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J-STD-001 ได้รับการยอมรับอย่างกว้างขวางทั่วโลกสำหรับเกณฑ์ในกระบวนการบัดกรีและวัสดุ ได้รับการปรับปรุงให้ทันสมัยจากผู้เข้าร่วมจาก 18 ประเทศที่ได้ให้การป้อนข้อมูลและความเชี่ยวชาญ เอกสารนี้นำเกณฑ์ข้อกำหนดใหม่ล่าสุดพร้อมด้วยกราฟิกใหม่ ต่างๆ เข้าสู่อุตสาหกรรมเพื่อความสะดวกในการใช้งานและความเข้าใจ...

J-STD-001 ist weltweit anerkannt für seine Kriterien zu Lötprozessen und -materialien. Aktualisiert durch das Fachwissen von Experten aus 18 Ländern, bietet dieses Dokument der Branche aktuellste Kriterien und neue bzw. aktualisierte Illustrationen für verbesserte Benutzerfreundlichkeit und Verständlichkeit. Diese Richtlinie ist ein absolutes Muss für alle, die ein Interesse an Prozess- und...

El IPC J-STD-001 es reconocido a nivel mundial como el único estándar de consenso de la industria que cubre los materiales y procesos de soldadura. Esta revisión incluye soporte tanto para aleaciones de soldadura convencionales como para la fabricación libre de plomo. Ejemplos de algunos de los cambios más significativos son la revisión de orificios metalizados, PTH, requisitos de llenado mínimo...

IPC-A-610 является наиболее широко используемым в мире стандартом по сборке электроники. Являясь обязательным для всех отделов обеспечения качества и сборки, IPC-A-610F иллюстрирует принятые отраслью критерии качества для электронных сборок, посредством детально описанных условий приемлемости и дефекта, подкрепленных полноцветными фотографиями и иллюстрациями. Это издание включает в себя два новых...

IPC-A-610 este cel mai folosit standard din lume în industria electronică de asamblare. Ca o necesitate absolută pentru toate departamentele în asigurarea calității și în liniile de asamblare, IPC-A-610F prezintă criterii industriale de acceptabilitate ale activităților practice din liniile de producție prin stabilirea unor condiții detaliate reflectând cerințele de acceptabilitate și cazurile de...

This is the Romanian Language version of IPC-A-610D Lead free acceptance criteria and pictures now included! Reformatted-easier to find acceptance criteria! IPC-A-610 is the most widely used electronics assembly standard in the world. A must for all quality assurance and assembly departments, IPC-A-610D illustrates industry-accepted workmanship criteria for electronics assemblies through full...

简要介绍 （英文） 本标准是IPC发布的首份电子产品整机的可接受性标准。内容涉及组装过程中整机的可接受性要求。本标准的制定用来指导电气和电子设备整机制造商和终端用户了解满足要求的最佳做法，确保终端产品在预期设计寿命内组装的可靠性和功能。2013年9月发布；共30页。2014年7月翻译

El IPC-A-610 es el estándar de ensambles electrónicos más utilizado del mundo. Es indispensable para todos los departamentos de aseguramiento de calidad y de ensamble, el IPC-A-610F ilustra los criterios de calidad aceptados por la industria para ensambles electrónicos a través de descripciones detalladas reflejando las condiciones aceptables y de defecto, apoyado por fotografías a todo color e...

Establishes the requirements for the evaluation of liquid and dry film solder mask material and for the determination of the acceptability of use on a standard printed board system. IPC-SM-840 provides two classes of requirements, T and H, to reflect functional performance requirements and testing severity based on industry/end use requirements. Coverage is given to adhesion, material qualification...

This is the Spanish Language version of IPC-A-610D Lead free acceptance criteria and pictures now included! Reformatted-easier to find acceptance criteria! IPC-A-610 is the most widely used electronics assembly standard in the world. A must for all quality assurance and assembly departments, IPC-A-610D illustrates industry-accepted workmanship criteria for electronics assemblies through full-color...

This is the Swedish Language version of IPC-A-610D Lead free acceptance criteria and pictures now included! Reformatted-easier to find acceptance criteria! IPC-A-610 is the most widely used electronics assembly standard in the world. A must for all quality assurance and assembly departments, IPC-A-610D illustrates industry-accepted workmanship criteria for electronics assemblies through full-color...

