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Document #:

IPC-2223

Revision

Product Type

Standard Only

Released: 01/24/2020

Language

English

Current Revision

IPC-2223E used in conjunction with IPC-2221, IPC-2223 establishes the specific requirements for the design of flexible printed boards and forms of component mounting and interconnecting structures. The flexible materials used in the structures are comprised of insulating films, reinforced and/or non-reinforced dielectric in combination with metallic materials. IPC-2223E provides new design...

Document #:

IPC-1791

Revision

Product Type

Standard Only

Released: 01/29/2026

Language

English

Current Revision

This standard provides minimum requirements, policies and procedures for printed board design, fabrication, assembly, and cable and wire harness assembly organizations and/or companies to become trusted sources for markets requiring high levels of confidence in the integrity of delivered products. These trusted sources shall ensure quality, supply chain risk management (SCRM), security and chain...

Document #:

IPC-7095

Revision

Product Type

Standard Only

Released: 10/17/2024

Language

English

Current Revision

The IPC-7095E describes design and assembly implementation for ball grid array (BGA) and fine-pitch BGA (FBGA) technology, focusing on inspection, repair and reliability issues associated with design and assembly of printed boards using these packages. IPC-7095E provides the useful and practical information to those who use or are considering using BGAs. IPC-7095E provides descriptions on how to...

Document #:

IPC-1791

Revision

Product Type

Standard Only

Released: 11/01/2023

Language

English

Current Revision

IPC-1791D standard provides minimum requirements, policies and procedures for printed board design, fabrication, assembly, and cable and wire harness assembly organizations and/or companies to become trusted sources for markets requiring high levels of confidence in the integrity of delivered products. These trusted sources shall ensure quality, supply chain risk management (SCRM), security and...

Document #:

IPC-7095

Revision

Product Type

Standard with amendment(s)

Released: 07/09/2019

Language

English

Current Revision

The IPC-7095D-AM1 standard describes design and assembly implementation for ball grid array (BGA) and fine-pitch BGA (FBGA) technology, focusing on inspection, repair and reliability issues associated with design and assembly of printed boards using these packages. IPC-7095D-AM1 provides the useful and practical information to those who use or are considering using BGAs. IPC-7095D-AM1 provides...

Document #:

IPC-D-350

Revision

Product Type

Standard Only

Released: 07/01/1992

Language

English

Current Revision

This document bears two reference numbers, and may be obtained from IPC or the IEC. IPC-D-350D and IEC 1182-1 are identical in technical content. The IEC version of this document also contains a French translation. The IEC is responsible for the accuracy of that translation.Specifies record formats used to describe printed board products with detail sufficient for tooling, manufacturing and...

Document #:

IPC-1782

Revision

Product Type

Standard Only

Released: 10/20/2023

Language

English

Current Revision

IPC-1782B establishes minimum requirements for manufacturing and supply chain traceability based on perceived risk. IPC-1782B applies to all products, processes, assemblies, parts, components, equipment used and other items as deﬁned by users and suppliers in the manufacture of printed board assemblies, as well as mechanical assembly and printed board fabrication. IPC-1782B is applicable both for...

Document #:

IPC-1602

Revision

Product Type

Standard Only

Released: 12/17/2024

Language

English

Current Revision

The industry's sole standard on the handling, packaging and storage of printed boards. The requirements in this document are intended to protect printed boards from contamination, physical damage, solderability degradation, ESD and moisture uptake. Consideration is given to packaging material types and methods, production environment, handling and transport of product, and establishing baking...

Document #:

IPC-7351

Revision

Product Type

Standard Only

Released: 07/01/2010

Language

English

Current Revision

This popular document covers land pattern design for all types of passive and active components, including resistors, capacitors, MELFs, SOPs, QFPs, BGAs, QFNs and SONs. The standard provides printed board designers with an intelligent land pattern naming convention, zero component rotations for CAD systems and three separate land pattern geometries for each component that allow the user to select...

Document #:

IPC-D-620

Revision

Product Type

Standard Only

Released: 02/28/2022

Language

English

Current Revision

The IPC-D-620A standard provides design and critical process requirements for cable and wire harness assemblies as well as military/space applications. IPC-D-620A is the design requirements companion to IPC/WHMA-A-620, "Requirements and Acceptance for Cable and Wire Harness Assemblies," and its associated Space Addendum. Three white papers are included to provide guidance on key topics discussed...

