Skip to main content
  • My Location
    • Global Home Page
    • China Mainland
    • Europe
    • India & Southeast Asia
    • Japan
    • México
    • Republic of Korea
    • Taiwan
    • U.S. & Canada
  • Cert Portal (CQI)
  • Store
  • Membership
    • Membership Home Page
    • Membership Benefits
    • Get Started with Your Membership
    • Member Directory
    • Online Membership Application
    • Renew Membership Online
    • Membership Pricing
Cart

Hello, Sign In
My Account

  • Sign in
  • Don't have an account yet? Start here.
  • My Profile
  • View Orders
  • My Dashboard
  • My Electronics U
  • Help
electronics.org
Menu
Main navigation
  • Featured Standards
    • IPC-A-610
    • IPC-J-STD-001
    • IPC/WHMA-A-620
    • IPC-2591
    • IPC-1791
    • IPC-6012
    • IPC-6018
    • IPC-7711/21
  • Product Types
    • Certification
      • CQI
    • Handbooks & Guides
      • Desk Reference Manual
      • Handbook
      • Reference Materials
      • Training & Reference Guide
    • Illustrations/Art
      • Illustrations/Art
    • Industry Intelligence
      • Industry Report
      • Intelligence Subscription
      • Roadmap
    • Standards
      • Addendum
      • Addendum with amendment(s)
      • Amendment
      • Appendix
      • Development Packet
      • Errata
      • Handbook
      • Redline Standard
      • Schema
      • Standard Only
      • Standard with amendment(s)
      • Test Data Tables
      • Update
    • Technical Presentations
      • Conference Presentation/Proceedings
    • Technical Reports & White Papers
      • Industry Report
      • Study/Technical Report
      • White Paper
    • Test Board Schematics & Tools
      • Gerber Coupon Generator Subscription
      • Gerber Files
  • Topics
    • Advanced Packaging
    • Automotive Electronics
    • Conformal Coating
    • e-Textiles
    • Environmental Regulations
    • Factory of the Future
    • IPC CFX
    • PCB Design
Close
Main navigation
  • Featured Standards
    • IPC-A-610
    • IPC-J-STD-001
    • IPC/WHMA-A-620
    • IPC-2591
    • IPC-1791
    • IPC-6012
    • IPC-6018
    • IPC-7711/21
  • Product Types
    • Certification
      • CQI
    • Handbooks & Guides
      • Desk Reference Manual
      • Handbook
      • Reference Materials
      • Training & Reference Guide
    • Illustrations/Art
      • Illustrations/Art
    • Industry Intelligence
      • Industry Report
      • Intelligence Subscription
      • Roadmap
    • Standards
      • Addendum
      • Addendum with amendment(s)
      • Amendment
      • Appendix
      • Development Packet
      • Errata
      • Handbook
      • Redline Standard
      • Schema
      • Standard Only
      • Standard with amendment(s)
      • Test Data Tables
      • Update
    • Technical Presentations
      • Conference Presentation/Proceedings
    • Technical Reports & White Papers
      • Industry Report
      • Study/Technical Report
      • White Paper
    • Test Board Schematics & Tools
      • Gerber Coupon Generator Subscription
      • Gerber Files
  • Topics
    • Advanced Packaging
    • Automotive Electronics
    • Conformal Coating
    • e-Textiles
    • Environmental Regulations
    • Factory of the Future
    • IPC CFX
    • PCB Design
Contact Us

