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IPC-WP-014 - White Paper

Pb-free Electronics Risk Management (PERM) Council Position on the Use of Pb-free Electronics in the Aerospace, Defense and High Performance Electronic Industries

Document #:
IPC-WP-014
Revision
Original Version
Product Type
White Paper
Released:  07/01/2014
Language
English
Pb-free materials are considered a major technology disruption to traditional Pb-based interconnect materials for electronics, which is of particular concern for the aerospace, defense, and high performance products (ADHP) industries where safety cannot be compromised and applicable reliability data remains scarce. Until validated data and modelling methods are developed, projects considering Pb...
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IPC-WP-017 - White Paper

What Conformal Coaters Wish Designers Knew About Coatings

Document #:
IPC-WP-017
Revision
Original Version
Product Type
White Paper
Released:  10/30/2015
Language
English
This technical paper covers the testing and evaluation of polymeric conformal coatings for moisture and insulation resistance (MIR) and dielectric withstanding voltage (DWV). This effort was initiated by the IPC Conformal Coating Task Group to support technical decisions for IPC coating specification CC-830 as part of the Revision C process. MIR testing was done per a modified method of IPC-TM-650...
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IPC-WP-019 - White Paper

An Overview on Global Change in Ionic Cleanliness Requirements

Document #:
IPC-WP-019
Revision
Original Version
Product Type
White Paper
Released:  09/29/2017
Language
English
This document provides an overview of ionic cleanliness requirements, providing examples of tests and requirements for acceptability from a residue/cleanliness standpoint. The history of ROSE testing is also provided, with explanations of the shortcomings of that testing.
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IPC-WP-019 - Revision A - White Paper

综述全球离子洁净度要求的变更

Document #:
IPC-WP-019
Revision
A
Product Type
White Paper
Released:  07/23/2019
Language
Chinese
IPC-WP-019A修订白皮书概述了新的离子清洁度要求，从残留物/清洁度角度提供了可接受性测试和要求的实例。 还提供了ROSE测试的历史，并解释了该测试的缺点。
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Coming Soon

IPC-9242: Guidelines for Microsection Evaluation

IPC-9691C: User Guide for the IPC-TM-650, Method 2.6.25 Conductive Anodic Filament (CAF) Resistance and Other Internal Electrochemical Migration Testing

IPC-A-630A: Acceptability Standard for Manufacture, Inspection, and Testing of Electronic Enclosures

IPC-4556A: Specification for Electroless Nickel/Electroless Palladium/ Immersion Gold (ENEPIG) Plating for Printed Boards

IPC-7527A: Requirements for Solder Paste Application

IPC-4204C: Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Boards

IPC-J-STD-002F: Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires

IPC-4101F: Specifications for Base Materials for Rigid and Multilayer Printed Boards

IPC-1755B: Responsible Sourcing of Minerals Data Exchange Standard

IPC-2223F: Sectional Design Standard for Flexible/Rigid-Flexible Printed Boards

IPC-HDBK-9798A: Handbook and Guide to Supplement IPC-9797

IPC-WP-011: Guidance for Strain Gage Limits for Assemblies

J-STD-046A: Customer Notification Standard for Product/Process Changes by Electronic Product Suppliers

J-STD-048A: Notification Standard for Product Discontinuance

IPC-T-50P: Terms and Definitions for Interconnecting and Packaging Electronic Circuits

IPC-1401B: Corporate Social Responsibility Management System Standard

IPC -1751B: Generic Requirements for Declaration Process Management

IPC-6013F: Qualification and Performance Specification for Flexible/Rigid-Flexible Printed Boards

IPC-4413 - Am1: Specification for Finished Fabric Woven from Low Dk Glass for Printed Boards