<div class="field field--name-name field--type-string field--label-hidden field__item">Standards

Released: 02/20/2020

Language

English

IPC-1791A standard provides minimum requirements, policies and procedures for printed board design, fabrication and assembly organizations and/or companies to become trusted sources for markets requiring high levels of conﬁdence in the integrity of delivered products. Revision A of IPC-1791 standard includes the requirements added for CAGE Code, citizenship, security, foreign person access...

Document #:

IPC-7095

Revision

Product Type

Released: 01/28/2013

Language

English

Implementing ball grid array (BGA) and fine-pitch ball grid array (FBGA) technology presents some unique challenges for design, assembly, inspection and repair personnel. IPC-7095C delivers useful and practical information to anyone currently using BGAs or FBGAs. Many issues have become especially important due to the change in the alloys of the ball, the ball shape, and the attachment procedures...

Document #:

IPC-1782

Revision

Product Type

Released: 01/13/2021

Language

English

The IPC-1782A standard establishes minimum requirements for manufacturing and supply chain traceability based on perceived risk. IPC-1782A applies to all products, processes, assemblies, parts, components, equipment and other items used in the manufacture of printed board assemblies and in mechanical assembly.

Document #:

IPC-CC-830

Revision

Product Type

Released: 10/23/2008

Language

English

This is the industry standard for qualification and quality conformance of conformal coating. Its intent is to show how to obtain maximum information with minimum test redundancy. Includes requirements and evaluations of material properties using standardized test vehicles. Amendment 1 updates include new qualification, retention and conformance inspection requirements for FTIR, MIR and hydrolytic...

Document #:

IPC-9701

Revision

Product Type

Released: 02/01/2006

Language

English

Provides specific test methods to evaluate the performance and reliability of surface mount solder attachments of electronic assemblies. Establishes levels of performance and reliability of the solder attachments of surface mount devices to rigid, flexible and rigid-flex circuit structures. When used with IPC-SM-785, it provides an understanding of the physics of SMT solder joint failure and an...

Document #:

IPC-2141

Revision

Product Type

Released: 03/01/2004

Language

English

Controlled impedance is the maintenance of some specified tolerance in the characteristic impedance of an interconnect line (transmission line) that is used to connect different devices on a circuit. Controlled impedance is often a design consideration for high-speed digital or high-frequency analog circuits. This guide is intended to be used by circuit designers, packaging engineers, printed...

Document #:

IPC-J-STD-005

Revision

Product Type

Released: 02/14/2012

Language

English

This standard lists requirements for qualification and characterization of solder paste. It references test methods and criteria for metal content, viscosity, slump, solder ball, tack and wetting of solder pastes. Additional support is provided in IPC-HDBK-005, Guide to Solder Paste Assessment (not included with purchase of this standard). Supersedes J-STD-005.

Document #:

IPC-9201

Revision

Product Type

Released: 09/19/2007

Language

English

Surface Insulation Resistance (SIR) testing is a tool used not only for characterization testing of production processes such as solder masks, soldering flux, and conformal coatings, but also for examining the electrochemical reactions at each stage of the electronic assembly production process. This handbook covers the terminology, theories, test procedures and test vehicles of SIR testing...

Document #:

IPC-J-STD-004

Revision

Product Type

Released: 02/28/2012

Language

English

This standard prescribes general requirements for the classification and characterization of fluxes for high quality solder interconnections. This standard may be used for quality control and procurement purposes. The purpose of this standard is to classify and characterize tin/lead and lead-free soldering flux materials for use in electronic metallurgical interconnections for printed circuit...

Document #:

IPC-QL-653

Revision

Product Type

Released: 11/01/1997

Language

English

This specification establishes the certification requirements for facilities that inspect/test printed boards, components and materials. This specification is intended to provide a minimum standardized basis for evaluating or auditing a technically oriented inspection/testing facility. Revised November 1997. 15 pages.

Document #:

IPC-DR-572

Revision

Product Type

Released: 03/01/2007

Language

English

This document provides guidelines for generating good quality holes in printed circuit boards (PCBs) made from a wide variety of materials. It addresses the following topics: Drill Bits, Tooling, Drilling Stacked Materials, Drilling Machines, Drilling Operation, Drilled Hole Quality and Trouble Shooting. 12 pages. Released March 2007.

Document #:

IPC-J-STD-030

Revision

Product Type

Released: 03/24/2014

Language

English

This document provides users of underfill material with guidance in selecting and evaluating underfill material for assembly solder joints second-level interconnects. Underfill material is used to increase reliability of electronic devices by two methods: alleviate coefficient of thermal expansion (CTE) mismatch (between the electronic package and the assembly substrate) and/or increase mechanical...

Document #:

IPC-9850

Revision

Product Type

Released: 12/21/2011

Language

English

This standard establishes the parameters, procedures and methodologies used to measure and report pick and place machine accuracy as a relationship to placement speed for a range of SMT component sizes and configurations. Purchase of this standard includes support documentation, report forms and the test material drawings in DWG format.

Document #:

IPC-7530

Revision

Product Type

Released: 04/28/2017

Language

English

This standard provides useful and practical information for developing thermal profiles to produce acceptable SnPb and Pb-free electronics assemblies. This revision expands the focus of the original standard from reflow profiling to include profiling for vapor phase, laser, selective soldering and wave soldering. The revision also includes a full-color troubleshooting guide for addressing common...

Document #:

IPC-6012

Revision

Product Type

Released: 04/13/2010

Language

English

Dual-language (Spanish/English) DVD -- Introduces industry specifications J-STD-001 & IPC-A-610 and explains the concept of process indicators. Includes an animated examination of the invisible problems that can be created during rework to explain why it's so important to avoid unnecessary rework. Reviews each of the tools and materials for plated-through hole (PTH) rework (including low-residue...

Document #:

IPC-7525

Revision

Product Type

Released: 10/24/2011

Language

English

This document provides guidelines for the design and fabrication of stencils for solder paste and surface mount adhesive with discussion on through-hole and mixed technology. This includes differences for tin lead and lead-free solder paste, overprint, two-print and step stencil designs. A sample order form and user inspection checklist are also included.