Document #:

IPC-D-356

Revision

Product Type

Standard Only

Released: 10/01/2002

Language

English

Current Revision

UPDATED! This standard describes a data format for transmitting bare board electrical test information in digital form, including data suitable for computer-aided repair. When used as a netlist input to test data processing, the receiver of IPC-D-356B data will determine test point assignments and positioning. Enhancements to the B Revision include updates to the concept of testable areas to...

Document #:

IPC-7525

Revision

Product Type

Standard Only

Released: 02/28/2022

Language

English

Current Revision

The IPC-7525C standard provides guidance for the design and fabrication of stencils for solder paste and surface-mount adhesive with much of the content based on the experience of stencil designers, fabricators, and users.

Document #:

IPC-7530

Revision

Product Type

Standard Only

Released: 03/13/2025

Language

English

Current Revision

This document provides useful and practical information for developing thermal profiles to produce acceptable SnPb and Pb-free electronics assemblies using reflow, vapor phase, laser, selective and wave soldering equipment. The document also includes a troubleshooting guide for addressing common defects which can be attributed to profiling.

Document #:

IPC-2231

Revision

Product Type

Standard Only

Released: 10/27/2021

Language

English

Current Revision

IPC-2231A provides guidelines for establishing a best practice methodology for use in developing a formal DFX (Design for Manufacturing, Fabrication, Assembly, Testability, Cost, Reliability, Environment, Reuse) process for layout of printed boards.

Document #:

IPC-2222

Revision

Product Type

Standard Only

Released: 10/07/2020

Language

English

Current Revision

IPC-2222B used in conjunction with IPC-2221, establishes the specific requirements for the design of rigid organic printed boards and other forms of component mounting and interconnecting structures. The IPC-2222B standard applies to single-sided, double-sided, or multi-layered boards. Key concepts in IPC-2222B are rigid laminate properties, design requirements for printed board assembly and...

Document #:

IPC-2221

Revision

Product Type

Standard Only

Released: 12/14/2023

Language

English

Current Revision

IPC-2221C is the foundation design standard for all documents in the IPC-2220 series. It establishes the generic requirements for the design of printed boards and other forms of component mounting or interconnecting structures, whether single-sided, double-sided or multilayer. Among the many updates to Revision C are new guidance and requirements on material and copper foil selection...

Document #:

IPC-2226

Revision

Product Type

Standard Only

Released: 10/12/2017

Language

English

Current Revision

IPC-2226A, Sectional Design Standards for High Density Interconnect (HDI) Printed Boards is used in conjunction with IPC-2221B. The IPC-2226A standard establishes requirements and considerations for the design of high density interconnect (HDI) printed boards and microvia technology. Revision A constitutes a substantial update to the document, with an all new color key for HDI constructions, new...

Document #:

IPC-7093

Revision

Product Type

Standard Only

Released: 11/30/2020

Language

English

Current Revision

The IPC-7093A standard provides essential design and assembly guidance for implementing bottom termination components (BTCs). Specifically, IPC-7093A provides guidelines on critical design, materials, assembly, inspection, repair, quality, and reliability issues associated with BTCs.

Document #:

IPC-D-325

Revision

Product Type

Standard Only

Released: 05/01/1995

Language

English

Current Revision

Establishes the general requirements for documentation necessary to fully describe end product printed boards, regardless of raw material, special fabrication requirements, layer count or end product usage. Includes master drawing requirements, board definition and artwork/phototooling. 94 pages. Revised May 1995.

Document #:

JEDEC/ECIA/IPC-J-STD-046

Revision

Product Type

Standard Only

Released: 01/22/2026

Language

English

Current Revision

This standard establishes the requirements for timely customer notification of changes to electronic products and associated processes.

Document #:

IPC-J-STD-048

Revision

Product Type

Standard Only

Released: 01/22/2026

Language

English

Current Revision

This standard is applicable to suppliers of, and affected customers for, electronic products and their constituent components. The goal of this notification standard is to better enable customers to manage and mitigate the disruption caused by the discontinuation of a product and to ensure continuity of supply. This standard establishes the requirements for timely customer notification of planned...

