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Products

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IPC-CMDDGUIDE - Handbook

Conflict Minerals Due Diligence Guide

Document #:
IPC-CMD
Revision
Original Version
Product Type
Handbook
Released:  02/07/2013
Language
English
Current Revision
This document helps establish guidance for the formation of due diligence programs for supply chain conflict minerals tracking, management, disclosure and reporting. This document is not, and should not be used as, a guide to legal compliance with Section 1502 of the Dodd-Frank Act. This document is intended to provide a guide for establishing and implementing a conflict minerals program to meet...
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EMSI-TC-Revision 3 - Reference Materials

IPC Sample Master Ordering Agreement for EMS Companies and OEMs with supplement

Document #:
IPC-EMSI
Revision
Original Version
Product Type
Reference Materials
Released:  11/15/2012
Language
English
Current Revision
Here's help for surviving the intricacies and unique needs of the EMS contracting process. Developed over hundreds of hours by lawyers from Squires, Sanders and Dempsey and industry volunteers from all sizes of EMS and OEM companies, this sample document provides "terms and conditions" for use in EMS transactions. Specific contracting issues such as inventory liability and order modification...

IPC-HDBK-610 - Revision C - Handbook

Handbook and Guide to Supplement IPC-A-610 (Includes IPC-A-610 B-C-D Comparisons) with Amendment 1

Document #:
IPC-HDBK-610
Revision
C
Product Type
Handbook
Released:  10/01/2005
Language
English
UPDATED with Amendment 1! A comprehensive cross-reference and comparison of Revisions B - C - D is provided. This handbook provides IPC-A-610 change history and cross reference support along with the previous Rev B to C content. IPC-HDBK-610 with Amendment 1 has summary listings of changes from Rev C to D and retains the original Rev B to C content. It offers explanatory and tutorial information...
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IPC-DRM-18 - Revision J - Training & Reference Guide

元器件识别 培训和参考指南

Document #:
IPC-DRM-18
Revision
J
Product Type
Training & Reference Guide
Language
Chinese
Current Revision
元器件识别培训和参考指南是员工培训和快速参考的宝贵工具。这种用于电子组装操作者和检验员的综合元器件识别资源包含当今电子组装中常用的通孔和表面安装元器件的彩色照片、计算机制图、原理图符号以及详细描述。 包含有关SSOP、TSOP、QFP、LQFP、PQFP、LCC、QFN和BGA相关封装的更新信息,包括这些组中的所有变种。 新的元器件包括DFN、QFN-多排、PoP(层叠封装)、CSP(芯片级封装)、COB(板上芯片)、裸晶片和倒装芯片。 术语部分有关于极性、方向、引线形式和元器件参考标识符(CRD)的简要情况。“读元器件值”部分包含用于电阻器和电感器的全彩色、易于使用的颜色代码表,以及用于读取带有编号的电容器数据的图表。共包含73页的紧凑5.5×8.5英寸(14×21.5厘米)尺寸。2018年1月发布。 注:免费审阅是Adobe Acrobat“.pdf”下载(2.2 MB)...
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IPC-PTH - Revision F - Training & Reference Guide

Through Hole Solder Joint Evaluation Training & Reference Guide

Document #:
IPC-DRM-PTH
Revision
F
Product Type
Training & Reference Guide
Language
German
Current Revision
Free Review German Language Edition Now updated to Revision F of the latest IPC-A-610 industry standard for the Acceptability of Electronic Assemblies, this Training & Reference Guide illustrates critical acceptance criteria for the evaluation of through-hole solder connections. With only 30 pages and a compact 5.5 x 8.5 inch (14 x 21.5 cm) size, these convenient spiral-bound manuals make it easy...
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IPC-SMT - Revision F - Training & Reference Guide

Surface Mount Solder Joint Evaluation Training & Reference Guide

Document #:
IPC-DRM-SMT
Revision
F
Product Type
Training & Reference Guide
Language
German
Current Revision
Free Review German Language Edition Now updated to Revision F of the latest IPC-A-610 industry standard for the Acceptability of Electronic Assemblies, this Training & Reference Guide illustrates critical acceptance criteria for the evaluation of surface mount solder connections. At only 44 pages and a compact 5.5 x 8.5 inch (14 x 21.5 cm) size, these convenient spiral-bound manuals make it easy...
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IPC-AJ-820 - Revision A - Handbook