Document #:

IPC-7095

Revision

Product Type

Released: 04/02/2008

Language

English

Implementing Ball Grid Array (BGA) and Fine-Pitch Ball Grid Array (FBGA) technology presents some unique challenges for design, assembly, inspection and repair personnel. IPC-7095B delivers useful and practical information to anyone currently using BGAs or considering a conversion to area array packaging formats. This has become especially important due to the change in the alloys being used, both...

Document #:

IPC/JEDEC-J-STD-033

Revision

Product Type

Released: 08/01/2014

Language

English

Provides surface mount device manufacturers and users with standardized methods for handling, packing, shipping and use of moisture/reflow sensitive components. These methods help avoid damage from moisture absorption and exposure to solder reflow temperatures that can result in yield and reliability degradation and damaged components. These procedures provide a minimum shelf life of 12 months...

Document #:

IPC-J-STD-006

Revision

Product Type

Released: 05/01/2001

Language

English

Document #:

IPC-D-620

Revision

Product Type

Language

English

The IPC-D-620A standard provides design and critical process requirements for cable and wire harness assemblies as well as military/space applications. IPC-D-620A is the design requirements companion to IPC/WHMA-A-620, "Requirements and Acceptance for Cable and Wire Harness Assemblies," and its associated Space Addendum. Three white papers are included to provide guidance on key topics discussed...

Document #:

IPC-J-STD-003

Revision

Product Type

Released: 09/30/2014

Language

English

J-STD-003C prescribes test methods, defect definitions and illustrations for assessing the solderability of printed board surface conductors, attachment lands, and plated-through holes utilizing either tin-lead or lead-free solders. This standard is intended for use by both vendor and user. The objective of the solderability test methods described in this standard is to determine the ability of...

Document #:

IPC-J-STD-004

Revision

Product Type

Released: 01/01/2004

Language

English

DoD Adopted 1995 Revision A covers requirements for qualification and classification of rosin, resin, organic and inorganic fluxes according to the activity level and halide content of the fluxes. It includes solder fluxes, flux-containing materials and low residue fluxes for no-clean processes. Associated test methods may have been updated and are available online for free download. Supersedes QQ...

Document #:

IPC-J-STD-003

Revision

Product Type

Released: 03/01/2007

Language

English

This standard prescribes test methods, defect definitions and illustrations for assessing the solderability of printed board surface conductors, attachment lands, and plated-through holes utilizing either tin/lead or lead-free solders. This standard is intended for use by both vendor and user. The objective of the solderability test methods described in this standard is to determine the ability of...

Document #:

IPC-T-50

Revision

Product Type

Released: 02/03/2015

Language

German

Current Revision

Das unentbehrliche Nachschlagewerk für alle Verantwortlichen entlang der Wertschöpfungskette von elektronischen Produkten. Die Revision K enthält auf mehr als 120 Seiten, mehr als 220 neue und überarbeitete Begriffe und bildliche Darstellungen. Beispiele: Access Hole, Accelerated Equivalent Soak, Capture Land, Micro Via Technology, Plating Thief, Etchback, Resin Recession, Tape Automated Bonding...

Document #:

IPC-J-STD-003

Revision

Product Type

Released: 04/01/2014

Released: 01/31/2026

Language

English

J-STD-003C prescribes test methods, defect definitions and illustrations for assessing the solderability of printed board surface conductors, attachment lands and plated-through holes utilizing either tin-lead or lead-free solders. This standard is intended for use by both vendor and user. The objective of the solderability test methods described in this standard is to determine the ability of...

Document #:

IPC-7095

Revision

Product Type

Released: 10/01/2004

Language

English

Implementing Ball Grid Array (BGA) and Fine-Pitch Ball Grid Array (FBGA) technology presents some unique challenges for design, assembly, inspection and repair personnel. Revision A of this document delivers useful and practical information to anyone who is currently using BGAs or is considering a conversion to area array packaging formats. In addition to providing guidelines for BGA inspection...

Document #:

IPC-7711/21

Revision

Product Type

Released: 11/30/2007

Language

English

This guide includes everything needed for repair and rework of electronic assemblies and printed circuit boards. IPC-7711B/7721B Rework, Modification and Repair of Electronic Assemblies has received a complete procedure by procedure update to assure applicability to both lead free and traditional SnPb soldered assemblies. This single volume includes all previously published changes and several new...

Document #:

IPC-6018

Revision

Product Type

Released: 08/09/2016

Language

English

This specification covers qualification and performance of high frequency (microwave) boards, including single-sided, double-sided, with or without plated-through holes, multilayer with or without blind/buried vias and metal core boards. It addresses final finish and surface plating coating requirements, conductors, holes/vias, frequency of acceptance testing and quality conformance as well as...

Document #:

IPC-7351

Revision

Product Type

Released: 02/01/2007

Language

English

NEW! IPC-7351A includes both the standard and an IPC-7351A land pattern calculator on CD-ROM for accessing component and land pattern dimensional data.The calculator includes the document’s mathematical algorithms so users can build a land pattern for a corresponding surface mount part quickly and accurately.The tool also allows for modification of dimensional attributes of IPC-approved land...

Document #:

IPC-4204

Revision

Product Type

Released: 02/22/2014

Language

English

This standard establishes the classification system, the qualification and quality performance requirements for flexible metal-clad dielectric materials to be used for the fabrication of flexible printed circuitry and flexible flat cable. It encompasses 12 specification sheets that result from the combinations of various copper foil claddings; a polymer base dielectric selected from at least two...

Document #:

IPC-4412

Revision

Product Type

Released: 06/17/2013

Language

English

IPC-4412B exhaustively covers the classification and requirements for finished fabrics that are formed by plain woven glass fiber yarns. Simply, these yarns are appropriately sized bundles of continuous filament, electrical-grade ("E" glass) borosilicate glass. Bulk "E" glass, for ease of description, is composed of a blend of raw metal oxides that form a borosilicate glass upon melting. Once...