IPC-A-610 este cel mai folosit standard din lume în industria electronică de asamblare. Actualizat prin participarea a 17 țări, oferind informații și expertiză, acest document aduce cele mai recente criterii în industrie cu numeroase graficii noi și revizuite. Acesta este un standard de nelipsit pentru toți inspectorii, operatorii și toți ceilalți interesați de criteriile de acceptare ale...

IPC-A-610, tüm dünyada elektronik üretimde yaygın olarak kullanılan bir standarttır. Tüm üretim ve kalite güvence departmanları için zorunlu olan IPC-A-610F, elektronik üretim için endüstri tarafından kabul gören işçilik kriterlerine ait kabul edilebilir ve kusur koşullarını yansıtan çok renkli fotoğraflar ve çizimlere sahiptir. Bu revizyon kaplı delik-içi dolgusu ve BGA boşluk kriterlerinin...

IEC, IPC-A-610'un elektronik üretimde tüm dünyada tercih edilen uluslararası kabul standardı olması için bir doğrulama sürecindedir. IPC-A-610, dünyada en çok kullanılan elektronik üretim standardıdır. Tüm üretim ve kalite güvence departmanları için zorunlu olan IPC-A-610E, elektronik üretim için endüstri tarafından kabul gören işçilik kriterlerine ait çok renkli fotoğraflar ve çizimlere sahiptir...

This is the Spanish Language version of the J-STD-001D Lead free acceptance criteria and pictures now included!> Reformatted-easier to find acceptance criteria! J-STD-001D is world-recognized as the sole industry-consensus standard covering soldering materials and processes. This revision now includes support for lead free manufacturing, in addition to easier to understand criteria for materials...

PC-A-610 เป็นเอกสารการยอมรับงานประกอบอิเล็กทรอนิกส์ที่ใช้กันแพร่หลายมากที่สุด มีความทันสมัย โดยได้รับการสนับสนุนข้อมูลและความเชี่ยวชาญจากผู้มีส่วนร่วม 17 ประเทศ เอกสารนี้นำเสนอเกณฑ์ข้อกำหนดล่าสุดพร้อมด้วยรูปภาพกราฟิกใหม่ๆ และที่ได้รับการแก้ไขเพื่อให้สอดคล้องกับอุตสาหกรรม มาตรฐานนี่เป็นสิ่งจำเป็นสำหรับผู้ตรวจสอบ พนักงานผู้ประกอบงาน...

IPC-A-610 เป็นมาตรฐานที่ได้มีการนำไปใช้กันอย่างแพร่หลายทั่วโลกในการประกอบงานอิเล็กทรอนิกส์ เป็นสิ่งที่ต้องมีสำหรับการประกันคุณภาพ และหน่วยงานการผลิต, IPC-A-610F แสดงให้เห็นถึงเกณฑ์ฝีมือที่ยอมรับได้ของงานประกอบอิเล็กทรอนิกส์ผ่านข้อความอย่างละเอียดที่สะท้อนถึงสภาวะที่สามารถยอมรับได้และสภาวะข้อบกพร่อง สนับสนุนด้วยภาพถ่ายและภาพประกอบสีอย่างเต็มรูปแบบ ในการปรับปรุงฉบับใหม่นี้...

J-STD-001E被业界公认为是全球唯一一份涵盖焊接材料和焊接工艺的标准。E版本更易理解用于生产高质量焊接互连和组件的材料、方法及验证要求，还包含了与无铅制造相关的内容。此外，还包括了对所有三个级别产品的要求。为了使用户更准确地了解本标准的要求，全书配有彩色插图。本标准完全可做为IPC-A-610E的补充文件。 Download the 下载E版本相对于D版本的主要修订变化文件（PDF文件）。

The A-53-Gerber is a single-sided test board having six SIR test patterns which were designed for surface insulation testing. The test patterns consist of two comb patterns with 500µm (0.0197”) lines/spaces, two comb patterns with 318µm (0.0125”) lines/spaces and two comb patterns with 200µm (0.0079) lines/spaces. The contact fingers of the board are normally gold plated for compatibility with...