組立と接合に関するハンドブック

Document #:
IPC-AJ-820
Revision
A
Product Type
Handbook
Released:  09/09/2025
Language
Japanese
Current Revision
このマニュアルには、電子組立品の組立やはんだ付に関する一般的な情報と、実証済みの技術/技法が記載されている。これらの内容は、著名な業界専門家や経験豊富な委員会メンバーよって策定/検討されたものである。各項では以下の内容を扱っている:電子組立品のオペレーション、設計に関する考慮事項、プリント回路基板、部品、はんだ付性、材料、部品実装、はんだ付の技術と接合部、清掃/洗浄、コンフォーマルコーティング、封止とポッティング、リワークとリペア。
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IPC-AJ-820 - Revision A - Handbook

组装和连接手册

Document #:
IPC-AJ-820
Revision
A
Product Type
Handbook
Released:  05/10/2019
Language
Chinese
Current Revision
本手册包含了关于组装和焊接电子组件的一般信息和经过验证的技术描述。内容由著名的行业专家和经验丰富的委员会成员开发和审查。章节包括:电子组件操作,设计需要考虑的因素,印制电路板,元器件,可焊性,材料,元器件安装,焊接技术和连接,清洁,敷形涂覆,封装和灌封,返工和维修。

IPC-HDBK-850 - Handbook

Guidelines for Design, Selection and Application of Potting Materials and Encapsulation Processes Used for Electronics Printed Circuit Board Assembly

Document #:
IPC-HDBK-850
Revision
Original Version
Product Type
Handbook
Released:  07/31/2012
Language
English
This handbook has been written to assist the designers and users of potting and encapsulation in understanding the characteristics of various materials, as well as the factors that can modify those characteristics when the potting or encapsulation is applied. The equipment and processes involved in the preparation and application of potting and encapsulation are also covered. The challenge in...
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IPC-HDBK-830 - Handbook

SUPERSEDED BY HDBK-830A

Document #:
IPC-HDBK-830
Revision
Original Version
Product Type
Handbook
Released:  10/01/2002
Language
English
This handbook is a compilation of the conformal coating industry's practical experience, and will assist the designers and users of conformal coatings in making informed choices. Users will better understand the properties of the various conformal coatings, the results to be achieved by its application and how to verify that these goals have been met. Use this document as a supplement in...
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IPC-HDBK-005 - Handbook

焊膏评估指南

Document #:
IPC-HDBK-005
Revision
Original Version
Product Type
Handbook
Released:  04/24/2019
Language
Chinese
Current Revision
本手册是焊膏标准J-STD-005的配套文件,应该视为帮助评估焊膏在表面贴装(SMT)工艺中使用的适用性指南。本文件还提出了一些可有助于设计和测试焊膏的测试方法。它旨在供焊膏供应商和用户使用。本文件作为指南而编写,以评估用于特定工艺的焊膏的适用性,给出了当前可用的不同材料、环境和工艺变量的大量组合。
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IPC-HDBK-9798 - Handbook

車載要求事項およびその他高信頼性用途のプレスフィット規格のためのハンドブック

Document #:
IPC-HDBK-9798
Revision
Original Version
Product Type
Handbook
Released:  08/16/2023
Language
Japanese
Current Revision
IPC-HDBK-9798は、コンプライアントプレスフィット技術を用いて電子組立品を製造するためのガイドラインおよび補足情報を提供するものである。本書は、これらの工法の「ハウツー」と「理由」に関する情報、および原理について説明することを意図している。 このハンドブックは、規格書「IPC-9797」を補足するものである。
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IPC-HDBK-4691 - Handbook

电子组件操作用粘合剂粘接手册

Document #:
IPC-HDBK-4691
Revision
Original Version
Product Type
Handbook
Released:  01/14/2021
Language
Chinese
Current Revision
本手册的目的是帮助那些必须选择粘合剂粘接或从事粘合剂粘接操作的个人,还为仅涉及电子组装的粘合剂粘接的设计、选型和使用提供指导。
IPC-HDBK-620D CN Cover Image