Document #:

IPC-6013

Revision

Product Type

Released: 12/18/2013

Language

English

Covers qualification and performance requirements for flexible printed boards designed to IPC-2221 and IPC-2223. The flexible printed board may be single-sided, double-sided, multilayer or rigid-flex multilayer. All of these constructions may include stiffeners, PTHs, microvias, and blind/buried vias. Revision C incorporates new and updated requirements for final finishes, surface and hole plating...

Document #:

IPC-4202

Revision

Product Type

Released: 04/13/2010

Language

English

This document provides comprehensive data to help users more easily determine both material capability and compatibility for flexible base dielectric materials for manufacture of flexible printed circuitry and flexible flat cables. It includes flexible base material specification sheets that have been updated with the newest properties for the specification material types. It establishes the most...

Document #:

IPC-2581

Revision

Product Type

Released: 09/01/2013

Language

English

This standard specifies the XML schema that represents the intelligent data file format used to describe printed board and printed board assembly products with details sufficient for tooling, manufacturing, assembly, and inspection requirements. This format may be used for transmitting information between a printed board designer and a manufacturing or assembly facility. The data is most useful...

Document #:

IPC-4103

Revision

Product Type

Released: 03/25/2014

Language

English

This specification covers the requirements for clad and unclad plastic laminate and bonding layer materials to be used for the fabrication of printed boards for microstrip, stripline, and high speed digital electrical and electronic circuits. In addition to updated testing parameters, inspection lot requirements, revised visual acceptance criteria, this revision incorporates a new specification...

Document #:

IPC-4101

Revision

Product Type

Released: 08/26/2009

Language

English

This specification covers the requirements for base materials that are referred to as laminate or prepreg. These are to be used primarily for rigid and multilayer printed boards for electrical and electronic circuits. This document contains 66 individual specification sheets that can be searched using key words. These key words allow the document's user to find materials of a similar nature, but...

Document #:

IPC-1602

Revision

Product Type

Redline Standard

Released: 04/23/2025

Language

English

Current Revision

IPC-1602A Redline document shows the changes from IPC-1602 to IPC-1602A in a side-by-side comparison of the two documents. This is only available in digital format.

Document #:

IPC-2221

Revision

Product Type

Released: 05/01/2003

Language

English

UPDATED!IPC-2221A is the foundation design standard for all documents in the IPC-2220 series. It establishes the generic requirements for the design of printed boards and other forms of component mounting or interconnecting structures, whether single-sided, double-sided or multilayer. Among the many updates to Revision A are new criteria for surface plating, internal and external foil thicknesses...

Document #:

IPC-4203

Revision

Product Type

Released: 01/25/2013

Language

English

This standard establishes the classification system, the qualification and quality conformance requirements for dielectric films coated with an adhesive on one or both sides. These materials are to be used as cover material for flexible printed circuitry as well as supported or unsupported adhesive films to be used in the fabrication of flexible printed circuitry. The standard does not address...

Document #:

IPC-4202

Revision

Product Type

Released: 04/20/2017

Language

English

This document provides comprehensive data to help users more easily determine both material capability and compatibility for flexible base dielectric materials for manufacture of flexible printed boards. It includes flexible base material specification sheets that have been updated with the newest properties for the specification material types. It establishes the most current classification...

Document #:

IPC-1752

Revision

Product Type

Released: 03/14/2014

Language

English

IPC-1752A establishes a standard reporting format for material declaration data exchange between supply chain participants and supports reporting of bulk materials, components, printed boards, sub-assemblies, and products. This standard is not supported directly by a PDF form. Third party software developers are invited to supply the implementation tool, and one organization has already made a...

Document #:

Revision

Product Type

Released: 11/25/2025

Language

Chinese (Zhōngwén)

Current Revision

關於印製板可接受性的權威圖解指南！本四色檔提供了裸印製板內部或外部可觀察到的目標、可接受和不符合條件的照片和示意圖。確保您的操作人員、檢驗員和工程師掌握最新的行業共識資訊。版本M新增或修訂了數十張照片和示意圖，新增和擴展了有關印製板邊緣電鍍、印製板階梯槽、邊緣毛刺、退潤濕、導體厚度、環寬（重合度）、內部銅滲透和鍍層空洞等主題的內容。本檔與 IPC-6012F 和 IPC-6013E 中表述的可接受性要求同步。取代 IPC-A-600K。

Document #:

IPC/JEDEC-J-STD-609

Revision

Product Type

Released: 06/01/2012

Language

English

This is a list of reported errata to the printed copies of IPC/JEDEC J-STD-609A. Pen and ink changes should be made in accordance with your company's document control policies.

Document #:

Revision

Product Type

Released: 01/08/2026

Language

Spanish

Current Revision

La norma IPC-A-610J es la norma de aceptación de ensambles electrónicos más utilizada en la industria electrónica. Participantes de 31 países aportaron su experiencia al desarrollo de este documento para la industria electrónica. Esta publicación es esencial para inspectores, operadores y cualquier persona interesada en los criterios de aceptación de ensambles electrónicos. La norma IPC-A-610 se...

Document #:

Revision

Product Type

Released: 05/13/2021

Language

Spanish

Current Revision

IPC-J-STD-001H es reconocido mundialmente por sus criterios sobre procesos y materiales de soldadura. Actualizado con participantes de 27 países que proporcionan información y experiencia, la norma IPC-J-STD-001H trae los últimos criterios a la industria, incluyendo pautas sobre el uso de rayos X para inspeccionar condiciones de soldadura en orificios con soporte que no son visibles bajo ningún...

Document #:

Revision

Product Type

Released: 08/11/2021

Language

Spanish

Current Revision

IPC-A-610H es la norma de aceptación de ensambles electrónicos más utilizada en la industria electrónica. La norma IPC-A-610H incluye una actualización general del documento, introduce varios nuevos tipos de componentes de montaje en superficie y elimina las condiciones ideales. Participantes de 29 países proporcionaron su apoyo y conocimientos especializados para traer este documento a la...

