The IPC APEX EXPO 2025 Technical Conference Proceedings represent the latest research and developments in printed board materials, design, manufacture and assembly as well as technical papers on Factory of the Future.
Products
Free Review German Language Edition Now updated to Revision F of the latest IPC-A-610 industry standard for the Acceptability of Electronic Assemblies, this Training & Reference Guide illustrates critical acceptance criteria for the evaluation of surface mount solder connections. At only 44 pages and a compact 5.5 x 8.5 inch (14 x 21.5 cm) size, these convenient spiral-bound manuals make it easy...
Based on data from 118 electronics assembly companies and PCB fabricators worldwide, this report presents data on the current state (2016) of PCB fabrication and assembly, and the industry’s predictions for the data by 2021. The data are segmented by five applications: automotive, defense and aerospace, high-end systems, industrial and medical electronics. Topics covered include board properties...
This report shows trends in PCB prototype sales and growth based on data from IPC's North American PCB Statistical Program covering 2014 through mid-2017. Data on prototype sales percentages by month compared to regular-production PCB sales, and estimates of North American prototype market sizes, are reported for all PCBs as well as for rigid PCBs and flexible circuits separately. The vertical...
This survey-based study about the current state of the the North American PCB industry covers data for 2016 and the first half of 2017 from IPC's PCB Statistical Program. It includes market size estimates, sales and production growth, sales by product type, product mix (e.g, prototype), vertical markets, revenue per employee, capacity utilization, inventory turns, lead times, US PCB imports and...
Findings from a 2017 IPC survey of U.S. electronics assembly manufacturers on the impact of the skills gap covers hard-to-fill production and professional positions, reasons applicants did not qualify, and essential skills in short supply. Published April 2017. 31 pages
The 2019 Annual Report & Forecast for the North American EMS Industry is based on data collected from IPC’s EMS statistical program and includes a five-year market forecast from New Venture Research. It covers market sizes, potential for market growth, sales and order growth, sales by product type, vertical markets, order backlogs, domestic production and number of EMS facilities. Management data...
Th 2022 Wage Rate & Salary Study for the North American Electronics Assembly Industry contains the results of IPC's biennial wage survey in which 30 U.S. companies participated, including both contract manufacturers/EMS companies and OEMs. It shows the data in averages and average ranges on 2022 hourly wages, annual salaries, and sales compensation in the USA. Salary budget growth and pay...
IPC conducts statistical programs for the EMS, PCB, and solder segments of the electronics manufacturing industry. The North American PCB Statistical Program aggregates industry data covering sales, orders and growth rates by product types and company-size tiers for rigid PCBs and by product types for flexible circuits, as well as separate rigid and flex book-to-bill ratios. Backlogs, inventory...
IPC conducts statistical programs for the EMS, PCB, and solder segments of the electronics manufacturing industry. The North American EMS Market Statistical Program aggregates industry data covering EMS sales growth by type of production and company size tier, order growth and backlogs by company size tier, vertical market growth, the EMS book-to-bill ratio, and 3-month and 12 month sales outlook...
"Underfill Selection and the Impact on Reliability" was presented at the IPC Conference on Reliability: Assembly Process for a Reliable Product in November 2011 by Dr. Brian Toleno, director of technical services and applications for Henkel. The author defines underfill and describes the types. He explaines the need for underfill and where it is typically used. He also explains the effects of...
The 2017 North American Cable Assembly Manufacturers report includes company name, address, phone number, business manager, website, estimated 2015 worldwide revenues, facility size, manufacturing locations by region of the world, markets served, product types manufactured, agency approvals/certifications, minority business designations, and a brief description of the business. Nonmember pricing...
2019 World Cable Assembly Market, a new research report from industry leader Bishop & Associates, addresses the growth markets and regions and much more. This 17-chapter, 219-page report provides a detailed analysis of the cable assembly market by region, end-use equipment sector, and cable assembly type in US dollars for the years 2018 through 2024. Analysis is provided numerically and...
IPC conducts statistical programs for the EMS, PCB, and solder segments of the electronics manufacturing industry. IPC’s Global Solder Statistical Program aggregates industry data covering the volume of solder consumption by product type and by regional market, with quarterly growth rates and a lead-free breakdown, as well as percentages of lead-free solder using SAC alloys. Three-month and 12...