Document #:

IPC-9121

Revision

Product Type

Standard Only

Released: 04/14/2022

Language

English

Current Revision

The IPC-1921A handbook provides problems, causes and possible corrective actions related to printed board manufacturing processes. Includes more than 200 photos and illustrations depicting common defects.

Document #:

IPC-7091

Revision

Product Type

Standard Only

Released: 01/13/2023

Language

English

Current Revision

This document describes the design and assembly challenges and ways to address those challenges for implementing 3D component technology. Recognizing the eﬀects of combining multiple uncased semiconductor die elements in a single-package format can impact individual component characteristics and can dictate suitable assembly methodology. The information contained in this standard focuses on...

Document #:

IPC-2581

Revision

Product Type

Standard Only

Released: 11/20/2020

Language

English

Current Revision

The IPC-2581C standard specifies the XML schema that represents the intelligent data file format used to describe printed board and printed board assembly products with details sufficient for tooling, manufacturing, assembly, and inspection requirements. This format may be used for transmitting information between a printed board designer and a manufacturing or assembly facility. The data is most...

Document #:

IPC-1401

Revision

Product Type

Standard Only

Released: 11/29/2021

Language

English

Current Revision

The IPC-1401A standard specifies the requirements and best practice guidelines for an effective corporate social responsibility (CSR) management system to help an enterprise integrate CSR as a customer requirement into products and value chain activities, as well as to identify and manage CSR risks and opportunities through cooperation with customers and suppliers, to enhance the competitive...

Document #:

IPC-7094

Revision

Product Type

Standard Only

Released: 02/14/2018

Language

English

Current Revision

IPC-7094A describes the design and assembly challenges for implementing flip chip technology in a direct chip attach (DCA) assembly. The effect of bare-die or die-size components in a flip chip format has an impact on component characteristics and dictates the appropriate assembly methodology. The IPC-7094A standard focuses on design, assembly methodology, critical inspection, repair and...

Document #:

IPC-PE-740

Revision

Product Type

Standard Only

Released: 12/01/1997

Language

English

Current Revision

This is the document all process engineers must have! Useful for day-to-day problem solving, it contains case histories of problems and corrective action in the design, manufacture, assembly and testing of printed wiring products. Each section has been updated to reflect today's manufacturing challenges. Sections address documentation, phototooling, raw materials, mechanical operations, hole...

Document #:

IPC-DR-570

Revision

Product Type

Standard Only

Released: 04/01/1994

Language

English

Current Revision

Establishes nomenclature and requirements for solid carbide twist drills with four-faceted drill points used in the fabrication of printed boards. 9 pages. Revised April 1994.

Document #:

IPC-D-390

Revision

Product Type

Standard Only

Released: 02/01/1988

Language

English

Current Revision

This document is a general overview of computer aided design and its processes, techniques, considerations and problem areas with respect to printed circuit design. Describes the CAD design process from initial input package requirements to engineering change. 44 pages. Revised February 1988.

Document #:

IPC-DW-425

Revision

Product Type

Standard Only

Released: 09/01/1982

Language

English

Current Revision

This specification establishes the qualification and performance requirements for encapsulated discrete wire interconnection boards with wires that terminate in plated holes. 62 pages. Revised May 1990.

Document #:

IPC-D-310

Revision

Product Type

Standard Only

Released: 06/01/1991

Language

English

Current Revision

This document provides manufacturing and design considerations, input data requirements, test coupons, process control, tape and preform artwork, cut and strip artwork, vector photoplotting, rasterplotting, direct imaging, measurement and quality assurance. 68 pages. Revised June 1991.

Document #:

IPC-6903

Revision

Product Type

Standard Only

Released: 01/01/2018

Language

English

Current Revision

The IPC-6903A standard provides 62 additional terms and definitions for the design and manufacture of printed electronics. The IPC-6903A standard creates a common language and understanding for the worldwide printed electronics community.

Document #:

IPC-T-50

Revision

Product Type

Standard Only

Released: 11/25/2025

Language

English

Current Revision

This document is designed to provide definitions for terms commonly used in the electronics industry. The definitions are intended to provide sufficient clarity of detail such that a reader utilizing English as a second language could understand the subtleties of the meaning. Revision P contains over 120 new or revised terms, including new terminology for back-drill structures, cable and wire...