Document #:

Revision

Product Type

Released: 01/05/2026

Language

French

Current Revision

La norme IPC-A-610J est la norme d'acceptation des assemblages électroniques la plus largement utilisée dans l'industrie électronique. Des participants de 31 pays ont apporté leur contribution et leur expertise à l'élaboration de ce document destiné à l'industrie électronique. Cet ouvrage est indispensable aux inspecteurs, aux opérateurs et à toute personne intéressée par les critères d...

Document #:

Revision

Product Type

Released: 12/17/2024

Language

Japanese

Current Revision

IPC-A-610Jは、エレクトロニクス業界で最も広く使用されている電子組立品の許容基準である。本書をエレクトロニクス業界に提供するにあたり、今回は31もの国々から参加者が集い、情報や専門知識が示された。本書は検査担当者やオペレータはもとより、電子組立品の許容基準に関心のあるの人々にとって必携の書といえる。IPC-A-610は、J-STD-001およびIPC/WHMA-A-620と共に作成されたものである。

Document #:

IPC-4413

Revision

Original Version

Product Type

Released: 01/29/2026

Language

English

Current Revision

IPC-4105 is a new document that covers the requirements for metal-base materials that are referred to as metal-based laminate listed in the specification sheets that are contained in the last of the main body. These are to be used primarily for rigid and multilayer printed boards for electronic interconnections.

Document #:

Revision

Product Type

Released: 07/27/2021

Language

Danish

Current Revision

IPC-A-610H er den mest udbredte godkendelsesstandard for elektronikprodukter i elektronikindustrien. IPC-A-610H standarden inkluderer en generel opdatering af dokumentet, introducere flere nye overflademonterede komponenttyper og fjerner ”Ønskelig” tilstand. Deltagere fra 29 lande leverede deres input og ekspertise til at bringe dette dokument til elektronikindustrien. Dette er en ”skal have”...

Document #:

Addendum with amendment(s)

Revision

Product Type

Released: 03/16/2020

Language

English

The IPC J-STD-001GS AM 1 amendment to the IPC J-STD-001GS space addendum supplements or replaces specifically identified requirements of IPC J-STD-001G for the cleaning requirements for soldered electrical and electronic assemblies that must survive the vibration and thermal cyclic environments of getting to and operating in space and military applications.

Document #:

Revision

Product Type

Released: 05/22/2025

Language

Thai

Current Revision

IPC-A-610J เป็นมาตรฐานการยอมรับการประกอบชิ้นส่วนอิเล็กทรอนิกส์ที่ใช้กันอย่างแพร่หลายที่สุดในอุตสาหกรรมอิเล็กทรอนิกส์ ผู้เข้าร่วมจาก 31 ประเทศได้ให้ข้อมูลและความเชี่ยวชาญเพื่อนำเอกสารนี้ไปใช้ในอุตสาหกรรมอิเล็กทรอนิกส์ เอกสารนี้ถือเป็นเอกสารที่ต้องมีสำหรับผู้ตรวจสอบ ผู้ปฏิบัติงาน และบุคคลอื่น ๆ ที่สนใจเกณฑ์การยอมรับสำหรับงานประกอบชิ้นส่วนอิเล็กทรอนิกส์ IPC-A-610 ได้รับการพัฒนาโดยทำงานร่วมกับ J-STD...

Document #:

Revision

Product Type

Released: 03/08/2021

Language

German

Current Revision

IPC-J-STD-001H-DE ist weltweit anerkannt für seine Kriterien zu Lötprozessen und -materialien. Die Richtlinie IPC-J-STD-001H-DE wurde unter Mitwirkung von Teilnehmern aus 27 Ländern aktualisiert, die ihre Beiträge und ihr Fachwissen zur Verfügung gestellt haben. Sie enthält die neuesten Kriterien für die Branche, einschließlich einer Anleitung für die Verwendung von Röntgensystemen zur Inspektion...

Document #:

Revision

Product Type

Released: 04/02/2025

Language

German

Current Revision

IPC-A-610J ist die in der Elektronik-Branche weltweit am meisten verwendete Abnahme-Richtlinie für Elektronikbaugruppen. Teilnehmer aus 31 Ländern haben ihre Beiträge und ihr Fachwissen eingebracht, um dieses Dokument der Elektronik-Branche zur Verfügung zu stellen. Es ist ein absolutes Muss für Prüfer, Montagemitarbeiter und Andere, die ein Interesse an Abnahmekriterien für elektronische...

Document #:

Revision

Product Type

Released: 10/25/2024

Language

Chinese

Current Revision

IPC-A-610J 是电子行业应用最广泛的电子组件验收标准。来自31个国家的参与者提供了他们的意见和专业知识，为电子行业带来了这份文件。这是检查人员、操作人员和其他对电子组件验收标准感兴趣的人员的必备工具。IPC-A-610 是与 J-STD-001 和 IPC/WHMA-A-620 协同开发的。

Document #:

Revision

Product Type

Released: 01/08/2026

Language

Spanish

Current Revision

La norma J-STD-001J es reconocida mundialmente por sus criterios relacionados con los procesos y materiales de soldadura. Se ha actualizado gracias a las contribuciones y la experiencia de participantes de 27 países. La norma J-STD-001J es esencial para todos los profesionales de la industria electrónica interesados en los criterios de proceso y aceptación para ensambles eléctricos y electrónicos...

Document #:

IPC-4554

Revision

Original Version

Product Type

Released: 09/01/2013

Language

English

Current Revision

IPC-4554, "Specification for Immersion Tin Plating for Printed Circuit Boards," is the third document in a series of specifications [the first two are: IPC-4552 which addresses electroless nickel/immersion gold (ENIG) and IPC-4553 which addresses immersion silver (IAg)] that set the requirements for printed circuit board surface finishes that are alternates to eutectic tin-lead. IPC-4554, a full...