IPC-A-610 là bộ tiêu chuẩn cho các lắp ráp điện tử được sử dụng rộng rãi nhất trên thế giới. Là một bắt buộc cho các bộ phận đảm bảo chất lượng sản phẩm và lắp ráp sản phẩm, IPC-A-610E minh họa các tiêu chuẩn công nghiệp chấp nhận sản phẩm cho các lắp ráp điện tử bằng các hình ảnh minh họa màu sắc. Phiên bản này bao gồm hai kiểu bản cực SMT, cũng như những thay đổi ở các tiêu chuẩn chấp nhận cho...

IEC đang trong tiến trình chứng thực IPC-A-610 như là một Bộ Tiêu Chuẩn Chấp Nhận cho các lắp ráp điện tử Quốc tế. IPC-A-610 là bộ tiêu chuẩn cho các lắp ráp điện tử được sử dụng rộng rãi nhất trên thế giới. Là một bắt buộc cho các bộ phận đảm bảo chất lượng sản phẩm và lắp ráp sản phẩm, IPC-A-610E minh họa các tiêu chuẩn công nghệ chấp nhận sản phẩm cho các lắp ráp điện tử bằng các hình ảnh minh...

В настоящее время МЭК находится в процессе рекомендации IPC-A-610 в качестве всемирно одобренного международного стандарта по приемке электронных сборок. IPC-A-610 является наиболее широко известным в мире стандартом электронной сборки. Обязательный для отделов сборки и обеспечения качества, документ IPC-A-610E иллюстрирует критерии качества изготовления, принятые в промышленности, посредством...

This is the Russian Language version of IPC-A-610D Now DoD Adopted! Download the adoption notice through this link. This is a .pdf file Lead free acceptance criteria and pictures now included! Reformatted-easier to find acceptance criteria! IPC-A-610 is the most widely used electronics assembly standard in the world. A must for all quality assurance and assembly departments, IPC-A-610D illustrates...

This is the Vietnamese Language version of IPC-A-610D Lead free acceptance criteria and pictures now included! Reformatted-easier to find acceptance criteria! IPC-A-610 is the most widely used electronics assembly standard in the world. A must for all quality assurance and assembly departments, IPC-A-610D illustrates industry-accepted workmanship criteria for electronics assemblies through full...

IPC-A-610是一份使用非常廣泛的電子裝配驗收文件。標準委員會的成員來自17個國家，他們提供數據和專業知識來完成升版工作，這份文件帶來了最新的標準，以及許多新的修訂的行業圖片。 這是一份檢查員，操作者和其他感興趣人員必須具備的電子組件接收標準的文件. IPC-A-610是和J-STD-001協同開發的，並在本修訂版中首次使用了IPC/WHMA-A-620.2017年11月翻譯。

Provided electronically, these Gerber Files include patterns for developing solder paste stencils by laser or chemical etching. Land widths of 0.4 mm, 0.63mm and 1.25 mm are provided with varying pitch in order to evaluate solder paste slump. J-STD-005 included with each order. Available in Gerber data only.

The Cleanliness and Residue Evaluation Test Board is designed to give the manufacturing process professional a tool to help assess the impact of cleanliness and residues on bare boards and finished assemblies, as well as a tool to assess the impact of changing manufacturing parameters on cleanliness. This artwork package provides .pdf master drawings and Gerber files necessary for fabricating the...

Recognition vehicle for UL-796 and UL-746. Tests for conductor width plating quality-PTH, flammability, etc. (1 pc. 41 x 57 cm 1:1). Gerber Format.

Organizația C.E.I. este în curs de a aproba IPC-A-610 ca un standard internațional acceptat, cu preferabilitate globală pentru asamblare, în industria electronică. Dintre standardele folosite în industria de asamblare aplicații electronice, IPC-A-610 are cea mai mare răspândire în lume. Ca o necesitate absolută pentru toate departamentele în asigurarea calității și în liniile de asamblare, IPC-A...

This is one of the first IPC standards developed in China. It is formulated for establishing wording, definitions and testing and certification methods for automated optical inspection (AOI) equipment. It also provides users with measurement system analysis for acceptance methods and acceptability criteria of AOI equipment. 这是首次在中国开发的 IPC标准之一。 它被制定用于建立自动光学检查（AOI）设备的措辞，定义和测试及认证方法...

