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JIG-101 - Standard Only

Joint Industry Guide Materials Composition Declaration for Electrotechnical Products

Document #:
JIG-101
Revision
4
Product Type
Standard Only
Released:  09/08/2011
Language
English
Current Revision
The Joint Industry Guide Material Composition Declaration for Electrotechnical Products has been updated to include the most recent substances for restriction. The JIG-101 is an industry materials declaration guide that facilitates reporting of material content information across the global electrotechnical supply chain. This document sets minimum requirements for a materials declaration. The...

IPC/WHMA-A-620 - Revision D - Standard Only

Requirements and Acceptance for Cable and Wire Harness Assemblies

Document #:
IPC/WHMA-A-620
Revision
D
Product Type
Standard Only
Released:  01/21/2020
Language
English
IPC/WHMA-A-620D is the only industry-consensus standard for Requirements and Acceptance of Cable and Wire Harness Assemblies. IPC/WHMA-A-620D describes materials, methods, tests and acceptance criteria for producing crimped, mechanically secured and soldered interconnections and the related assembly activities associated with cable and harness assemblies. IPC/WHMA-A-620D was developed by IPC and...
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IPC-2615 - Standard Only

Printed Board Dimensions and Tolerances

Document #:
IPC-2615
Revision
Original Version
Product Type
Standard Only
Released:  07/01/2000
Language
English
Current Revision
The definitive standard on printed board dimensioning and tolerancing is finally here! IPC-2615 comprehensively covers dimensioning and tolerancing of electronic packaging and is consistent with other IPC printed board standards such as IPC-6012A and IPC-2221A. The document includes fundamental dimensioning and tolerancing rules, positional, profile, orientation and form tolerances and detailed...

IPC-D-279 - Standard Only

Design Guidelines for Reliable Surface Mount Technology Printed Board Assemblies

Document #:
IPC-D-279
Revision
Original Version
Product Type
Standard Only
Released:  07/01/1996
Language
English
Current Revision
Establishes design concepts, guidelines and procedures for reliable printed wiring assemblies. Focuses on SMT or mixed technology PWAs, specifically addressing the interconnect structure and the solder joint itself. Discusses substrates, components, attachment materials, coatings and assembly processes and testing considerations. In addition, this document contains detailed appendices covering...

IPC-SM-784 - Standard Only

Guidelines for Chip-on-Board Technology Implementation

Document #:
IPC-SM-784
Revision
Original Version
Product Type
Standard Only
Released:  11/01/1990
Language
English
Current Revision
Discusses chip types, board selection, design issues and thermal transfer methods for Chip on Board (COB) applications. Details wire bonding, TAB and flip chip designs and provides information on mounting materials, including adhesives, wires and various mechanical bonding techniques. 37 pages. Released November 1990.

IPC-A-610 - Revision G - Standard Only

Acceptability of Electronic Assemblies

Document #:
IPC-A-610
Revision
G
Product Type
Standard Only
Released:  10/31/2017
Language
English
IPC-A-610 is the most widely used electronics assembly acceptance document. Updated with participants from 17 countries providing input and expertise, this document brings the latest criteria along with many new and revised graphics to the industry. This is a must-have for inspectors, operators and others with an interest in the acceptance criteria for electronic assemblies. IPC-A-610 is developed...
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IPC-A-610 - Revision F - Standard with Amendment 1

Acceptability of Electronic Assemblies

Document #:
IPC-A-610
Revision
F
Product Type
Standard with amendment(s)
Released:  05/09/2016
Language
English
IPC-A-610F with Amendment 1 incorporates the requirements of IPC-A-610F and IPC-A-610F Amendment 1 into one document. Criteria are presented in a seamless IPC-A-610 format, and there are no redline marks. This document is the equivalent to using IPC-A-610F and IPC-A-610F Amendment 1. IPC brings this version to industry to minimize confusion for those using both documents and those wishing to...
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IPC-0040 - Standard Only

Optoelectronic Assembly and Packaging Technology

Document #:
IPC-0040
Revision
Original Version
Product Type
Standard Only
Released:  05/01/2003
Language
English
Current Revision
This document addresses the implementation of optical and optoelectronic packaging technologies. The areas discussed include: technology choices, design considerations, material properties, component mounting and interconnecting structures, assembly processes, testing, application, rework, and reliability of completed optoelectronic products. Optoelectronic packaging technologies include active...
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IPC-8911 - Standard Only

Requirements for Conductive Yarns for E-Textiles Applications

Document #:
IPC-8911
Revision
Original Version
Product Type
Standard Only
Released:  05/27/2025
Language
English
Current Revision
This standard identifies categories and establishes a designation system and qualification/quality conformance requirements and test methods for conductive yarns used in e-textiles. The standard enables suppliers of conductive yarns to demonstrate their products’ performance against real-world processing and end-use environments, leveraging eight IPC Test Methods developed specifically for...
IPC-1402 Cover Image