Document #:

Revision

Product Type

Released: 01/05/2026

Language

French

Current Revision

La norme J-STD-001J est reconnue mondialement pour ses critères relatifs aux procédés et matériaux de soudage. Elle a été mise à jour grâce aux contributions et à l'expertise de participants issus de 27 pays. La norme J-STD-001J est indispensable pour tous les professionnels de l'industrie électronique intéressés par les critères de processus et d'acceptation des assemblages électriques et...

Document #:

IPC-4821

Revision

Original Version

Product Type

Released: 05/01/2006

Language

English

Current Revision

IPC-4821 Amendment 1 provides the update of IPC-CF-148 to the correct IPC-4563, references the IPC-TM-650, Method 2.5.7.2 for correct Hi-Pot testing of these thin materials, uses proper reference for visual inspection by inspectors and finally, updated the first five material specification sheets (IPC-4821/1 through IPC-4821/5) that now show Effective Dates of April 2010. The Specification Sheet...

Document #:

IPC-1754

Revision

Original Version

Product Type

Released: 06/23/2020

Language

English

Current Revision

IPC-1754-Am2, establishes the requirements for the exchanging material and substance data for Products between suppliers and their customers and has been developed through the participation of aerospace, defense, automotive, electronics and solution provider representatives.

Document #:

Revision

Product Type

Released: 05/04/2022

Language

Danish

Current Revision

IPC-J-STD-001H anerkendes globalt for sine kriterier for loddeprocesser og materialer. Opdateret med input og ekspertise leveret af deltagere fra 27 lande, IPC-J-STD-001H standarden indeholder de nyeste kriterier til industrien, inklusiv vejledning om anvendelse af røntgen til inspektion af hulmonterede lodninger, som ikke er synlige på anden måde.IPC-J-STD-001H er et must for folk i...

Document #:

Revision

Product Type

Released: 04/12/2022

Language

Czech

Current Revision

IPC-A-610H je nejpoužívanější standard pro provádění přejímek elektronických sestav. Standard IPC-A-610H obsahuje obecnou aktualizaci dokumentu, představuje několik nových typů komponent pro povrchovou montáž, a odstraňuje cílové podmínky. Účastníci z 29 zemí poskytli své příspěvky a odborné znalosti, aby tento dokument přinesli elektronickému průmyslu.

Jde o nepostradatelnou příručku pro...

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Revision

Product Type

Released: 12/17/2024

Language

Chinese (Zhōngwén)

Current Revision

IPC-A-610J 是電子行業應用最廣泛的電子元件驗收標準。來自31個國家的參與者提供了他們的意見和專業知識，為電子行業帶來了這份文件。這是檢查人員、操作人員和其他對電子元件驗收標準感興趣的人員的必備工具。IPC-A-610 是與 J-STD-001 和 IPC/WHMA-A-620 協同開發的

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Revision

Product Type

Released: 09/30/2025

Language

Korean

Current Revision

J-STD-001J는 솔더링 공정과 재료에 대한 기준으로 세계적인 인정을 받는다. 정보와 전문지식을 제공하는 27개국의 참여자가 갱신 작업을 진행했다. J-STD-001J는 전기 및 전자 조립품 공정과 허용기준에 관심 있는 전자 산업 종사자가 반드시 소지해야 하는 것이다. J-STD-001은 IPC-A-610과 호환하도록 개발되었으며 요구조건에 대한 추가 정보와 설명을 원하는 사람은 IPC-HDBK-001을 확인할 수 있다. J-STD-001J를 구입한다면 IPC-A-610J도 구입하는 것이 바람직하다. 이 두 표준서를 함께 사용하면 전기 및 전자 조립품 제조 공정과 육안 검사 허용기준을 확인할 수 있다.

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IPC/JEDEC-9707

Revision

Original Version

Product Type

Released: 05/01/2018

Language

English

Current Revision

IPC/JEDEC-9707-AM1 is an amendment which clarifies that the standard is only applicable to transient bending during short-term test operations. The standard specifies a common method of establishing strain limits of board-level device interconnects under spherical transient bending conditions, the worst-case flexure condition that can occur during conventional printed board/system assembly...

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Revision

Product Type

Released: 04/21/2021

Language

Chinese

Current Revision

IPC-A-610H是电子行业广泛采用的电子组件验收标准。IPC-A-610H标准中包含了本文件的一般更新内容，介绍了一些新型表面贴装元器件，同时删除了目标条件。本文件在电子行业成功问世离不开来自29个国家/地区的参与者，这些参与者在本文件编制期间投入了大量的精力并贡献了宝贵的专业知识。该标准是检查人员、操作人员及其他与电子组件验收要求相关的人员必须掌握的技术标准。与IPC-A-610一起制定的标准还有J-STD-001和IPC/WHMA-A-620。

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Revision

Product Type

Released: 04/12/2019

Language

Polish

Current Revision

Pełne, ilustrowane wydanie przewodnika dla kryteriów dopuszczenia płyt drukowanych. Niniejszy czterokolorowy dokument dostarcza fotografii i ilustracji stanów docelowych, dopuszczalnych i niezgodnych, które są dostrzegalne wewnętrznie lub zewnętrznie na gołych płytkach drukowanych. Upewnij się, że Twoi operatorzy, inspektorzy i inżynierowie posiadają najnowsze informacje uzgodnione w przemyśle...

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Revision

Product Type

Released: 04/29/2025

Language

Vietnamese

Current Revision

IPC-A-610J là tiêu chuẩn chấp nhận các cụm lắp ráp điện tử được sử dụng rộng rãi nhất trong ngành công nghiệp điện tử. Những đơn vị tham gia từ 31 quốc gia đã cung cấp thông tin đầu vào cùng chuyên môn của họ để đưa tài liệu này đến với ngành công nghiệp điện tử. Đây là tài liệu bắt buộc phải có đối với những người kiểm hàng, người thao tác và những người khác quan tâm đến tiêu chuẩn chấp nhận đối...