Search results

Breadcrumb

  1. Global Home
  2. Store
  3. Search results

Your results

  • 1152
  • Current Revision Only

  • Standards (1002)
    • Standard Only (798)
    • Amendment (51)
    • Addendum (77)
    • Standard with amendment(s) (34)
    • Handbook (2)
    • Addendum with amendment(s) (8)
    • Redline Standard (23)
    • Errata (5)
    • Appendix (1)
    • Update (1)
    • Development Packet (1)
    • Test Data Tables (1)
  • Technical Reports & White Papers (63)
    • Study/Technical Report (17)
    • White Paper (46)
  • Handbooks & Guides (41)
    • Handbook (24)
    • Desk Reference Manual (2)
    • Training & Reference Guide (14)
    • Reference Materials (1)
  • Industry Intelligence (16)
    • Industry Report (11)
    • Intelligence Subscription (3)
    • Roadmap (2)
  • Technical Presentations (12)
    • Conference Presentation/Proceedings (12)
  • Test Board Schematics & Tools (10)
    • Gerber Files (10)
  • Illustrations/Art (6)
    • Illustrations/Art (6)
  • Certification (1)
    • CQI (1)

  • Automotive (21)
  • Medical (3)
  • Rail Transit (4)
  • Space and Military (49)
  • Telecom (5)

  • 3-D Printed Boards (4)
  • Cables and Harnesses (119)
  • Data Transfer (78)
  • E-Textiles (7)
  • Press Fit (15)
  • Printed Boards (527)
  • Printed Electronics (93)
  • Smart Factory (11)
  • Soldering (462)
  • Wire Harness (22)

  • Assembly (712)
  • Board Fab (286)
  • Box Build (133)
  • Cables and Harnesses (WHMA) (148)
  • Cleaning and Coating (258)
  • Design (184)
  • Environmental Due Diligence (3)
  • Materials (278)
  • Rework and Repair (278)
  • Test (329)

Products

no-image-available

IPC-9121 - Amendment 1

印制板制造工艺问题解答 修订本1

Document #:
IPC-9121
Revision
Original Version
Product Type
Amendment
Released:  10/08/2020
Language
Chinese
Current Revision
本手册可供任何生产制造或采购印制板的人员作为基本资源。数百张真实的全彩色照片聚焦了650多个印刷电路板工艺缺陷,每个缺陷都有其分析原因和纠正措施。IPC-9121是取代1997年12月发布 的IPC-PE-740A中的PCB部分。2016年3月发布9121英文母标准,2018年年4月发布修订本1,修订本1于2020年4月翻译。详情参见目录。
no-image-available

IPC-J-STD-001 - Revision G - Amendment 1

Hardware electrónico para aplicaciones espaciales y militares - Anexo a IPC J-STD-001G, Requisitos para ensambles soldados eléctricos y electrónicos

Document #:
IPC-J-STD-001
Revision
G
Product Type
Addendum with amendment(s)
Released:  08/11/2020
Language
Spanish
El anexo espacial IPC J-STD-001GS complementa o reemplaza los requisitos específicamente identificados de IPC J-STD-001G para ensambles soldados eléctricos y electrónicos que deben soportar los entornos de ciclos térmicos y de vibración propios de la instalación y operación en aplicaciones espaciales y militares.
no-image-available

IPC-J-STD-001 - Revision F - Amendment 1

Exigences des Assemblages Électriques et Électroniques Brasés

Document #:
IPC-J-STD-001
Revision
F
Product Type
Amendment
Released:  06/22/2017
Language
French
Ceci est un amendement de l’IPC J-STD-001F, une norme reconnue selon un consensus industriel décrivant les matériaux et les procédés. Les changements incluent, mais ne sont pas limités à, une révision des exigences de remplissage minimum des trous métallisés, des critères de vide pour les BGA, de nouveaux dessins pour plusieurs types de composants montés en surface, des critères de collage révisés...
no-image-available

IPC-J-STD-001 - Revision G - Addendum with Amendment 1 - Space and Military

IPC J-STD-001G焊接的电气和电子组件要求航天和军事应用电子部件补充标准 修订本 1

Document #:
IPC-J-STD-001
Revision
G
Product Type
Addendum with amendment(s)
Released:  01/15/2021
Language
Chinese
对IPC J-STD-001GS空间附录的IPC J-STD-001GS AM 1修订补充或替代了IPC J-STD-001G的特定标识要求,以应对必须经受振动和热影响的焊接电气和电子组件的清洁要求,进入太空并在太空和军事应用中运行的周期性环境。
no-image-available