本标准以故障排除示例、工艺因果信息和统计方法的形式提供指导，以纠正与印制线路产品的设计、制造、组装和测试相关的所有领域的问题。整个文档中都提供了照片以帮助读者。 IPC-9111取代IPC-PE-740A关于印制电路板组件部分内容。 2019年1月发布，2019年8月完成汉化

MEGHATÁROZÁS> angolul MEGHATÁROZÁS angolul A tömegforrasztás során alapvető fontosságú, hogy mindegyik forraszkötés elérje a minimális forrasztási hőmérsékletet ezzel biztosítható, hogy a forraszanyag és az összeforrasztandó fémfelületek között diffúziós kötés jöjjön létre. A diffúziós kötésnek mindkét forrasztandó fémfelület és a forraszanyag között létre kell jönnie. Ehhez a minimális...

Denne standard er en samling af visuelle kvalitetskriterier for godkendelse af tinpastatrykkeprocessen. Der er anvendt standardiseret sprog til karakterisering af tinpasta. Standarden indeholder gængse beskrivelser og potentielle metoder til tinpastapåføring. Standarden giver et nyttigt indblik i tinpastatryk, som kan anvendes ved fejlfinding i trykkeprocessen. 23 sider. Udgivet i maj 2012...

This is one of the first IPC standards developed in China. The purpose of this standard is to define the characterization, quality conformance and performance testing of solder dross reduction chemicals for application on the surface of molten solder. 这是首次在中国开发的 IPC标准之一。本标准的目的是定义了用于熔融焊料表面的焊渣抗氧化还原剂的的特征、质量控制和性能测试。

本标准描述了采用底部端子表面贴装元器件(BTC)在设计和组装方面的挑战，BTC元器件外部连接由构成元器件整体一部分的金属端子组成。本文件中BTC包括了仅有底部端子并要实施表面贴装的所有类型元器件。包括QFN、 DFN、 SON、 LGA、MLP 和MLF等业界描述性术语。这里所含信息的焦点放在BTCs元器件的关键设计、组装、检验、维修以及和BTC相关的可靠性问题上。 这份文件的目标读者是与电子设计、组装、检验和维修等过程有关的经理、设计和工艺工程师、操作员和技术员。本文件的目的是给正考虑采用锡/铅、无铅、粘合剂或其它形式互连工艺来组装BTC类元器件的那些公司提供实际而有用的资讯。虽然本文件不是包含一切的秘方，但它识别了影响进行稳健和可靠组装的许多特性，可给正面临组装制程问题的元器件供应商提供指导性的信息。全文共68页。2011年3月发布。2014年5月翻译。

Free Review German Language Edition Now updated to Revision F of the latest IPC-A-610 industry standard for the Acceptability of Electronic Assemblies, this Training & Reference Guide illustrates critical acceptance criteria for the evaluation of through-hole solder connections. With only 30 pages and a compact 5.5 x 8.5 inch (14 x 21.5 cm) size, these convenient spiral-bound manuals make it easy...

This is a list of reported errata to the printed copies of IPC/ECA J-STD-002D. Pen and ink changes should be made in accordance with your company's document control policies.

Free Review German Language Edition Now updated to Revision F of the latest IPC-A-610 industry standard for the Acceptability of Electronic Assemblies, this Training & Reference Guide illustrates critical acceptance criteria for the evaluation of surface mount solder connections. At only 44 pages and a compact 5.5 x 8.5 inch (14 x 21.5 cm) size, these convenient spiral-bound manuals make it easy...

Based on data from 118 electronics assembly companies and PCB fabricators worldwide, this report presents data on the current state (2016) of PCB fabrication and assembly, and the industry’s predictions for the data by 2021. The data are segmented by five applications: automotive, defense and aerospace, high-end systems, industrial and medical electronics. Topics covered include board properties...

This presentation "HDI Assembly Related Issues" was given by Ian Williams, manager of customer interconnect core competency team at Intel Corp. at the IPC Conference on HDI Technology High Performance: Strategies for the 21st Century at Baltimore, Md., in March 2011. The author describes an Intel investigation into assembly challenges, capabilities, quality, reliability and testability of HDI...

This addendum to IPC-TR-464 was released in April 1987 and represents the results of the task group study to evaluate and determine if the aging period recommended in the original Technical Report could be shortened and still provide the appropriate information on solderability retention.