Document #:

IPC-2152

Revision

Original Version

Product Type

Standard Only

Released: 09/16/2009

Language

English

Current Revision

The sole industry standard for determining appropriate internal and external conductor sizes on printed boards as a function of the current carrying capacity required and the acceptable conductor temperature rise. This document provides guidance on how thermal conductivity, vias, copper planes, power dissipation and printed board material and thickness all factor into the relationship between...

Document #:

IPC-2228

Revision

Original Version

Product Type

Standard Only

Released: 10/17/2022

Language

English

Current Revision

The IPC-2228 standard establishes the specific requirements for the design of rigid, flexible and rigid-flexible printed boards utilizing radio frequency (RF) and/or Microwave circuity and/or high frequency laminates where RF transmission lines and related passive metal layers are considered as distributed circuits, instead of conventional lumped circuit elements. The IPC-2228 standard is used to...

Document #:

IPC-2316

Revision

Original Version

Product Type

Standard Only

Released: 03/01/2007

Language

English

Current Revision

IPC-2316 offers printed board users and designers the necessary information for incorporating formed and placed embedded passive components into their applications. The history of embedded passive technologies is given along with full coverage of embedded resistors, capacitors and inductors. In addition, it also assists the user in understanding some of the physical, electrical and thermal...

Document #:

IPC-2614

Revision

Original Version

Product Type

Standard Only

Released: 04/30/2010

Language

English

Current Revision

This standard establishes the requirements for the documentation of printed circuit board fabrication, and identifies the physical attributes and performance requirements of the unpopulated product. The descriptions apply to rigid, flexible, inorganic substrates or any combination thereof. The construction may be single, double, multilayered, or HDI technology and may include embedded (integrated)...

Document #:

IPC-2615

Revision

Original Version

Product Type

Standard Only

Released: 07/01/2000

Language

English

Current Revision

The definitive standard on printed board dimensioning and tolerancing is finally here! IPC-2615 comprehensively covers dimensioning and tolerancing of electronic packaging and is consistent with other IPC printed board standards such as IPC-6012A and IPC-2221A. The document includes fundamental dimensioning and tolerancing rules, positional, profile, orientation and form tolerances and detailed...

Document #:

IPC-D-279

Revision

Original Version

Product Type

Standard Only

Released: 07/01/1996

Language

English

Current Revision

Establishes design concepts, guidelines and procedures for reliable printed wiring assemblies. Focuses on SMT or mixed technology PWAs, specifically addressing the interconnect structure and the solder joint itself. Discusses substrates, components, attachment materials, coatings and assembly processes and testing considerations. In addition, this document contains detailed appendices covering...

Document #:

IPC-8401

Revision

Original Version

Product Type

Standard Only

Released: 10/22/2024

Language

English

Current Revision

IPC-8401 standard provides guidelines for In-Mold Electronics (IME) manufacturing processes, part structures, candidate materials, and production test methods. In-Mold Electronics integrates printed electronics and electrical components into injection molded plastics, creating a three-dimensional smart molded structure. IME technology uses mass production processes, materials, and components. IME...

Document #:

IPC-9271

Revision

Original Version

Product Type

Standard Only

Released: 09/30/2025

Language

English

Current Revision

The IPC-9271 standard provides guidelines for device-level In-System Programming (ISP) as part of electronics assembly process. The standard addresses PCB design for ISP, fundamental characteristics when selecting an ISP programmer and the integration of the programmer in the production environment, including: fixtures, software, mechanical and process integration methodologies to increase...

Document #:

IPC-5262

Revision

Original Version

Product Type

Standard Only

Released: 10/17/2022

Language

English

Current Revision

The IPC-5262 prescribes the minimum design, critical process and acceptance requirements for the application of polymeric materials to electrical/electronic components, modules, printed wiring assemblies and other elements thereof. The intent of IPC-5262 is to establish a baseline of requirements, procedures, practices and process attributes based on lessons learned and best practices that have...

Document #:

IPC-2225

Revision

Original Version

Product Type

Standard Only

Released: 05/01/1998

Language

English

Current Revision

Used in conjunction with IPC-2221A, IPC-2225 establishes the requirements and other considerations (thermal, electrical, electromechanical and mechanical) for the design of Single Chip Module (SCM-L), MCM or MCM-L assemblies. Key concepts include adhesive interconnection information, typical die attach materials, microvia material properties and relationships with DFM and DFE.

