-A-610GA addendum is not a standalone document. The addendum requires...
The IPC-A-610GC Telecom Addendum to IPC-A-610G Acceptability of Electronic Assemblies provides specific requirements for telecommunications products when it is specifically required by procurement documentation. Information in this document either supplements or replaces specifically identified requirements of IPC-A-610 Revision G by providing additional requirements to ensure that electrical and...
Acesta este un amendament la standardul IPC J-STD-001F, un standard industrial recunoscut și adoptat, acoperind cerințe de materiale și procese. Modificările includ, fără a se limita la acestea, o revizuire a cerințelor minime de umplere cu aliaj a găurilor metalizate, PTH, o schimbare a criteriilor pentru goluri la circuitele BGA cu bile fără turtire, reprezentări grafice noi pentru montarea...
The IPC-J-STD-001GS space addendum supplements or replaces specifically identified requirements of IPC J-STD-001G for soldered electrical and electronic assemblies that must survive the vibration and thermal cyclic environments of getting to and operating in space and military applications.
This Telecom Addendum to IPC-A-610F Acceptability of Electronic Assemblies provides specific requirements for telecommunications products when it is specifically required by procurement documentation. Information in this document either supplements or replaces specifically identified requirements of IPC-A-610 Revision F by providing additional requirements to ensure that electrical and electronic...
This space applications addendum was for the previous Revision D of J-STD-001, February 2005. J-STD-001DS can only be used with J-STD-001D and J-STD-001ES can only be used with J-STD-001E.
Telecom Addendum to IPC-A-610D Acceptability of Electronic Assemblies Telecom Addendum Published August 2009. When specifically required by procurement documentation, this Addendum supplements or replaces specifically identified requirements of IPC-A-610, Revision D of February 2005 by providing additional requirements to ensure compliance to GR-78-CORE.
Ergänzung 1 zu IPC-7711/21C-DE, das Dokument enthält Verfahren für das Entfernen und Montieren von D-Pak-Komponenten.
Enmienda 1 al IPC-7711/21C, el documento proporciona los procedimientos para la extracción y la instalación de componentes D-Pak.
IPC-7711/21C的修订本1，本文件提供D-Pak元器件的去除和安装程序.
Amendement 1 à IPC-7711 / 21C fournit des procédures supplémentaires de retrait et d'installation
Die Richtlinie IPC J-STD-001HS-DE Ergänzung für Raumfahrt-Anwendungen ergänzt oder ersetzt spezifisch identifizierte Anforderungen von IPC J-STD-001H-DE für gelötete elektrische und elektronische Baugruppen, die Schwingungen und die Umgebungsbedingungen thermischer Zyklen von Raumfahrt und militärischen Anwendungen überstehen müssen.
“IPC J-STD-001JS 宇宙・軍事用途向け追加規格”は、IPC J-STD-001Jの要求事項のうち特定の要件を補完する/置き換えるものであり、宇宙および軍事用途において、輸送時や運用時の振動/熱サイクル環境に耐えることが求められる電気・電子組立品を対象としている。
This is a three-page list of common terms and definitions use when discussing solder reflow processes and equipment.
IPC J-STD-001JA/IPC-A-610JAは、J-STD-001JおよびIPC-A-610Jの車載用途向け追加規格である。本書は、自動化された大量生産という条件を考慮しながら、過酷な環境下にある車載用電気・電子組立品について、そのはんだ付け信頼性を保証するための基準を提供するものである。 IPC J-STD-001JA/IPC-A-610JA(Addendum：追加規格)は独立した文書として使用するのではなく、J-STD-001JおよびIPC-A-610Jと併用する必要がある。
IPC J-STD-001JS 航太和軍事補充標準補充或取代了 IPC J-STD-001J 中針對焊接電氣和電子元件的特定要求，這些元件必須能在航太和軍事應用振動與熱迴圈環境下運行。
This is a seven-page list of electronics cleaning terms and definitions as they relate to printed circuit assembly cleaning.
This is a four-page list of common terms and definitions use when discussing screen printing processes and equipment.
This SMEMA standard is for fiducial marks. It was developed to facilitate the accurate placement of components on printed circuit boards.
