Menu
Close
Contact Us

Study/Technical Report

Your results

Document #

Language

Products

no-image-available

IPC-TR-464 - Addendum with Amendment 1 - Other

Accelerated Aging for Solderability Evaluations-Addendum

Document #:
IPC-TR-464
Revision
Original Version
Product Type
Study/Technical Report
Released:  04/01/1987
Language
English
Current Revision
This addendum to IPC-TR-464 was released in April 1987 and represents the results of the task group study to evaluate and determine if the aging period recommended in the original Technical Report could be shortened and still provide the appropriate information on solderability retention.

IPC-TR-464 - Study/Report

Accelerated Aging for Solderability Evaluations

Document #:
IPC-TR-464
Revision
Original Version
Product Type
Study/Technical Report
Released:  04/01/1984
Language
English
This technical report was developed to meet the growing need for a standard method of evaluating the solderability retention capability of printed boards during inventory storage. 21 Pages. Released April 1984. IPC-TR-464 Addendum The addendum to IPC-TR-464 represents the results of the task group study to evaluate and determine if the aging period recommended in the original Technical Report...
1-2 of 2

Coming Soon

IPC-9242: Guidelines for Microsection Evaluation

IPC-9691C: User Guide for the IPC-TM-650, Method 2.6.25 Conductive Anodic Filament (CAF) Resistance and Other Internal Electrochemical Migration Testing

IPC-A-630A: Acceptability Standard for Manufacture, Inspection, and Testing of Electronic Enclosures

IPC-4556A: Specification for Electroless Nickel/Electroless Palladium/ Immersion Gold (ENEPIG) Plating for Printed Boards

IPC-7527A: Requirements for Solder Paste Application

IPC-4204C: Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Boards

IPC-J-STD-002F: Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires

IPC-4101F: Specifications for Base Materials for Rigid and Multilayer Printed Boards

IPC-1755B: Responsible Sourcing of Minerals Data Exchange Standard

IPC-2223F: Sectional Design Standard for Flexible/Rigid-Flexible Printed Boards

IPC-HDBK-9798A: Handbook and Guide to Supplement IPC-9797

IPC-WP-011: Guidance for Strain Gage Limits for Assemblies

J-STD-046A: Customer Notification Standard for Product/Process Changes by Electronic Product Suppliers

J-STD-048A: Notification Standard for Product Discontinuance

IPC-T-50P: Terms and Definitions for Interconnecting and Packaging Electronic Circuits

IPC-1401B: Corporate Social Responsibility Management System Standard

IPC -1751B: Generic Requirements for Declaration Process Management

IPC-6013F: Qualification and Performance Specification for Flexible/Rigid-Flexible Printed Boards

IPC-4413 - Am1: Specification for Finished Fabric Woven from Low Dk Glass for Printed Boards