IPC-1402 - Standard Only

Standard for Greener Cleaners Used in Electronic Manufacturing

Document #:
IPC-1402
Revision
Original Version
Product Type
Standard Only
Released:  11/28/2022
Language
English
Current Revision
IPC-1402 standard applies to cleaning products used in the Electronics Manufacturing, including but not limited to original equipment manufacturers, electronics manufacturing services companies, board manufactures, cable and wire harness manufacturers and electronics industry suppliers. IPC-1402 standard applies to direct use chemicals to clean products or components, as well as to clean...

IPC-J-STD-001 - Revision F - Standard with Amendment 1

Requirements for Soldered Electrical and Electronic Assemblies

Document #:
IPC-J-STD-001
Revision
F
Product Type
Standard with amendment(s)
Released:  05/09/2016
Language
English
J-STD-001F with Amendment 1 incorporates the requirements of J-STD-001F and J-STD-001F Amendment 1 into one document. Criteria are presented in a seamless J-STD-001 format, and there are no redline marks. This document is the equivalent to using J-STD-001F and J-STD-001F Amendment 1. IPC brings this version to industry to minimize confusion for those using both documents and those wishing to...
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IPC-SMEMA 7 - Standard Only

SMEMA7 - Fluid Dispensing Terms and Definitions

Document #:
IPC-SMEMA 7
Revision
Original Version
Product Type
Standard Only
Released:  02/12/2007
Language
English
Current Revision
This document is intended to clarify terms used in the area of fluid dispensing. As is often the case, different terms are used by different manufacturers to convey a similar meaning. Common interchangeable terms are shown in parenthesis and the reader should not infer one term is preferred over the other.
IPC-8971 Cover Image

IPC-8971 - Standard Only

Requirements for Electrical Testing of Printed Electronics E-Textiles

Document #:
IPC-8971
Revision
Original Version
Product Type
Standard Only
Released:  01/27/2023
Language
English
Current Revision
IPC-8971 is intended to assist in selecting the test equipment, test parameters, test data and fixturing required to perform electrical test(s) on printed electronics on e-textiles. Printed electronics on e-textiles is printed electronics on coated or treated textile substrates. Coatings and treatments may be applied for printability of the textile substrate and/or for performance of the textile...
IPC-8952 Cover Image

IPC-8952 - Standard Only

Design Standard for Printed Electronics on Coated or Treated Textiles and E-Textiles

Document #:
IPC-8952
Revision
Original Version
Product Type
Standard Only
Released:  01/27/2023
Language
English
Current Revision
IPC-8952 standard establishes specific requirements for the design of printed electronic applications and their forms of component mounting and interconnecting structures on coated or treated textile substrates. Textile substrate, as pertains to IPC-8952 standard, could be a bare textile or an integrated e-textile (e.g., woven or knitted e-textile). Coated or treated textile substrates, as pertain...
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IPC-2294 - Standard Only

Design Standard for Printed Electronics on Rigid Substrates

Document #:
IPC-2294
Revision
Original Version
Product Type
Standard Only
Released:  07/09/2024
Language
English
Current Revision
IPC-2294 standard establishes specific requirements for the design of printed electronic applications and their forms of component mounting and interconnecting structures on rigid substrates. Rigid substrates, as applies to IPC-2294 standard, are those that are not required to be flexed into a new shape for the purposes of assembly or operation. The rigid substrate can be conductive (e.g., rigid...
IPC-4922 Cover Image

IPC-4922 - Standard Only

Requirements for Sintering Materials for Electrical and Thermal Interconnects

Document #:
IPC-4922
Revision
Original Version
Product Type
Standard Only
Released:  03/25/2024
Language
English
Current Revision
IPC-4922 standard prescribes general minimum requirements for the classification and testing of sintering materials for reliable electrical and thermal interconnects. IPC-4922 standard is a sintering materials classification, quality assurance and procurement document for sintering materials.
IPC-8401 Cover Image

IPC-8401 - Standard Only

Guidelines for In-Mold Electronics

Document #:
IPC-8401
Revision
Original Version
Product Type
Standard Only
Released:  10/22/2024
Language
English
Current Revision
IPC-8401 standard provides guidelines for In-Mold Electronics (IME) manufacturing processes, part structures, candidate materials, and production test methods. In-Mold Electronics integrates printed electronics and electrical components into injection molded plastics, creating a three-dimensional smart molded structure. IME technology uses mass production processes, materials, and components. IME...
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IPC-8981 - Standard Only

