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IPC-014 - Revision A - White Paper

Pb-free Electronics Risk Management (PERM) Council Position on the Use of Pb-free Electronics in the Aerospace and Defense Electronics Industries

Document #:
IPC-WP-014
Revision
A
Product Type
White Paper
Released:  04/07/2020
Language
English
Current Revision
Pb-free materials are considered a major technology disruption to traditional Pb-based interconnect materials for electronics, which is of particular concern for the aerospace & defense industries where safety cannot be compromised and applicable reliability data remains scarce. Until validated data and modelling methods are developed, projects considering Pb-free Aerospace & Defense products and...

IPC-WP-019 - Revision B - White Paper

An Overview on Global Change in Ionic Cleanliness Requirements

Document #:
IPC-WP-019
Revision
B
Product Type
White Paper
Released:  10/07/2020
Language
English
Current Revision
The IPC-WP-019B white paper was created to support the IPC-J-STD-001H standard and provides additional guidance, examples, and understanding of Section 8.0 Cleaning and Residue Requirements. The IPC-WP-019B has information on how to meet the requirements of IPC-J-STD-001H chapter 8. Recommentded for those looking to implement the requirements of IPC-J-STD-001H standard, chapter 8. 0..
IPC-WP-116A Cover Images

IPC-WP-116 - Revision A - White Paper

Guidance for the Development and Implementation of a Foreign Object Debris (FOD) Control Plan

Document #:
IPC-WP-116
Revision
A
Product Type
White Paper
Released:  03/01/2022
Language
English
Current Revision
The IPC-WP-116A white paper provides guidance to control and mitigate risks associated with the introduction of Foreign Object Debris (FOD) in electrical and electronic assemblies. Guidance to control and mitigate risks associated with the introduction of Foreign Object Debris (FOD) in electrical and electronic assemblies is provided. A template for developing a Foreign Object Debris (FOD) Control...

IPC-WP-584 - Revision A - White Paper

IPC White Paper and Technical Report on the Use of Halogenated Flame Retardants in Printed Circuit Boards and Assemblies (Correcting the Misunderstandings on "Halogen-Free")

Document #:
IPC-WP/TR-584
Revision
A
Product Type
White Paper
Released:  09/19/2007
Language
English
Current Revision
This document summarizes the IPC position on the subject of “halogen-free” materials for the electronics industry. Its initial release was developed over a period of three years and this revision is also the culmination of another three years of work by a team representing every level of the electronics supply chain. This document is applicable to materials for interconnecting electronics...
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IPC-WP-012 - White Paper

Pb-free Electronics Risk Management (PERM) Council Pb-free Research Priorities

Document #:
IPC-WP-012
Revision
Original Version
Product Type
White Paper
Released:  05/02/2014
Language
English
Current Revision
Lead-free electronics continues to be a concern of the aerospace, defense, and high performance products (ADHP) industries. This is primarily due to the lack of data and knowledge to: thoroughly categorize performance under harsh service conditions and provide a level of confidence in reliability assessments of Pb-free electronics equal to those for traditional tin-lead electronics. To help close...
IPC-WP-028 - Cover Image

IPC-WP-028 - White Paper

Guidance on Objective Evidence for Validating the Acceptability of Bubbles in Conformal Coatings

Document #:
IPC-WP-028
Revision
Original Version
Product Type
White Paper
Released:  04/04/2024
Language
English
Current Revision
IPC-WP-028 white paper provides guidance on obtaining objective evidence for validating the acceptability of bubbles in conformal coatings. It focuses on a failure mode where bubbles in coatings could activate a microclimate involving condensation of humidity inside the bubbles resulting in an increase of the local humidity load to a critical level, thus generating electrochemical migration...
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IPC-WP-004 - White Paper

Design for Success

Document #:
IPC-WP-004
Revision
Original Version
Product Type
White Paper
Released:  08/01/1994
Language
English
Current Revision
Addresses the complete process of reengineering new product development processes to incorporate DFX methodologies. Presents the case for a comprehensive analysis of the key business issues and definition of requirements before initiating work to refine or restructure processes. Editor, Dieter Bergman, IPC. 88 pages. Released by the Surface Mount Council, April 1997.

IPC-WP-021 - White Paper

Considerations of New Classes of Coatings for IPC-CC-830 Revision C

Document #:
IPC-WP-021
Revision
Original Version
Product Type
White Paper
Released:  12/16/2019
Language
English
Current Revision
The IPC-WP-021 white paper considers conformal coatings, like many high-performance materials, have evolved considerably since the 1990s. New coatings, such as fluoropolymers or hybrid coatings, have come on the market, many of which offer superior protection characteristics, but do not fit into the existing classifications of either MIL-I-46058 or IPC-CC-830. The IPC-WP-021 white paper discusses...