IPC-J-STD-001 - Revision G - Amendment 1

Provee requisitos para materiales de soldadura y procesos para ensambles

Document #:
IPC-J-STD-001
Revision
G
Product Type
Amendment
Released:  03/13/2019
Language
Spanish
El documento IPC J-STD-001D-Am 1 proporciona la primera revisión importante a la que se han sometido los requisitos de limpieza de la norma J-STD-001 desde hace más de 25 años y con la que se cambia el modo en el que la industria abordará los requisitos relativos a limpieza y residuos. Entre los puntos destacados de esta enmienda se encuentra un requisito para fabricantes de productos de clase 2 y...
no-image-available

IPC-J-STD-001 - Revision G - Amendment 1

Les exigences relatives au brasage d’assemblages électroniques et électriques.

Document #:
IPC-J-STD-001
Revision
G
Product Type
Amendment
Released:  03/13/2019
Language
French
IPC J-STD-001D-Am 1 constitue la première révision majeure des exigences de propreté de la norme J-STD-001 depuis plus de 25 ans et modifie la façon dont l’industrie doit répondre aux exigences de nettoyage et de résidus. Les points forts de cette modification incluent, sauf spécification contraire de l’utilisateur, l’obligation pour les fabricants de produits des Classes 2 et 3 de se soumettre à...
no-image-available

IPC-A-610 - Revision F - Amendment 1

电子组件的可接受性 修订本1

Document #:
IPC-A-610
Revision
F
Product Type
Amendment
Released:  11/17/2016
Language
Chinese
该文件是IPC-A-610F的修订本,是电子组装可接受性要求的公认行业标准。变化包括,但不仅限于:镀通孔、最小填充要求、有非塌落焊料球的球栅阵列空洞标准和加固标准。
no-image-available

IPC-A-610 - Revision F - Amendment 1

Acceptabilitatea Ansamblurilor Electronice Amendament 1

Document #:
IPC-A-610
Revision
F
Product Type
Amendment
Released:  11/28/2016
Language
Romanian
Acesta este un amendament la standardul IPC-A-610F, un standard industrial recunoscut și adoptat, acoperind cerințe de acceptabilitate ale ansamblurilor electronice. Modificările includ, fără a se limita la acestea, o revizuire a cerințelor minime de umplere cu aliaj a găurilor metalizate, PTH, o schimbare a criteriilor pentru goluri la circuitele BGA cu bile fără turtire și cerințe noi pentru...
no-image-available

IPC-A-610 - Revision F - Amendment 1

Acceptabilité des Assemblages Électroniques

Document #:
IPC-A-610
Revision
F
Product Type
Amendment
Released:  06/22/2017
Language
French
Ceci est un amendement à l’IPC-A-610-F, une norme reconnue selon un consensus industriel décrivant les exigences d’acceptabilité des assemblages électroniques. Les changements incluent, mais ne sont pas limités à, une révision des exigences de remplissage minimum des trous métallisés, des critères de vide pour les BGA à billes non affaissables et des critères de collage. Publiée en Décembre 2015
no-image-available

IPC-6012 - Revision D - Amendment 1

リジッドプリント板の認定および性能仕様-改定1

Document #:
IPC-6012
Revision
D
Product Type
Amendment
Released:  03/19/2019
Language
Japanese
本改訂は、IPC-6012Dで定められた銅ラップめっきの測定に関し、既存の許容基準に対し変更を加えるものである。本改訂は、新規設計品に施行される受け入れ要件の導入に伴い、旧来の設計品に追加的な品質認定作業を課すことのないよう、設計の有効日(2018年1月1日の前日まで、また、2018年1月1日以降)を基準に、クラス3製品の銅ラップめっきに二重基準を施行するものである。IPC-6012Dに記載する「銅ラップめっきの要求事項」の対象となる旧来の製品に対しては、本改訂は適用されない。8ページ。2019年1月翻訳。
no-image-available