Document #:

IPC-D-422

Revision

Original Version

Product Type

Standard Only

Released: 09/01/1982

Language

English

Current Revision

Contains backplane design information from the fabrication and assembly perspective. Includes sections on design and documentation; fabrication; assembly; repair; and inspection. 17 pages. Revised September 1982.

Document #:

IPC-D-354

Revision

Original Version

Product Type

Standard Only

Released: 02/01/1987

Language

English

Current Revision

Describes the usage of libraries within the processing and generation of information files. The data contained within covers both the definition and usage of internal (existing within the information file) and external libraries. The libraries can be used to make generated data more compact and facilitate data exchange and archival. The subroutines within a library can be used one or more times...

Document #:

IPC-D-351

Revision

Original Version

Product Type

Standard Only

Released: 08/01/1985

Language

English

Current Revision

Describes an intelligent, digital format for transfer of drawings between printed wiring board designers, manufacturers and customers. Also conveys additional requirements, guidelines and examples necessary to provide the data structures and concepts for drawing description in digital form. Supplements ANSI/IPC-D-350. Pertains to four basic types of drawings: master drawings, schematics, assembly...

Document #:

IPC-D-355

Revision

Original Version

Product Type

Standard Only

Released: 01/01/1995

Language

English

Current Revision

Describes an intelligent, digital data transfer format for describing component mounting information. Supplements IPC-D-350 and is for designers and assemblers. Data included are pin location, component orientation, etc. This document is frozen; no future updates are planned. 33 pages. Released January 1995.

Document #:

IPC-D-352

Revision

Original Version

Product Type

Standard Only

Released: 08/01/1985

Language

English

Current Revision

Describes the relationship between elements used in electromechanical design and packaging of printed boards. Includes descriptions for logical and physical elements necessary as input to a design system, as well as the network of interconnection description between the various electronic parts. Provides the capability of describing all elements in their final form upon design completion. The...

Document #:

IPC-D-859

Revision

Original Version

Product Type

Standard Only

Released: 12/01/1989

Language

English

Current Revision

This standard covers the requirements and considerations for the design of multilayer hybrid circuits based on industry manufacturing capabilities. 80 pages. Released December 1989.

Document #:

IPC-D-322

Revision

Original Version

Product Type

Standard Only

Released: 09/01/1984

Language

English

Current Revision

Defines guidelines for choosing sizes of printed wiring boards using standard fabrication panel sizes. 4 pages. Reaffirmed September 1991.

Document #:

IPC-A-311

Revision

Original Version

Product Type

Standard Only

Released: 03/01/1996

Language

English

Current Revision

Covers the information and data to be collected during the generation and use of phototools to improve artwork quality, thereby improving yields downstream. It also helps establish and maintain ISO 9000 certification and SPC by facilitating troubleshooting, standardizing the process for both experienced and inexperienced operators and by identifying process improvements for the ultimate...

Document #:

IPC-7621

Revision

Original Version

Product Type

Standard Only

Released: 02/14/2018

Language

English

Current Revision

Encapsulation, for the purpose of IPC-7621 standard, is defined as a low pressure molded thermoplastic, e.g., polyamide, which is brought to a liquid state and injection molded and (rather quickly) returned to a temperature below its melting point., forming a durable yet pliable (rubbery-like) form. The desired performance characteristics of low pressure molding (LPM) encapsulation depend on the...

Document #:

IPC/JPCA-6901

Revision

Original Version

Product Type

Standard Only

Released: 08/26/2015

Language

English

Current Revision

This standard establishes a Market Classification System and Level Classification System for printed electronics assemblies and provides a list of performance criteria and testing methods. It provides a standardized product category structure for designing and manufacturing printed electronics and assemblies which conform to industry-established performance metrics as determined by accepted...

Document #:

IPC-2612

Revision

Original Version

Product Type

Standard Only

Released: 04/30/2010

Language

English

Current Revision

This standard establishes the requirements for the documentation of electronic diagrams used as the foundation for defining the electrical interconnectivity of electronic products. The description pertains to either schematic diagrams, logic diagrams or Boolean truth tables and includes methodology for defining circuit flow, electrical or functional restrictions, or maintenance test procedures...