IPC-WP-009 - White Paper

A Summary of Tin Whisker Research References

Document #:
IPC-WP-009
Revision
Original Version
Product Type
White Paper
Released:  05/14/2009
Language
English
Current Revision
As most of the world converts to lead-free manufacturing, the concern over tin whiskers as a reliability hazard has grown due to the emergence of pure tin as a dominate component surface finish. A significant amount of research on tin whisker formation and tin whisker mitigating strategies has been performed in both commercial and defense industries. This working paper is a summary of the...
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IPC-WP-001 - White Paper

Soldering Capability White Paper Report

Document #:
IPC-WP-001
Revision
Original Version
Product Type
White Paper
Released:  08/01/1991
Language
English
Current Revision
Due to a concern in the electronic packaging industry about solderability problems, Foster Gray, PC Interconnects, developed this document for the Surface Mount Council. Areas covered are: design for the soldering process; solderable PWBs; solderable components and soldering process. Five different industry perspectives provide analysis of these issues. 35 pages. Released August 1991.

IPC-WP-024 - White Paper

IPC White Paper on Reliability and Washability of Smart Textile Structures – Readiness for the Market

Document #:
IPC-WP-024
Revision
Original Version
Product Type
White Paper
Released:  08/16/2018
Language
English
Current Revision
IPC-WP-024 is a white paper which discusses the issues associated with reliability of smart textiles (e-textiles structures) following multiple washing cycles and emphasizes efforts that industry and research laboratories must undertake to make e-textile structures more robust and able to be washed similarly to everyday textile products (e.g., underwear, clothing, home textiles and technical...
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IPC-WP-003 - White Paper

Chip Mounting Technology

Document #:
IPC-WP-003
Revision
Original Version
Product Type
White Paper
Released:  08/01/1993
Language
English
Current Revision
Status of the technology discussion on the various methodologies for mounting and interconnecting active devices to a variety of substrate materials is summarized in this document. Reviews mounting techniques of tape automated bonding (TAB), chip on board (COB) and flip chip. Examinations of the most commonly used substrate options of laminate, ceramic and silicon are also reviewed. Editor: John...

IPC-WP-026 - White Paper

IPC Technology Solutions White Paper on Blockchain and the Electronics Industry: A Review of the Current State of Blockchain Technology and Its Potential Applications in Electronics Manufacturing

Document #:
IPC-WP-026
Revision
Original Version
Product Type
White Paper
Released:  12/05/2019
Language
English
Current Revision
The IPC-WP-026 white paper explores blockchain as an emerging technology that has a core strength in providing an immutable, auditable, transparent and secure environment for data exchanges. These advantages make it a prime candidate for implementation in the electronics industry. The IPC-WP-026 white paper explores blockchain and its limitations and challenges. It also provides a few directions...

IPC-WP-025 - White Paper

IPC White Paper on A Framework for the Engineering and Design of E-Textiles

Document #:
IPC-WP-025
Revision
Original Version
Product Type
White Paper
Released:  04/01/2019
Language
English
Current Revision
This white paper is a benchmarking exercise of e-textile integrations, providing an introductory categorization of how the current market sector is using textile-based electrical components to achieve integrated functionality. This peer assessment provides a baseline understanding of e-textile process techniques, requirements and resources within this emerging sector.
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IPC/PERM-WP-022 - White Paper

Mitigation of Pure Tin Risk by Tin-Lead SMT Reflow - Results of an Industry Round-Robin - Final Report

Document #:
IPC/PERM-WP-022
Revision
Original Version
Product Type
White Paper
Released:  09/05/2018
Language
English
Current Revision
Manufacturers of high reliability electronics have been working for many years to mitigate the deleterious effects of tin whisker formation. One highly effective means to suppress the growth of tin whiskers is to replace the pure tin plating with reflowed tin-lead solder. One approach is to fully consume the tin plating by tin-lead solder during the SMT reflow process. This phenomenon of tin...
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IPC-WP-015 - White Paper

Pb-free Electronics Risk Management (PERM) Council Re-baseline of the Lead-Free Manhattan Project

Document #:
IPC-WP-015
Revision
Original Version
Product Type
White Paper
Released:  04/01/2014
Language
English
Current Revision
The PERM Lead-Free Manhattan Project (LFMP) was established to identify the technology and knowledge gaps relevant to the implementation of commercially available Pb-free product in Aerospace & Defense Systems. These knowledge gaps threaten to affect the safety, performance and reliability of Aerospace & Defense systems, which cannot be compromised. Investment is required to close these knowledge...
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IPC-WP-016 - White Paper

IPC Round Robin Study

Document #:
IPC-WP-016
Revision
Original Version
Product Type
White Paper
Released:  02/07/2013
Language
English
Current Revision
A discussion was held in the 5-33AWG (ad hoc working group), on things that conformal coat professionals (materials and processes) wish designers knew about conformal coating. The 5-33AWG group is comprised of individuals from OEMs, coating suppliers, and test lab personnel.
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IPC-COMPTRACE-609 - White Paper