001H-DE und IPC-A-610H-DE enthält Kriterien zur Sicherstellung der Zuverlässigkeit gelöteter elektrischer und elektronischer Automotive-Baugruppen im Feld unter rauen Umgebungsbedingungen und berücksichtigt die Bedingungen einer automatisierten Großserienproduktion. Die Ergänzung IPC J-STD-001HA-DE/IPC-A-610HA-DE ist kein eigenständiges Dokument. Diese Ergänzung fordert, dass sie in Verbindung mit...
Le présent Addendum IPC-J-STD-001HS relatif aux applications spatiales et militaires présente des exigences qui complètent ou remplacent des exigences spécifiques de la norme J-STD-001H, pour les assemblages électriques et électroniques brasés qui doivent résister aux vibrations et aux importantes variations thermiques subies dans des applications spatiales et militaires.
IPC J-STD-001HS 航天和军用附录，补充或替代 IPC J-STD-001H 对焊接电气和电子组件的具体要求，这些组件必须能够承受进入航天和军事应用并在其中运行的振动和热循环环境。
During mass soldering, it is important that all solder joints reach the minimum soldering (reflow) temperature to assure metallurgical bonding of the solder alloy and the base metals to be soldered. Metallurgical bonding requires that both surfaces to be soldered, as well as the solder, reach this minimum soldering temperature for a sufficient time to allow the wetting of the solder surfaces. This...
Implementing flip chip technology in a direct chip attach (DCA) assembly presents some unique challenges for design, assembly, inspection and repair personnel. IPC-7094 delivers useful and practical information to anyone who is currently using or contemplating developing products that employ the very complex and high density methods needed for the flip chip technology. The concepts have become...
Guidelines for accelerated reliability testing of surface mount solder attachments when evaluating and extrapolating the results of these tests towards actual use environments of electronic assemblies. 50 pages. Released November 1992. Included in the IPC-C-103 and the IPC-C-1000 Collections
The IPC-A-640, Acceptance Requirements for Optical Fiber, Optical Cable and Hybrid Wiring Harness Assemblies standard provides acceptance requirements and technical insight for cable and wire harness assemblies incorporating optical fiber, optical cable and hybrid wiring technology. The IPC-A-640 standard includes full-color illustrations and an Excel spreadsheet Verification and Compliance...
This full-color document provides design and critical process requirements and technical insight for cable and wire harness assemblies incorporating optical fiber, optical cable and hybrid wiring technology. This standard also includes an Excel spreadsheet Verification and Compliance checklist.
This document establishes the requirements and interactions necessary for printed board assembly processes for interconnecting high performance/high pin count IC packages. Includes information on design principles, material selection, board fabrication, assembly technology, testing strategy and reliability expectations based on end-use environments. Developed by IPC, EIA, MCNC and Sematech. 96...
J-STD-001 Revision E to Revision F Redline Comparison Document. This document is free to Task Group members participating in development of the standard and to Certification Centers with current training licenses for the associated Training and Certification program. CITs who are not members of the Task Group are encouraged to contact his or her MIT for a copy of the redline document.
This is a redline document showing the changes from IPC J-STD-001F with Amendment 1 to IPC J-STD-001G. This document provides a side-by-side comparison of the two documents and includes the figures and tables. The document shows the deleted/changed text in the IPC J-STD-001F with Amendment 1 pages and the new/revised text in purple highlights in the IPC J-STD-001G pages. Yellow pop-up boxes are...
This is a redline document showing the changes from IPC-A-610F with Amendment 1 to IPC-A-610G. This document provides a side-by-side comparison of the two documents and includes the figures and tables. The document shows the deleted/changed text in the IPC-A-610F with Amendment 1 pages and the new/revised text in purple highlights in the IPC-A-610G pages. Yellow pop-up boxes are also present in...
IPC-A-610 Revision E to Revision F Redline Comparison Document. This document is free to Task Group members participating in development of the standard and to Certification Centers with current training licenses for the associated Training and Certification program. CITs who are not members of the Task Group are encouraged to contact his or her MIT for a copy of the redline document.
Cleaning of stencils and misprinted PCBs has taken an increasingly important role in surface mount technology. Fine and ultra-fine pitch lands, together with other advanced packages, place new demands on stencil cleaning. Paste volume is a critical issue for fine, ultra-fine, chip-scale, BGA and flip-chip components. Insufficient solder due to clogging of stencil apertures is a primary cause of...
