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Document #:
Revision
Original Version
Product Type
Released:  07/01/2014
Language
English
Pb-free materials are considered a major technology disruption to traditional Pb-based interconnect materials for electronics, which is of particular concern for the aerospace, defense, and high performance products (ADHP) industries where safety cannot be compromised and applicable reliability data remains scarce. Until validated data and modelling methods are developed, projects considering Pb...
Document #:
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Original Version
Product Type
Released:  10/30/2015
Language
English
This technical paper covers the testing and evaluation of polymeric conformal coatings for moisture and insulation resistance (MIR) and dielectric withstanding voltage (DWV). This effort was initiated by the IPC Conformal Coating Task Group to support technical decisions for IPC coating specification CC-830 as part of the Revision C process. MIR testing was done per a modified method of IPC-TM-650...

IPC-WP-008 - White Paper

Setting Up Ion Chromatography Capability

Document #:
Revision
Original Version
Product Type
Released:  12/01/2005
Language
English
Ion chromatography has been recognized as a method for which the data output is ion specific and very precise in the quantification of ionic residues. This paper is intended for those contemplating the setup of an ion chromatography lab and provides many of the practical considerations that should be addressed, including the core components of an ion chromatograph system such as carrier solutions...
Document #:
Revision
Original Version
Product Type
Released:  09/29/2017
Language
English
This document provides an overview of ionic cleanliness requirements, providing examples of tests and requirements for acceptability from a residue/cleanliness standpoint. The history of ROSE testing is also provided, with explanations of the shortcomings of that testing.
Document #:
Revision
Original Version
Product Type
Released:  07/31/2024
Language
Japanese
Current Revision
このホワイトペーパーは、コンフォーマルコーティングにおける気泡の許容性を検証するための、客観的証拠を得るためのガイダンスを提供するものである。 本書では、コーティング内の気泡により微気候が活性化すると気泡内部の水分が凝縮し、その結果、局所的な湿度負荷が臨界レベルまで上昇し、電気化学的マイグレーション不良が生じるという故障モードに焦点を当てている。 このホワイトペーパーはJ-STD-001Jにおいて参照されている。
Document #:
Revision
Original Version
Product Type
Released:  04/01/1984
Language
English
This technical report was developed to meet the growing need for a standard method of evaluating the solderability retention capability of printed boards during inventory storage. 21 Pages. Released April 1984. IPC-TR-464 Addendum The addendum to IPC-TR-464 represents the results of the task group study to evaluate and determine if the aging period recommended in the original Technical Report...
Document #:
Revision
Original Version
Product Type
Released:  04/16/2019
Language
Chinese
Current Revision
IPC-WP-024是一份白皮书,讨论了多次洗涤循环后智能织物(电子织物结构)可靠性相关的问题,并强调了工业和研究实验室必须做出的努力。以使电子织物结构更加坚固,能够像市场上的日常织物(例如,内衣、服装、家用织物和技术织物)一样被清洁或洗涤。 研究人员在商用洗衣机和家用洗衣机洗涤剂多次洗涤循环后,为电子织物提供实验室测试的初始可靠性结论。
Document #:
Revision
Original Version
Product Type
Released:  03/01/2009
Language
English
This technical report provides the documentation of a round robin testing effort that generated data used by the 4-14 Plating Processes Subcommittee in developing the maximum immersion silver plating thickness requirement in the revision A of IPC-4553. This compendium of data resulted from three information sets: a) Test vehicle assembly report by Celestica, b) Thermal cycle test report by...

IPC-WP-019 - Revision A - White Paper

综述全球离子洁净度要求的变更

Document #:
Revision
A
Product Type
Released:  07/23/2019
Language
Chinese
IPC-WP-019A修订白皮书概述了新的离子清洁度要求,从残留物/清洁度角度提供了可接受性测试和要求的实例。 还提供了ROSE测试的历史,并解释了该测试的缺点。

Coming Soon

IPC-9242: Guidelines for Microsection Evaluation

IPC-9691C: User Guide for the IPC-TM-650, Method 2.6.25 Conductive Anodic Filament (CAF) Resistance and Other Internal Electrochemical Migration Testing

IPC-A-630A: Acceptability Standard for Manufacture, Inspection, and Testing of Electronic Enclosures

IPC-4556A: Specification for Electroless Nickel/Electroless Palladium/ Immersion Gold (ENEPIG) Plating for Printed Boards

IPC-7527A: Requirements for Solder Paste Application

IPC-4204C: Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Boards

IPC-J-STD-002F: Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires

IPC-4101F: Specifications for Base Materials for Rigid and Multilayer Printed Boards

IPC-1755B: Responsible Sourcing of Minerals Data Exchange Standard

IPC-2223F: Sectional Design Standard for Flexible/Rigid-Flexible Printed Boards

IPC-HDBK-9798A: Handbook and Guide to Supplement IPC-9797

IPC-WP-011: Guidance for Strain Gage Limits for Assemblies

J-STD-046A: Customer Notification Standard for Product/Process Changes by Electronic Product Suppliers

J-STD-048A: Notification Standard for Product Discontinuance

IPC-T-50P: Terms and Definitions for Interconnecting and Packaging Electronic Circuits

IPC-1401B: Corporate Social Responsibility Management System Standard

IPC -1751B: Generic Requirements for Declaration Process Management

IPC-6013F: Qualification and Performance Specification for Flexible/Rigid-Flexible Printed Boards

IPC-4413 - Am1: Specification for Finished Fabric Woven from Low Dk Glass for Printed Boards