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Document #:

IPC-WP-003

Revision

Original Version

Product Type

White Paper

Released: 08/01/1993

Language

English

Current Revision

Status of the technology discussion on the various methodologies for mounting and interconnecting active devices to a variety of substrate materials is summarized in this document. Reviews mounting techniques of tape automated bonding (TAB), chip on board (COB) and flip chip. Examinations of the most commonly used substrate options of laminate, ceramic and silicon are also reviewed. Editor: John...

Document #:

IPC/PERM-WP-022

Revision

Original Version

Product Type

White Paper

Released: 09/05/2018

Language

English

Current Revision

Manufacturers of high reliability electronics have been working for many years to mitigate the deleterious effects of tin whisker formation. One highly effective means to suppress the growth of tin whiskers is to replace the pure tin plating with reﬂowed tin-lead solder. One approach is to fully consume the tin plating by tin-lead solder during the SMT reﬂow process. This phenomenon of tin...

Document #:

IPC-RFP

Revision

Original Version

Product Type

White Paper

Released: 01/18/2012

Language

English

Current Revision

"Is Your RFP D.O. A." was presented at the IPC Conference for the PCB Industry: Critical Issues for the Military Market in December 2011 by Steve DeWaters, president, Penumbra Strategies, Inc. The author describes the procedures of the military in preparing an RFP and evaluating the proposals. He also describes the procedures to create an effective response to the RFP and some of the pitfalls of...

Document #:

IPC-WP-013

Revision

Original Version

Product Type

White Paper

Released: 07/01/2014

Language

English

Current Revision

There are a large number of new lead-free alloys that address the manufacturing problems inherent in current lead-free products on the market. However, their reliability properties are less understood than many of the first alloys introduced, for example SAC 305. While it is tempting to look to the new alloys as solutions to manufacturing issues of the older materials, the lack of reliability...

Document #:

IPC-WP-023

Revision

Original Version

Product Type

White Paper

Released: 05/01/2018

Language

English

Current Revision

IPC-WP-023 is an IPC Technology Solutions White Paper addressing reliability issues associated with stacked microvias. There is evidence that staggering vias can result in a more robust structure; however, staggering microvias is only a temporary solution to accommodate complex designs with microvias built with weak interface structures IPC-WP-023 white paper provides an investigation of these...