IPC/WHMA-A-620 - Revision B - Amendment 1

Requirements and Acceptance for Cable and Wire Harness Assemblies

Document #:
IPC/WHMA-A-620
Revision
B
Product Type
Amendment
Released:  11/07/2014
Language
Hebrew
Amendment 1 to IPC/WHMA-A-620B This amendment provides resolution to some internal conflicts, aligns common criteria to other IPC standards, and corrects some editorial errors. This amendment is only to be used in conjunction with IPC/WHMA-A-620 Revision B, October 2012. Follow your company policy and procedures to make pen and ink changes or notations to the published IPC/WHMA-A-620 Revision B...

IPC-WP-014 - White Paper

Pb-free Electronics Risk Management (PERM) Council Position on the Use of Pb-free Electronics in the Aerospace, Defense and High Performance Electronic Industries

Document #:
IPC-WP-014
Revision
Original Version
Product Type
White Paper
Released:  07/01/2014
Language
English
Pb-free materials are considered a major technology disruption to traditional Pb-based interconnect materials for electronics, which is of particular concern for the aerospace, defense, and high performance products (ADHP) industries where safety cannot be compromised and applicable reliability data remains scarce. Until validated data and modelling methods are developed, projects considering Pb...
no-image-available

IPC-HDBK-9798 - Handbook

Handbook for Press-fit Standard for Automotive Requirements and other High-Reliability Applications

Document #:
IPC-HDBK-9798
Revision
Original Version
Product Type
Handbook
Released:  06/21/2022
Language
English
IPC-HDBK-9798 provides guidelines and supporting information for manufacturing electronic assemblies using compliant press-fit technology. The intent is to explain the ‘‘how-to’’ and ‘‘why’’ information, and fundamentals for these processes. This handbook is supporting the IPC-9797 standard.
no-image-available

IPC-J-STD-001 Revision H - Addendum - Space and Military

はんだ付される電気および電子組立品に関する要求事項:宇宙・軍事用途向け追加規格

Document #:
IPC-J-STD-001
Revision
H
Product Type
Addendum
Released:  10/28/2022
Language
Japanese
IPC-J-STD-001HS 宇宙用追加規格は、宇宙・軍事用途において振動や熱サイクル環境に耐え、動作することが求められる電気・電子組立品に関し、J-STD-001Hの特定要求事項を補完する、もしくは置き換えるものである。
no-image-available

IPC-J-STD-001 and IPC-A-610 - Revision H - Addendum - Automotive

IPC J-STD-001H はんだ付される電気および電子組立品、およびIPC-A-610H 電子組立品の許容基準:車載用途向け追加規格

Document #:
IPC-J-STD-001 and IPC-A-610
Revision
H
Product Type
Addendum
Released:  06/22/2022
Language
Japanese
IPC J-STD-001HA/IPC-A-610HAは、J-STD-001HおよびIPC-A-610Hの車載用途向け追加規格である。本書は、自動化された大量生産ラインという条件を考慮しながら、過酷な環境下にある車載用電気・電子部品がはんだ付された組立品について、その信頼性を保証するための基準を提供するものである。 IPC J-STD-001HA/IPC-A-610HA(すなわち追加規格)は独立した文書として使用するのではなく、J-STD-001HおよびIPC-A-610Hと併用する必要がある
no-image-available

IPC-J-STD-001 and IPC-A-610 - Revision H - Addendum - Automotive

J-STD-001H(电气与电子组件的焊接要求)与IPC-A-610H(电子组件的可接受性)的汽车补充标准

Document #:
IPC-J-STD-001 and IPC-A-610
Revision
H
Product Type
Addendum
Released:  03/06/2023
Language
Chinese
IPC J-STD-001HA/IPC-A-610HA是J-STD-001H和IPC-A-610H的汽车补充标准。它提供了标准,以确保在恶劣环境下现场焊接的汽车电气和电子组件的可靠性,并考虑了自动化大批量生产。 这份补充标准不能作为单独文件使用,它必须与 J-STD-001H and IPC-A-610H一起使用.