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Revision

Product Type

Released: 04/29/2025

Language

Thai

Current Revision

J-STD-001J ได้รับการยอมรับทั่วโลกในด้านเกณฑ์สำหรับกระบวนการบัดกรีและวัสดุ มีผู้เข้าร่วมจาก 27 ประเทศที่ให้ข้อมูลและความเชี่ยวชาญ J-STD-001J เป็นสิ่งที่ต้องมีสำหรับผู้ที่อยู่ในอุตสาหกรรมอิเล็กทรอนิกส์ที่สนใจในกระบวนการและเกณฑ์การยอมรับสำหรับการประกอบชิ้นส่วนไฟฟ้าและอิเล็กทรอนิกส์ J-STD-001 ได้รับการพัฒนาควบคู่ไปกับ IPC-A-610 และได้รับการสนับสนุนโดย IPC-HDBK-001...

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Revision

Product Type

Released: 04/10/2025

Language

Vietnamese

Current Revision

J-STD-001J được công nhận trên toàn cầu về các tiêu chuẩn liên quan đến vật liệu và quy trình hàn . Được cập nhật với sự tham gia của các thành viên từ 27 quốc gia cung cấp thông tin đầu vào và chuyên môn. J-STD-001J là tài liệu bắt buộc dành cho những người trong ngành điện tử quan tâm đến quy trình và tiêu chuẩn chấp nhận đối với các cụm lắp ráp điện và điện tử. J-STD-001 được phát triển kết hợp...

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Revision

Product Type

Released: 01/27/2025

Language

Chinese (Zhōngwén)

Current Revision

J-STD-001J 是全球公認的焊接工藝和材料標準。根據來自27個國家的參與者提供的意見和專業知識進行更新。 J-STD-001J 是電子行業中對電氣和電子元件的工藝和驗收標準感興趣的人員的必備工具。J-STD-001 是與 IPC-A-610 協同開發的，並得到 IPC-HDBK-001 的支援，供那些需要更多資訊和要求解釋的人使用。如果您購買了 J-STD-001J，還應該購買和使用 IPC-A-610J，因為它們可以一起使用，為電氣和電子元件的製造提供工藝和外觀驗收標準。

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Revision

Product Type

Released: 01/10/2025

Language

Chinese

Current Revision

J-STD-001J 是全球公认的焊接工艺和材料标准。根据来自27个国家的参与者提供的意见和专业知识进行更新。 J-STD-001J 是电子行业中对电气和电子组件的工艺和验收标准感兴趣的人员的必备工具。J-STD-001 是与 IPC-A-610 协同开发的，并得到 IPC-HDBK-001 的支持，供那些需要更多信息和要求解释的人使用。如果您购买了 J-STD-001J，还应该购买和使用 IPC-A-610J，因为它们可以一起使用，为电气和电子组件的制造提供工艺和外观验收标准。

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Revision

Product Type

Released: 12/17/2024

Language

Japanese

Current Revision

J-STD-001Jは、電気および電子組立品の工程と受入基準に関心のあるエレクトロニクス業界関係者にとって必携の書である。 J-STD-001はIPC-A-610と共に開発されたものであり、要求事項に関する追加情報や説明についてはIPC-HDBK-001で補足されている。IPC-A-610Jでは電気および電子組立品の工程と外観の合格基準が提供されているため、J-STD-001Jを購入する際にはIPC-A-610Jも併せて購入することをお勧めする。

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Revision

Product Type

Released: 05/04/2022

Language

Dutch

Current Revision

IPC-A-610 is het meest gebruikte acceptatiedocument voor elektronica-assemblage. Bijgewerkt met deelnemers uit 17 landen die input en expertise leveren, brengt dit document de nieuwste criteria samen met veel nieuwe en herziene grafische afbeeldingen uit de industrie. Dit is een must-have voor inspecteurs, operators en anderen die geïnteresseerd zijn in de acceptatiecriteria voor elektronische...

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Revision

Product Type

Released: 05/31/2022

Language

Turkish

Current Revision

IPC-J-STD-001H, lehimleme prosesleri ve malzemeleri konusundaki kriterleri ile dünya çapında tanınmaktadır. 27 ülkeden girdi ve uzmanlık sağlayan katılımcılarla güncellenen IPC-J-STD-001H standardı, başka hiçbir şekilde görülemeyen delik-içi lehim koşullarının denetlenmesi için x-ışını kullanımına ilişkin rehberlik te dahil olmak üzere sektöre en son kriterleri getirmektedir. IPC-J-STD-001H...

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Revision

Product Type

Released: 01/10/2022

Language

Vietnamese

Current Revision

IPC-J-STD-001H Được công nhận trên toàn cầu về tiêu chuẩn cho các quy trình hàn và các nguyên vật liệu. Được cập nhật với những người tham gia từ 27 quốc gia cung cấp đầu vào và ý kiến chuyên môn, tiêu chuẩn IPC-J-STD-001H mang đến các tiêu chuẩn mới nhất cho ngành công nghiệp cùng với hướng dẫn sử dụng tia X để kiểm tra các tình trạng mối hàn xuyên lỗ mà không thể kiểm tra được bằng các phương...

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Revision

Product Type

Released: 01/10/2022

Language

Korean

Current Revision

IPC-A-610H는 전자 산업에서 가장 널리 사용되는 전자 어셈블리 허용 표준이다. IPC-A-610H 표준은 문서에 대한 일반 업데이트를 포함하며, 몇 가지 새로운 표면 실장 소자 유형을 도입하고 대상 조건을 제거한다. 29개국에서 온 참가자들은 이 문서를 전자 산업에 가져오기 위해 그들의 조언과 전문지식을 제공했다. 이는 전자 어셈블리의 허용 기준에 관심이 있는 검사자, 작업자 및 기타 사용자에게 반드시 필요한 사항이다. IPC-A-610은 J-STD-001 및 IPC/WHMA-A-620과 함께 개발되었다.