Document #:

IPC-2612-1

Revision

Original Version

Product Type

Standard Only

Released: 04/30/2010

Language

English

Current Revision

This standard establishes the requirements for generation of electronic symbols used in the documentation of electronic diagrams that define the electrical interconnectivity of electronic products. The descriptions pertain to schematic symbols, logic symbols or Boolean truth tables required to define the circuit configuration. Where appropriate, the standard also includes methodology for defining...

Document #:

IPC-T-50

Revision

Product Type

Standard Only

Released: 01/13/2023

Language

Chinese

Current Revision

IPC-T-50N-CN文件旨在为电子行业中常用的词汇和术语提供其定义。本文件所规定的定义充分详细地阐明了术语，以便以英语为第二语言的读者能够理解含义的细微之处。IPC-T-50N-CN包含550多个新的或修订的术语，包括通孔结构、表面贴装器件类型、焊料凸点、焊料合金、焊接、退润湿、电路板制造工艺和测试的新术语。

Document #:

IPC-T-50

Revision

Product Type

Standard Only

Released: 02/03/2015

Language

German

Current Revision

Das unentbehrliche Nachschlagewerk für alle Verantwortlichen entlang der Wertschöpfungskette von elektronischen Produkten. Die Revision K enthält auf mehr als 120 Seiten, mehr als 220 neue und überarbeitete Begriffe und bildliche Darstellungen. Beispiele: Access Hole, Accelerated Equivalent Soak, Capture Land, Micro Via Technology, Plating Thief, Etchback, Resin Recession, Tape Automated Bonding...

Document #:

IPC-1602

Revision

Product Type

Redline Standard

Released: 04/23/2025

Language

English

Current Revision

IPC-1602A Redline document shows the changes from IPC-1602 to IPC-1602A in a side-by-side comparison of the two documents. This is only available in digital format.

Document #:

IPC-7095

Revision

Product Type

Standard with amendment(s)

Released: 06/17/2020

Language

Japanese

Current Revision

IPC-7095D-AM1は、ボールグリッドアレイ(BGA)およびファインピッチBGA(FBGA)技術の設計および組立の実施について記述するものであり、これらのパッケージを使用したプリント基板の設計と組立に関連する検査、リペアおよび信頼性の問題に焦点を当てている。 IPC-7095D-AM1は、BGAを使用している、もしくは使用を検討している本書読者に対し、有用で実用的な情報を提供するものである。またIPC-7095D-AM1では、BGAを使用するプリント基板組立のためのロバスト設計と組立プロセスの正しい方法について説明するとともに、BGAの組立中に発生する可能性のある一般的な異常について、トラブルシューティングの方法を説明している。

Document #:

IPC-2223

Revision

Product Type

Standard Only

Released: 08/10/2021

Language

Chinese

Current Revision

IPC-2223与IPC-2221一起使用时，IPC-2223确立了挠性印制板设计以及组件安装和互连结构形式的特定要求。结构中使用的挠性材料由绝缘膜，增强和/或非增强电介质与金属材料组成。 IPC-2223E为制造图纸，孔到边的间距，弯曲区域的导体注意事项，刚性和挠性区域之间的介电厚度以及双行零插入力（ZIF）连接器提供了新的设计指南和要求

Document #:

IPC-7095

Revision

Product Type

Standard with amendment(s)

Released: 09/19/2019

Language

Chinese

Current Revision

IPC-7095D在设计，组装，检查和维修过程中实施球栅阵列（BGA）和细节距球栅阵列（FBGA）技术提出了了一些独特的挑战。它为使用或正在考虑使用BGA的用户提供有用和实用的信息。它还介绍了如何使用BGA成功实现印刷电路板组件的稳健设计和装配流程，以及解决BGA组装过程中可能出现的一些常见异常的方法。由于焊球中合金，焊球形状，封装程序等的改变，许多问题变得尤为重要。D版主要重点是为组装后出现的一些新的机械失效问题如坑裂或层压缺陷提供信息。除了提供BGA检查和维修的指引外，本标准还解决了与BGA相关的可靠性问题和无铅焊点的使用标准。该标准中有许多X射线和内窥镜的照片和插图以确认行业中BGA组装工艺的实施中的遇到的一些情况。