IPC-HDBK-850 - Handbook

Guidelines for Design, Selection and Application of Potting Materials and Encapsulation Processes Used for Electronics Printed Circuit Board Assembly

Document #:
IPC-HDBK-850
Revision
Original Version
Product Type
Handbook
Released:  07/31/2012
Language
English
This handbook has been written to assist the designers and users of potting and encapsulation in understanding the characteristics of various materials, as well as the factors that can modify those characteristics when the potting or encapsulation is applied. The equipment and processes involved in the preparation and application of potting and encapsulation are also covered. The challenge in...

IPC-WP-008 - White Paper

Setting Up Ion Chromatography Capability

Document #:
IPC-WP-008
Revision
Original Version
Product Type
White Paper
Released:  12/01/2005
Language
English
Ion chromatography has been recognized as a method for which the data output is ion specific and very precise in the quantification of ionic residues. This paper is intended for those contemplating the setup of an ion chromatography lab and provides many of the practical considerations that should be addressed, including the core components of an ion chromatograph system such as carrier solutions...
no-image-available

IPC-HDBK-830 - Handbook

SUPERSEDED BY HDBK-830A

Document #:
IPC-HDBK-830
Revision
Original Version
Product Type
Handbook
Released:  10/01/2002
Language
English
This handbook is a compilation of the conformal coating industry's practical experience, and will assist the designers and users of conformal coatings in making informed choices. Users will better understand the properties of the various conformal coatings, the results to be achieved by its application and how to verify that these goals have been met. Use this document as a supplement in...
no-image-available

IPC-WP-019 - White Paper

An Overview on Global Change in Ionic Cleanliness Requirements

Document #:
IPC-WP-019
Revision
Original Version
Product Type
White Paper
Released:  09/29/2017
Language
English
This document provides an overview of ionic cleanliness requirements, providing examples of tests and requirements for acceptability from a residue/cleanliness standpoint. The history of ROSE testing is also provided, with explanations of the shortcomings of that testing.

IPC-WP-116 - White Paper

Guidance for the Development and Implementation of a Foreign Object Debris (FOD) Control Plan

Document #:
IPC-WP-116
Revision
Original Version
Product Type
White Paper
Released:  12/08/2015
Language
English
Guidance to control and mitigate risks associated with the introduction of Foreign Object Debris (FOD) in electrical and electronic assemblies is provided. A template for developing a Foreign Object Debis (FOD) Control Plan is included.

IPC-WP-114 - White Paper

Guidance for the Development and Implementation of a White Plague Control Plan (WPCP)

Document #:
IPC-WP-114
Revision
Original Version
Product Type
White Paper
Released:  12/08/2015
Language
English
Guidance to reduce and control exposure to environmental conditions and contamination that promote the development of White Plague is provided in this document. A template for developing a White Plague Control Plan (WPCP) is included.

IPC-WP-113 - White Paper

Guidance for the Development and Implementation of a Red Plague Control Plan (RPCP)

Document #:
IPC-WP-113
Revision
Original Version
Product Type
White Paper
Released:  12/08/2015
Language
English
Guidance to reduce and control exposure to environmental conditions and contamination that promote the development of Red Plague is provided in this document. A template for developing a Red Plague Control Plan (RPCP) is included.
no-image-available

IPC-A-610 - Revision G - Addendum - Rail Transit

IPC-A-610G电子组件的可接受性轨道交通补充标准 Rail Transit Addendum to IPC-A-610G Acceptability of Electronic Assemblies

Document #:
IPC-A-610
Revision
G
Product Type
Addendum
Released:  08/04/2022
Language
Chinese
IPC-A-610GR 轨道交通补充标准提供了对 IPC-A-610G 标准的补充要求,指定了一套标准化的验收标准,这些标准适用于在与高速铁路设备相关的高机械和环境应力的严苛微环境中使用的电子组件 ,确保轨道交通行业应用中电子组件的行业特定高可靠性和环境适应性。
no-image-available