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Revision

Product Type

Released: 04/12/2022

Language

Hungarian

Current Revision

Az IPC-A-610 a világon legszélesebb körben használt elektronikai szerelvényekkel foglalkozó szabvány. Az IPC-A-610H szabvány jó néhány dokumentum általános frissítését tartalmazza, számos új felületszerelt alkatrésztípus követelményeivel kiegészült és megszüntetésre került a cél állapot kritérium. A szabvány 29 országból beérkező újabb észrevételek, szakvélemények alapján biztosítja az...

Document #:

Revision

Product Type

Released: 03/12/2021

Language

Chinese

Current Revision

IPC-J-STD-001H是全球公认的焊接工艺和材料标准。此次更新由27个国家/地区参与者参与编制，这些参与者在本文件更新期间投入了大量的精力并贡献了宝贵的专业知识。IPC-J-STD-001H标准是业内最新标准，包含了有关使用X射线方法检查其他方法难以检测的通孔焊料状况的指导信息。 IPC-J-STD-001H是关注电子行业电气和电子组件工艺和验收标准的人员必须掌握的技术标准。 J-STD-001是与IPC-A-610一起制定的标准，由IPC-HDBK-001提供支持，其中包含了一些额外信息和要求释义。如果您已购买了IPC-J-STD-001H，您还需要购买并使用IPC-A-610H，二种标准需要配合使用。

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Revision

Product Type

Released: 10/13/2010

Language

Swedish

Current Revision

NOUVEAU! Cette version prend en compte les exigences et les critères d’acceptabilité liés à l’utilisation d’alliages sans plomb. La révision A du standard industriel consensuel dénomé Critères d’Acceptation pour l’Assemblage de Câbles et de Faisceaux de câbles est désormais disponible. IPC et l’association Wire Harness Manufacturers Association (WHMA), ont collaboré pour développer de manière...

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Revision

Product Type

Released: 09/16/2021

Language

Vietnamese

Current Revision

IPC-A-610 là tiêu chuẩn chấp nhận sản phẩm lắp ráp điện tử được sử dụng rộng rãi nhất trong ngành công nghiệp điện tử. Tiêu chuẩn IPC-A-610H bao gồm một cập nhận tổng quát, giới thiệu một số loại linh kiện SMT mới và loại bổ tình trạng mục tiêu. Những người tham gia từ 29 quốc gia cung cấp đầu vào và ý kiến chuyên môn để mang đến tài liệu này cho ngành công nghiệp điện tử. Đây là bộ tiêu chuẩn...

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Revision

Product Type

Released: 04/12/2022

Language

Romanian

Current Revision

IPC-A-610H este cel mai folosit standard de acceptabilitate pentru asamblare electronice din industria electronică. Standardul IPC-A-610H include o actualizare generală a documentului, introduce mai multe tipuri noi de componente cu montare pe suprafață și elimină condițiile Obiectiv. Participanții din 29 de țări și-au adus contribuția și expertiza lor pentru a da acest document industriei...

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Revision

Product Type

Released: 06/28/2017

Language

Japanese

Current Revision

本書は、プリント板の、外部または内部で観察可能な、目標、許容可能、または不適合条件について記載している。現在のIPC規格で求められている要求事項を、目に見える形で示しており、プリント板がこれら文書の規定に従わない場合には、製品の受け入れ基準は発注・受入当事者の合意のよるものとする。120の写真とイラストを追加/更新して、リビジョンEから改版が行われました。本書は、明確な図解入りでプリント板の受け入れ基準を記述している。この4色のドキュメントは、部品実装前のプリント板 (ベアボード) の外観または内部的に観察可能な、許容可能な条件と不適合な条件を写真と説明図で記載している。業務に携わる作業者、検査員、技術者は、業界が合意した最新情報を把握していることを確認すべきである。改訂J版は、120以上の新規または改善した写真と説明図を使用して、マイクロビアと接合の大きさ (寸法)、銅めっき...

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Revision

Product Type

Released: 03/01/2022

Language

Thai

Current Revision

IPC-A-610H เป็นมาตรฐานการยอมรับการประกอบอุปกรณ์อิเล็กทรอนิกส์ที่ใช้กันอย่างแพร่หลายมากที่สุดในอุตสาหกรรมอิเล็กทรอนิกส์ มาตรฐาน IPC-A-610H มีการอัพเดตทั่วไปในเอกสาร, แนะนำตัวอุปกรณ์ที่ติดตั้งบนพื้นผิวประเภทใหม่ๆ หลายประเภท และลบสภาวะเป้าหมายออกไป ผู้เข้าร่วมจาก 29 ประเทศได้ให้ข้อมูลและความเชี่ยวชาญเพื่อนำเอกสารนี้ไปสู่อุตสาหกรรมอิเล็กทรอนิกส์ นี่เป็นสิ่งที่ต้องมีสำหรับผู้ตรวจสอบ ผู้ปฏิบัติงาน...

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Revision

Product Type

Released: 03/01/2022

Language

Thai

Current Revision

IPC-J-STD-001H เป็นที่ยอมรับทั่วโลกในด้านเกณฑ์กระบวนการและวัสดุในการบัดกรี อัปเดตด้วยผู้เข้าร่วมจาก 27 ประเทศที่ให้ข้อมูลและความเชี่ยวชาญ มาตรฐาน IPC-J-STD-001H นำเกณฑ์ล่าสุดมาสู่อุตสาหกรรม รวมถึงคำแนะนำเกี่ยวกับการใช้เอ็กซ์เรย์เพื่อตรวจสอบสภาพการบัดกรีผ่านรูที่มองไม่เห็นโดยวิธีอื่น IPC-J-STD-001H...

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Revision

Product Type

Addendum with amendment(s)

Released: 01/03/2019

Language

Turkish

Current Revision

Baskı devre kartları kabul edilebilirliği için açıklamalı resimli bir rehber! Bu dört renkli döküman çıplak baskı devre kartlarında iç kısımdan ya da dışarıdan gözlemlenebilen hedef, kabul edilebilir ve uygun olmayan koşullar için fotoğraflar ve şekiller sağlamaktadır. Operatörleriniz, denetleme personeliniz ve mühendislerinizin en son yayınlanmış revizyonu kullanmasını sağlayınız. 120 adet yeni...

