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IPC-ASSY - Conference Presentations

HDI Assembly Related Issues

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Revision
Original Version
Released:  03/30/2011
Language
English
Current Revision
This presentation "HDI Assembly Related Issues" was given by Ian Williams, manager of customer interconnect core competency team at Intel Corp. at the IPC Conference on HDI Technology High Performance: Strategies for the 21st Century at Baltimore, Md., in March 2011. The author describes an Intel investigation into assembly challenges, capabilities, quality, reliability and testability of HDI...

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