These procedures are additions to the IPC-7711B/7721B. Section 2: 3.11.1; 5.7.6; 5.8.1.1; 5.8.1.2; 5.8.1.3; Section 3: 4.7.4; 4.7.5; all released November 2011. Section 2: 5.5.7 released February 2013. The pages herein are authorized for download, reproduction, and printing for insertion into the IPC- 7711B/7721B. These procedures are not intended for previous versions of IPC-7711/7721

Esta guía proporciona procedimientos de retrabajo, reparación y modificación de ensambles de tablero impreso. Incluídos en esta revisión son los procedimientos previamente lanzados como páginas con cambios, una información general actualizada y sección de procedimientos comunes, nuevos procedimientos de BGAs utilizando sistemas enfocados de reflujo de infrarrojos con precalentadores y...

Dieser Leitfaden enthält Verfahren für die Nacharbeit, Reparatur und Änderung von Leiterplatten-Baugruppen. In diese Ausgabe wurden die Verfahren integriert, die in die vorherige Ausgabe als Änderungsseiten aufgenommen wurden. Der Abschnitt Allgemeine Angaben und häufig angewendete Verfahren wurde aktualisiert. Neue Verfahren für BGAs wurden aufgenommen, die fokussierte IR-Reflow-Systeme mit...

本規格は、許容可能な電子組立品(SnPbおよびPbフリー)を製造するうえで必要となる熱プロファイルの作成において、有用かつ実用的な情報を提供するものである。今回の改版では、旧版でのリフロープロファイルから、ベーパーフェーズ、レーザー、セレクティブおよびウェーブソルダリングのプロファイルに至るまで対象範囲が拡大されている。また、プロファイル作成時に発生し得る一般的な不具合事象に対処するためのトラブルシューティングガイドをフルカラーで掲載している。

このマニュアルには、電子組立品の組立やはんだ付に関する一般的な情報と、実証済みの技術/技法が記載されている。これらの内容は、著名な業界専門家や経験豊富な委員会メンバーよって策定/検討されたものである。各項では以下の内容を扱っている：電子組立品のオペレーション、設計に関する考慮事項、プリント回路基板、部品、はんだ付性、材料、部品実装、はんだ付の技術と接合部、清掃/洗浄、コンフォーマルコーティング、封止とポッティング、リワークとリペア。

本指南提供了印刷電路板組件的返工，維修和修改程序。 本次修訂包括以前作為修訂本發布的程序，基本信息和通用程序部分的更新，使用具有預熱功能的聚焦紅外返工系統的BGA新程序，和所有其他程序的一般更新。許多規程包含彩色插圖。全文超過300頁。於2017年1月正式發布。2017年5月翻譯。

本規格にはソルダペーストの認定および特性評価に関する要求事項が記載されている。本書ではソルダペーストの金属含有量、粘度、スランプ、はんだボール、粘着およびぬれに関する試験方法と基準について言及している。補完的な情報は「IPC-HDBK-005 Guide to Solder Paste Assessment」に 記載されている(この資料は、本規格の購入には含まれていない)。J-STD-005に優先する。10ページ。2012年2月出版。

Ce guide fournit des procédures de reprise, réparation et modification d’assemblages de circuits imprimés. Cette révision inclut les changements de pages des procédures publiées précédemment, une mise à jour de la section information générale et procédures communes, de nouvelles procédures pour les BGAs utilisant des Systèmes de Refusion par IR focalisés avec préchauffe intégrale et des mises à...

简要介绍 （英文） 本标准规定了应用于电子焊接领域的电子级焊料合金、含助焊剂与不含助焊剂的棒状、带状、丝状、粉末状焊料及“专用”电子级焊料的命名原则、要求及测试方法。本标准是一个质量控制标准，无意直接关联制造工艺中材料的性能。对于应用于非电子领域的焊料，应该按照ASTM B-32的规定进行采购。本标准是三项联合工业标准之一，这三项联合工业标准规定了电子工业所用焊接材料的要求和测试方法。另外两项联合工业标准是IPC/EIA J-STD-004《助焊剂要求》和IPC/EIA J-STD-005《焊膏要求》。“C”版本已更新，主要阐述了有意添加到焊料合金中的金属成分和合金中的杂质问题。此外，表格和附录已经更新了最新的合金信息。共22页。2013年7月发布。2014年2月翻译。