Document #:

IPC-6012

Revision

Product Type

Released: 12/01/2018

Language

English

The IPC-6012DA-WAM1 Addendum, when required by procurement documentation/drawings, supplements or replaces specifically identified requirements of IPC-6012D, Revision D, for rigid printed boards that must survive the vibration and thermal cycling environments of electronic interconnects within the automotive industry. The amendment changes to this document includes updated requirements for lifted...

Document #:

IPC-6012

Revision

Product Type

Released: 09/01/2017

Language

English

The IPC-6012D-AM1 makes changes to the existing acceptance criteria for copper wrap plating measurements as deﬁned by IPC-6012D. The IPC-6012D-AM1 implements a dual criterion for Class 3 copper wrap plating, based on design effectivity (before and after January 01, 2018), so as not to impose onto legacy designs any additional qualiﬁcation activity associated with adopting acceptance requirements...

Document #:

IPC-1754

Revision

Product Type

Language

English

Current Revision

IPC-1754-Am2, establishes the requirements for the exchanging material and substance data for Products between suppliers and their customers and has been developed through the participation of aerospace, defense, heavy equipment, automotive, electronics and solution provider representatives.

Document #:

Addendum with amendment(s)

Revision

Product Type

Released: 02/01/2017

Language

English

This addendum supplements J-STD-001F for soldered assemblies that must survive the vibration and thermal cyclic environments associated with space hardware. It is to be used with J-STD-001FS WAM 1.

Document #:

Revision

Product Type

Released: 11/01/2015

Language

English

This is an amendment to IPC J-STD-001F, a recognized industry-consensus standard covering materials and processes. Changes include, but are not limited to, a revision to plated-through hole, PTH, minimum fill requirements and BGA voiding criteria, new graphics for several surface mount component types, revised staking criteria, and recognition of the paragraphs addressed in J-STD-001FS, Space...

Document #:

Revision

Product Type

Released: 12/14/2015

Language

English

This amendment cannot be used without a copy of IPC-A-610F. See Related items. This is an amendment to IPC-A-610F, a recognized industry-consensus standard covering acceptability requirements for electronic assemblies. Changes include, but are not limited to, a revision to plated-through hole, PTH, minimum fill requirements, BGA voiding criteria for noncollapsing balls, and staking criteria.

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IPC-1072

Revision

Original Version

Product Type

Released: 03/07/2017

Language

English

Current Revision

This amendment to IPC-1072 updates the document to align its requirements with the requirements in its counterpart standard IPC-1071 for PCB shops. 5 Pages. Released March 2017 This amendment cannot be used without a copy of IPC-1072 (December 2015). To purchase the original document please see Related Products and choose 1072(D)1

Document #:

Revision

Product Type

Released: 12/10/2025

Language

Korean

Current Revision

IPC-A-610J는 전자 산업에서 가장 널리 사용되는 전자 조립품 허용 표준서이다. 본 표준서는 31개국의 참여자가 제공한 정보와 전문지식을 바탕으로 전자 산업계에 제공된다. 본 표준서는 전자 조립품 허용기준에 관심 있는 검사자, 운용자 등이 반드시 소지해야 한다. IPC-A-610은 J-STD-001 및 IPC/WHMA-A-620와 호환하도록 개발되었다.

Document #:

Revision

Product Type

Released: 04/09/2020

Language

Russian

Current Revision

Описание на русском IPC-A-610 – наиболее широко используемый в мире стандарт по приемке электронных сборок. Этот документ, в усовершенствование которого внесли свой вклад участники из 17 стран, поделившись информацией и своими знаниями и опытом, предоставляет отрасли новейшие критерии наряду со множеством новых и обновленных иллюстраций. Этот документ – то, что обязательно нужно иметь контролерам...

Document #:

IPC-7711/21

Revision

Product Type

Released: 06/27/2025

Language

French

Current Revision

Le guide IPC-7711/21 fournit des procédures de reprise, réparation et modification des assemblages de circuits imprimées, y compris des outils et des matériaux, des procédures courantes, le retrait du revêtement et des graphiques pour aider l'utilisateur.

Document #:

IPC/WHMA-A-620

Revision

Product Type

Released: 08/01/2013

Language

English

This amendment provides resolution to some internal conflicts, aligns common criteria to other IPC standards, and corrects some editorial errors. This amendment is only to be used in conjunction with IPC/WHMA-A-620 Revision B, October 2012. Follow your company policy and procedures to make pen and ink changes or notations to the published IPC/WHMA-A-620 Revision B. When there are changes to a...

Document #:

IPC/WHMA-A-620

Revision

Product Type

Released: 03/05/2025

Language

German

Current Revision

IPC/WHMA-A-620E ist die einzige, im Branchenkonsens entwickelte Richtlinie für Anforderungen und Abnahmekriterien für Kabel- und Kabelbaum-Baugruppen. IPC/WHMA-A-620E beschreibt Materialien, Methoden, Tests und Abnahmekriterien für die Herstellung gecrimpter, mechanisch gesicherter oder gelöteter Verbindungen und die zu den Kabel- und Kabelbaum-Baugruppen zugehörigen Montageaktivitäten. IPC/WHMA-A...

Document #:

IPC/JEDEC-J-STD-033

Revision

Product Type

Released: 02/18/2019

Language

Spanish

Current Revision

El IPC/JEDEC J-STD-033D proporciona a los fabricantes de dispositivos de montaje superficial y a los usuarios con métodos estandarizados para la manejo, embalaje, transporte y uso de componentes sensibles a la humedad/reflujo. Estos métodos ayudan a evitar daños por la absorción de humedad y por la exposición a las temperaturas de la soldadura por reflujo que pueden tener como resultado una...

Document #:

IPC-7711/21

Revision

Product Type