IPC-HDBK-620 - Handbook

IPC-D-620和IPC/WHMA-A-620操作手册与指南

Document #:
IPC-HDBK-620
Revision
Original Version
Product Type
Handbook
Released:  10/28/2021
Language
Chinese
Current Revision
IPC-HDBK-620 是 IPC-D-620“线缆及线束的设计和关键工艺要求”和 IPC/WHMA-A-620“线缆及线束组件的要求与验收”的配套参考文件和为这些标准中的要求提供支持信息和技术原理。 强烈建议任何想要了解要求背后的“方式”和“原因”的人都强烈推荐本指南文件,并且是从事线缆和线束工艺的工艺和制造工程师的必备文件。
IPC-HDBK-630 CN Cover Image

IPC-HDBK-630 - Handbook

电子整机的设计、制造、检验和测试指南

Document #:
IPC-HDBK-630
Revision
Original Version
Product Type
Handbook
Released:  12/08/2021
Language
Chinese
Current Revision
该标准是 IPC-A-630 的配套文件。 IPC-HDBK-630 是高级组件或包含电子组件的“盒子”的设计、制造、检查和测试的深入指南。 本文档旨在帮助电气和电子设备的电子外壳的设计人员、制造商和最终用户了解行业的最佳实践以满足要求——确保最终项目组件在其预期设计寿命内的可靠性和功能。 2014 年 6 月发行,168 页。
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IPC-DR-DES-2022 - Desk Reference Manual

PCB Design Desk Reference 2022 Edition

Document #:
IPC-DES
Revision
2022
Product Type
Desk Reference Manual
Released:  05/31/2022
Language
French
Ce document a été créé pour guider les concepteurs dans leur processus de définition des paramètres nécessaires pour créer les différents motifs dans leurs outils de CAD.

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Coming Soon

IPC-9242: Guidelines for Microsection Evaluation

IPC-9691C: User Guide for the IPC-TM-650, Method 2.6.25 Conductive Anodic Filament (CAF) Resistance and Other Internal Electrochemical Migration Testing

IPC-6905: Qualification and Performance Specification for Additively Manufactured Electronics (AME)

IPC-A-630A: Acceptability Standard for Manufacture, Inspection, and Testing of Electronic Enclosures

IPC-4556A: Specification for Electroless Nickel/Electroless Palladium/ Immersion Gold (ENEPIG) Plating for Printed Boards

IPC-7527A: Requirements for Solder Paste Application

IPC-4204C: Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Boards

IPC-J-STD-002F: Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires

IPC-4101F: Specifications for Base Materials for Rigid and Multilayer Printed Boards

IPC-1755B: Responsible Sourcing of Minerals Data Exchange Standard

IPC-2223F: Sectional Design Standard for Flexible/Rigid-Flexible Printed Boards

IPC-HDBK-9798A: Handbook and Guide to Supplement IPC-9797

IPC-WP-011: Guidance for Strain Gage Limits for Assemblies

J-STD-046A: Customer Notification Standard for Product/Process Changes by Electronic Product Suppliers

J-STD-048A: Notification Standard for Product Discontinuance

IPC-T-50P: Terms and Definitions for Interconnecting and Packaging Electronic Circuits

IPC-1401B: Corporate Social Responsibility Management System Standard

IPC -1751B: Generic Requirements for Declaration Process Management

IPC-6013F: Qualification and Performance Specification for Flexible/Rigid-Flexible Printed Boards

IPC/JEDEC-9702A: Monotonic Bend Characterization of Board-Level Interconnects

IPC-4413 - Am1: Specification for Finished Fabric Woven from Low Dk Glass for Printed Boards

IPC-9716A: Requirements for Automated Optical Inspection (AOI) Process Control for Printed Board Assemblies

IPC-9711: Generic Requirements for Automated Inspection Process Control

IPC-HERMES-9852 Version 1.7: The Global Standard for Machine-to-Machine Communication in SMT Assembly

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