What You Can Do About Component Traceability

Document #:
IPC-CT
Revision
Original Version
Product Type
White Paper
Released:  07/07/2009
Language
English
Current Revision
The problem of counterfeit components continues to escalate. It is no longer limited to high value items like semiconductors. It can include connectors, resistors, passive components or anything that is in demand. What more could you be doing to ensure that the components you purchase are genuine? What can you do about component traceability? Jack Stradley, Manager, Business Development &...
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IPC-EMBPASWP309- White Paper

An IPC White Paper: Embedded Passives, An Overview of Implementation, Benefits and Costs

Document #:
IPC-EP
Revision
09
Product Type
White Paper
Released:  02/24/2009
Language
English
Current Revision
This specification sets requirements based on performance criteria for the use of Immersion Silver (IAg) as a surface finish for printed circuit boards. It is intended for use by chemical suppliers, printed board manufacturers, electronics manufacturing services (EMS) companies and original equipment manufacturers (OEM). IAg is a thin immersion deposit over copper. It is a multifunctional surface...
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IPC-MILMKT12-11-RFPDOA - White Paper

Is Your RFP D.O.A.

Document #:
IPC-RFP
Revision
Original Version
Product Type
White Paper
Released:  01/18/2012
Language
English
Current Revision
"Is Your RFP D.O. A." was presented at the IPC Conference for the PCB Industry: Critical Issues for the Military Market in December 2011 by Steve DeWaters, president, Penumbra Strategies, Inc. The author describes the procedures of the military in preparing an RFP and evaluating the proposals. He also describes the procedures to create an effective response to the RFP and some of the pitfalls of...
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IPC-EMB - White Paper

Embedded Capacitor Technology; Status, Opportunity and Challenges

Document #:
IPC-EMB
Revision
Original Version
Product Type
White Paper
Released:  01/25/2012
Language
English
Current Revision
"Embedded Capacitor Technology; Status, Opportunity and Challenges" was presented by John Andresakis, vice president of strategic technology, Oak-Mitsui at the IPC Conference for the PCB Industry: Critical Issues for the Military Market, Washington D.C., in December 2011.The author explains how the use of this technology improves the performance, reliability and assembly cost of printed boards and...
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IPC-SPVC-LAT1 - White Paper

Analytical Procedures for Portable Lead-Free Alloy Test Data

Document #:
IPC-SPVC-LAT
Revision
Original Version
Product Type
White Paper
Released:  05/19/2010
Language
English
Current Revision
If not completely characterized, many of the early lead-free alloys’ reliability properties are better understood than those of the new alloys being introduced today. Therefore, it can be quite difficult to compare alloy properties. The lack of reliability characterization of new materials introduces uncertainty for the user. To address this problem, the IPC Solder Products Value Council (IPC SPVC...
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IPC-FINFIN - White Paper

Final Finish for Connectivity

Document #:
IPC-FINFIN
Revision
Original Version
Product Type
White Paper
Released:  01/18/2012
Language
English
Current Revision
"Final Finish for Connectivity" was presented by George Milad of Uyemura International Corporation at the IPC Conference for the PCB Industry: Critical Issues for the Military Market, in December 2011. The author describes surface finishes applied to printed circuit boards to enhance their reliability, solderability, shelf life and the applicability to wire bonding. He also mentions the IPC...
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Coming Soon

IPC-9242: Guidelines for Microsection Evaluation

IPC-9691C: User Guide for the IPC-TM-650, Method 2.6.25 Conductive Anodic Filament (CAF) Resistance and Other Internal Electrochemical Migration Testing

IPC-A-630A: Acceptability Standard for Manufacture, Inspection, and Testing of Electronic Enclosures

IPC-4556A: Specification for Electroless Nickel/Electroless Palladium/ Immersion Gold (ENEPIG) Plating for Printed Boards

IPC-7527A: Requirements for Solder Paste Application

IPC-4204C: Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Boards

IPC-J-STD-002F: Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires

IPC-4101F: Specifications for Base Materials for Rigid and Multilayer Printed Boards

IPC-1755B: Responsible Sourcing of Minerals Data Exchange Standard

IPC-2223F: Sectional Design Standard for Flexible/Rigid-Flexible Printed Boards

IPC-HDBK-9798A: Handbook and Guide to Supplement IPC-9797

IPC-WP-011: Guidance for Strain Gage Limits for Assemblies

J-STD-046A: Customer Notification Standard for Product/Process Changes by Electronic Product Suppliers

J-STD-048A: Notification Standard for Product Discontinuance

IPC-T-50P: Terms and Definitions for Interconnecting and Packaging Electronic Circuits

IPC-1401B: Corporate Social Responsibility Management System Standard

IPC -1751B: Generic Requirements for Declaration Process Management

IPC-6013F: Qualification and Performance Specification for Flexible/Rigid-Flexible Printed Boards

IPC-4413 - Am1: Specification for Finished Fabric Woven from Low Dk Glass for Printed Boards