This presentation "HDI Assembly Related Issues" was given by Ian Williams, manager of customer interconnect core competency team at Intel Corp. at the IPC Conference on HDI Technology High Performance: Strategies for the 21st Century at Baltimore, Md., in March 2011. The author describes an Intel investigation into assembly challenges, capabilities, quality, reliability and testability of HDI...
Presentation by Karl Dietz, Ph.D., DuPont at the Technology Interchange meeting at EIT in Endicott, N.Y. Contains powerpoint slides and recorded presentation. Includes overview, capabilities, challenges and advances of laser direct imaging techniques, photolithography and etching. Also includes problems in etching and how to minimize them. Excellent 37 minute non-commercial tutorial on the subject...
This addendum to IPC-TR-464 was released in April 1987 and represents the results of the task group study to evaluate and determine if the aging period recommended in the original Technical Report could be shortened and still provide the appropriate information on solderability retention.
The 2022 Quality Benchmarks for the Electronics Assembly Industry is a biennial report released by IPC. The report represents the findings from an online quantitative survey fielded between the dates of September 28, 2001 – October 20, 2021. A total of 59 assembly companies completed the survey, representing both contract electronics manufacturing services (EMS) companies and original equipment...
IPC-TR-587 technical report delivers results of a major study on conformal coating. In most manufacturing specifications, conformal coating thickness is defined as the thickness of the final polymer film on a flat, unencumbered surface of the assembly, however conformal coating thickness on other assembly and component surfaces is not characterized. IPC-TR-587 is a report outlining an IPC study of...
The 2019 IPC APEX EXPO technical conference is one of the most outstanding in the electronics industry. Proceedings from this technical conference include: 98 presentations from 34 sessions, 20 poster papers and 5 buzz session presentations on Automation in Electronics Manufacturing, Adhesives, Advanced Technology, Area Array/Flip Chip/0201 Metric, Assembly and Rework Processes, BGA/CSP Packaging...
These procedures are additions to the IPC-7711B/7721B. Section 2: 3.11.1; 5.7.6; 5.8.1.1; 5.8.1.2; 5.8.1.3; Section 3: 4.7.4; 4.7.5; all released November 2011. Section 2: 5.5.7 released February 2013. The pages herein are authorized for download, reproduction, and printing for insertion into the IPC- 7711B/7721B. These procedures are not intended for previous versions of IPC-7711/7721
Esta guía proporciona procedimientos de retrabajo, reparación y modificación de ensambles de tablero impreso. Incluídos en esta revisión son los procedimientos previamente lanzados como páginas con cambios, una información general actualizada y sección de procedimientos comunes, nuevos procedimientos de BGAs utilizando sistemas enfocados de reflujo de infrarrojos con precalentadores y...
In section C1 which defines the JIG-101 reference fields, the rationale and date fields are redundant fields that are a part of the Unique ID string. The unique ID string is comprised of the list name, the revision date of the list, and the JIG-101 Ed 2 rationale level ("R", "I", or "A"). The table will be updated to 3 separate tables, one for each rationale level with the naming convention of...
Dieser Leitfaden enthält Verfahren für die Nacharbeit, Reparatur und Änderung von Leiterplatten-Baugruppen. In diese Ausgabe wurden die Verfahren integriert, die in die vorherige Ausgabe als Änderungsseiten aufgenommen wurden. Der Abschnitt Allgemeine Angaben und häufig angewendete Verfahren wurde aktualisiert. Neue Verfahren für BGAs wurden aufgenommen, die fokussierte IR-Reflow-Systeme mit...
本規格は、許容可能な電子組立品(SnPbおよびPbフリー)を製造するうえで必要となる熱プロファイルの作成において、有用かつ実用的な情報を提供するものである。今回の改版では、旧版でのリフロープロファイルから、ベーパーフェーズ、レーザー、セレクティブおよびウェーブソルダリングのプロファイルに至るまで対象範囲が拡大されている。また、プロファイル作成時に発生し得る一般的な不具合事象に対処するためのトラブルシューティングガイドをフルカラーで掲載している。