This standard describes the design and assembly challenges for implementing Bottom Termination surface mount Components (BTCs) whose external connections consist of metallized terminals that are an integral part of the component body. The BTCs in this document include all types and forms of bottom-only termination components intended for surface mounting. This includes such industry descriptive...
The IPC-7091 intends to provide useful and practical information to those who are designing, developing or using 3D-packaged semiconductor components or those who are considering 3D package implementation. The 3D semiconductor package may include multiple die elements—some homogeneous and some heterogeneous. The package may also include several discrete passive SMT devices, some of which are...
This document describes the design and assembly challenges for implementing passive and active components, in either formed or placed methodology, into a printed board. It provides useful and practical information to decision makers of formed or placed, passive or active components and helps establish inspection techniques, testing processes, and reliability validations. Users will also learn...
IPC J-STD-001JS 航天和军事补充标准补充或取代了 IPC J-STD-001J 中针对焊接电气和电子组件的特定要求，这些组件必须能在航天和军事应用振动与热循环环境下运行。
This file shows significant changes in J-STD-001 from Revision D to Revision E.
This file shows significant changes in IPC-A-610 from Revision D to Revision E.
Ce document essentiel pour l’industrie fournit des descriptions et des illustrations de la terminologie de l’industrie d’assemblage électronique afin d’aider les utilisateurs et leur clients à casser les barrières linguistiques. La révision M contient plus de 220 termes nouveaux ou révisés, incluant la nouvelle terminologie pour les procédés de tropicalisation, d’enrobage et d’encapsulation, la...
当采购文件特别要求对电子产品IPC-A-610G可接受性的IPC-A-610GC电信附录时，对电信产品提出了特定要求。本文档中的信息通过提供其他要求来确保电气和电子组件满足要求符合GE-78-CORE的客户的要求，从而补充或替代了IPC-A-610修订版G专门确定的要求
本文件是电子互连行业不可或缺的术语标准。该文件图文并茂，可帮助用户及其客户克服语言上的沟通障碍。M版本包含超过220多条新术语或修订术语，包括敷形涂覆、灌封和封装工艺、模板设计、统计工艺控制和挠性印制板技术。也包括通用行业缩写词。
This is a redline document showing the changes from IPC-7711/21B to IPC-7711/21C. This 790+ page document provides a side-by-side comparison of the two documents and includes the figures. The document shows the deleted/changed text in the IPC-7711/21B pages and the new/revised text in purple highlights in the IPC-7711/21C pages. Yellow pop-up boxes are also present in the IPC-7711/21C pages to...
IPC-A-610H ist die in der Elektronik-Branche weltweit am meisten verwendete Abnahme-Richtlinie für Elektronikbaugruppen. Die IPC-A-610H-Richtlinie beinhaltet eine allgemeine Aktualisierung des Dokuments, führt mehrere neue oberflächenmontierbare Bauteiltypen ein und entfernt die Kategorie „Anzustreben“ bei den Bewertungen. Teilnehmer aus 29 Ländern haben ihre Beiträge und ihr Fachwissen...
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IPC-9242: Guidelines for Microsection Evaluation
IPC-A-630A: Acceptability Standard for Manufacture, Inspection, and Testing of Electronic Enclosures
IPC-7527A: Requirements for Solder Paste Application
IPC-4204C: Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Boards
IPC-J-STD-002F: Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires
IPC-4101F: Specifications for Base Materials for Rigid and Multilayer Printed Boards
IPC-1755B: Responsible Sourcing of Minerals Data Exchange Standard
IPC-2223F: Sectional Design Standard for Flexible/Rigid-Flexible Printed Boards
IPC-HDBK-9798A: Handbook and Guide to Supplement IPC-9797
IPC-WP-011: Guidance for Strain Gage Limits for Assemblies
J-STD-048A: Notification Standard for Product Discontinuance
IPC-T-50P: Terms and Definitions for Interconnecting and Packaging Electronic Circuits
IPC-1401B: Corporate Social Responsibility Management System Standard
IPC -1751B: Generic Requirements for Declaration Process Management
IPC-6013F: Qualification and Performance Specification for Flexible/Rigid-Flexible Printed Boards
IPC-4413 - Am1: Specification for Finished Fabric Woven from Low Dk Glass for Printed Boards