Document #:

IPC-7530

Revision

Product Type

Standard Only

Released: 12/17/2025

Language

Japanese

Current Revision

本書は、リフロー、ベーパーフェーズ(気相)、レーザー、セレクティブ、ウェーブの各ソルダリング装置を使用し、許容可能な電子組立品(SnPb及びPbフリー)を生産する上で必要となる熱プロファイルの作成において、有用かつ実用的な情報を提供するものである。本書には、プロファイル測定に起因する一般的な欠陥に対処するためのトラブルシューティングガイドも含まれている

Document #:

IPC-2141

Revision

Product Type

Errata

Released: 01/01/2018

Language

English

Current Revision

This is a list of reported errata to the printed copies of IPC-2141A. Pen and ink changes should be made in accordance with your company's document control policies.

Document #:

IPC-2222

Revision

Product Type

Standard Only

Released: 03/08/2021

Language

French

Current Revision

Utilisée conjointement avec la norme IPC-2221, la norme IPC-2222B établit les exigences spécifiques pour la conception de circuits imprimés organiques rigides et autres formes d’installations de composants et de structures dʼinterconnexion. La norme IPC-2222B sʼapplique aux circuits simple face, double face ou multicouche. Les concepts clés de la norme IPC-2222B sont les propriétés des stratifiés...

Document #:

IPC-7351

Revision

Product Type

Standard Only

Released: 06/30/2010

Language

German

Current Revision

Dieses bekannte Dokument deckt das Anschlussflächen-Design für alle Typen von passiven und aktiven Bauteilen ab, inklusive MELFs, SOPs, QFPs, BGAs, QFNs und SONs. Der Standard unterstützt Leiterplatten-Designer mit durchdachten Anschlussflächen-Bezeichnungen, 0°-Drehlage der Bauteile für CAD-Systeme und drei unterschiedlichen Anschlussflächen-Geometrien (Design-Produzierbarkeitsstufen) für jedes...

Document #:

IPC-2221

Revision

Product Type

Standard Only

Released: 10/25/2024

Language

Japanese

Current Revision

IPC-2221Cは、IPC-2220シリーズ全書の基本となる設計規格書である。本書は、片面/両面/多層を問わず、プリント基板およびその他の形状の部品実装構造または相互接続構造の設計に関し、一般的な要求事項を規定するものである。リビジョンCには、材料や銅はくの選択、プリント基板のパレタイゼーション、基板端部のめっき、最小電気的クリアランス(例えば絶縁耐圧/DWV、コロナ作用、沿面距離)、インピーダンス公差、プレーン内のクリアランス領域、各形状の位置公差、コンプライアントピン(プレスフィット)、バックドリル等に関する新規のガイダンスと要求事項が含まれる。附属書Aでは、ロットの受入れ試験および品質適合試験(IPC-6010シリーズの性能仕様に対応したもの)で使用するテストクーポンの最新設計について紹介している。本規格書は、分野別規格書(IPC-2222、IPC-2223、IPC-2226および...

Document #:

IPC-7093

Revision

Product Type

Standard Only

Released: 09/14/2022

Language

Chinese

Current Revision

IPC-7093A 标准为实施底部端子元器件(BTCs)提供了基本的设计和组装指南。具体而言，IPC-7093A 提供了与 BTCs 相关的关键设计、材料、组装、检查、维修、质量和可靠性问题的指南。

Document #:

IPC-7091

Revision

Product Type

Standard Only

Released: 11/04/2024

Language

Japanese

Current Revision

本書では、3D部品の技術を実施する際の設計/組立の課題や、課題への対処方法について述べる。ケースに収納されていない複数の半導体ダイ素子を単一パッケージのフォーマットに組み合わせる効果を考える場合、その影響は個々の部品特性にも、これまでの組立手法にも及ぶ。本規格に含まれる情報は、3D半導体パッケージの組立とプロセスに関連する最適な機能性、工程評価、最終製品の信頼性とリペアの諸問題の解決に向け焦点を当てたものである。

Document #:

IPC-1602

Revision

Product Type

Standard Only

Released: 04/16/2025

Language

Japanese

Current Revision

本書はプリント基板の取扱い、梱包、保管に関する業界唯一の規格書である。本書に記載する要求事項は、プリント基板を汚染や物理的損傷、はんだ付性の低下、ESD、吸湿から保護することを目的としている。梱包資材の種類や梱包方法、製品の製造環境、取扱いと輸送、また、水分除去を目的としたベーキングプロファイルの策定などに関し、懸念事項が示されている。本書では、プリント基板のはんだ付性に対するベーキングの影響、エッチング後のコア材・複合材の湿気に関する懸念事項、防湿袋(MBB)、乾燥剤、HICカードなどのドライパックに関する要求事項、相対的な吸湿を評価するためのテストクーポン、ベーキングによるフロアライフとリワークに関するガイダンスについて取り上げている。本書はIPC-1602の改訂版である。

Document #:

IPC-7525

Revision

Product Type

Standard Only

Released: 11/01/2023

Language

Chinese

Current Revision

本标准是为设计与制造焊膏及表面贴装粘合剂用模板提供指导。本文件大部分内容是基于模板设计者、制造厂商和用户的经验编写的。

Document #:

IPC-2221

Revision

Product Type

Standard Only

Released: 08/18/2025

Language

Chinese

Current Revision

IPC-2221C 是 IPC-2220 系列所有文件的基础设计标准。它建立了印制板和其他元器件安装形式或互连结构（无论是单面、双面还是多层）设计的通用要求。修订版 C 的众多更新包括有关材料和铜箔选择、印制板拼板化、印制板板边电镀、最小电气间隙（如介质耐压、电晕效应和爬电）、阻抗公差、导体层的隔离区、要素位置公差、柔性压接引脚（压配）和背钻的最新指导和要求。附录 A 提供了相应 IPC-6010 系列性能规范中用于批量验收和质量一致性测试的最新附连测试板设计。适用于一个或多个适用的设计分标准（如 IPC-2222、IPC-2223、IPC-2226 和/或 IPC-2228）。取代 IPC-2221B。

Document #:

IPC-9121

Revision

Product Type

Standard Only

Released: 07/26/2023

Language

Japanese

Current Revision

ハンドブック「IPC-1921A」は、プリント基板の製造工程に関する問題点、原因、想定される対策(是正処置)について文書化したものである。よくある欠陥事象について、200枚を超える写真やイラストとともに紹介している。

Document #:

IPC-2222

Revision

Product Type

Standard Only

Released: 04/13/2022

Language

Chinese

Current Revision

IPC-2222 与 IPC-2221 一起使用，确立了刚性有机印制板和其他形式的元件安装和互连结构设计的具体要求。本标准适用于单面、双面或多层板。本文档中的关键概念是：刚性层压板特性、印制板组装的设计要求和孔/互连的设计要求。修订版B为层压板选择、刻痕和布线参数、印制板厚度公差、非功能性焊盘、孔纵横比、通孔尺寸和印制板边缘间距提供了新的设计指南和要求。2020年10月发布。

Document #:

IPC-7093

Revision

Product Type

Standard Only

Released: 05/03/2022

Language

Japanese

Current Revision

本規格「IPC-7093A」は、下面電極部品(BTC)を実装するための基本的な設計および組立のガイダンスについて記述するものである。IPC-7093Aでは特にBTCに関連する重要な設計、材料、組立、検査、リペア、品質および信頼性の問題について、そのガイドラインを提供している

Document #:

IPC-1601

Revision

Product Type

Standard Only

Released: 10/17/2022

Language

Japanese

Current Revision

概説本書はプリント基板の取扱い、梱包、保管に関する、業界唯一のガイドラインである。このガイドラインはプリント基板を汚染、物理的損傷、はんだ付性の低下、吸湿から保護することを目的としている。梱包材の種類と方法、製造環境、製品の取扱いと輸送、水分除去のためのベーキングプロファイルの確立などについて懸念事項が示されている。本書(A版)では、防湿袋(MBB)、プリント基板をベーキングすることによるはんだ付性への影響、ESDの問題、エッチング後のコア材・サブコンポジットの湿気に関する懸念事項、乾燥剤とHICカード、梱包/取扱いに関する要求事項のフローダウンの事例についてより詳しく解説している。翻訳年： 2022年7月。