Quality and Reliability of E-Textile Wearables

Document #:
IPC-8981
Revision
Original Version
Product Type
Standard Only
Released:  04/10/2025
Language
English
Current Revision
This standard defines classification levels and testing thresholds to assess the reliability of e-textile wearables in their intended end-use environments. It establishes baseline criteria for evaluating durability under mechanical stressors—such as abrasion, flexing, and UV exposure—and environmental conditions including perspiration, washing, water/saltwater, alkalis, and acids. Supported by 14...
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IPC-HERMES-9852 - Version 1.6 - Standard Only

The Global Standard for Machine-to-Machine Communication in SMT Assembly

Document #:
IPC/HERMES-9852
Revision
1.6
Product Type
Standard Only
Released:  08/28/2024
Language
English
Current Revision
The IPC-Hermes-9852 standard provides a state-of-the-art communication protocol for machine-to-machine communication for surface-mount technology. Used with IPC-2591, Connected Factory Exchange, IPC-HERMES-9852 can assist any electronics manufacturer, large or small, to align their companies with smart manufacturing and Industry 4.0. Version 1.6 includes updates to SendBoardInfo and capabilities...
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IPC-6904 - Standard Only

Qualification and Performance Specification for Printed Electronics on Rigid Substrates

Document #:
IPC-6904
Revision
Original Version
Product Type
Standard Only
Released:  07/09/2024
Language
English
Current Revision
IPC-6904 standard establishes and defines the qualification and performance requirements for printed electronics and their forms of component mounting and interconnecting structures on rigid substrates. The substrate can be conductive, semiconductive or nonconductive.
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IPC-2591 - Version 2.0 - Standard Only

Connected Factory Exchange (CFX)

Document #:
IPC-2591
Revision
2.0
Product Type
Standard Only
Released:  03/10/2025
Language
English
Current Revision
This standard establishes the requirements for the omnidirectional exchange of information between manufacturing processes and associated host systems for assembly manufacturing. This standard applies to communication between all executable processes in the manufacture of printed board assemblies, automated, semiautomated and manual, and is applicable to related mechanical assembly and...
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IPC-9716 - Standard Only

Requirements for Automated Optical Inspection (AOI) Process Control for Printed Board Assemblies

Document #:
IPC-9716
Revision
Original Version
Product Type
Standard Only
Released:  01/10/2025
Language
English
Current Revision
IPC-9716 provides requirements for automated optical inspection (AOI) systems to define, set up, establish, and apply process control for manufacturing printed board assemblies, including general and specific process and AOI system conditions. Requirements include inspection parameters, lighting conditions, calibration, detectability, resolution, threshold limits, program setups, measurement...
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IPC-9271 - Standard Only

Guidelines for In System Programming

Document #:
IPC-9271
Revision
Original Version
Product Type
Standard Only
Released:  09/30/2025
Language
English
Current Revision
The IPC-9271 standard provides guidelines for device-level In-System Programming (ISP) as part of electronics assembly process. The standard addresses PCB design for ISP, fundamental characteristics when selecting an ISP programmer and the integration of the programmer in the production environment, including: fixtures, software, mechanical and process integration methodologies to increase...
151-175 of 1001

Coming Soon

IPC-9242: Guidelines for Microsection Evaluation

IPC-9691C: User Guide for the IPC-TM-650, Method 2.6.25 Conductive Anodic Filament (CAF) Resistance and Other Internal Electrochemical Migration Testing

IPC-A-630A: Acceptability Standard for Manufacture, Inspection, and Testing of Electronic Enclosures

IPC-4556A: Specification for Electroless Nickel/Electroless Palladium/ Immersion Gold (ENEPIG) Plating for Printed Boards

IPC-7527A: Requirements for Solder Paste Application

IPC-4204C: Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Boards

IPC-J-STD-002F: Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires

IPC-4101F: Specifications for Base Materials for Rigid and Multilayer Printed Boards

IPC-1755B: Responsible Sourcing of Minerals Data Exchange Standard

IPC-2223F: Sectional Design Standard for Flexible/Rigid-Flexible Printed Boards

IPC-HDBK-9798A: Handbook and Guide to Supplement IPC-9797

IPC-WP-011: Guidance for Strain Gage Limits for Assemblies

J-STD-046A: Customer Notification Standard for Product/Process Changes by Electronic Product Suppliers

J-STD-048A: Notification Standard for Product Discontinuance

IPC-T-50P: Terms and Definitions for Interconnecting and Packaging Electronic Circuits

IPC-1401B: Corporate Social Responsibility Management System Standard

IPC -1751B: Generic Requirements for Declaration Process Management

IPC-6013F: Qualification and Performance Specification for Flexible/Rigid-Flexible Printed Boards

IPC-4413 - Am1: Specification for Finished Fabric Woven from Low Dk Glass for Printed Boards