IPC-J-STD-001 and IPC-A-610 - Revision G - Addendum - Automotive

J-STD-001G(電氣與電子組件的焊接要求)與IPC-A-610G(電子組件的可接受性)的汽車補充標準

Document #:
IPC-J-STD-001 and IPC-A-610
Revision
G
Product Type
Addendum
Released:  11/20/2020
Language
Chinese (Zhōngwén)
本補充標準提供了在J-STD-001G和IPC-A-610G中發佈的標準之外使用的要求,和在某些情況下的替代要求。考慮到大批量自動化生產,確保汽車電氣和電子組件的焊接在惡劣環境下的可靠性。全文共148頁。2020年2月發佈。

Pagination

  • First First page
  • Previous Previous page
  • Next Next page
  • Last Last page
1076-1100 of 1152
    • 25
    • 50
    • 75
    • 100

Coming Soon

IPC-9242: Guidelines for Microsection Evaluation

IPC-9691C: User Guide for the IPC-TM-650, Method 2.6.25 Conductive Anodic Filament (CAF) Resistance and Other Internal Electrochemical Migration Testing

IPC-6905: Qualification and Performance Specification for Additively Manufactured Electronics (AME)

IPC-A-630A: Acceptability Standard for Manufacture, Inspection, and Testing of Electronic Enclosures

IPC-4556A: Specification for Electroless Nickel/Electroless Palladium/ Immersion Gold (ENEPIG) Plating for Printed Boards

IPC-7527A: Requirements for Solder Paste Application

IPC-4204C: Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Boards

IPC-J-STD-002F: Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires

IPC-4101F: Specifications for Base Materials for Rigid and Multilayer Printed Boards

IPC-1755B: Responsible Sourcing of Minerals Data Exchange Standard

IPC-2223F: Sectional Design Standard for Flexible/Rigid-Flexible Printed Boards

IPC-HDBK-9798A: Handbook and Guide to Supplement IPC-9797

IPC-WP-011: Guidance for Strain Gage Limits for Assemblies

J-STD-046A: Customer Notification Standard for Product/Process Changes by Electronic Product Suppliers

J-STD-048A: Notification Standard for Product Discontinuance

IPC-T-50P: Terms and Definitions for Interconnecting and Packaging Electronic Circuits

IPC-1401B: Corporate Social Responsibility Management System Standard

IPC -1751B: Generic Requirements for Declaration Process Management

IPC-6013F: Qualification and Performance Specification for Flexible/Rigid-Flexible Printed Boards

IPC/JEDEC-9702A: Monotonic Bend Characterization of Board-Level Interconnects

IPC-4413 - Am1: Specification for Finished Fabric Woven from Low Dk Glass for Printed Boards

IPC-9716A: Requirements for Automated Optical Inspection (AOI) Process Control for Printed Board Assemblies

IPC-9711: Generic Requirements for Automated Inspection Process Control

IPC-HERMES-9852 Version 1.7: The Global Standard for Machine-to-Machine Communication in SMT Assembly

Receive Email Updates from Global Electronics Association

electronics.org

Global Electronics Association
3000 Lakeside Drive, 105 N 
Bannockburn, IL 60015 
PH + 1 847-615-7100 
8:00 a.m. to 5:00 p.m. CST

EMAIL: contact@electronics.org

 

Contact Us

Footer Navigation
  • WHMA
  • Electronics Foundation
  • I-Connect007
Footer Secondary Navigation
  • About Us
  • Blog
  • FAQ
  • Careers
  • USPAE
© 2026 Legal Name: IPC International Inc, DBA Global Electronics Association
Footer Bottom Navigation
  • Cookie
  • Disclosure / Legal
  • Privacy Policy
  • Return Policy
  • LinkedIn
  • YouTube
  • Instagram
  • Facebook
  • Flickr